SZNZ9F2V4T5G - ON SEMICONDUCTOR

November, 2016 − Rev. 4 1Publication Order Number:

NZ9F2V4/D

NZ9F2V4T5G,

SZNZ9F2V4T5G SERIES

Zener Voltage Regulators

250 mW SOD−923 Surface Mount

This series of Zener diodes is packaged in a SOD−923 surface

mount package. They are designed to provide voltage regulation

protection and are especially attractive in situations where space is at a

premium. They are well suited for applications such as cellular

phones, hand held portables, and high density PC boards.

Specification Features:

•Standard Zener Breakdown Voltage Range − 2.4 V to 24 V

•Steady State Power Rating of 250 mW

•Small Body Outline Dimensions:

0.039″ x 0.024″(1.00 mm x 0.60 mm)

•Low Body Height: 0.016″ (0.40 mm)

•ESD Rating of Class 3 (>16 kV) per Human Body Model

•SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

MAXIMUM RATINGS

Rating Symbol Max Unit

Total Device Dissipation FR−5 Board,

(Note 1) @ TA = 25°C

Derate above 25°C

PD250

2.0 mW

mW/°C

Thermal Resistance from

Junction−to−Ambient RqJA 500 °C/W

Junction and Storage Temperature Range TJ, Tstg −65 to

+150 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be af fected.

1. FR−4 Minimum Pad.

Cathode 2

Anode

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 3 of this data sheet.

DEVICE MARKING INFORMATION

www.onsemi.com

Device Package Shipping†

ORDERING INFORMATION

NZ9FxxxxT5G,

SZNZ9FxxxxT5G SOD−923

(Pb−Free) 8000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

SOD−923

CASE 514AB

X = Specific Device Code

M = Month Code

G= Pb−Free Package

(Note: Microdot may be in either location)

MARKING

DIAGRAM

X MG

NZ9F2V4T5G, SZNZ9F2V4T5G SERIES

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ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted,

VF = 0.9 V Max. @ IF = 10 mA for all types)

Symbol Parameter

VZReverse Zener Voltage @ IZT

IZT Reverse Current

ZZT Maximum Zener Impedance @ IZT

IZK Reverse Current

ZZK Maximum Zener Impedance @ IZK

IRReverse Leakage Current @ VR

VRReverse Voltage

IFForward Current

VFForward Voltage @ IF

QVZMaximum Temperature Coefficient of VZ

CMax. Capacitance @VR = 0 and f = 1 MHz

Zener Voltage Regulator

IZT

VZVF

TEMPERATURE (°C)

250

100

POWER DISSIPATION (%)

50 75 100 125 150

Figure 1. Steady State Power Derating

NZ9F2V4T5G, SZNZ9F2V4T5G SERIES

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)

Device*** Device

Marking

Zener Voltage

(Note 1) Zener Impedance Leakage Current

QVZ

(mV/k) @ IZT

@ VR = 0

f = 1 MHz

VZ (Volts) @ IZT

ZZT

@ IZT ZZK @ IZK IR @ VR

Min Max mA W W mA mAVolts Min Max pF

SZ, NZ9F2V4T5G J 2.28 2.52 5 100 1000 1 50 1 −3.5 0 210

SZ, NZ9F2V7T5G E** 2.57 2.84 5 100 1000 1 20 1 −3.5 0 210

SZ, NZ9F3V0T5G T** 2.85 3.15 5 100 1000 1 10 1 −3.5 0 210

SZ, NZ9F3V3T5G Q 3.14 3.47 5 100 1000 1 10 1 −3.5 0 210

SZ, NZ9F3V6T5G 3** 3.42 3.78 5 100 1000 1 10 1 −3.5 0 210

SZ, NZ9F3V9T5G V** 3.71 4.10 5 100 1000 1 5 1 −3.5 −2.5 210

SZ, NZ9F4V3T5G Y** 4.09 4.52 5 100 1000 1 5 1 −3.5 0 210

SZ, NZ9F4V7T5G 3 4.47 4.94 5 100 800 0.5 2 1 −3.5 0.2 150

SZ, NZ9F5V1T5G 4 4.85 5.36 5 80 500 0.5 2 1.5 −2.7 1.2 130

SZ, NZ9F5V6T5G 5 5.32 5.88 5 60 200 0.5 1 2.5 −2.0 2.5 115

SZ, NZ9F6V2T5G 6 5.89 6.51 5 60 100 0.5 1 3 0.4 3.7 110

SZ, NZ9F6V8T5G A* 6.46 7.14 5 40 60 0.5 0.5 3.5 1.2 4.5 105

SZ, NZ9F7V5T5G D* 7.13 7.88 5 30 60 0.5 0.5 4 2.5 5.3 100

SZ, NZ9F8V2T5G E* 7.79 8.61 5 30 60 0.5 0.5 5 3.2 6.2 90

SZ, NZ9F9V1T5G F* 8.65 9.56 5 30 60 0.5 0.5 6 3.8 7 80

SZ, NZ9F10VT5G J* 9.50 10.50 5 30 60 0.5 0.1 7 4.5 8 80

SZ, NZ9F11VT5G K* 10.45 11.55 5 30 60 0.5 0.1 8 5.4 9 80

SZ, NZ9F12VT5G L* 11.40 12.60 5 30 80 0.5 0.1 9 6 10 80

SZ, NZ9F13VT5G P* 12.35 13.65 5 37 80 0.5 0.1 10 7 11 75

SZ, NZ9F15VT5G Q* 14.25 15.75 5 42 80 0.5 0.1 11 9.2 13 70

SZ, NZ9F16VT5G R* 15.20 16.80 5 50 80 0.5 0.1 12 10.4 14 65

SZ, NZ9F18VT5G T* 17.10 18.90 5 50 80 0.5 0.1 14 12.4 16 60

SZ, NZ9F20VT5G V* 19.00 21.00 5 55 100 0.5 0.1 15.4 14.4 18 55

SZ, NZ9F22VT5G Y* 20.90 23.10 5 55 100 0.5 0.1 16.8 15.4 20 55

SZ, NZ9F24VT5G F 22.80 25.20 5 70 120 0.5 0.1 18.9 16.8 22 50

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*Rotated 90°.

**Rotated 270°.

***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP

Capable.

1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.

NZ9F2V4T5G, SZNZ9F2V4T5G SERIES

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PACKAGE DIMENSIONS

SOD−923

CASE 514AB

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

DIM MIN NOM MAX

MILLIMETERS

A0.34 0.37 0.40

b0.15 0.20 0.25

c0.07 0.12 0.17

D0.75 0.80 0.85

E0.55 0.60 0.65

0.95 1.00 1.05

L0.19 REF

0.013 0.015 0.016

0.006 0.008 0.010

0.003 0.005 0.007

0.030 0.031 0.033

0.022 0.024 0.026

0.037 0.039 0.041

0.007 REF

MIN NOM MAX

INCHES

−Y−

−X−

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

See Application Note AND8455/D for more mounting details

1.20 2X

0.25

0.36

PACKAGE

OUTLINE

b2X

0.08 XY TOP VIEW

SIDE VIEW

BOTTOM VIEW

L2 0.05 0.10 0.15 0.002 0.004 0.006

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