8 . . . . . . . . . an . . . . . . CKT.| DIM. "A" | DIM *B' | DIM. "Ct | DIM. F* | DIM. ** VERSION A (1.687.066 END CIRCUITS TO INSIDE END WALLS) CB 2540.08) os | heal | Rae | oe) r 5964 on | a [ong | ge | | | Pe et tt eae DIA. TYP. SP OPPOOOS SH lo a Ye Ape) | _ J b$O-$946-5-9-4-6 Ta SBT Se | (2540.08 ia | Spee | Sigg | easel | | | 6.0 NON-ACCUM. we | Bee | a | ia |] | | 200 Sago __ |__| __ t RECOMMENDED P.C. BOARD HOLE LAYOUT 8 Ps j_=39e__| a (6.10) F a a 2a, SEE NOTE 5 2a | Segal | Shes | Sees | et |] | pt 26 | bee | SRP | Bee | Se? | | 3 (102 05 za | See | Ho | Sage | ee |] | i. 1 : Jere ee so | [aba [ae [Seer | | rer | | ese O20 se | Spee | Ste | ea | eet | | aa _< oo SE NOTED OP ack TP 34 | SRL | Eas | bee | easel | eae |] 068 RE. 36 | See | Sea | a | eee | ee | HH - OE ee ae gap H = - 4o | eee | Base | Haae | ee? | ee | _ Fi | eee a aa [gee [ TTv Ovo 100 i | aa | See | SBS | Saat | ug | ese | (0.38) oo J ac | See | es | Sika | eg | sare 4 t oe oe |e ae [ne [Se gee | J (155) 7 "es "L" REF. so | Spee | See | Some | pee | ce Fr TYP. a3) B | 2.032 | 2.400 | *.f50_ | a Pov a = |e | a | se | a | See | a ee nr S90 4 | ABP | So | Sea | Sak | Seg? | se | Segal | Shea | Saat | Sake | hag | SECTION J-J 744n | he | Lap | == sa | {eee | Sage | Risiet | ERR? | tees! | co | oe Shgp {LMATERIAL: SHROUDED WAFER: GLASS FILLED, LIOUID CRYSTAL POLYMER 7 | EARP | EBB | EG | a y 7 TTP iT COLOR: BLAGK, ULO4V-0 wa | See | Sas | eee | SERGE | tees! | FINS: COPPER ALLOY icmo ne) | Gaya) | O7 RA) l I . 4 5p Sar Shp 5a@) I | abs 2 ENS TIN - Set none Ce MICRONGHES | MINIMUM TIN PLATE s Spee Tease t---}} Jt___4 Se. on ener ca i TC RET sae | a_i Jl 30 GOLD wn verve eroes wownores MINIMUM GOLD PLATE IN SELECT AREA a 2.25) | ten90) | za | Hy 4.91 MCROMETERS/75 MICRCINCHES MINMUM TIN PLATE IN SELECT AREA 72 | ee | Seep | Gea | Shap | Ga | OVER NCKEL UNDERPLATE OVERALL Sooo 3. PRODUCT SPECIFICATION: PS-74162-0001 4. PACKAGING INFORMATION: SEE CHARTS 5. WINDOW NOT AVAILABLE ON 6 CKT. 6. FOR CHARTED DIMENSIONS AND ASSEMBLY NOS NOT SHOWN ON THIS SHEET - SEE SHEET 2. 52 7. 20 CIRCUIT SIZE SHOWN FOR ILLUSTRATION PURPOSES. DEO 8. PIN PUSHOUT FORCE: (17.79 NI/4 LBS. (0.38) +060 REF. 9. PINS MUST MEET SOLOLRARLLITY SPEC. MIL-STD-202 METHOD 208B. 06 10, ROW TO ROW PIN HEIGHT VARIATION MUST NOT EXCEED (0,25)/.010 IN. | 11. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS-45499-002. | rt ! L S55) [CUAITY] GENERAL TOLERANCES | MMIN | at | INCH [OCIARSRANGIE (10.29) (1.40) un a a a SYMBOLS INCH _| ORAWN BY DATE TLE aE | 055 REF. ZBRaS z|W=0 [PLACES =-= MILLER 2009/03/27 SALES ASSEMBLY | an Fa 3 PLACES ,010 [CHECKED BY DATE WAFER-RIGHT ANGLE FULLY TN = 25 eo eG] W=0 (ZPCACESHEOZS [4014 BBARKER 2009/03/27 SHROUDED .100 GRID ee eee TPLACE [F036 _[=--~ D BY DATE 2.) WS S25] |V-0 Pace = MILLER 2009/03/27 085 REF. 6os322 ANGULAR #1/2 MATERIAL NO. DOCUMENT NO. SHEET NO. = oece DRAFT WHERE APPLICABLE| SEE TABLE SD-74162-001 OF 8 Moot MUST REMAIN SHE] THIS DRAWING CONTANS INFORMATION THAT IS PROPRETARY TO MOLEX C fg WITHIN DIMENSIONS INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMSSION Maat | Ss | 2 T 6 -] . 2 fl n | 9 | 6 7 6 | 5 | 4 | 3 | 2 | 1VERSION A (1.68/.066 END CIRCUITS TO INSIDE END WALLS) ITEM NUMBER 74162 PLATING FINISH CONNECTOR END PLATING PC BOARD END PLATING TYPE d LENGTH TYPE L LENGTH INFORMATION PK-70873 -0006-0072 TIN TIN TIN 0019 0106-0172 TIN TIN TIN 0019 -0206-0272 15 GOLD TIN 0019 -0306-0372 15 GOLD TIN 0019 -0406-0472 30 GOLD TIN 0019 -0506-0572 30 GOLD TIN 0019 -0606-0672 TIN TIN 0019 74162-0008 74162-0030 74162-0038 74162-0060 74162-0108 74162-0130 74162-0138 74162-0160 74162-0208 74162-0230 74162-0238 74162-0260 74162-0308 74162-0330 74162-0338 74162-0360 74162-0408 74162-0430 74162-0438 74162-0460 SHEET 1 NO: UCP2015-2054 74162-0508 74162-0530 74162-0538 74162-0560 QUALITY qq < Ls 4S 74162-0608 74162-0630 74162-0638 74162-0660 MM/IN 1" INCH | |OC] ILLER 2009 SALES ASSEMBLY mA WAFER-RIGHT ANGLE FULLY ILLER 2009 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRETARY TO MOLEX2 | 9 | 2 | v | 6 | a | | a | 2 | fl | a | s | a 7 6 a x a DIM. "3" DIM. "F" | DIM. "G"| DIM. "H VERSION B (3.81/.150 END CIRCUITS TO INSIDE END WALLS) H rer. C 2 2.540.000 (0.09 oy rp, SOSSSOHS oo eet eet] 045#.002 re *F | \ Ce =100#,003 (5.08) yj NON-ACCLML 200 4 RECOMMENDED P.C. BOARD HOLE LAYOUT (6.10) (SEF NOTE 6) 5 =| DIM. "AY DIM. *C* OE Sag : 08 | Seg Si | | Sey ee 2 | Set Rap | 4 | Sept Sg | 6 | Set SP | 8 | Sept Sige | 20 | St Seppe zz | Sept aap ts. 24 | eo | Eas | a ae (8.0020.38) 26 | ey | BAR | ERE? | a 2 /seo8 ran |e | | Se | See age A rer. c REE SEA 30 | ot | fe | Tae | SE? | | ie Le oy 2.54 14.42) per. TYP, 32 | Seb | as | Sagat | eet | | Sig a mor m set ure San | ae | ae [a Se ae ae Fr 36 | RD | SOR | Sa | gee | Ug TeD | nae) A pte) |} 650 35 | Seat | Baa | dee | | ete | at } nee ee ee ee Tae = ro] a aa [ge i gt ' en = OE SE Ie JE SE ee y mini a) A | | 44 | Bo | SRG | Bo | a | Ho | Sie OBR TYP. 4 | Seat | eae | See | ee | ae VY oe | ros | a (se | [ea age | | Ei Feo | Sa [sia [agg [a [ns | be 80 PLATE AREA s2 | Set | ade | Saat | ee | ere | See Lp wt UL Gan 54 | Sel | Peue | Seay | eee | aes | Diet SECTION J-J ee re SS 5a | Syot | Sido | eae | Bom | BER | AP 1 MATERAL: SHROUDED WAFER: GLASS FILLED. LIQUID CRYSTAL POLYMER. Bo | Soo | Eee | tee | teed | TT TT) 1 rT ps commer a CT BLACK: ULBAV-0 2 | Beet | uaa | eee | ha | eee | Se 2. FINSH: 64 | See | Rasa | Seasa | ebeet | tee | Se ! ! ales 1 Sawa gece Meng een TPE x [Sa a [alae | a [a [age Lb---th4t---44] | Be. oo ae ee mena een ee [Sa [me [ae [aa [ae to | SBD | Sigh | Gene | Gre) | Gee | Qh Ja_i_A_M_i_S_J_J_ SJL (4.80) 30 GOLD - 0,76 MICROMETERS/30 MICRONCHES MINMUM GOLD PLATE IN SELECT AREA 2S | ese | eas | eran | esa | ie CT] -189 REF. 191 MICROMETERS/75 MICROINCHES MINIMUM TIN PLATE IN SELECT AREA ra | Sat | Sas | ase | That | ba | ee OVER NICKEL UNDERPLATE OVERALL we 3. PRODUCT SPECIFICATION: PS-74162-0001 4. PACKAGING INFORMATION: SEE CHARTS 5. FOR CHARTED DIMENSIONS AND ASSEMBLY NOS NOT SHOWN ON THIS SHEET - SEE SHEET 4. je 5.68) PLC.) 6. WINDOW NOT AVAILABLE ON 6 CKT. L52) -145 REF. 7. 20 CIRCUIT SIZE SHOWN FOR ILLUSTRATION PURPOSES. ,060 REF. 8. PIN PUSHOUT FORCE: (17.79 Ni/4 LBS. (0.38) 9. PINS MUST MEET SOLDERABLILITY SPEC. MIL-STD-202 METHOD 208B. 06 | 10. ROW TO ROW PIN HEIGHT VARIATION MUST NOT EXCEED (0.251/.010 IN. | | | 1. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS~45499-002. | oH i SS=) Quaury) GENERAL TOLERANCES DRENSIN STYLE SCALE] DESIGN UNTS Odi# HIRD ANGLE 10-2 r (40), See ISYMBOLS| (UNLESS. SPEC EO MM/IN fl INCH PROJECTION T | = SRR ZI W=0 [ZPLACES pS BNILLER 2009703727 WAFER Bie, ASSEMBLY Ly Ty 3 PLACES |+ CHECKED BY DATE | XN neceel WO [2 PLACES|+ 0. + BARKER 2009/03/27 SHROUDED .100 GRID We, oe 8) __, LIPLACe [0.36 | APPROVED EY DATE I (2.16) Go eaz |VOD PLACE | F-- E=-=SMILLER 2009/03/27 m aE REF $33 e ULAR +1/2 [MATERIAL NO. DOCUMENT NO. SHEET NO. Woes DRAFT ERE APPLICABLE|_SEE TABLE SD-74162-001 3 OF 8 NwWSow = MUST REMAIN D| THSS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX C g WITHIN DIMENSIONS INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMSSION feats Doren | . | Bs v 6 6 BS 2 A) n | 5 | 5 | 7 6 | 5 | 4 | 3 2 1VERISION B (3.81/.150 END CIRCUITS TO INSIDE END WALLS) CONNECTOR END PLATING PC BOARD END PLATING ITEM NUMBER |p PLATING J L INFORMATION 74162 FINISH TYPE | ENGTH TYPE |) ENGTH PK-70873 -1006-1072 TIN TIN TIN 0019 -1106-1172 J TIN TIN TIN 0019 -1206-1272 = 15 GOLD : TIN . 0019 -1306-1372 i 15 GOLD 5 TIN rT 0019 -1406-1472 : 30 GOLD TIN i 0019 -1506-1572 5 30 GOLD Soo TIN 3 0019 74162-1012 74162-1112 74162-1212 74162-1312 74162-1412 74162-1512 74162-1014 74162-1114 74162-1214 74162-1314 74162-1414 74162-1514 74162-1042 74162-1142 74162-1242 74162-1342 74162-1442 74162-1542 74162-1050 74162-1150 74162-1250 74162-1350 74162-1450 74162-1550 74162-1072 74162-1172 74162-1272 74162-1372 74162-1472 74162-1572 cua MM/IN 1A INCH [OC] ILLER 2009 SALES ASSEMBLY WAFER-RIGHT ANGLE FULLY <q & 2009 ILLER 2009 q <q i & SHEET 1 NO; UCP2015-2054 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX AND SHOULD NOT BE USED WITHOUT WRITTEN s 2 7 6 6 a 2 1 o 9 a 7 6 5 4 a 2 12 | s | s | v | * | 5 | * | 2 | | . | : | 6 7 | 5 | | 3 | 2 | 1 VERSION C WITH POLARIZATION SLOTS CKT.| DIM. "A" | DIM. "B" | DIM, C" | DIM. "F" | DIM. "G" | DIM. "H" | DIM. "X" 4 Sgr Ago Sop Ad gad So. _ 4 (3.817.150 END CIRCUITS TO INSIDE END WALLS) 40.15) (2540.08) al oa 17 : = H REF. | #006 1008.03 os | Sight | gt | ag | | | Spe | Sage | | 110029 yop _ $$ 99-09 2 | Sa a [Se | | [ing age | $6 SS $6655 a | Sa | pe | egg | | | apg | ge | | | yep cae = | SE | |g | | [a [ge eo | Se | | Sa | | [Sa | ee | k =200 RECOMMENDED P.C. BOARD HOLE LAYOUT 20 Sa ape gpa) | ce 449 ll, t } zz | Set | ae | Saget | | | Se | Aap | = 2 a [aa [eae | a | a |e [ | 20 0000.30 | 26 | | hae | Bae | SB | | Se | Se | 8 32, sea za [ [ ae | ae |[ge [e [ ||- UT REF SLATE AREA 30 | fa pe pg? | | Soe | 4 | 32 }_ cures ae se | A | a | (la | Bag | 2 [ | |Z ae mec re ESE Ge Ge Ge ee i 3a | ee | Sea | ade | ee | ac | Se | Ae | || Ts 0 | -Gaae | SRe | teas | ee | earee | See | ae | oa =r, | SE [Sa [ae |e | S| Be | Se | | , Lage i | | [aR | [| ge | ge | 7 ae | Seah | Seah | ee | eRe | aac | aa | SP | || 45 | Seah | Sais | Sense | Sab | ate | Se | P| (2.54) pre ee tee PP ee LR. so | Se | Shae | Suse | eg | ete | Shee | Aye | || sd | PLATE AREA se | ae | nie | See | ap | ate | Se | AP || 20 4 | Saat | She | Re | See | Sue | eee | ee | | comms, wa (a [ava [ae [ae [ee |e | . Se sa | Seat | Seas | tale | thee | See | Sa | 44 | ]| * NOTES 60 | eee | ebee | SaBe | thee | See | See | SP || 1, MATERIAL: SHROUDED WAFER: GLASS FILLED, LIQUID CRYSTAL POLYMER. : | S09 | 2500} L085 | L080 | SIZ} |__ mo WFER foe tae: OW oa | SE | ae | uae ea [ae [eae | ge | E 2 NSN = 3.81 MIGROMETERS/I50 MRONCHES MNMUM TIN PLATE je | ish | Bas? | Eo | Eb | pase | OEE | ie E OVER NICKEL UNDERPLATE OVERALL 66 | hd | Seep | bee) | ETaD | Gee) | eee | te | _ 16.23) 1 GOLD - 0.38 MICROMETERS/15 MICROINCHES MINIMUM GOLD PLATE IN SELECT AREA - alaay aR Ro TT EDT eaar 1 laa por Ta __| 639 REF. 491 MICROMETERS/75 MICRONCHES MINIMUM TIN PLATE IN SELECT AREA os | SRP | eae | ee | TaD | GSae | ap | ae | |} | OVER NICKEL UNDERPLATE OVERALL 0 5 n ee ey a | (4.80) _ 30 GOLD - 0.76 MICROMETERS/30 MICROINCHES MINIMUM GOLD PLATE IN SELECT AREA 72 5 Ttegaal | Seeeor | Setar | Seger | eear Bag D z 159 REF. 181 MGROMETERS76 MIGRONGHES MINMUM TIN PLATE IN SELECT AREA Sp ! , 4 || f 3, PRODUCT SPECIFICATION: PS-74162-0001 4, PACKAGING INFORMATION: SEE CHARTS 5, FOR CHARTED DIMENSIONS AND ASSEMBLY NO.S NOT SHOWN ON THIS SHEET - SEE SHEET 6, / 6. 20 CIRCUIT SIZE SHOWN FOR ILLUSTRATION PURPOSES. 7, PIN PUSHOUT FORCE: (17.79 Ni/4 LBS MINIMUM, c 8. PINS MUST MEET SOLDERABLILITY SPEC. ML-STD-202 METHOD 208B. c (0.38) 9, ROW TO ROW PIN HEIGHT VARIATION MUST NOT EXCEED (0.25)/.010 IN. 05 | 10. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS-<5499-002. 4 Sas ; | Saa| QUAM Ghesespecreo | MM/IN. | at | INCH [OCTZHRR ANGLE B (10,29) tee 3 mm INCH DRAWN BY DATE TITLE B BRRR|2| WH SLACES|E=-- TE=== SALES ASSEMBLY 1 i EY Ee eeu") WAFER-RIGHT. ANGLE FULLY be smely| VO (ZPLAces|0.25 [4.074 BBARKER 2009/03/27 SHROUDED .100 GRID = ] wees w=0 [AeA 2s ELLER 2009/03/27 2.16) a 3 3 a 3 7 eA AGULAR 4722 |RATERIAL NO. DOCUMENT NO. a 085 REF. he ==8 DRAFT WHERE APPLICABLEL._.oEE TABLE SD-74162-004 5 oF 8| Ww ou > MUST REMAIN THIS DRAWING CONTAINS INFORMATION THAT IS PROPRETARY TO MOLEX C 5 WITHIN DIMENSIONS LD [INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMSSION Rens | Ss | s v 6 Ss " B 2 n 2 , | 8 | 7 6 | 5 | 4 | 3 2 1VERSION C WITH POLARIZATION SLOTS (3.81/.150 END CIRCUITS TO INSIDE END WALLS) CONNECTOR END PLATING | PC BOARD END PLATING ITEM NUMBER | _p PLATING r L | INFORMATION 74162 FINISH TYPE LENGTH TYPE |LENGTH| MEAS. | PK-70873 -2006-2072 +: TIN TIN TIN 0019 -2106-2172 saa, TIN TIN TIN 0019 -2206-2272 | =3A- 15 GOLD TIN " 0019 -2306-2372 45 GOLD TIN o019 -2406-2472 a 30 GOLD si TIN ai 0019 -2506-2572 SI 30 GOLD Fi TIN a 0019 74162-2008 74162-2108 74162-2208 74162-2308 74162-2408 74162-2508 74162-2030 74162-2130 74162-2230 74162-2330 74162-2430 74162-2530 74162-2038 74162-2138 74162-2238 74162-2338 74162-2438 74162-2538 74162-2066 74162-2166 74162-2266 74162-2366 74162-2466 74162-2566 74162-2068 74162-2168 74162-2268 74162-2368 74162-2468 74162-2568 QUALITY 1A INCH cl W-0 SALES ASSEMBLY 9-0 WAFER-RIGHT ANGLE FULLY W-0 =BMILLER DESCRIPTION SHEET 1 NO: UCP2015-2054 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX AND SHOULD NOT BE USED WITHOUT WRITTEN . a v 6 a] . 2 b | 2 9 6 7 6 5 4 3 2 1VERSION A, B, OR C WITH VOID(S) NOTES 1. MATERIAL: SHROUDED WAFER: GLASS FILLED, LIQUID CRYSTAL POLYMER, b VERSION A COLOR: BLACK; UL94V-0 PINS: COPPER ALLOY (2.54 2. FINISH: "1 loo Trp. TIN - 3.81 MICROMETERS/150 MICRONCHES } MINIMUM TIN PLATE OVER NICKEL UNDERPLATE OVERALI 1 GOLD - 0,38 MICROMETERS/15 MIORONCHES } MINIMUM GOLD PLATE IN SELECT AREA 1.91 MICROMETERS/75 MICROINCHES MINIMUM TIN PLATE IN SELECT AREA OVER NICKEL UNDERPLATE OVERALL 30 GOLD - 0.76 MICROMETERS/30 MICRONCHES MINIMUM GOLD PLATE IN SELECT AREA 4.91 MICROMETERS/75 MICROINCHES MNIMUM TIN PLATE IN SELECT AREA OVER NICKEL UNDERPLATE OVERALL PRODUCT SPECIFICATION: PS-74162-0001 PACKAGING INFORMATION: SEE CHARTS PINS MUST MEET SOLDERABLILITY SPEC. MIL-STD-202 METHOD 2088. PIN PUSHOUT FORCE: (17.79 Ni/6 LBS MINIMUM, ROW TO ROW PIN HEIGHT VARIATION MUST NOT EXCEED (0.25)/.010 IN. 20 CIRCUIT SIZE WITH PINS VODED IN LOCATIONS A-2 AND 6-2 SHOWN FOR ILLUSTRATION PURPOSES. FOR VARIABLE DIMENSIONS, CIRCUIT SIZE, WAFER STYLE AND ASSEMBLY NUMBER - SEE SHEET 8. "RE rt r 40. FOR VODED FIN LOCATIONS SEE STYLE C" AND CHART ON SHEET 8. SNORE w 2 11. FOR DIMENSIONS NOT SHOWN, FIRST: DETERMINE THE SHROUDED WAFER STYLE FROM CHART ON SHEET 8, SECOND: USING WAFER STYLE, LOCATE THE CORRESPONDING J" REF Je- SELECTIVE SHEET WITH NON-VODED ASSEMBLIES AND DIMENSIONS | VERSION B PLATE AREA FOR ALL CIRCUIT SIZES. 12. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC J+ SEE NOTE 7 SPECIFICATION PS3-45499-002, 4 r y | t "pt REF. a. Ek 98) (2.54) 2/5T REF. "100 F Ge . ee . VERSION C SECTION J-J D Row at Row '' c 1234567890 | Sez] GENERAL TOLERANCES DRENSON STYIE SCALE] DESEN UNTS THIRD. ANGLE USE FOR LOCATING VOIDED PINS ON ALL STYLES S82] yo (UNLESS SPECRIED) MM/IN 4A INCH [ Cl PROJECTION LETTERS AND NUMBERS ARE NOT DESIGNATED ON WAFER HOUSING see INCH | DRAWN BY DATE TITLE . SS BREE lw-0 (PAE MILLER 2009/03/27 SALES ASSEMBLY (SEE NOTE 10 AND CHART ON SHEET @ -% j FPL CHECKED BY DATE WAFER-RIGHT ANGLE FULLY | DS =5e W=0 [2 PLAC BBARKER 2009/03/27| SHROUDED .100 GRID we 3 | Ww 4 PLACE APPROVED BY DATE Rr eSes| |V-O [Place MILLER 2009/03/27] mm S322 ANGULAR He MATERIAL NO. DOCUMENT NO. SHEET NO. We eee DRAFT WHERE APPLICABLE|_SEE TABLE SD-74162-001 7 OF 8 Auoo = MAIN 5 THS DRAWING CONTANS INFORMATION THAT IS PROPRIETARY TO MOLEX C Og WITHIN DIMENSIONS INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION Bar G Pac os a 7 6 6 B 2 " 2 5 6 7 6 t 4 | 3 2 1VERSION A, B, OR C WITH VOID(S) SHROUDED CONNECTOR END PLATING PC_BOARD END PLATING | yoiDED PIN LOCATIONS) ITEM NUMBER wareR CKT P PLATING J L (SEE NOTE 8 ON SHEET 7)| NFORMATION 74162 5 FINISH TYPE |LENGTH TYPE |LENGTH PK-70873 SEE SHEET 7 ROW POSITION Inn fun ls 74162-3001 E . TIN TN | 32 TIN A 1 0019 A 8 0019 08 00. 74162-3002 TIN TIN = g. TIN 08 Shs} lab A 4 0019 74612-3003 - * 15 GOLD 56 TIN # x 15 GOLD TIN 30 GOLD TIN x x Fi 30 GOLD TIN x TIN TIN QUALITY 1A INCH c] SALES ASSEMBLY WAFER-RIGHT ANGLE FULLY DESCRIPTION ILLER SHEET 1 NO: UCP2015-2054 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX AND SHOULD NOT BE USED WITHOUT WRITT! 2 v a a 2 fl 2 9 a 7 6 3 a 3 2 41