Micro Sensing Device Data Book OMRON Corporation Industrial Automation Company Sensing Devices Division H.Q. Industrial Sensors Division Industrial Sensors Division Shiokoji Horikawa, Shimogyo-ku, Kyoto, 600-8530 Japan Tel: (81)75-344-7022/Fax: (81)75-344-7107 In the interest of product improvement, specifications are subject to change without notice. Authorized Distributor: Cat. No. X062-E1-05 Printed in Japan 0306-0.1M(C) CONTENTS Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Microphotonic Devices 2 Manuscript Paper Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Photomicrosensors Technical Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Transmissive Photomicrosensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Reflective Photomicrosensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Emitters and Detectors Emitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 General Information Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 Security Trade Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 1 Selection Guide Sensing method Transmissive Sensing distance Output configuration Features Page 1.0 mm EE-SX1107 Phototransistor Ultra-compact, surface mounting 72 2.0 mm EE-SX1018 Phototransistor Compact, general purpose 32 EE-SX1049 Phototransistor Compact, general purpose 46 EE-SX1103 Phototransistor Ultra-compact, general purpose 66 EE-SX1105 Phototransistor Ultra-compact, general purpose 68 EE-SX1108 Phototransistor Ultra-compact, surface mounting 76 EE-SX1131 Phototransistor Ultra-compact, surface mounting, dualchannel output 88 EE-SX4134 Photo-IC Ultra-compact, surface mounting 154 EE-SX493 Photo-IC High resolution 146 2.1 mm EE-SX1023-W1 Phototransistor Harness connecting 34 2.8 mm EE-SX1031 Phototransistor Dual-channel output 36 EE-SX1055 Phototransistor Compact, excellent cost performance 48 EE-SX1046 Phototransistor With a horizontal aperture 44 EE-SX1082 Phototransistor With a horizontal aperture 60 EE-SX1106 Phototransistor Ultra-compact, general purpose 70 EE-SX1109 Phototransistor Ultra-compact, surface mounting 80 EE-SX129 Phototransistor High resolution 98 EE-SX198 Phototransistor General purpose 104 EE-SX199 Phototransistor With a positioning boss 106 EE-SX298 Photo-Darlington transistor General purpose 128 EE-SX398/498 Photo-IC General purpose 148 EE-SX1071 Phototransistor General purpose 56 EE-SX1088 Phototransistor Screw mounting 62 EE-SX1096 Phototransistor With a horizontal aperture 64 EE-SX138 Phototransistor Screw mounting 100 EE-SX153 Phototransistor Screw mounting 102 EE-SH3 series Phototransistor Screw mounting 118 EE-SJ3 series Phototransistor Screw mounting 120 3.0 mm 3.4 mm 2 Model EE-SV3 series Phototransistor Screw mounting 126 EE-SX301/401 Photo-IC General purpose 130 EE-SX305/405 Photo-IC With a horizontal aperture 132 EE-SX3088/4088 Photo-IC Screw mounting 138 3.5 mm EE-SX384/484 Photo-IC General purpose 144 3.6 mm EE-SX1057 Phototransistor Dust-proof construction, general purpose 50 EE-SG3(-B) Phototransistor Dust-proof construction 116 4.2 mm EE-SX1128 Phototransistor With a horizontal aperture 86 4.6 mm EE-SX1061 Phototransistor General purpose 52 5.0 mm EE-SX1041 Phototransistor General purpose 40 EE-SX1042 Phototransistor High profile 42 EE-SX1081 Phototransistor General purpose 58 EE-SX1115 Phototransistor High profile with positioning pins 84 EE-SX1137 Phototransistor General purpose 92 EE-SX1235A-P2 Phototransistor Snap-in mounting 96 5.0 mm EE-SJ5-B Phototransistor General purpose 122 3.4 mm EE-SX338 Photo-IC Screw mounting, horizontal aperture 142 Selection Guide Sensing method Transmissive Sensing distance Reflective Output configuration Features Page 5.0 mm EE-SX3081/4081 Photo-IC General purpose 4.0 mm EE-SX3133 Photo-IC Screw mounting, horizontal aperture 140 5.0 mm EE-SX3239-P2 Photo-IC Snap-in mounting 160 EE-SX3009-P1/ 4009-P1 Photo-IC Screw mounting 150 EE-SX4019-P2 Photo-IC Screw mounting 152 EE-SX4235A-P2 Photo-IC Snap-in mounting 158 136 EE-SX460-P1 Photo-IC Snap-in mounting 162 5.2 mm EE-SX1035 Phototransistor Compact, wide 38 8.0 mm EE-SX1070 Phototransistor General purpose 54 EE-SJ8-B Phototransistor High profile 124 EE-SX3070/4070 Photo-IC General purpose 134 12 mm EE-SPX415-P2 Photo-IC Use light modulation built-in Amplifier IC 168 15.0 mm EE-SX461-P11 Photo-IC Easy to mount 164 14 mm EE-SX1140 Phototransistor Wide, high profile 94 108 Actuator mount- --ing Actuator Model --- EE-SA102 Phototransistor General purpose EE-SA104 Phototransistor Compact 110 EE-SA407-P2 Photo-IC Easy to mount 166 112 EE-SA105 Phototransistor General purpose EE-SA113 Phototransistor General purpose 114 EE-SY124 Phototransistor Ultra-compact, general purpose 174 EE-SY125 Phototransistor Ultra-compact, surface mounting 176 EE-SY193 Phototransistor Ultra-compact, surface mounting 188 3.5 mm EE-SY171 Phototransistor Thin 186 4.0 mm EE-SY169 Phototransistor High resolution (red LED) 180 EE-SY169A Phototransistor High resolution (infrared LED) 182 EE-SY169B Phototransistor High resolution (red LED) 184 1.0 mm 4.4 mm 5.0 mm EE-SY113 Phototransistor Dust-proof 172 EE-SY313/413 Photo-IC Dust-proof 198 EE-SY110 Phototransistor General purpose 170 EE-SB5(-B) Phototransistor Screw mounting 192 EE-SF5(-B) Phototransistor Dust-proof 194 EE-SY310/410 Photo-IC General purpose 196 Selection Guide 3 4 Selection Guide Microphotonic Devices Manuscript Paper Sensors EY3A-1051 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EY3A-1081 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EY3A-112 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 10 5 Manuscript Paper Sensor (1 Beam: 50 mm) EY3A-1051 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. Positioning boss 7.9 dia. Center of detector 8.3 dia . 3.2+0.2 -0 dia. Center of emitter Pin no. 1 * Ensures higher sensitivity and external light interference resistivity than any other photomicrosensor. * Narrow sensing range ensures stable sensing of a variety of sensing objects. Absolute Maximum Ratings (Ta = 25C) Item Rated value VCC 7V Load voltage VOUT 7V Load current IOUT 10 mA Ambient temperature 15 0.5 Symbol Power supply voltage Operating Topr 0C to 60C Storage Tstg -15C to 70C Note: Make sure there is no icing or condensation when operating the Sensor. 8 dia. 3 +0 -0.2 dia. Pin no. Remarks Name 1 2 O V Output (OUT) Power supply (Vcc) 3 G Ground (GND) Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 0.3 3 mm max. 3 < mm 6 0.375 6 < mm 10 10 < mm 18 0.45 0.55 18 < mm 30 0.65 30 < mm 50 0.8 Recommended Mating Connectors: Japan Molex 51090-0300 (crimp connector) 52484-0310 (press-fit connector) Electrical and Optical Characteristics (Ta = 0C to 60C) Item Value Condition Power supply voltage 5 V 5% --- Current consumption 50 mA max. VCC = 5 V, RL = Peak current consumption 200 mA max. VCC = 5 V, RL = Low-level output voltage 0.6 V max. VCC = 5 V, IOL = 4 mA (see note 1) High-level output voltage 3.5 V min. VCC = 5 V, RL = 4.7 k (see note 2) Response delay time (High to Low) 1.5 ms max. The time required for the output to become "Lo" after placing sensing object. Response delay time (Low to high) 1.5 ms max. The time required for the output to become "Hi" after removing sensing object. Note: 1. These conditions are for the sensing of lusterless paper with an OD of 0.9 maximum located at the correct sensing position of the Sensor as shown in the optical path arrangement on page 7. 2. These conditions are for the sensing of the paper supporting plate with an OD of 0.05 located using the glass plate without paper as shown in the optical path arrangement on page 7. 6 EY3A-1051 Manuscript Paper Sensor (1 Beam: 50 mm) Characteristics (Paper Table Glass: t = 6 mm max., Transparency Rate: 90% min.) (Ta =0C to 60C) Item Characteristic value Sensing density Lusterless paper with an OD of 0.9 max. (sensing distance: 50 mm) (see note) Non-sensing distance 85 mm (from the top of the sensor), OD: 0.05 Paper sensing distance 50 mm (from the top of the sensor) Ambient illumination Sunlight: 3,000 lx max., fluorescent light: 2,000 lx max. Note: 1. The data shown are initial data. 2. Optical darkness (OD) is defined by the following formula: OD = - log10 PIN (mW): POUT PIN Light power incident upon the document POUT (mW): Reflected light power from the document Optical Path Arrangement 85 (see note 2) 10 dia. (see note 1) 50 (standard value) 8.9 Paper supporting plate Glass Note: 1. The part with oblique lines indicates the paper sensing area of the EY3A-1051, which is practically determined by the diameter of the beam and its tolerance. 2. The non-sensing distance of the EY3A-1051 is determined using a paper with an OD of 0.05. Engineering Data Distance Characteristics (Typical) OD (value) 4.75 V 5.0 V 5.25 V Distance (mm) EY3A-1051 Manuscript Paper Sensor (1 Beam: 50 mm) 7 Manuscript Paper Sensor (1 Beam: 80 mm) EY3A-1081 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ensures higher sensitivity and external light interference resistivity than any other photomicrosensor. * Narrow sensing range ensures stable sensing of a variety of sensing objects. Center of detector Positioning boss Absolute Maximum Ratings (Ta = 25C) 7.9 dia. 8.3 dia. Center of emitter 3.2 Item +0.2 0 dia. Pin no.1 Symbol Rated value Power supply voltage VCC 7V Load voltage VOUT 7V Load current IOUT 10 mA Operating Topr 0C to 60C Storage Tstg -15C to 70C Ambient temperature Note: Make sure there is no icing or condensation when operating the Sensor. 3 Pin no. Remarks 0 -0.2 dia. Name 1 O Output (OUT) 2 3 V G Power supply (Vcc) Ground (GND) Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 3 mm max. 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 30 < mm 50 0.8 50 < mm 80 0.95 Recommended Mating Connectors: Japan Molex 51090-0300 (crimp connector) 52484-0310 (press-fit connector) Electrical and Optical Characteristics (Ta = 0C to 60C) Item Value Condition Power supply voltage 5 V 5% --- Current consumption 50 mA max. VCC = 5 V, RL = Peak current consumption 200 mA max. VCC = 5 V, RL = Low-level output voltage 0.6 V max. VCC = 5 V, IOL = 4 mA (see note 1) High-level output voltage 3.5 V min. VCC = 5 V, RL = 4.7 k (see note 2) Response delay time (High to Low) 1.5 ms max. The time required for the output to become "Lo" after placing sensing object. Response delay time (Low to high) 1.5 ms max. The time required for the output to become "Hi" after removing sensing object. Note: 1. These conditions are for the sensing of lusterless paper with an OD of 0.7 maximum located at the correct sensing position of the Sensor as shown in the optical path arrangement on page 9. 2. These conditions are for the sensing of the paper supporting plate with an OD of 0.05 located using the glass plate without paper as shown in the optical path arrangement on page 9. 8 EY3A-1081 Manuscript Paper Sensor (1 Beam: 80 mm) Characteristics (Paper Table Glass: t = 6 mm max., Transparency Rate: 90% min.) (Ta =0C to 60C) Item Characteristic value Sensing density Lusterless paper with an OD of 0.7 max. (sensing distance: 80 mm) (see note) Non-sensing distance 120 mm (from the top of the sensor), OD: 0.05 Paper sensing distance 80 mm (from the top of the sensor) Ambient illumination Sunlight: 3,000 lx max., fluorescent light: 2,000 lx max. Note: 1. The data shown are initial data. 2. Optical darkness (OD) is defined by the following formula: OD = - log10 POUT PIN PIN (mW):Light power incident upon the document POUT (mW):Reflected light power from the document Optical Path Arrangement 120 (see note 2) 80 (Standard value) 10 dia. (see note 1) Paper supporting plate Glass Note: 1. The part with oblique lines indicates the paper sensing area of the EY3A-1081, which is practically determined by the diameter of the beam and its tolerance. 2. The non-sensing distance of the EY3A-1081 is determined using a paper with an OD of 0.05. Engineering Data OD (value) Distance Characteristics (Typical) 4.75 V 5.0 V 5.25 V Distance (mm) EY3A-1081 Manuscript Paper Sensor (1 Beam: 80 mm) 9 Manuscript Paper Sensor (1 Beam: 125 mm) EY3A-112 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ensures higher sensitivity and external light interference resistivity than any other photomicrosensor. * Narrow sensing range ensures stable sensing of a variety of sensing objects. Center of detector Positioning boss Absolute Maximum Ratings (Ta = 25C) Item Two, 10 dia. Center of emitter 53325-0310 (Japan Molex) 3.2 +0.2 0 dia. Pin no.1 Symbol Rated value Power supply voltage VCC 7V Load voltage VOUT 7V Load current IOUT 10 mA Operating Topr 0C to 65C Storage Tstg -15C to 70C Ambient temperature Note: Make sure there is no icing or condensation when operating the Sensor. 0 3 -0.2 dia. C1 Pin no. Remarks Name 1 O Output (OUT) 2 V Power supply (Vcc) 3 G Ground (GND) Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 3 mm max. 0.3 3 < mm 6 6 < mm 10 0.375 0.45 10 < mm 18 0.55 18 < mm 30 0.65 30 < mm 50 0.8 50 < mm 80 0.95 Recommended Mating Connectors: Japan Molex 51090-0300 (crimp connector) 52484-0310 (press-fit connector) Electrical and Optical Characteristics (Ta = 0C to 65C) Item Power supply voltage Value 5 V 5% Condition --- Current consumption 50 mA max. VCC = 5 V, RL = Peak current consumption 200 mA max. VCC = 5 V, RL = Low-level output voltage 0.6 V max. VCC = 5 V, IOL = 4 mA (see note 1) High-level output voltage 3.5 V min. VCC = 5 V, RL = 4.7 k (see note 2) Response delay time (High to Low) 35 ms max. The time required for the output to become "Lo" after placing sensing object. Response delay time (Low to high) 20 ms max. The time required for the output to become "Hi" after removing sensing object. Note: 1. These conditions are for the sensing of lusterless paper with an OD of 0.6 maximum located at the correct sensing position of the Sensor as shown in the optical path arrangement on page 11. 2. These conditions are for the sensing of the paper supporting plate with an OD of 0.05 located using the glass plate without paper as shown in the optical path arrangement on page 11. 10 EY3A-112 Manuscript Paper Sensor (1 Beam: 125 mm) Characteristics (Paper Table Glass: t = 6 mm max., Transparency Rate: 90% min.) (Ta =0C to 65C) Item Characteristic value Sensing density Lusterless paper with an OD of 0.6 max. (sensing distance: 125 mm) (see note) Non-sensing distance 185 mm (from the top of the sensor), OD: 0.05 Paper sensing distance 125 mm (from the top of the sensor) Ambient illumination Sunlight: 3,000 lx max., fluorescent light: 2,000 lx max. Note: 1. The data shown are initial data. 2. Optical darkness (OD) is defined by the following formula: OD = - log10 POUT PIN PIN (mW): Light power incident upon the document POUT (mW): Reflected light power from the document Optical Path Arrangement (beam center) 185 min. 13 dia. 4 dia. 125 (standard value) (beam diameter) 8.5 (beam center) Paper supporting plate Glass Engineering Data Distance Characteristics (Estimated Lower-limit Value) OD (value) 4.75 V 5.0 V 5.25 V Distance (mm) EY3A-112 Manuscript Paper Sensor (1 Beam: 125 mm) 11 12 EY3A-112 Manuscript Paper Sensor (1 Beam: 125 mm) Photomicrosensors Transmissive Sensors Technical Information . . . . . . . . . . . . . . Precautions . . . . . . . . . . . . . . . . . . . . . Application Examples . . . . . . . . . . . . . . EE-SX1018. . . . . . . . . . . . . . . . . . . . . . EE-SX1023-W1 . . . . . . . . . . . . . . . . . . EE-SX1031. . . . . . . . . . . . . . . . . . . . . . EE-SX1035. . . . . . . . . . . . . . . . . . . . . . EE-SX1041. . . . . . . . . . . . . . . . . . . . . . EE-SX1042. . . . . . . . . . . . . . . . . . . . . . EE-SX1046. . . . . . . . . . . . . . . . . . . . . . EE-SX1049. . . . . . . . . . . . . . . . . . . . . . EE-SX1055. . . . . . . . . . . . . . . . . . . . . . EE-SX1057. . . . . . . . . . . . . . . . . . . . . . EE-SX1061. . . . . . . . . . . . . . . . . . . . . . EE-SX1070. . . . . . . . . . . . . . . . . . . . . . EE-SX1071. . . . . . . . . . . . . . . . . . . . . . EE-SX1081. . . . . . . . . . . . . . . . . . . . . . EE-SX1082. . . . . . . . . . . . . . . . . . . . . . EE-SX1088. . . . . . . . . . . . . . . . . . . . . . EE-SX1096. . . . . . . . . . . . . . . . . . . . . . EE-SX1103. . . . . . . . . . . . . . . . . . . . . . EE-SX1105. . . . . . . . . . . . . . . . . . . . . . EE-SX1106. . . . . . . . . . . . . . . . . . . . . . EE-SX1107. . . . . . . . . . . . . . . . . . . . . . EE-SX1108. . . . . . . . . . . . . . . . . . . . . . EE-SX1109. . . . . . . . . . . . . . . . . . . . . . EE-SX1115. . . . . . . . . . . . . . . . . . . . . . EE-SX1128. . . . . . . . . . . . . . . . . . . . . . EE-SX1131. . . . . . . . . . . . . . . . . . . . . . EE-SX1137. . . . . . . . . . . . . . . . . . . . . . EE-SX1140. . . . . . . . . . . . . . . . . . . . . . EE-SX1235A-P2. . . . . . . . . . . . . . . . . . EE-SX129. . . . . . . . . . . . . . . . . . . . . . . EE-SX138. . . . . . . . . . . . . . . . . . . . . . . 14 27 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 76 80 84 86 88 92 94 96 98 100 EE-SX153 . . . . . . . . . . . . . . . . . . . . . . EE-SX198 . . . . . . . . . . . . . . . . . . . . . . EE-SX199 . . . . . . . . . . . . . . . . . . . . . . EE-SA102 . . . . . . . . . . . . . . . . . . . . . . EE-SA104 . . . . . . . . . . . . . . . . . . . . . . EE-SA105 . . . . . . . . . . . . . . . . . . . . . . EE-SA113 . . . . . . . . . . . . . . . . . . . . . . EE-SG3/EE-SG3-B . . . . . . . . . . . . . . . EE-SH3 Series. . . . . . . . . . . . . . . . . . . EE-SJ3 Series . . . . . . . . . . . . . . . . . . . EE-SJ5-B . . . . . . . . . . . . . . . . . . . . . . . EE-SJ8-B . . . . . . . . . . . . . . . . . . . . . . . EE-SV3 Series . . . . . . . . . . . . . . . . . . . EE-SX298 . . . . . . . . . . . . . . . . . . . . . . EE-SX301/-SX401 . . . . . . . . . . . . . . . . EE-SX305/-SX405 . . . . . . . . . . . . . . . . EE-SX3070/-SX4070 . . . . . . . . . . . . . . EE-SX3081/-SX4081 . . . . . . . . . . . . . . EE-SX3088/-SX4088 . . . . . . . . . . . . . . EE-SX3133 . . . . . . . . . . . . . . . . . . . . . EE-SX338 . . . . . . . . . . . . . . . . . . . . . . EE-SX384/-SX484 . . . . . . . . . . . . . . . . EE-SX493 . . . . . . . . . . . . . . . . . . . . . . EE-SX398/498 . . . . . . . . . . . . . . . . . . . EE-SX3009-P1/-SX4009-P1 . . . . . . . . EE-SX4019-P2. . . . . . . . . . . . . . . . . . . EE-SX4134 . . . . . . . . . . . . . . . . . . . . . EE-SX4235A-P2 . . . . . . . . . . . . . . . . . EE-SX3239-P2. . . . . . . . . . . . . . . . . . . EE-SX460-P1. . . . . . . . . . . . . . . . . . . . EE-SX461-P11. . . . . . . . . . . . . . . . . . . EE-SA407-P2. . . . . . . . . . . . . . . . . . . . EE-SPX415-P2 . . . . . . . . . . . . . . . . . . 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 134 136 138 140 142 144 146 148 150 152 154 158 160 162 164 166 168 Reflective Sensors EE-SY110. . . . . . . . . . . . . . . . . . . . . . . EE-SY113. . . . . . . . . . . . . . . . . . . . . . . EE-SY124. . . . . . . . . . . . . . . . . . . . . . . EE-SY125. . . . . . . . . . . . . . . . . . . . . . . EE-SY169. . . . . . . . . . . . . . . . . . . . . . . EE-SY169A . . . . . . . . . . . . . . . . . . . . . EE-SY169B . . . . . . . . . . . . . . . . . . . . . EE-SY171. . . . . . . . . . . . . . . . . . . . . . . EE-SY193. . . . . . . . . . . . . . . . . . . . . . . EE-SB5(-B). . . . . . . . . . . . . . . . . . . . . . EE-SF5(-B). . . . . . . . . . . . . . . . . . . . . . EE-SY310/-SY410 . . . . . . . . . . . . . . . . EE-SY313/-SY413 . . . . . . . . . . . . . . . . 170 172 174 176 180 182 184 186 188 192 194 196 198 13 Technical Information Features of Photomicrosensors The Photomicrosensor is a compact optical sensor that senses objects or object positions with an optical beam. The transmissive Photomicrosensor and reflective Photomicrosensor are typical Photomicrosensors. The transmissive Photomicrosensor incorporates an emitter and a transmissive that face each other as shown in Figure 1. When an object is located in the sensing position between the emitter and the detector, the object intercepts the optical beam of the emitter, thus reducing the amount of optical energy reaching the detector. The reflective Photomicrosensor incorporates an emitter and a detector as shown in Figure 2. When an object is located in the sensing area of the reflective Photomicrosensor, the object reflects the optical beam of the emitter, thus changing the amount of optical energy reaching the detector. "Photomicrosensor" is an OMRON product name. Generally, the Photomicrosensor is called a photointerrupter. Figure 1. Transmissive Photomicrosensor LED Phototransistor Datasheet Absolute Maximum Ratings and Electrical and Optical Characteristics The datasheets of Photomicrosensors include the absolute maximum ratings and electrical and optical characteristics of the Photomicrosensors as well as the datasheets of transistors and ICs. It is necessary to understand the difference between the absolute maximum ratings and electrical and optical characteristics of various Photomicrosensors. Absolute Maximum Ratings The absolute maximum ratings of Photomicrosensors and other products with semiconductors specify the permissible operating voltage, current, temperature, and power limits of these products. The products must be operated absolutely within these limits. Therefore, when using any Photomicrosensor, do not ignore the absolute maximum ratings of the Photomicrosensor, or the Photomicrosensor will not operate precisely. Furthermore, the Photomicrosensor may be deteriorate or become damaged, in which case OMRON will not be responsible. Practically, Photomicrosensors should be used so that there will be some margin between their absolute maximum ratings and actual operating conditions. 14 Technical Information Figure 2. Reflective Photomicrosensor LED Phototransistor Electrical and Optical Characteristics The electrical and optical characteristics of Photomicrosensors indicate the performance of Photomicrosensors under certain conditions. Most items of the electrical and optical characteristics are indicated by maximum or minimum values. OMRON usually sells Photomicrosensors with standard electrical and optical characteristics. The electrical and optical characteristics of Photomicrosensors sold to customers may be changed upon request. All electrical and optical characteristic items of Photomicrosensors indicated by maximum or minimum values are checked and those of the Photomicrosensors indicated by typical values are regularly checked before shipping so that OMRON can guarantee the performance of the Photomicrosensors. In short, the absolute maximum ratings indicate the permissible operating limits of the Photomicrosensors and the electrical and optical characteristics indicate the maximum performance of the Photomicrosensors. Terminology The terms used in the datasheet of each Photomicrosensor with a phototransistor output circuit or a photo IC output circuit are explained below. Phototransistor Output Photomicrosensor Symbol Item Definition IFP Pulse forward current The maximum pulse current that is allowed to flow continuously from the anode to cathode of an LED under a specified temperature, a repetition period, and a pulse width condition. IC Collector current The current that flows to the collector junction of a phototransistor. PC Collector dissipation The maximum power that is consumed by the collector junction of a phototransistor. ID Dark current The current leakage of the phototransistor when a specified bias voltage is imposed on the phototransistor so that the polarity of the collector is positive and that of the emitter is negative on condition that the illumination of the Photomicrosensor is 0 lx. IL Light current The collector current of a phototransistor under a specified input current condition and at a specified bias voltage. VCE (sat) Collector-emitter saturated The ON-state voltage between the collector and emitter of a phototransistor under a specified bias curvoltage rent condition. ILEAK Leakage current The collector current of a phototransistor under a specified input current condition and at a specified bias voltage when the phototransistor is not exposed to light. tr Rising time The time required for the leading edge of an output waveform of a phototransistor to rise from 10% to 90% of its final value when a specified input current and bias condition is given to the phototransistor. tf Falling time The time required for the trailing edge of an output waveform of a phototransistor to decrease from 90% to 10% of its final value when a specified input current and bias condition is given to the phototransistor. VCEO Collector-emitter voltage The maximum positive voltage that can be applied to the collector of a phototransistor with the emitter at reference potential. VECO Emitter-collector voltage The maximum positive voltage that can be applied to the emitter of a phototransistor with the collector at reference potential. Phototransistor/Photo IC Output Photomicrosensor Symbol Item Definition IF Forward current The maximum DC voltage that is allowed to flow continuously from the anode of the LED to the cathode of the LED under a specified temperature condition. VR Reverse voltage The maximum negative voltage that can be applied to the anode of the LED with the cathode at reference potential. VCC Supply voltage The maximum positive voltage that can be applied to the voltage terminals of the photo IC with the ground terminal at reference potential. VOUT Output voltage The maximum positive voltage that can be applied to the output terminal with the ground terminal of the photo IC at reference potential. IOUT Output current The maximum current that is allowed to flow in the collector junction of the output transistor of the photo IC. POUT Output permissible dissipation The maximum power that is consumed by the collector junction of the output transistor of the photo IC. VF Forward voltage The voltage drop across the LED in the forward direction when a specified bias current is applied to the photo IC. IR Reverse current The reverse leakage current across the LED when a specified negative bias is applied to the anode with the cathode at reference potential. VOL Output low voltage The voltage drop in the output of the photo IC when the IC output is turned ON under a specified voltage and output current applied to the photo IC. VOH Output high voltage The voltage output by the photo IC when the IC output is turned OFF under a specified supply voltage and bias condition given to the photo IC. ICC Current consumption The current that will flow into the sensor when a specified positive bias voltage is applied from the power source with the ground of the photo IC at reference potential. IFT (IFT OFF) LED current when output is The forward LED current value that turns OFF the output of the photo IC when the forward current to turned OFF the LED is increased under a specified voltage applied to the photo IC. IFT (IFT ON) LED current when output is The forward LED current value that turns ON the output of the photo IC when the forward current to the turned ON LED is increased under a specified voltage applied to the photo IC. H Hysteresis The difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC is turned ON and when the photo IC is turned OFF. f Response frequency The number of revolutions of a disk with a specified shape rotating in the light path, expressed by the number of pulse strings during which the output logic of the photo IC can be obtained under a specified bias condition given to the LED and photo IC (the number of pulse strings to which the photo IC can respond in a second). Technical Information 15 Design Driving Current Level The following explains how systems using Photomicrosensors must be designed. It is especially important to decide the level of the forward current (IF) of the emitter incorporated by any Photomicrosensor. The forward current must not be too large or too small. Before using any Photomicrosensor, refer to the absolute maximum ratings in the datasheet of the Photomicrosensor to find the emitter's forward current upper limit. For example, the first item in the absolute maximum ratings in the datasheet of the EE-SX1018 shows that the forward current (IF) of its emitter is 50 mA at a Ta (ambient temperature) of 25C. This means the forward current (IF) of the emitter is 50 mA maximum at a Ta of 25C. As shown in Figure 4, the forward current must be reduced according to changes in the ambient temperature. Figure 4 indicates that the forward current (IF) is approximately 27 mA maximum if the EE-SX1018 is used at a Ta of 60C. This means that a current exceeding 27 mA must not flow into the emitter incorporated by the EE-SX1018 at a Ta of 60C. As for the lower limit, a small amount of forward current will be required because the LED will not give any output if the forward current IF is zero. Characteristics of Emitter The emitter of each Photomicrosensor has an infrared LED or red LED. Figure 3 shows how the LED forward current characteristics of the EE-SX1018, which has an emitter with an infrared LED, and those of the EE-SY169B, which has an emitter with a red LED, are changed by the voltages imposed on the EE-SX1018 and EESY169B. As shown in this figure, the LED forward current characteristics of the EE-SX1018 greatly differ from those of the EESY169B. The LED forward current characteristics of any Photomicrosensor indicate how the voltage drop of the LED incorporated by the emitter of the Photomicrosensor is changed by the LED's forward current (IF) flowing from the anode to cathode. Figure 3 shows that the forward voltage (VF) of the red LED is higher than that of the infrared LED. The forward voltage (VF) of the infrared LED is approximately 1.2 V and that of the red LED is approximately 2 V provided that the practical current required by the infrared LED and that required by the red LED flow into these LEDs respectively. Figure 4. Temperature Characteristics (EE-SX1018) PC IF Forward current IF (mA) Forward current IF (mA) Figure 3. LED Forward Current vs. Forward Voltage Characteristics (Typical) EE-SX1018 (infrared LED) EE-SY169B (red LED) 2.4 Forward voltage VF (V) Forward Voltage VF 16 Technical Information Collector dissipation PC (mW) Emitter Ambient temperature Ta (C) In short, the forward current lower limit of the emitter of any Photomicrosensor must be 5 mA minimum if the emitter has an infrared LED and 2 mA minimum if the emitter has a red LED. If the forward current of the emitter is too low, the optical output of the emitter will not be stable. To find the ideal forward current value of the Photomicrosensor, refer to the light current (IL) shown in the datasheet of the Photomicrosensor. The light current (IL) indicates the relationship between the forward current (IF) of the LED incorporated by the Photomicrosensor and the output of the LED. The light current (IL) is one of the most important characteristics. If the forward current specified by the light current (IL) flows into the emitter, even though there is no theoretical ground, the output of the emitter will be stable. This characteristic makes it possible to design the output circuits of the Photomicrosensor easily. For example, the datasheet of EE-SX1018 indicates that a forward current (IF) of 20 mA is required. Design Method The following explains how the constants of a Photomicrosensor must be determined. Figure 5 shows a basic circuit that drives the LED incorporated by a Photomicrosensor. The basic circuit absolutely requires a limiting resistor (R). If the LED is imposed with a forward bias voltage without the limiting resistor, the current of the LED is theoretically limitless because the forward impedance of the LED is low. As a result the LED will burn out. Users often ask OMRON about the appropriate forward voltage to be imposed on the LED incorporated by each Photomicrosensor model that they use. There is no upper limit of the forward voltage imposed on the LED provided that an appropriate limiting resistor is connected to the LED. There is, however, the lower limit of the forward voltage imposed on the LED. As shown in Figure 3, the lower limit of the forward voltage imposed on the LED must be at least 1.2 to 2 V, or no forward current will flow into the LED. The supply voltage of a standard electronic circuit is 5 V minimum. Therefore, a minimum of 5 V should be imposed on the LED. A system incorporating any Photomicrosensor must be designed by considering the following. 1. Forward current (IF) 2. Limiting resistor (R) (refer to Figure 5) As explained above, determine the optimum level of the forward current (IF) of the LED. The forward current (IF) of the EE-SX1018, for example, is 20 mA. Therefore, the resistance of the limiting resistor connected to the LED must be decided so that the forward current of the LED will be approximately 20 mA. The resistance of the limiting resistor is obtained from the following. The positions of the limiting resistor (R) and the LED in Figure 5 are interchangeable. If the LED is imposed with reverse voltages including noise and surge voltages, add a rectifier diode to the circuit as shown in Figure 6. LEDs can be driven by pulse voltages, the method of which is, however, rarely applied to Photomicrosensors. In short, the following are important points required to operate any Photomicrosensor. A forward voltage (VF) of approximately 1.2 V is required if the Photomicrosensor has an infrared LED and a forward voltage (VF) of approximately 2 V is required if the Photomicrosensor has a red LED. The most ideal level of the forward current (IF) must flow into the LED incorporated by the Photomicrosensor. Decide the resistance of the limiting resistor connected to the LED after deciding the value of the forward current (IF). If the LED is imposed with a reverse voltage, connect a rectifier diode to the LED in parallel with and in the direction opposite to the direction of the LED. Figure 6. Reverse Voltage Protection Circuit VCC - VF IF In this case 5 V must be substituted for the supply voltage (VCC). The forward voltage (VF) obtained from Figure 3 is approximately 1.2 V when the forward current (IF) of the LED is 20 mA. Therefore, the following resistance is obtained. R= VCC - VF IF 5 to 1.2 V = 190 20 mA = approx. 180 to 220 The forward current (IF) varies with changes in the supply voltage (VCC), forward voltage (VF), or resistance. Therefore, make sure that there is some margin between the absolute maximum ratings and the actual operating conditions of the Photomicrosensor. R= = Figure 5. Basic Circuit VCC IF R VF GND (ground) Technical Information 17 Phototransistor Output Characteristics of Detector Element The changes in the current flow of the detector element with and without an optical input are important characteristics of a detector element. Figure 7 shows a circuit used to check how the current flow of the phototransistor incorporated by a Photomicrosensor is changed by the LED with or without an appropriate forward current (IF) flow, provided that the ambient illumination of the Photomicrosensor is ideal (i.e., 0 lx). When there is no forward current (IF) flowing into the LED or the optical beam emitted from the LED is intercepted by an opaque object, the ammeter indicates several nanoamperes due to a current leaking from the phototransistor. This current is called the dark current (ID). When the forward current (IF) flows into the LED with no object intercepting the optical beam emitted from the LED, the ammeter indicates several milliamperes. This current is called the light current (IL). The difference between the dark current and light current is 106 times larger as shown below. * When optical beam to the phototransistor is interrupted Dark current ID: 10-9 A The dark current temperature and light current temperature dependencies of the phototransistor incorporated by any Photomicrosensor must not be ignored. The dark current temperature dependency of the phototransistor increases when the ambient temperature of the Photomicrosensor in operation is high or the Photomicrosensor has a photoelectric Darlington transistor as the detector element of the Photomicrosensor. Figure 8 shows the dark current temperature dependency of the phototransistor incorporated by the EE-SX1018. Figure 8. Dark Current vs. Ambient Temperature Characteristics (Typical) (EE-SX1018) VCE = 10 V 0 lx Dark current ID Design of Systems Incorporating Photomicrosensors (1) * When optical beam to the phototransistor is not interrupted Light current IL: 10-3 A The standard light current of a phototransistor is 106 times as large as the dark current of the phototransistor. This difference in current can be applied to the sensing of a variety of objects. Figure 7. Measuring Circuit Ammeter The ambient illumination of the LED and phototransistor incorporated by the Photomicrosensor in actual operation is not 0 lx. Therefore, a current larger than the dark current of the phototransistor will flow into the phototransistor when the optical beam emitted from the LED is interrupted. This current is rather large and must not be ignored if the Photomicrosensor has a photoelectric Darlington transistor, which is highly sensitive, as the detector element of the Photomicrosensor. The dark current of the phototransistor incorporated by any reflective Photomicrosensor flows if there is no reflective object in the sensing area of the reflective Photomicrosensor. Furthermore, due to the structure of the reflective Photomicrosensor, a small portion of the optical beam emitted from the LED reaches the phototransistor after it is reflected inside the reflective Photomicrosensor. Therefore, the dark current and an additional current will flow into the phototransistor if there is no sensing object in the sensing area. This additional current is called leakage current (ILEAK). The leakage current of the phototransistor is several hundred nanoamperes and the dark current of the phototransistor is several nanoamperes. 18 Technical Information Ambient temperature Ta (C) Due to the temperature dependency of the phototransistor, the light current (IL) of the phototransistor as the detector element of the Photomicrosensor increases according to a rise in the ambient temperature. As shown in Figure 9, however, the output of the LED decreases according to a rise in the ambient temperature due to the temperature dependency of the LED. An increase in the light current of the phototransistor is set off against a decrease in the output of the LED and consequently the change of the output of the Photomicrosensor according to the ambient temperature is comparatively small. Refer to Figure 10 for the light current temperature dependency of the phototransistor incorporated by the EE-SX1018. The light current temperature dependency shown in Figure 10 is, however, a typical example. The tendency of the light current temperature dependency of each phototransistor is indefinite. This means the temperature compensation of any Photomicrosensor is difficult. Figure 9. LED and Phototransistor Temperature Characteristics (Typical) A relative value of 100 is based on a Ta of 25C. Relative value (%) LED optical output Phototransistor light current Ambient temperature Ta (C) Figure 10. Relative Light Current vs. Ambient Temperature Characteristics (EE-SX1018) Relative light current (%) Measurement condition IF = 20 mA VCE = 5 V Ambient temperature Ta (C) Changes in Characteristics The following explains the important points required for the designing of systems incorporating Photomicrosensors by considering worst case design technique. Worst case design technique is a method to design systems so that the Photomicrosensors will operate normally even if the characteristics of the Photomicrosensors are at their worst. A system incorporating any Photomicrosensor must be designed so that they will operate even if the light current (IL) of the phototransistor is minimal and the dark current (ID) and leakage current of the phototransistor are maximal. This means that the system must be designed so that it will operate even if the difference in the current flow of the phototransistor between the time that the Photomicrosensor senses an object and the time that the Photomicrosensor does not sense the object is minimal. The worst light current (IL) and dark current (ID) values of the phototransistor incorporated by any Photomicrosensor is specified in the datasheet of the Photomicrosensor. (These values are specified in the specifications either as the minimum value or maximum value.) Table 1 shows the dark current (ID) upper limit and light current (IL) lower limit values of the phototransistors incorporated by a variety of Photomicrosensors. Systems must be designed by considering the dark current (ID) upper limit and light current (IL) lower limit values of the phototransistors. Not only these values but also the following factors must be taken into calculation to determine the upper limit of the dark current (ID) of each of the phototransistors. External light interference Temperature rise Power supply voltage Leakage current caused by internal light reflection if the systems use reflective Photomicrosensors. The above factors increase the dark current (ID) of each phototransistor. As for the light current (IL) lower limit of each phototransistor, the following factors must be taken into calculation. * Temperature change * Secular change The above factors decrease the light current (IL) of each phototransistor. Table 2 shows the increments of the dark current (ID) and the decrements of the light current (ID) of the phototransistors. Therefore, if the EE-SX1018 is operated at a Ta of 60C maximum and a VCC of 10 V for approximately 50,000 hours, for example, the dark current (ID) of the phototransistor incorporated by the EESX1018 will be approximately 4 A and the light current (IL) of the phototransistor will be approximately 0.5 mA because the dark current (ID) of the phototransistor at a Ta of 25C is 200 nanoamperes maximum and the light current (IL) of the phototransistor at a Ta of 25C is 0.5 mA minimum. Table 3 shows the estimated worst values of a variety of Photomicrosensors, which must be considered when designing systems using these Photomicrosensors. The dispersion of the characteristics of the Photomicrosensors must be also considered, which is explained in detail later. The light current (IL) of the phototransistor incorporated by each reflective Photomicrosensor shown in its datasheet was measured under the standard conditions specified by OMRON for its reflective Photomicrosensors. The light current (IL) of any reflective Photomicrosensor greatly varies with its sensing object and sensing distance. * * * * Technical Information 19 Table 1. Rated Dark Current (ID) and Light Current (IL) Values Model Upper limit (ID) Lower limit (IL) Condition EE-SG3(-B) 200 nA 2 mA IF = 15 mA EE-SX1018, -SX1055 EE-SX1041, -SX1042 EE-SX1070, -SX1071 EE-SX198, -SX199 200 nA 0.5 mA IF = 20 mA EE-SB5(-B) EE-SF5(-B) EE-SY110 200 nA 0.2 mA IF = 20 mA (see note) Condition VCE = 10 V, 0 lx Ta = 25C VCE = 10 V Ta = 25C --- Note: These values were measured under the standard conditions specified by OMRON for the corresponding Photomicrosensors. Table 2. Dependency of Detector Elements on Various Factors Elements Dark current ID Light current IL Phototransistor To be checked using experiment Temperature rise Increased by approximately 10 times with Increased by approximately 28 times with a temperature rise of 25C. a temperature rise of 25C. Supply voltage See Figure 11. See Figure 12. Temperature change Approximately -20% to 10% Approximately -20% to 10% Secular change (20,000 to 50,000 hours) Note: For an infrared LED. Decreased to approximately one-half of Decreased to approximately one-half of the initial value considering the tempera- the initial value considering the temperature changes of the element. ture changes of the element. Relative dark current ID (%) Figure 11. Dark Current Imposed Voltage Dependency (Typical) (EE-SX1018) A relative dark current value of 100 is based on a Ta of 25C and a VCE of 10 V. Collector-emitter voltage VCE (V) 20 Photo-Darlington transistor External light interference Technical Information To be checked using experiment Table 3. Estimated Worst Values of a Variety of Photomicrosensors Model Estimated worst value (ID) Estimated worst value (IL) Condition EE-SG3(-B) 4 nA 1 mA IF = 15 mA EE-SX1018, -SX1055 EE-SX1041, -SX1042 EE-SX1070, -SX1071 EE-SX198, -SX199 4 nA 0.25 mA IF = 20 mA EE-SB5(-B) EE-SF5(-B) EE-SY110 4 nA 0.1 mA IF = 20 mA (see note) Condition VCE = 10 V, 0 lx Ta = 60C VCE = 10 V, Operating hours = 50,000 to 100,000 hrs Ta = Topr --- Note: These values were measured under the standard conditions specified by OMRON for the corresponding Photomicrosensors with an Infrared LED. Design of Basic Circuitry The following explains the basic circuit incorporated by a typical Photomicrosensor and the important points required for the basic circuit. The flowing currents (i.e., IL and ID) of the phototransistor incorporated by the Photomicrosensor must be processed to obtain the output of the Photomicrosensor. Refer to Figure 13 for the basic circuit. The light current (IL) of the phototransistor will flow into the resistor (RL) if the phototransistor receives an optical input and the dark current (ID) and leakage current of the phototransistor will flow into the resistor (RL) if the phototransistor does not receive any optical input. Therefore, if the phototransistor receives an optical input, the output voltage imposed on the resistor (RL) will be obtained from the following. IL x RL If the phototransistor does not receive any optical input, the output voltage imposed on the resistor (RL) will be obtained from the following. (ID + leakage current) x RL The output voltage of the phototransistor is obtained by simply connecting the resistor (RL) to the phototransistor. For example, to obtain an output of 4 V minimum from the phototransistor when it is ON and an output of 1 V maximum when the phototransistor is OFF on condition that the light current (IL) of the phototransistor is 1 mA and the leakage current of the phototransistor is 0.1 mA, and these are the worst light current and leakage current values of the phototransistor, the resistance of the resistor (RL) must be approximately 4.7 k. Then, an output of 4.7 V (i.e., 1 mA x 4.7 k) will be obtained when the phototransistor is ON and an output of 0.47 V (i.e., 0.1 mA x 4.7 k) will be obtained when the phototransistor is OFF. Practically, the output voltage of the phototransistor will be more than 4.7 V when the phototransistor is ON and less than 0.47 V when the phototransistor is OFF because the above voltage values are based on the worst light current and leakage current values of the phototransistor. The outputs obtained from the phototransistor are amplified and input to ICs to make practical use of the Photomicrosensor. Figure 13. Basic Circuit or Output Figure 14. Output Example VCC = 10 V Output voltage RL = 4.7 k EE-SX1018 Technical Information 21 Design of Applied Circuit The following explains the designing of the applied circuit shown in Figure 15. The light current (IL) of the phototransistor flows into R1 and R2 when the phototransistor receives the optical beam emitted from the LED. Part of the light current (IL) will flow into the base and emitter of Q 1 when the voltage imposed on R2 exceeds the bias voltage (i.e., approximately 0.6 to 0.9 V) imposed between the base and emitter of the transistor (Q1). The light current flowing into the base turns Q1 ON. A current will flow into the collector of Q1 through R3 when Q1 is ON. Then, the electric potential of the collector will drop to a low logic level. The dark current and leakage current of the phototransistor flow when the optical beam emitted from the LED is intercepted. The electric potential of the output of the phototransistor (i.e., (ID + leakage current) x R2) is, however, lower than the bias voltage between the base and emitter of Q1. Therefore, no current will flow into the base of Q1 and Q1 will be OFF. The output of Q 1 will be at a high level. As shown in Figure 16, when the phototransistor is ON, the phototransistor will be seemingly short-circuited through the base and emitter of the Q1, which is equivalent to a diode, and if the light current (IL) of the phototransistor is large and R1 is not connected to the phototransistor, the light current (IL) will flow into Q1 and the collector dissipation of the phototransistor will be excessively large. The following items are important when designing the above applied circuit: * The voltage output (i.e., IL x R2) of the phototransistor receiving the optical beam emitted from the LED must be much higher than the bias voltage between the base and emitter of Q1. * The voltage output (i.e., (ID + leakage current) x R2) of the phototransistor not receiving the optical beam emitted from the LED must be much lower than the bias voltage between the base and emitter of Q1. Therefore, it is important to determine the resistance of R2. Figure 17 shows a practical applied circuit example using the EE-SX1018 Photomicrosensor at a supply voltage (VCC) of 5V to drive a 74series TTL IC. This applied circuit example uses R1 and R2 with appropriate resistance values. Figure 15. Applied Circuit Figure 17. Applied Circuit Example EE-SX1018 VCC = 5 V R3 4.7 kW R1 200 IC1 74-series TTL IC R2 10 k Calculation of R2 The resistance of R2 should be decided using the following so that the appropriate bias voltage (VBE(ON)) between the base and emitter of the transistor (Q1) to turn Q1 ON will be obtained. IC1 x R2 > VBE(ON) IC1 = IL - IB (IL - IB) x R2 > VBE(ON) VBE(ON) IL - I B The bias voltage (VBE(ON)) between the base and emitter of Q1 is approximately 0.8 V and the base current (IB) of Q1 is approximately 20 A if Q1 is a standard transistor controlling small signals. The estimated worst value of the light current (IL) of the phototransistor is 0.25 mA according to Table 3. Therefore, the following is obtained. R2 > 0.8 V = approx. 3.48 k 0.25 mA - 20 A R2 must be larger than the above result. Therefore, the actual resistance of R2 must be two to three times as large as the above result. In the above applied circuit example, the resistance of R2 is 10 k. R2 > Verification of R2 Value The resistance of R2 obtained from the above turns Q1 ON. The following explains the way to confirm whether the resistance of R2 obtained from the above can turns Q1 OFF as well. The condition required to turn Q1 OFF is obtained from the following. (ID + ) x R2 < VBE(OFF) Output EE-SX1018 Figure 16. Equivalent Circuit 22 Technical Information Substitute 10 k for R2, 4 A for the dark current (ID) according to Table 3, and 10 A for the leakage current on the assumption that the leakage current is 10 A in formula 3. The following is obtained. (ID + a) x R2 > VBE(ON) (4 A + 10 A) x 10 k = 0.140 V VBE(OFF) = 0.4 V 0.140 V < 0.4 V The above result verifies that the resistance of R2 satisfies the condition required to turn Q1 OFF. If the appropriateness of the resistance of R2 has been verified, the design of the circuit is almost complete. R1 As shown in Figure 16, when the phototransistor is ON, the phototransistor will be seemingly short-circuited through the base and emitter of the Q1, and if the light current (IL) of the phototransistor is large and R1 is not connected to the phototransistor, the light current will flow into Q1 and the collector dissipation of the phototransistor will be excessively large. The resistance of R1 depends on the maximum permissible collector dissipation (PC) of the phototransistor, which can be obtained from the datasheet of the Photomicrosensor. The resistance of R1 of a phototransistor is several hundred ohms. In the above applied circuit example, the resistance of R1 is 200 . If the resistance of R1 is determined, the design of the circuit is complete. It is important to connect a transistor to the phototransistor incorporated by the Photomicrosensor to amplify the output of the phototransistor, which increases the reliability and stability of the Photomicrosensor. Such reliability and stability of the Photomicrosensor cannot be achieved if the output of the phototransistor is not amplified. The response speed and other performance characteristics of the circuit shown in Figure 15 are far superior to those of the circuit shown in Figure 13 because the apparent impedance (i.e., load resistance) of the Photomicrosensor is determined by R1, the resistance of which is comparatively small. Recently, Photomicrosensors that have photo IC amplifier circuits are increasing in number because they are easy to use and make it possible to design systems using Photomicrosensors without problem. Design of Systems Incorporating Photomicrosensors (2) Photo IC Output Figure 18 shows the circuit configuration of the EE-SX301 or EESX401 Photomicrosensor incorporating a photo IC output circuit. The following explains the structure of a typical Photomicrosensor with a photo IC output circuit. Figure 18. Circuit Configuration Voltage stabilizer A Temperature compensation preamplifier Schmitt switching circuit + Output OUT transistor K Input (GaAs infrared LED) Output (Si photo IC) - LED Forward Current (IF) Supply Circuit The LED in the above circuitry is an independent component, to which an appropriate current must be supplied from an external power supply. This is the most important item required by the Photomicrosensor. It is necessary to determine the appropriate forward current (IF) of the LED that turns the photo IC ON. If the appropriate forward current is determined, the Photomicrosensor can be easily used by simply supplying power to the detector circuitry (i.e., the photo IC). Refer to the datasheet of the Photomicrosensor to find the current of the LED turning the photo IC ON. Table 4 is an extract of the datasheet of the EE-SX301/EE-SX401. Table 4. Abstract of Characteristics Item Symbol EE-SX301, -SX401 Value LED current when output IFTOFF is turned OFF (EE-SX301) Condition 8 mA max. VCC = 4.5 to 16 V Ta = 25C LED current when output IFTON is turned ON (EE-SX401) To design systems incorporating EE-SX301 or EE-SX401 Photomicrosensors, the following are important points. * A forward current equivalent to or exceeding the IFTOFF value must flow into the LED incorporated by each EE-SX301 Photomicrosensors. * A forward current equivalent to or exceeding the IFTON value must flow into the LED incorporated by the EE-SX401 Photomicrosensors. The IFTON value of the EE-SX301 is 8 mA maximum and so is the IFON value of the EE-SX401. The forward current (IF) of LED incorporated by the EE-SX301 in actual operation must be 8 mA or more and so must the actual forward current of (IF) the LED incorporated by the EE-SX401 in actual operation. The actual forward currents of the LEDs incorporated by the EE-SX301 and EE-SX401 are limited by their absolute maximum forward currents respectively. The upper limit of the actual forward current of the LED incorporated by the EESX301 and that of the LED incorporated by the EE-SX401 must be decided according Figure 19, which shows the temperature characteristics of the EE-SX301 and EE-SX401. The forward current (IF) of the EE-SX301 must be as large as possible within the absolute maximum forward current and maximum ambient temperature shown in Figure 19 and so must be the forward current (IF) of the EE-SX401. The forward current (IF) of the EE-SX301 or that of the EE-SX401 must not be close to 8 mA, otherwise the photo IC of the EE-SX301 or that of the EE-SX401 may not operate if there is any ambient temperature change, secular change that reduces the optical output of the LED, or dust sticking to the LED. The forward current (IF) values of the EE-SX301 and the EE-SX401 in actual operation must be twice as large as the IFOFF values of the EE-SX301 and EE-SX401 respectively. Figure 20 shows the basic circuit of a typical Photomicrosensor with a photo IC output circuit. If the Photomicrosensor with a photo IC output circuit is used to drive a relay, be sure to connect a reverse voltage absorption diode (D) to the relay in parallel as shown in Figure 21. Technical Information 23 Detector Circuit Precautions Supply a voltage within the absolute maximum supply voltage to the positive and negative terminals of the photo IC circuit shown in Figure 18 and obtain a current within the IOUT value of the output transistor incorporated by the photo IC circuit. The following provides the instructions required for the operation of Photomicrosensors. Collector dissipation Pc (mW) Forward current IF (mA) Figure 19. Forward Current vs. Ambient Tempera ture Characteristics (EE-SX301/-SX401) IF * PC Ambient temperature Ta (C) Figure 20. Basic Circuit VCC Load OUT Transmissive Photomicrosensor Incorporating Phototransistor Output Circuit When using a transmissive Photomicrosensor to sense the following objects, make sure that the transmissive Photomicrosensor operates properly. * Highly permeable objects such as paper, film, and plastic * Objects smaller than the size of the optical beam emitted by the LED or the size of the aperture of the detector. The above objects do not fully intercept the optical beam emitted by the LED. Therefore, some part of the optical beam, which is considered noise, reaches the detector and a current flows from the phototransistor incorporated by the detector. Before sensing such type of objects, it is necessary to measure the light currents of the phototransistor with and without an object to make sure that the transmissive Photomicrosensor can sense objects without being interfered by noise. If the light current of the phototransistor sensing any one of the objects is IL(N) and that of the phototransistor sensing none of the objects is IL(S), the signal-noise ratio of the phototransistor due to the object is obtained from the following. S/N = IL(S)/IL(N) The light current (IL) of the phototransistor varies with the ambient temperature and secular changes. Therefore, if the signal-noise ratio of the phototransistor is 4 maximum, it is necessary to pay utmost attention to the circuit connected to the transmissive Photomicrosensor so that the transmissive Photomicrosensor can sense the object without problem. The light currents of phototransistors are different to one another. Therefore, when multiple transmissive Photomicrosensors are required, a variable resistor must be connected to each transmissive Photomicrosensor as shown in Figure 22 if the light currents of the phototransistors greatly differ from one another. Figure 22. Sensitivity Adjustment VCC GND Figure 21. Connected to Inductive Load Output VCC Relay GND GND The optical beam of the emitter and the aperture of the detector must be as narrow as possible. An aperture each can be attached to the emitter and detector to make the optical beam of the emitter and the aperture of the detector narrower. If apertures are attached to both the emitter and detector, however, the light current (IL) of the phototransistor incorporated by the detector will decrease. It is desirable to attach apertures to both the emitter and detector. If an aperture is attached to the detector only, the transmissive Photomicrosensor will have trouble sensing the above objects when they pass near the emitter. Figure 23. Aperture Example Aperture 24 Technical Information When using the transmissive Photomicrosensor to sense any object that vibrates, moves slowly, or has highly reflective edges, make sure to connect a proper circuit which processes the output of the transmissive Photomicrosensor so that the transmissive Photomicrosensor can operate properly, otherwise the transmissive Photomicrosensor may have a chattering output signal as shown in Figure 24. If this signal is input to a counter, the counter will have a counting error or operate improperly. To protect against this, connect a 0.01- to 0.02-F capacitor to the circuit as shown in Figure 25 or connect a Schmitt trigger circuit to the circuit as shown in Figure 26. Figure 27. Configuration of Reflective Photomicrosensor Object Emitter element Detector element Housing Figure 24. Chattering Output Signal VCC Output Chattering output Figure 28. Light Interception Characteristics of Filters GND Figure 25. Chattering Prevention (1) Permeability (%) VCC Output GND EE-SF5 EE-SB5 Figure 26. Chattering Prevention (2) VCC Output Schmitt trigger circuit (IC) Wavelength l (nm) GND Reflective Photomicrosensor Incorporating Phototransistor Output Circuit When using a reflective Photomicrosensor to sense objects, pay attention to the following so that the reflective Photomicrosensor operates properly. * External light interference * Background condition of sensing objects * Output level of the LED The reflective Photomicrosensor incorporates a detector element in the direction shown in Figure 27. Therefore, it is apt to be affected by external light interference. The reflective Photomicrosensor, therefore, incorporates a filter to intercept any light, the wavelength of which is shorter than a certain wavelength, to prevent external light interference. The filter does not, however, perfectly intercept the light. Refer to Figure 28 for the light interception characteristics of filters. A location with minimal external light interference is best suited for the reflective Photomicrosensor. Figure 29. Influence of Background Object Sensing object Sensor Background object With regard to the background conditions, the following description is based on the assumption that the background is totally dark. Figure 29 shows that the optical beam emitted from the LED incorporated by a reflective Photomicrosensor is reflected by a sensing object and background object. The optical beam reflected by the background object and received by the phototransistor incorporated by the detector is considered noise that lowers the signal-noise ratio of the phototransistor. If any reflective Photomicrosensor is used to sense paper passing through the sensing area of the reflective Photomicrosensor on condition that there is a stainless steel or zinc-plated object behind the paper, the light current (IL(N)) of the phototransistor not sensing the paper may be larger than the light current (IL(S)) of phototransistor sensing the paper, in which case remove the background object, make a hole larger than the area of the sensor surface in the background object as shown in Figure 30, coat the surface of the background object with black lusterless paint, or roughen the surface of the background. Most malfunctions of a reflective Photomicrosensor are caused by an object located behind the sensing objects of the reflective Photomicrosensor. Unlike the output (i.e., IL) of any transmissive Photomicrosensor, the Technical Information 25 light current (IL) of a reflective Photomicrosensor greatly varies according to sensing object type, sensing distance, and sensing object size. Figure 30. Example of Countermeasure Cutout Light current IL (A) Figure 31. Sensing Distance Characteristics (EE-SF5) a: Aluminum b: White paper with a reflection factor of 90% c: Pink paper d: OHP sheet e: Tracing paper f: Black sponge Ta = 25 IF = 20 mA VCE =10 V The light current (IL) of the phototransistor incorporated by the transmissive Photomicrosensor is output when there is no sensing object in the sensing groove of the transmissive Photomicrosensor. On the other hand, the light current (IL) of the phototransistor incorporated by the reflective Photomicrosensor is output when there is a standard object specified by OMRON located in the standard sensing distance of the reflective Photomicrosensor. The light current (IL) of the phototransistor incorporated by the reflective Photomicrosensor varies when the reflective Photomicrosensor senses any other type of sensing object located at a sensing distance other than the standard sensing distance. Figure 31 shows how the output of the phototransistor incorporated by the EE-SF5(B) varies according to varieties of sensing objects and sensing distances. Before using the EE-SF5(-B) to sense any other type of sensing objects, measure the light currents of the phototransistor in actual operation with and without one of the sensing objects as shown in Figure 32. After measuring the light currents, calculate the signal-noise ratio of the EE-SF5(-B) due to the sensing object to make sure if the sensing objects can be sensed smoothly. The light current of the reflective Photomicrosensor is, however, several tens to hundreds of microamperes. This means that the absolute signal levels of the reflective Photomicrosensor are low. Even if the reflective Photomicrosensor in operation is not interfered by external light, the dark current (ID) and leakage current (ILEAK) of the reflective Photomicrosensor, which are considered noise, may amount to several to ten-odd microamperes due to a rise in the ambient temperature. This noise cannot be ignored. As a result, the signalnoise ratio of the reflective Photomicrosensor will be extremely low if the reflective Photomicrosensor senses any object with a low reflection ratio. Pay utmost attention when applying the reflective Photomicrosensor to the sensing of the following. * Marked objects (e.g., White objects with a black mark each) * Minute objects The above objects can be sensed if the signal-noise ratio of the reflective Photomicrosensor is not too low. The reflective Photomicrosensor must be used with great care, otherwise it will not operate properly. Figure 32. Output Current Measurement Distance d (mm) 26 Technical Information Actual operation Precautions Correct Use WARNING Do not use this product in sensing devices designed to provide human safety. Precautions for Safe Use * Use the product within the rated voltage range. Applying voltages beyond the rated voltage ranges may result in damage or malfunction to the product. * Wire the product correctly and be careful with the power supply polarities. Incorrect wiring may result in damage or malfunction to the product. * Connect the loads to the power supply. Do not short-circuit the loads. Short-circuiting the loads may result in damage or malfunction to the product. 3. Do not mount Photomicrosensors to plates stained with machining oil, otherwise the machining oil may cause cracks on the Photomicrosensors. 4. Do not impose excessive forces on Photomicrosensors mounted to PCBs. Make sure that no continuous or instantaneous external force exceeding 500 g (4.9 N) is imposed on any lead wire of the Photomicrosensors. PCB Mounting Holes Unless otherwise specified, the PCB to which a Photomicrosensor is mounted must have the following mounting holes. Four Terminals Terminal pitch 0.1 Four, 0.80.1 dia. Terminal pitch 0.1 Precautions for Correct Use Structure and Materials Five Terminals The emitter and detector elements of conventional Photomicrosensors are fixed with transparent epoxy resin and the main bodies are made of polycarbonate. Unlike ICs and transistors, which are covered with black epoxy resin, Photomicrosensors are subject to the following restrictions. 1. Low Heat Resistivity The storage temperature of standard ICs and transistors is approximately 150C. The storage temperature of highly resistant Photomicrosensors is 100C maximum. The heat resistance of the EE-SY169 Series which use ABS resin in the case, is particularly low (80C maximum). 2. Low Mechanical Strength Black epoxy resin, which is used for the main bodies of ICs and transistors, contains additive agents including glass fiber to increase the heat resistivity and mechanical strength of the main bodies. Materials with additive agents cannot be used for the bodies of Photomicrosensors because Photomicrosensors must maintain good optical permeability. Unlike ICs and transistors, Photomicrosensors must be handled with utmost care because Photomicrosensors are not as heat or mechanically resistant as ICs and transistors. No excessive force must be imposed on the lead wires of Photomicrosensors. Mounting Screw Mounting If Photomicrosensors have screw mounting holes, the Photomicrosensors can be mounted with screws. Unless otherwise specified, refer to the following when tighten the screws. Hole diameter Screw size Tightening torque 1.5 dia. M1.4 0.20 N * m 2.1 dia. M2 0.34 N * m 3.2 dia. M3 0.54 N * m 4.2 dia. M4 0.54 N * m Read the following before tightening the screws. 1. The use of a torque screwdriver is recommended to tighten each of the screws so that the screws can be tightened to the tightening torque required. 2. The use of a screw with a spring washer and flat washer for the mounting holes of a Photomicrosensor is recommended. If a screw with a spring washer but without a flat washer is used for any mounting hole, the part around the mounting hole may crack. Terminal pitch 0.1 Five, 0.80.1 dia. Terminal pitch 0.1 Terminal pitch 0.1 Soldering Lead Wires Make sure to solder the lead wires of Photomicrosensors so that no excessive force will be imposed on the lead wires. If an excessive forces is likely to be imposed on the lead wires, hold the bases of the lead wires. Soldering Temperature Regardless of the device being soldered, soldering should be completed quickly so that the devices are not subjected to thermal stress. Care is also required in the processing environment for processes other than soldering so that the devices are not subject to thermal stress or other external force. 1. Manual Soldering Unless otherwise specified, the lead wires of Photomicrosensors can be soldered manually under the following conditions. These conditions must also be maintained when using lead-free solder, i.e., soldering with lead-free solder is possible as long as the following conditions are maintained. Soldering temperature: 350C max. (The temperature of the tip of a 30-W soldering iron is approximately 320C when the soldering iron is heated up.) Soldering time: 3 s max. Soldering position: At least 1.5 mm away from the bases of the lead wires. The temperature of the tip of any soldering iron depends on the shape of the tip. Check the temperature with a thermometer before soldering the lead wires. A highly resistive soldering iron incorporating a ceramic heater is recommended for soldering the lead wires. Precautions 27 2. Dip Soldering The lead wires of Photomicrosensors can be dip-soldered under the following conditions unless otherwise specified. Preheating temperature: Must not exceed the storage temperature of the Photomicrosensors. Soldering temperature: 260C max. (the lead wires) Soldering time: 10 s max. Soldering position: At least 0.3 mm away from the bases of the housing. The soldering temperature is specified as the temperature applied to the lead terminals. Do not subject the cases to temperatures higher than the maximum storage temperature. It is also possible for the sensor case to melt due to residual heat of the PCB. When using a PCB with a high thermal capacity (e.g., those using fiber-glass reinforced epoxy substrates), confirm that the case is not deformed and install cooling devices as required to prevent distortion. Particular care is required for the EE-SY169 Series, which use ABS resin in the case. Do not use non-washable flux when soldering EE-SA-series Photomicrosensors, otherwise the Photomicrosensors will have operational problems. For other Photomicrosensors, check the case materials and optical characteristics carefully to be sure that residual flux does not adversely affect them. 3. Reflow Soldering The reflow soldering of Photomicrosensors is not possible except for the EE-SX1107, -SX1108, -SX1109, -SX1131, -SX4134, EESY125 and EE-SY193. The reflow soldering of these products must be performed carefully under the conditions specified in the datasheets of these products, respectively. Before performing the reflow soldering of these products, make sure that the reflow soldering equipment satisfies the conditions. Compared to general ICs, optical devices have a lower resistance to heat. This means the reflow temperature must be set to a lower temperature. Observe the temperature provides provided in the specifications when mounting optical devices. 4. External Forces Immediately Following Soldering The heat resistance and mechanical strength of Photomicrosensors are lower than those of ICs or transistors due to their physical properties. Care must thus be exercised immediately after soldering (particularly for dip soldering) so that external forces are not applied to the Photomicrosensors. 2. Cleaning Method Unless otherwise specified, Photomicrosensors other than the EE-SA105 and EE-SA113 can be cleaned under the following conditions. Do not apply an unclean detergent to the Photomicrosensors. DIP cleaning: OK Ultrasonic cleaning: Depends on the equipment and the PCB size. Before cleaning Photomicrosensors, conduct a cleaning test with a single Photomicrosensor and make sure that the Photomicrosensor has no broken lead wires after the Photomicrosensor is cleaned. Brushing: The marks on Photomicrosensors may be brushed off. The emitters and detectors of reflective Photomicrosensors may have scratches and deteriorate when they are brushed. Before brushing Photomicrosensors, conduct a brushing test with a single Photomicrosensor and make sure that the Photomicrosensor is not damaged after it is brushed. External Forces LED Drive Currents The heat resistivity and mechanical strength of Photomicrosensors are lower than those of ICs or transistors. Do not to impose external force on Photomicrosensors immediately after the Photomicrosensors are soldered. Especially, do not impose external force on Photomicrosensors immediately after the Photomicrosensors are dip-soldered. Photomicrosensors consist of LEDs and light detectors. Generally speaking, temporal changes occur to LEDs when power is supplied to them (i.e., the amount of light emitted diminishes). With less light, the photoelectric current is reduced for a sensor with a phototransistor output or the threshold current is increased for a sensor with a photo-IC output. Design circuits with sufficient consideration to the decline in the emitted light level. The reduction in emitted light is far greater for red LEDs than for infrared LEDs. Also, with red LEDs that contain aluminum, aluminum oxide will form if they are powered under high humidities, calling for a greater need for consideration of the decline in the emitted light level. Cleaning Precautions Cleaning Photomicrosensors except the EE-SA105 and EE-SA113 can be cleaned subject to the following restrictions. 1. Types of Detergent Polycarbonate is used for the bodies of most Photomicrosensors. Some types of detergent dissolve or crack polycarbonate. Before cleaning Photomicrosensors, refer to the following results of experiments, which indicate what types of detergent are suitable for cleaning Photomicrosensors other than the EE-SA105 and EE-SA113. Observe the law and prevent against any environmental damage when using any detergent. Results of Experiments Ethyl alcohol: OK Methyl alcohol: OK Isopropyl alcohol: OK Trichlene: NG Acetone: NG Methylbenzene: NG Water (hot water): The lead wires corrode depending on the conditions 28 Precautions Operating and Storage Temperatures Observe the upper and lower limits of the operating and storage temperature ranges for all devices and do not allow excessive changes in temperature. As explained in the restrictions given in Structure and Materials, elements use clear epoxy resin, giving them less resistance to thermal stress than normal ICs or transistors (which are sealed with black epoxy resin). Refer to reliability test results and design PCBs so that the devices are not subjected to excessive thermal stress. Even for applications within the operating temperature range, care must also be taken to control the humidity. As explained in the restrictions given in Structure and Materials, elements use clear epoxy resin, giving them less resistance to humidity than normal ICs or transistors (which are sealed with black epoxy resin). Refer to reliability test results and design PCBs so that the devices are not subjected to excessive thermal stress. Photomicrosensors are designed for application under normal humidities. When using them in humidified or dehumidified, high-humidity or low-humidity, environments, test performance sufficiently for the application. Light Interceptors Select a material for the light interceptor with superior interception properties. If a material with inferior light interception properties, such as a plastic that is not black, is used, light may penetrate the interceptor and cause malfunction. With Photomicrosensors, most of which use infrared LEDs, a material that appears black to the human eye (i.e., in the visible light range) may be transparent to infrared light. Select materials carefully. Guideline for Light Interceptors When measuring the light interception properties of the light interceptor, use 0.1% maximum light transmission as a guideline. IF IL RF Vcc OUT RL GND Criteria Where, IL1 is the IL for light reception IL2 is the IL for light interception by the intercepter VTH is the threshold voltage IF1 is the IF for measurement of IL given in product specifications IF2 is the IF in actual application ( = (VCC - VF)/RF = (VCC - 1.2)/RF) ILMAX is the standard upper limit of the optical current IL Then, Light transmission = IL2/IL1 = Here there should be no problems if the following equation is satisfied. VTH (IF2/IF1) x ILMAX x RL x Caution is required, however, because there are inconsistencies in light transmission. Reflectors The reflectors for most Photomicrosensors are standardized to white paper with a reflection ratio of 90%. Design the system to allow for any differences in the reflection ratio of the detection object. With Photomicrosensors, most of which use infrared LEDs, a material that appears black to the human eye (i.e., in the visible light range) may have a higher reflection ratio. Select materials carefully. Concretely, marks made with dye-based inks or marks made with petroliumbased magic markers (felt pens) can have the same reflection ratio for infrared light as white paper. The reflectors for most Photomicrosensors are standardized to white paper with a reflection ratio of 90%. Paper, however, disperses light relatively easily, reducing the effect of the detection angle. Materials with mirrored surfaces, on the other hand, show abrupt changes in angle characteristics. Check the reflection ratio and angles sufficiently for the application. The output from most Photomicrosensors is determined at a specified distance. Characteristics will vary with the distance. Carefully check characteristics at the specific distance for the application. Output Stabilization Time Photomicrosensors with photo-IC outputs require 100 ms for the internal IC to stabilize. Set the system so that the output is not read for 100 ms after the power supply is turned ON. Also be careful if the power supply is turned OFF in the application to save energy when the Photomicrosensor is not used. When using a Photomicrosensor with a phototransistor output outside of the saturation region, stabilization time is required to achieve thermal balance. Care is required when using a variable resistor or other adjustment. Precautions 29 Application Examples Most People May Not Realize the Fact that Photomicrosensors are Built Into Machines and Equipment that are Used Everyday Office Automation Machines Copy machines Facsimiles Printers X-Y plotters Mouse Image scanners FDD Photomicrosensor Household products VCRs Camcorders Audio equipment Microwave ovens Air conditioners Fan heaters Vacuum cleaners 30 Application Examples Others Automatic vending machines Cameras Slot machines Garage doors Pinball machines Game machines Application Examples Classification Household products Products VCRs Camcorders Lens origin sensing and lens control Laserdisc players Rotation sensing and disk size sensing Air conditioners/Fan heaters Louver direction sensing and fan motor rotation sensing Microwave ovens Turntable sensing Vacuum cleaners Carpet and floor discrimination Office automation ma- Printers chines Copy machines Others Sensing example Rotating reel sensing and tape sensing Origin sensing, paper sensing, paper size sensing, and ink ribbon end sensing Paper sensing, cassette sensing, and toner sensing Facsimiles Paper sensing, black end mark sensing, paper size sensing Floppy disk drives Disk sensing, origin sensing, and write protect sensing Optical disk drives Disk sensing, disk type sensing, and write protection sensing Image scanners Origin sensing and movement value sensing Mouse Movement direction sensing and movement value sensing X-Y plotters Paper sensing, origin sensing, pen sensing, and movement value sensing Automatic vending machines/Ticket machines Coin sensing, coin discrimination, and ticket sensing Cameras Film forwarding, lens control, and motor control Cash dispensers Card sensing, bill sensing, mechanical control Robot/Machine tools Mechanical control Sewing machines Motor rotation sensing and needle position sensing Pinball machines Ball sensing, mechanical control, and sensing of remaining balls Slot machines Coil sensing and lever sensing Game machines Prize sensing, coil sensing, and mechanical control Garage doors Door opening and closing sensing Application Examples 31 Photomicrosensor (Transmissive) EE-SX1018 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Compact model with a 2-mm-wide slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Item 0.50.05 Four, C0.3 Emitter IF Detector Four, 0.25 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA 100 mW (see note 1) Collector dissipation PC Cross section AA Ambient temperature Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Internal Circuit K C A E Dimensions 3 mm max. 0.3 3 < mm 6 K C 6 < mm 10 0.375 0.45 10 < mm 18 0.55 18 < mm 30 0.65 E Emitter Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance Terminal No. Name A Anode Cathode Collector Soldering temperature Unless otherwise specified, the tolerances are as shown below. Rated value 50 mA (see note 1) Pulse forward current IFP Optical axis Four, 0.5 Symbol Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V IF = 30 mA Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA 32 EE-SX1018 Photomicrosensor (Transmissive) Engineering Data IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) IF = 20 mA VCE = 5 V Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Ta = 70C Forward voltage VF (V) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) IF = 50 mA Ta = -30C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Sensing Position Characteristics (Typical) 120 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Ta = 25C Ta = 25C VCE = 10 V Dark current ID (nA) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1018 Photomicrosensor (Transmissive) 33 Photomicrosensor (Transmissive) EE-SX1023-W1 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * General-purpose model with a 2.1-mm-wide slot. * Harness type. * High resolution with a 0.5-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Two, R1.60.1 Item Emitter Symbol Forward current IF Pulse forward current IFP Detector 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA 100 mW (see note 1) Collector dissipation PC Ambient temperature Cross section A-A Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature K C A E Terminal No. A K C E Operating 4-wire UL1007 AWG26 80C 300 V Internal Circuit Name Anode Cathode Collector Emitter Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 3 mm max. 0.200 3 < mm 6 0.240 6 < mm 10 0.290 10 < mm 18 0.350 18 < mm 30 0.420 30 < mm 50 0.500 50 < mm 80 0.600 Rated value 50 mA (see note 1) Electrical and Optical Characteristics (Ta = 25C) Item Emitter Forward voltage Symbol Value VF 1.2 V typ., 1.5 V max. Condition IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min. IF = 20 mA, VCE = 5 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Detector 34 EE-SX1023-W1 Photomicrosensor (Transmissive) Engineering Data IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) IF = 20 mA VCE = 5 V Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Forward current IF (mA) Ambient temperature Ta (C) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 70C Forward voltage VF (V) Relative light current IL (%) Light current IL (mA) IF = 40 mA Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Ta = 25C IF = 50 mA Ta = -30C Dark current ID (nA) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Sensing Position Characteristics (Typical) 120 Distance d (mm) IF = 20 mA VCE = 10 V Ta = 25C 100 80 d 60 40 20 0 -2.0 Load resistance RL (k) Ta = 25C VCE = 10 V (Center of optical axis) Ambient temperature Ta (C) Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1023-W1 Photomicrosensor (Transmissive) 35 Photomicrosensor (Transmissive) EE-SX1031 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * High resolution with a 0.5-mm-wide aperture. * Separate LED/Phototransistor combinations within a single housing. * PCB mounting type. 0.3 1 EE-SX 1031 0.5 Silver or white marking 2 JAPAN 13.6 Absolute Maximum Ratings (Ta = 25C) Optical Optical axis (2) axis (1) 13.6 7.10.13 3.4 0.2 Item Emitter 10.2 7.2 Detector Optical axis 2-2.1 3 Eight, 0.25 Four, 2.54 Eight, 0.5 7.1 A 7.6 Ambient temperature Cross section AA A (2) (1) E C K E A K C (Bottom View) K (1) C (1) A (1) E (1) K (2) C (2) A (2) E (2) Rated value IF 50 mA (see note) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Collector current IC 20 mA Collector dissipation PC 100 mW Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C 3.2 Two, 0.5 A Symbol Forward current Soldering temperature Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 to 14 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Collector-Emitter saturated voltage VCE (sat) 0.15 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time (see note) tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector Forward voltage Note: Refer to Response Time Measurement Circuit. 36 EE-SX1031 Photomicrosensor (Transmissive) IF = 30 mA Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) IF Ambient temperature Ta (C) Ta = -30C Ta = 25C Ta = 70C Forward current IF (mA) Dark current ID (nA) VCE = 10 V 0 lx PC (max.) rated IF = 30 mA IF = 20 mA Light Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 10 V Light current IL (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) Ta = 25C Light current IL (mA) Ta = 25C VCE = 10 V Forward voltage VF (V) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 40 mA Light Current vs. Forward Current Characteristics (Typical) Light current IL (mA) Collector dissipation PC (mW) Forward current IF (mA) PC Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating IF = 10 mA VCE = 10 V IF = 10 mA A B B A Response time tr, tf (s) d Ambient temperature Ta (C) Response Time vs. Load Resistance Characteristics (Typical) Sensing Position Characteristics (Typical) Ta = -25C VCC = 10 V RL = 4.7K RL = 1K RL = 500K RL = 100K 120 80 Light current IL (mA) d 60 40 20 0 -2.0 Distance d (mm) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Relative light current IL (%) Sensing Position Characteristics (Typical) Ambient temperature Ta (C) Relative light current IL (%) Collector-Emitter voltage VCE (V) -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1031 Photomicrosensor (Transmissive) 37 Photomicrosensor (Transmissive) EE-SX1035 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Compact model with a 5.2-mm-wide slot. * PCB mounting type. Absolute Maximum Ratings (Ta = 25C) 6.3 Item Emitter 10.1 Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) 10.1 10.1 Optical axis Detector Four, 0.25 Four, 0.5 Cross section AA Cross section BB (2.5) Ambient temperature Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Internal Circuit K C A E Terminal No. A K C E Soldering temperature Unless otherwise specified, the tolerances are as shown below. Name Anode Cathode Collector Emitter Dimensions Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.2 3 < mm 6 0.24 6 < mm 10 0.29 10 < mm 18 0.35 18 < mm 30 0.42 Rated value Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Forward voltage IF = 30 mA Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.15 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA 38 EE-SX1035 Photomicrosensor (Transmissive) Engineering Data Ambient temperature Ta (C) Light current IL (mA) IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) Forward current IF (mA) IF = 20 mA VCE = 5 V Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) 120 Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Ta = 70C Forward voltage VF (V) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) 80 Response Time Measurement Circuit Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Ta = 25C Ta = -30C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C VCE = 10 V Dark current ID (nA) PC Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) Collector dissipation PC (mW) Forward current IF (mA) IF Forward Current vs. Forward Voltage Characteristics (Typical) Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Input Output 90 % 10 % Input Output EE-SX1035 Photomicrosensor (Transmissive) 39 Photomicrosensor (Transmissive) EE-SX1041 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * General-purpose model with a 5-mm-wide slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. 0.2 max. 140.2 0.2 max. Absolute Maximum Ratings (Ta = 25C) 60.2 0.50.1 Emitter Optical axis Detector 5 min. Two, 0.7 0.1 Four, 0.25 2.350.1 Four, 0.5 5.20.1 Two, 2.54 Two, 0.70.1 dia. Internal Circuit C A E Terminal No. Symbol Forward current IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Name Anode Cathode Collector Emitter Unless otherwise specified, the tolerances are as shown below. Dimensions Operating Topr -25C to 95C Tstg -30C to 100C Tsol 260C (see note 3) Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value Storage Soldering temperature K A K C E Ambient temperature Item Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector 40 EE-SX1041 Photomicrosensor (Transmissive) Engineering Data IF = 20 mA IF = 10 mA Light current IL (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V VCE = 10 V 0 lx Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) 120 Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Forward current IF (mA) Ambient temperature Ta (C) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 70C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 30 mA Relative light current IL (%) Light current IL (mA) IF = 40 mA Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Ta = 25C IF = 50 mA Ta = -30C Forward voltage VF (V) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C VCE = 10 V Dark current ID (nA) PC Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1041 Photomicrosensor (Transmissive) 41 Photomicrosensor (Transmissive) EE-SX1042 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * 14.5-mm-tall model with a deep slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Four, C0.3 Absolute Maximum Ratings (Ta = 25C) Item 0.50.05 Emitter 14.5 120.4 Detector 5 min. Four, 0.25 (11.2) (1.92) Cross section AA Ambient temperature K C A E Name Anode Cathode Collector Emitter Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 3 mm max. 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature Internal Circuit Terminal No. A K C E Symbol Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 10 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector 42 EE-SX1042 Photomicrosensor (Transmissive) Engineering Data IF = 20 mA IF = 10 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Light current IL (mA) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 5 V Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) Ta = 70C Dark current ID (nA) Relative light current IL (%) Light current IL (mA) IF = 30 mA Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Ta = 25C IF = 40 mA Ta = -30C Forward voltage VF (V) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 50 mA Ta = 25C VCE = 10 V IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Sensing Position Characteristics (Typical) 120 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Ambient temperature Ta (C) Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1042 Photomicrosensor (Transmissive) 43 Photomicrosensor (Transmissive) EE-SX1046 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * With a horizontal sensing aperture. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Optical axis 5 Absolute Maximum Ratings (Ta = 25C) 6.5 2.5 Item Emitter Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) 100.3 0.50.1 0.50.1 Optical axis Optical axis Detector Four, 0.25 9 min. 0.3 max. Four, 0.25 Cross section BB 0.25 max. Cross section AA Ambient temperature Internal Circuit K C A E Dimensions 3 mm max. Terminal No. Name A Anode K C E Cathode Collector Emitter Soldering temperature Unless otherwise specified, the tolerances are as shown below. Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value Forward current Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 920 nm typ. IF = 20 mA Light current IL 1.2 mA min., 14 mA max. IF = 20 mA, VCE = 5 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector 44 EE-SX1046 Photomicrosensor (Transmissive) Engineering Data Ta = -30C Ta = 25C Ta = 70C Ambient temperature Ta (C) IF = 30 mA IF = 20 mA IF = 10 mA Ambient temperature Ta (C) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) VCE = 10 V 0 lx Dark current ID (nA) IF = 40 mA Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V Relative light current IL (%) Light current IL (mA) IF = 50 mA Forward current IF (mA) Forward voltage VF (V) Relative Light Current vs. Ambient Temperature Characteristics (Typical) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C Light current IL (mA) PC Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 10 V Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) 120 80 d 60 40 20 -0.5 -0.25 0 0.25 Distance d (mm) 0.5 0.75 Relative light current IL (%) 100 0 -0.75 Load resistance RL (k) IF = 20 mA VCE = 5 V Ta = 25C (Center of optical axis) Response time tr, tf (s) Relative light current IL (%) 120 VCC = 5 V Ta = 25C IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) 80 d 60 40 20 0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1046 Photomicrosensor (Transmissive) 45 Photomicrosensor (Transmissive) EE-SX1049 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Compact with a slot width of 2 mm. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. 9 Absolute Maximum Ratings (Ta = 25C) Optical axis 4 Item Four, C0.3 2 Two, 0.5 Emitter A 2 max. Optical 0 axis 5.2 -0.2 2 max. Optical axis Optical axis 1.2 Detector 9 min. Four, 0.25 Four, 0.5 2.5 0.70.1 C0.3 0 1.2 -0.05 dia. C A Cross section AA C A A K C E 2.5 A Cross section BB Name Anode Cathode Collector Emitter Ambient temperature Unless otherwise specified, the tolerances are as shown below. 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature E Terminal No. B 0.25 max. 60.2 Internal Circuit K 0.3 max. K Dimensions Tolerance 3 mm max. 0.3 3 < mm 6 6 < mm 10 0.375 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value IF B 1.5 1.5 E Symbol Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V IF = 30 mA Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA 46 EE-SX1049 Photomicrosensor (Transmissive) Engineering Data 30 50 20 10 -20 0 20 40 60 Ta = -30C Ta = 70C 30 20 10 0 0 100 80 Ta = 25C 40 0 0.2 Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 30 mA 10 IF = 20 mA 8 6 IF = 10 mA 4 2 0 1 2 3 4 5 6 7 8 9 Relative light current IL (%) Response time tr, tf (s) 1,000 tf 100 tr 10 Load resistance RL (k) 4 2 0 10 30 40 50 Dark Current vs. Ambient Temperature Characteristics (Typical) 1,000 100 90 80 70 VCE = 10 V 0 lx 100 10 1 0.1 0.01 -20 0 20 40 60 80 0.001 -30 -20 -10 0 100 d 60 40 20 -0.5 -0.25 0 0.25 0.5 0.75 Distance d (mm) 1.0 Sensing Position Characteristics (Typical) 120 (Center of optical axis) 80 10 20 30 40 50 60 70 80 90 Ambient temperature Ta (C) IF = 20 mA VCE = 10 V Ta = 25C 100 0 20 Forward current IF (mA) 10,000 120 VCC = 5 V Ta = 25C 1 6 0 1.8 Sensing Position Characteristics (Typical) 10,000 0.1 1.6 8 Ambient temperature Ta (C) Response Time vs. Load Resistance Characteristics (Typical) 1 0.01 1.4 IF = 20 mA VCE = 10 V 110 60 -40 10 Collector-Emitter voltage VCE (V) 10 1.2 Dark current ID (nA) Relative light current IL (%) Light current IL (mA) 14 12 1 120 IF = 40 mA 16 0.8 Relative Light Current vs. Ambient Temperature Characteristics (Typical) IF = 50 mA Ta = 25C 18 0.6 Ta = 25C VCE = 10 V Forward voltage VF (V) Ambient temperature Ta (C) 20 0.4 Relative light current IL (%) 0 -40 50 Light current IL (mA) 100 Forward current IF (mA) PC 40 Collector dissipation PC (mW) Forward current IF (mA) IF 10 60 150 60 50 Light Current vs. Forward Current Characteristics (Typical) Forward Current vs. Forward Voltage Characteristics (Typical) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Forward Current vs. Collector Dissipation Temperature Rating 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input 0 t Output 90 % 10 % 0 Input t tf tr IL VCC Output RL EE-SX1049 Photomicrosensor (Transmissive) 47 Photomicrosensor (Transmissive) EE-SX1055 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Longer leads allow the sensor to be mounted to a 1.6-mm thick board. * 5.4-mm-tall compact model. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. 0.2 max. 0.2 max. Absolute Maximum Ratings (Ta = 25C) Four, 5 0.50.05 White band Item Emitter Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Optical axis 5.40.2 3.60.5 Detector Four, 0.5 Four, 0.25 Cross section AA Ambient temperature Internal Circuit Soldering temperature K C A E Terminal No. A K C E Unless otherwise specified, the tolerances are as shown below. Name Anode Cathode Collector Emitter Dimensions Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.3 3 < mm 6 6 < mm 10 0.375 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value Forward current Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector 48 EE-SX1055 Photomicrosensor (Transmissive) Engineering Data Ambient temperature Ta (C) Ta = 25C Light current IL (mA) IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) Ta = -30C Ta = 25C Ta = 70C Forward current IF (mA) Forward voltage VF (V) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C VCE = 10 V Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 5 V Dark current ID (nA) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) (Center of optical axis) 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 20 mA VCE = 10 V Ta = 25C Relative light current IL (%) Response time tr, tf (s) Relative light current IL (%) 120 VCC = 5 V Ta = 25C -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1055 Photomicrosensor (Transmissive) 49 Photomicrosensor (Transmissive) EE-SX1057 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Compact model with a 3.6-mm-wide slot. * PCB mounting type. Absolute Maximum Ratings (Ta = 25C) Item Emitter Detector Ambient temperature K C A E Unless otherwise specified, the tolerances are as shown below. Dimensions Tolerance 3 < mm 6 0.2 0.24 6 < mm 10 0.29 10 < mm 18 0.35 18 < mm 30 0.42 3 mm max. Name A K C Anode Cathode Collector E Emitter Rated value IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature Internal Circuit Terminal No. Symbol Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.15 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 1.5 mA min., 8 mA typ., 30 mA max. IF = 15 mA, VCE = 2 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.4 V max. IF = 30 mA, IL = 1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ., 20 A max. VCC = 10 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ., 20 A max. VCC = 10 V, RL = 100 , IL = 5 mA 50 EE-SX1057 Photomicrosensor (Transmissive) Engineering Data Ambient temperature Ta (C) IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 5 V Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) 120 Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Ta = 70C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 50 mA Ta = -30C Dark current ID (nA) Light current IL (mA) Ta = 25C Ta = 25C VCE = 10 V Forward voltage VF (V) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1057 Photomicrosensor (Transmissive) 51 Photomicrosensor (Transmissive) EE-SX1061 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * General-purpose model with a 4.6-mm-wide slot. * PCB mounting type. Absolute Maximum Ratings (Ta = 25C) Item Emitter Detector Ambient temperature Symbol IF 50 mA (see note 1) Pulse forward current IFP --- Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -40C to 85C Storage Tstg -40C to 100C Tsol 260C (see note 2) Soldering temperature Internal Circuit K C A E Tolerance 0.3 3 mm max. Terminal No. A K C E Name Anode Cathode Collector Emitter Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 10 seconds. Unless otherwise specified, the tolerances are as shown below. Dimensions Rated value Forward current 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Electrical and Optical Characteristics (Ta = 25C) Item Emitter Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 1.3 mA min., 26 mA max. IF = 20 mA, VCE = 12 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.8 V max. IF = 10 mA, Vcc = 12 V, RL = 22k Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 1,000 s max. VCC = 12 V, RL = 22k , IL = 10 mA Falling time tf 1,000 s max. VCC = 12 V, RL = 22k , IL = 10 mA Detector 52 EE-SX1061 Photomicrosensor (Transmissive) Engineering Data Ta = -30C Ta = 25C Ta = 70C Ambient temperature Ta (C) Ta = 25C Light current IL (mA) 18 16 IF = 50 mA 14 IF = 40 mA 12 10 IF = 30 mA 8 IF = 20 mA 6 4 IF = 10 mA Relative Light Current vs. Ambient Temperature Characteristics (Typical) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 12 V Dark current ID (nA) 20 Forward current IF (mA) Forward voltage VF (V) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light current IL (mA) PC Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 10 V Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating 2 Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) (Center of optical axis) -2 Load resistance RL (k) -1 1 2 3 Distance d (mm) 4 IF = 20 mA VCE = 12 V Ta = 25C 100 (Center of optical axis) Relative light current IL (%) Response time tr, tf (s) IF = 20 mA VCE = 12 V Ta = 25C Relative light current IL (%) 120 VCC = 5 V Ta = 25C 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1061 Photomicrosensor (Transmissive) 53 Photomicrosensor (Transmissive) EE-SX1070 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Wide model with a 8-mm-wide slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. JAPAN 17.7 60.2 Absolute Maximum Ratings (Ta = 25C) Item 0.50.1 8 +0.2 -0.1 Two, C1 Emitter Optical axis 0 10 -0.2 7.50.2 2.2 2.5 6.2 Detector Two, 0.70.1 Four, 0.5 Four, 0.25 (2.5) (13.8) 2.350.1 (2.5) 5.20.1 K C A E 6.60.1 Ambient temperature Two, 0.70.1 dia. Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 95C Storage Tstg -30C to 100C Tsol 260C (see note 3) Internal Circuit K C A E Dimensions 3 mm max. Terminal No. A K C E Name Anode Cathode Collector Emitter Soldering temperature Unless otherwise specified, the tolerances are as shown below. Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V IF = 30 mA Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA 54 EE-SX1070 Photomicrosensor (Transmissive) Engineering Data Forward Current vs. Collector Dissipation Temperature Rating Light Current vs. Forward Current Characteristics (Typical) 100 30 50 20 10 -20 0 20 40 60 Ta = 25C Ta = 70C 0 100 80 Ambient temperature Ta (C) Ta = 25C IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Forward current IF (mA) Forward voltage VF (V) Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light current IL (mA) Ta = -30C Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 5 V Dark current ID (nA) 0 -40 Ta = 25C VCE = 10 V Light current IL (mA) PC 40 Forward current IF (mA) IF 50 Collector dissipation PC (mW) 150 60 Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) Distance d (mm) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Relative light current IL (%) Response time tr, tf (s) Load resistance RL (k) Relative light current IL (%) 120 VCC = 5 V Ta = 25C 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1070 Photomicrosensor (Transmissive) 55 Photomicrosensor (Transmissive) EE-SX1071 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * General-purpose model with a 3.4-mm-wide slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) 6.2 Item Emitter Four, C0.3 2.1 Optical axis 10.2 7.2 Detector Four, 0.25 Cross section BB (2.54) Cross section AA Ambient temperature Internal Circuit K C A E Terminal No. Name A Anode K C E Cathode Collector Emitter 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature Unless otherwise specified, the tolerances are as shown below. Dimensions Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.3 3 < mm 6 6 < mm 10 0.375 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value IF 0.5 0.2 Four, 0.5 Symbol Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA IF = 20 mA, VCE = 10 V IF = 30 mA Light current IL 0.5 mA min., 14 mA max. Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Detector 56 EE-SX1071 Photomicrosensor (Transmissive) Engineering Data Light current IL (mA) Ta = 25C IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Load resistance RL (k) Light current IL (mA) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V VCE = 10 V 0 lx Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Ta = 70C Forward voltage VF (V) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = -30C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Distance d (mm) Sensing Position Characteristics (Typical) 120 IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Ambient temperature Ta (C) Ta = 25C VCE = 10 V Dark current ID (nA) PC Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1071 Photomicrosensor (Transmissive) 57 Photomicrosensor (Transmissive) EE-SX1081 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * General-purpose model with a 5-mm-wide slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Four, C0.3 13.70.3 Item 5+0.1 0.50.1 Emitter Two, C10.3 (Optical axis) 7.50.2 6.50.1 6.20.5 Four, 0.50.1 Detector Four, 0.250.1 (10.5) Cross section BB Cross section AA Ambient temperature Internal Circuit K C 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) A E Terminal No. A Name Anode K C E Cathode Collector Emitter Soldering temperature Unless otherwise specified, the tolerances are as shown below. Dimensions Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value IF 2.50.2 100.2 8.50.1 Symbol Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA IF = 20 mA, VCE = 10 V IF = 30 mA Light current IL 0.5 mA min., 14 mA max. Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Detector 58 EE-SX1081 Photomicrosensor (Transmissive) Engineering Data IF = 20 mA IF = 10 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Light current IL (mA) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V VCE = 10 V 0 lx Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) 120 Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) Ta = 70C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) 80 Response Time Measurement Circuit Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 30 mA Ta = 25C Dark current ID (nA) IF = 40 mA Ta = -30C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) IF = 50 mA Ta = 25C VCE = 10 V Forward voltage VF (V) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Input Output 90 % 10 % Input Output EE-SX1081 Photomicrosensor (Transmissive) 59 Photomicrosensor (Transmissive) EE-SX1082 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Horizontal sensing aperture. * PCB mounting type. * High resolution with a 0.2-mm-wide aperture. E Absolute Maximum Ratings (Ta = 25C) C Item Emitter Detector Ambient temperature Internal Circuit K Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -40C to 85C Storage Tstg -40C to 100C Tsol 260C (see note 3) C Soldering temperature A E Terminal No. Name A K C Anode Cathode Collector E Emitter Unless otherwise specified, the tolerances are 0.2 mm. Rated value Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 920 nm typ. IF = 20 mA Light current IL 0.12 mA min. IF = 20 mA, VCE = 5 V VCE = 10 V, 0 lx Forward voltage IF = 30 mA Dark current ID 2 nA typ., 200 nA max. Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.08 V typ., 0.4 V max. IF = 20 mA, IL = 0.05 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 100 s typ. VCC = 5 V, RL = 50 k, IL = 0.1 mA Falling time tf 1,000 s typ. VCC = 5 V, RL = 50 k, IL = 0.1 mA 60 EE-SX1082 Photomicrosensor (Transmissive) Engineering Data Ta = 25C Ta = 70C IF = 30 mA IF = 20 mA IF = 10 mA IF = 20 mA VCE = 5 V Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Ambient temperature Ta (C) 120 IF = 20 mA VCE = 10 V Ta = 25C 100 80 60 d 40 20 0 Load resistance RL (k) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) VCE = 10 V 0 lx Dark current ID (nA) IF = 40 mA Dark Current vs. Ambient Temperature Characteristics (Typical) -0.2 -0.1 0 0.1 0.2 0.3 Distance d (mm) 0.4 Sensing Position Characteristics (Typical) 120 Relative light current IL (%) IF = 50 mA Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Forward current IF (mA) Forward voltage VF (V) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light current IL (mA) Ta = -30C (Center of optical axis) PC Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) 80 d 60 40 20 0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1082 Photomicrosensor (Transmissive) 61 Photomicrosensor (Transmissive) EE-SX1088 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * * * * 250.2 190.15 Two, R1 50.2 60.2 Four, C0.3 Two, 3.20.2 dia. holes Two, C2 Absolute Maximum Ratings (Ta = 25C) 0.50.1 0.50.1 Item 6.50.1 (Optical axis) Emitter 100.2 7.20.2 8.40.1 2.50.1 30.4 General-purpose model with a 3.4-mm-wide slot. Mounts to PCBs or connects to connectors. High resolution with a 0.5-mm-wide aperture. OMRON's XK8-series Connectors can be connected without soldering. Contact your OMRON representative for information on obtaining XK8-series Connectors. Four, 0.25 Four, 0.5 Detector Cross section BB Cross section AA Internal Circuit K C A Ambient temperature Unless otherwise specified, the tolerances are as shown below. E Dimensions 3 mm max. 0.3 3 < mm 6 0.375 K C Cathode Collector 6 < mm 10 0.45 10 < mm 18 0.55 E Emitter 18 < mm 30 0.65 Rated value IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature Tolerance Terminal No. Name A Anode Symbol Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. IF = 30 mA Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.15 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Emitter Detector 62 EE-SX1088 Photomicrosensor (Transmissive) Engineering Data IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Light current IL (mA) Ta = -30C Ta = 25C Ta = 70C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Ta = 25C VCE = 10 V Forward voltage VF (V) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V VCE = 10 V 0 lx Dark current ID (nA) PC Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) (Center of optical axis) Distance d (mm) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) IF = 20 mA VCE = 10 V Ta = 25C Relative light current IL (%) Response time tr, tf (s) Load resistance RL (k) Relative light current IL (%) 120 VCC = 5 V Ta = 25C 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1088 Photomicrosensor (Transmissive) 63 Photomicrosensor (Transmissive) EE-SX1096 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * * * * * 250.2 190.15 Two, R1 50.2 60.2 Two, 3.20.2 dia. holes Four, C0.3 Two, C2 General-purpose model with a 3.4-mm-wide slot. Mounts to PCBs or connects to connectors. High resolution with a 0.5-mm-wide aperture. With a horizontal sensing slot. OMRON's XK8-series Connectors can be connected without soldering. Contact your OMRON representative for information on obtaining XK8-series Connectors. Absolute Maximum Ratings (Ta = 25C) 2.10.15 2.10.15 Item 0.50.1 0.50.1 Emitter (Optical axis) 100.2 7.20.2 2.50.1 Four, 0.5 30.4 Four, 0.25 Detector Cross section AA Cross section BB Internal Circuit K C A Unless otherwise specified, the tolerances are as shown below. E Dimensions Tolerance 3 mm max. 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 E 18 < mm 30 0.65 Rated value IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Soldering temperature 0.3 Terminal No. Name A Anode K Cathode C Collector Emitter Ambient temperature Symbol Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 0.5 mA min., 14 mA max. IF = 20 mA, VCE = 10 V IF = 30 mA Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA 64 EE-SX1096 Photomicrosensor (Transmissive) Engineering Data Light current IL (mA) Ta = -30C Ta = 25C Ta = 70C Ambient temperature Ta (C) Relative Light Current vs. Ambient Temperature Characteristics (Typical) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 20 mA IF = 10 mA Dark current ID (nA) IF = 30 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Ambient temperature Ta (C) 120 80 d 60 40 20 -0.5 -0.25 0 0.25 0.5 Distance d (mm) 0.75 1.0 Sensing Position Characteristics (Typical) 120 IF = 20 mA VCE = 10 V Ta = 25C 100 0 Load resistance RL (k) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) VCE = 10 V 0 lx Relative light current IL (%) IF = 40 mA Dark Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V Relative light current IL (%) Light current IL (mA) Ta = 25C IF = 50 mA Forward current IF (mA) Forward voltage VF (V) (Center of optical axis) PC Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 10 V Forward current IF (mA) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) 100 80 d 60 40 20 0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1096 Photomicrosensor (Transmissive) 65 Photomicrosensor (Transmissive) EE-SX1103 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a sensor width of 5 mm and a slot width of 2 mm. * PCB mounting type. * High resolution with a 0.4-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Two, C0.5 Item Gate Emitter Optical axis dia. Two, C0.3 5 min. Four, 0.5 Detector Four, 0.2 Internal Circuit Ambient temperature Symbol IF 50 mA (see note 1) Pulse forward current IFP --- Reverse voltage VR 5V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO 4.5 V Collector current IC 30 mA Collector dissipation PC 80 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 2) Soldering temperature Terminal No. A K C E Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 3 seconds. Name Anode Cathode Collector Emitter Rated value Forward current Unless otherwise specified, the tolerances are 0.2 mm. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.3 V typ., 1.6 V max. Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 950 nm typ. IF = 50 mA Light current IL 0.5 mA min. IF = 20 mA, VCE = 5 V VCE = 10 V, 0 lx IF = 50 mA Dark current ID 500 nA max. Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.4 V max. IF = 20 mA, IL = 0.3 mA Peak spectral sensitivity wavelength P 800 nm typ. VCE = 5 V Rising time tr 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA Falling time tf 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA 66 EE-SX1103 Photomicrosensor (Transmissive) Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) Ambient temperature Ta (C) IF = 30 mA IF = 20 mA IF = 10 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Light current It (mA) Light current IL (mA) Sensing Position Characteristics (Typical) Sensing Position Characteristics (Typical) IF = 20 mA VCE = 5 V Ta = 25C Distance d (mm) VCE = 30 V VCE = 20 V VCE = 10 V Ambient temperature Ta (C) Ambient temperature Ta (C) Relative light current IL (%) Response Time vs. Light Current Characteristics (Typical) IF = 20 mA VCE = 5 V Dark Current vs. Ambient Temperature Characteristics (Typical) Dark current ID (nA) Light current IL (mA) IF = 40 mA Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Ta = 25C IF = 50 mA Forward current IF (mA) Forward voltage VF (V) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Forward current IF (mA) Forward current IF (mA) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 20 mA VCE = 5 V Ta = 25C Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1103 Photomicrosensor (Transmissive) 67 Photomicrosensor (Transmissive) EE-SX1105 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a sensor width of 4.9 mm and a slot width of 2 mm. * Low-height of 3.3 mm. * PCB mounting type. * High resolution with a 0.4-mm-wide aperture. Two, C0.7 Gate Optical axis Four, 0.5 Four, 0.4 Absolute Maximum Ratings (Ta = 25C) Item Emitter Two, R0.15 Two, R0.3 5 min. Four, Detector Cross section AA Internal Circuit Ambient temperature Symbol IF 50 mA (see note 1) Pulse forward current IFP --- Reverse voltage VR 5V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO 4.5 V Collector current IC 30 mA Collector dissipation PC 80 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 85C Tsol 260C (see note 2) Soldering temperature Terminal No. Name A Anode K Cathode C Collector E Emitter Note: Unless otherwise specified, the tolerances are 0.2 mm. Rated value Forward current 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 3 seconds. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition VF 1.3 V typ., 1.6 V max. Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 950 nm typ. IF = 50 mA Light current IL 0.2 mA min. IF = 20 mA, VCE = 5 V Dark current ID 500 nA max. VCE = 10 V, 0 lx Leakage current ILEAK Forward voltage IF = 50 mA --- --- 0.4 V max. IF = 20 mA, IL = 0.1 mA P 800 nm typ. VCE = 5 V Rising time tr 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA Falling time tf 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA Collector-Emitter saturated volt- VCE (sat) age Peak spectral sensitivity wavelength 68 EE-SX1105 Photomicrosensor (Transmissive) Engineering Data Forward Current vs. Collector Dissipation Temperature Rating Forward Current vs. Forward Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Light current IL (mA) Forward current IF (mA) Forward current IF (mA) Collector dissipation Pc (mW) 2.5 2 1.5 1 0.5 Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) IF = 10 mA Dark Current vs. Ambient Temperature Characteristics (Typical) 120 100 80 60 RL = 500 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response time tr, tf (s) RL = 1K VCE = 10 V 20 Collector-Emitter voltage VCE (V) Ta = 25C VCE = 5 V VCE = 30 V VCE = 20 V 40 0 -40 Response Time vs. Light Current Characteristics (Typical) IF = 20 mA VCE = 5 V 140 Dark current ID (nA) IF = 20 mA Relative Light Current vs. Ambient Temperature Characteristics (Typical) IF = 20 mA VCE = 5 V Ta = 25C Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) IF = 30 mA Relative light current IL (%) Light current IL (mA) IF = 40 mA Forward current IF (mA) 160 Ta = 25C IF = 50 mA Forward voltage VF (V) IF = 20 mA VCE = 5 V Ta = 25C RL = 100 Light current lt (mA) Distance d (mm) Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1105 Photomicrosensor (Transmissive) 69 Photomicrosensor (Transmissive) EE-SX1106 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a slot width of 3 mm. * PCB mounting type. * High resolution with a 0.4-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Item Two, C0.7 Gate Emitter Optical axis 5.4 Detector 5 min. Two, R1 Four, 0.2 Two, C0.2 Four, 0.5 Internal Circuit Ambient temperature 0 dia 1-0.1 1.4 Symbol IF 50 mA (see note 1) Pulse forward current IFP --- Reverse voltage VR 5V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO 4.5 V Collector current IC 30 mA Collector dissipation PC 80 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 85C Tsol 260C (see note 2) Soldering temperature 0 -0.1 dia Rated value Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Complete soldering within 3 seconds. Terminal No. Name A Anode K C E Cathode Collector Emitter Unless otherwise specified, the tolerances are 0.2 mm. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Symbol Value Condition Forward voltage VF 1.3 V typ., 1.6 V max. Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 950 nm typ. IF = 50 mA IF = 50 mA Light current IL 0.2 mA min. IF = 20 mA, VCE = 5 V Dark current ID 500 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 800 nm typ. VCE = 5 V Rising time tr 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA Falling time tf 10 s typ. VCC = 5 V, RL = 100 , IF = 20 mA Detector 70 EE-SX1106 Photomicrosensor (Transmissive) Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) Ambient temperature Ta (C) IF = 15 mA IF = 10 mA IF = 5 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCE = 5 V Ta = 25C RL = 1K RL = 500 RL = 100 Light current It (mA) Light current IL (mA) VCE = 10 V Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Light Current Characteristics (Typical) VCE = 30 V VCE =20 V IF = 20 mA VCE = 5 V Ta = 25C Distance d (mm) Sensing Position Characteristics (Typical) Relative light current IL (%) IF = 20 mA IF = 20 mA VCE = 5 V Dark Current vs. Ambient Temperature Characteristics (Typical) Dark current ID (nA) Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) IF = 25 mA Forward current IF (mA) Forward voltage VF (V) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Forward current IF (mA) Forward current IF (mA) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 20 mA VCE = 5 V Ta = 25C Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1106 Photomicrosensor (Transmissive) 71 Photomicrosensor (Transmissive) EE-SX1107 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a 3.4-mm-wide sensor and a 1-mm-wide slot. * PCB surface mounting type. * High resolution with a 0.15-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Item Emitter Optical axis Detector Cross section AA Recommended Soldering Pattern Internal Circuit Ambient temperature Terminal No. Name A Anode K C E Cathode Collector Emitter Unless otherwise specified, the tolerances are 0.15 mm. Symbol Rated value Forward current IF 25 mA (see note 1) Pulse forward current IFP 100 mA (see note 2) Reverse voltage VR 5V Collector-Emitter voltage VCEO 20 V Emitter-Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 75 mW (see note 1) Operating Topr -30C to 85C Storage Tstg -40C to 90C Reflow soldering Tsol 240C (see note 3) Manual soldering Tsol 300C (see note 3) Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.1 V typ., 1.3 V max. IF = 5 mA Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 50 A min., 150 A typ., 500 A max. IF = 5 mA, VCE = 5 V Dark current ID 100 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 A P 900 nm typ. --- Rising time tr 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Falling time tf 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Peak spectral sensitivity wavelength 72 EE-SX1107 Photomicrosensor (Transmissive) Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Load resistance RL (k) Response Time Measurement Circuit Light current IL (mA) Sensing Position Characteristics (Typical) IF = 5 mA VCE = 5 V Distance d (mm) VCE = 10 V VCE =2 V Ambient temperature Ta (C) Ambient temperature Ta (C) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) Dark current ID (nA) IF = 5 mA IF = 5 mA VCE = 5 V Sensing Position Characteristics (Typical) Relative light current IL (%) IF = 10 mA Relative Light Current vs. Ambient Dark Current vs. Ambient TemTemperature Characteristics (Typical) perature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Forward current IF (mA) Forward voltage VF (V) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Forward current IF (mA) Forward current IF (mA) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 5 mA VCE = 5 V Distance d (mm) Input Output 90 % 10 % Input Output EE-SX1107 Photomicrosensor (Transmissive) 73 Unit: mm (inch) Tape and Reel Reel 210.8 dia. 3302 dia. 20.5 13 0.5 dia. 801 dia. Product name Quantity Lot number 12.4 +2 0 18.4 max. Tape 1.5 dia. Tape configuration Terminating part (40 mm min.) Parts mounted Pull-out direction Tape quantity 2,500 pcs./reel 74 EE-SX1107 Photomicrosensor (Transmissive) Leading part (400 mm min.) Empty (40 mm min.) Precautions Soldering Information Reflow soldering * The following soldering paste is recommended: Melting temperature: 216 to 220C Composition: Sn 3.5 Ag 0.75 Cu * The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. * Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. Temperature 1 to 5C/s 1 to 5C/s 260C max. 255C max. 230C max. 150 to 180C 120 sec 10 sec max. 40 sec max. Time Manual soldering * * * * Use "Sn 60" (60% tin and 40% lead) or solder with silver content. Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 350C or below. Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60C for 24 hours or more Bulk: 80C for 4 hours or more EE-SX1107 Photomicrosensor (Transmissive) 75 Photomicrosensor (Transmissive) EE-SX1108 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a 5-mm-wide sensor and a 1-mm-wide slot. * PCB surface mounting type. * High resolution with a 0.3-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Item Emitter Optical axis Detector Cross section AA Recommended Soldering Pattern Internal Circuit Ambient temperature Terminal No. Name A Anode K C Cathode Collector E Emitter Symbol Rated value Forward current IF 25 mA (see note 1) Pulse forward current IFP 100 mA (see note 2) Reverse voltage VR 5V Collector-Emitter voltage VCEO 20 V Emitter-Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 75 mW (see note 1) Operating Topr -30C to 85C Storage Tstg -40C to 90C Reflow soldering Tsol 240C (see note 3) Manual soldering Tsol 300C (see note 3) Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. Unless otherwise specified, the tolerances are 0.15 mm. Electrical and Optical Characteristics (Ta = 25C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.1 V typ., 1.3 V max. IF = 5 mA Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 50 A min., 150 A typ., 500 A max. IF = 5 mA, VCE = 5 V Dark current ID 100 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 A P 900 nm typ. --- Rising time tr 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Falling time tf 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Peak spectral sensitivity wavelength 76 EE-SX1108 Photomicrosensor (Transmissive) Engineering Data Ambient temperature Ta (C) Light Current vs. Forward Current Characteristics (Typical) Ta = 25C VCE = 5 V Light current IL (mA) Forward current IF (mA) Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating Forward current IF (mA) Forward voltage VF (V) IF = 5 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Load resistance RL (k) IF = 5 mA VCE = 5 V Distance d (mm) VCE = 10 V VCE = 2 V Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) Dark current ID (nA) IF = 10 mA IF = 5 mA VCE = 5 V Sensing Position Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Relative light current IL (%) Light Current vs. Collector-Emitter Relative Light Current vs. Ambient Dark Current vs. Ambient TemVoltage Characteristics (Typical) Temperature Characteristics (Typical) perature Characteristics (Typical) IF = 5 mA VCE = 5 V Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1108 Photomicrosensor (Transmissive) 77 Unit: mm (inch) Tape and Reel Reel 210.8 dia. 3302 dia. 20.5 13 0.5 dia. 801 dia. Product name Quantity Lot number 12.4 +2 0 18.4 max. Tape 1.5 dia. Tape configuration Terminating part (40 mm min.) Parts mounted Pull-out direction Tape quantity 2,000 pcs./reel 78 EE-SX1108 Photomicrosensor (Transmissive) Leading part (400 mm min.) Empty (40 mm min.) Precautions Soldering Information Reflow soldering * The following soldering paste is recommended: Melting temperature: 216 to 220C Composition: Sn 3.5 Ag 0.75 Cu * The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. * Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. Temperature 1 to 5C/s 1 to 5C/s 260C max. 255C max. 230C max. 150 to 180C 120 sec 10 sec max. 40 sec max. Time Manual soldering * * * * Use "Sn 60" (60% tin and 40% lead) or solder with silver content. Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300C or below. Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60C for 24 hours or more Bulk: 80C for 4 hours or more EE-SX1108 Photomicrosensor (Transmissive) 79 Photomicrosensor (Transmissive) EE-SX1109 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * Ultra-compact with a 6-mm-wide sensor and a 3-mm-wide slot. * PCB surface mounting type. * High resolution with a 0.5-mm-wide aperture. Absolute Maximum Ratings (Ta = 25C) Item Emitter Optical axis Detector Cross section AA Recommended Soldering Pattern Internal Circuit Ambient temperature Terminal No. A K C E Symbol IF 25 mA (see note 1) Pulse forward current IFP 100 mA (see note 2) Reverse voltage VR 5V Collector-Emitter voltage VCEO 20 V Emitter-Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 75 mW (see note 1) Operating Topr -30C to 85C Storage Tstg -40C to 90C Reflow soldering Tsol 240C (see note 3) Manual soldering Tsol 300C (see note 3) Name Anode Cathode Collector Emitter Rated value Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. Unless otherwise specified, the tolerances are 0.15 mm. Electrical and Optical Characteristics (Ta = 25C) Item Symbol Value Condition Forward voltage VF 1.1 V typ., 1.3 V max. Reverse current IR 10 A max. VR = 5 V Peak emission wavelength P 940 nm typ. IF = 20 mA Light current IL 50 A min., 150 A typ., 500 A max. IF = 5 mA, VCE = 5 V Dark current ID 100 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 A Peak spectral sensitivity wavelength P 900 nm typ. --- Rising time tr 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Falling time tf 10 s typ. VCC = 5 V, RL = 1 k, IL = 100 A Emitter Detector 80 EE-SX1109 Photomicrosensor (Transmissive) IF = 5 mA Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) Forward current IF (mA) Light current IL (mA) Ta = 25C VCE = 5 V Ambient temperature Ta (C) IF = 10 mA IF = 5 mA Collector-Emitter voltage VCE (V) Response time tr, tf (s) VCC = 5 V Ta = 25C Load resistance RL (k) VCE = 10 V VCE = 2 V Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) IF = 5 mA VCE = 5 V IF = 5 mA VCE = 5 V Distance d (mm) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Forward current IF (mA) Forward voltage VF (V) Relative Light Current vs. Ambient Dark Current vs. Ambient TemperTemperature Characteristics (Typical) ature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Dark current ID (nA) Forward current IF (mA) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 5 mA VCE = 5 V Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1109 Photomicrosensor (Transmissive) 81 Unit: mm (inch) Tape and Reel Reel 210.8 dia. 330+2 dia. 20.5 13 0.5 dia. 801 dia. Product name Quantity Lot No. 12.4+2 0 18.4 max. Tape 1.5 dia. Tape configuration Terminating part (40 mm min.) Parts mounted Pull-out direction Tape quantity 1,000 pcs./reel 82 EE-SX1109 Photomicrosensor (Transmissive) Leading part (400 mm min.) Empty (40 mm min.) Precautions Soldering Information Reflow soldering * The following soldering paste is recommended: Melting temperature: 216 to 220C Composition: Sn 3.5 Ag 0.75 Cu * The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. * Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. Temperature 1 to 5C/s 1 to 5C/s 260C max. 255C max. 230C max. 150 to 180C 120 sec 10 sec max. 40 sec max. Time Manual soldering * * * * Use "Sn 60" (60% tin and 40% lead) or solder with silver content. Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300C or below. Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60C for 24 hours or more Bulk: 80C for 4 hours or more EE-SX1109 Photomicrosensor (Transmissive) 83 Photomicrosensor (Transmissive) EE-SX1115 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * 14.5-mm-tall model with a deep slot. * PCB mounting type. * High resolution with a 0.5-mm-wide aperture. Four, C0.3 1.03 Four, R0.1 Absolute Maximum Ratings (Ta = 25C) 5 1.35 +0.06 -0.01 1.35 +0.06 -0.01 Item 14 0.2 Part B 5 0.50.05 Emitter Symbol IF 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) A Four, R0.1 Optical axis 1.03 1.35 +0.06 -0.01 14.5 1.35 120.4 +0.06 -0.01 Detector Part C 2.5 2-2 5 min. A Four, 0.25 Four, 0.5 (11.2) K (1.94) C Cross section AA A B (2.1) Internal Circuit K C A Name A K C Anode Cathode Collector E Emitter 4.20.1 C Soldering temperature Unless otherwise specified, the tolerances are as shown below. E Terminal No. Ambient temperature E Dimensions Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 3 mm max. 0.3 3 < mm 6 0.375 6 < mm 10 0.45 10 < mm 18 0.55 18 < mm 30 0.65 Rated value Forward current Electrical and Optical Characteristics (Ta = 25C) Item Emitter Symbol Value Condition Forward voltage VF 1.2 V typ., 1.5 V max. Reverse current IR 0.01 A typ., 10 A max. VR = 4 V Peak emission wavelength P 940 nm typ. IF = 20 mA IF = 20 mA, VCE = 10 V IF = 30 mA Light current IL 0.5 mA min., 14 mA max. Dark current ID 2 nA typ., 200 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector-Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 0.1 mA Peak spectral sensitivity wavelength P 850 nm typ. VCE = 10 V Rising time tr 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Falling time tf 4 s typ. VCC = 5 V, RL = 100 , IL = 5 mA Detector 84 EE-SX1115 Photomicrosensor (Transmissive) Engineering Data IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA IF = 10 mA Light current IL (mA) Forward current IF (mA) Dark Current vs. Ambient Temperature Characteristics (Typical) VCE = 10 V 0 lx IF = 20 mA VCE = 5 V Ambient temperature Ta (C) Ambient temperature Ta (C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response time tr, tf (s) VCC = 5 V Ta = 25C Ta = 70C Forward voltage VF (V) Collector-Emitter voltage VCE (V) Response Time vs. Load Resistance Characteristics (Typical) Ta = 25C Relative Light Current vs. Ambient Temperature Characteristics (Typical) Relative light current IL (%) Light current IL (mA) Ta = 25C Ta = -30C IF = 20 mA VCE = 10 V Ta = 25C (Center of optical axis) Sensing Position Characteristics (Typical) 120 80 Distance d (mm) d 60 40 20 0 -2.0 Load resistance RL (k) IF = 20 mA VCE = 10 V Ta = 25C 100 (Center of optical axis) Ambient temperature Ta (C) Light Current vs. Collector-Emitter Voltage Characteristics (Typical) Ta = 25C VCE = 10 V Dark current ID (nA) PC Light Current vs. Forward Current Characteristics (Typical) Relative light current IL (%) IF Forward current IF (mA) Forward Current vs. Forward Voltage Characteristics (Typical) Collector dissipation PC (mW) Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1115 Photomicrosensor (Transmissive) 85 Photomicrosensor (Transmissive) EE-SX1128 Be sure to read Precautions on page 27. Dimensions Features Note: All units are in millimeters unless otherwise indicated. * * * * General-purpose model with a 4.2-mm-wide slot. PCB mounting type. High resolution with a 0.5-mm-wide aperture. Horizontal sensing aperture. Absolute Maximum Ratings (Ta = 25C) Item Emitter Detector Ambient temperature Internal Circuit K C A E Terminal No. A K C E Name Anode Cathode Collector Emitter 0.100 4 < x 18 0.200 50 mA (see note 1) Pulse forward current IFP 1A (see note 2) Reverse voltage VR 4V Collector-Emitter voltage VCEO 30 V Emitter-Collector voltage VECO --- Collector current IC 20 mA Collector dissipation PC 100 mW (see note 1) Operating Topr -25C to 85C Storage Tstg -30C to 100C Tsol 260C (see note 3) Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25C. 2. The pulse width is 10 s maximum with a frequency of 100 Hz. 3. Complete soldering within 10 seconds. Tolerance 0