ATZB-RF-233-1-CR - MICROCHIP TECHNOLOGY

ZIGBIT 2.4GHZ WIRELESS MODULES

ATZB-RF-233-1-C

DATASHEET

Features

• Ultra Compact size (25.0 x 20.0mm)

• Built In Front End Module to boost Output power upto +20dBm with Integrated

LNA for increased Sensitivity

• MCU less Tranceiver module with SPI interface

• High RX sensitivity (-104dBm)

• Outperforming link budget (up to +124dB)

• Up to +20.5dBm output power

• Very low power consumption:

• 7.5mA in RX mode (1)

• 157mA in TX mode (1)

• 0.7µA in sleep mode (2)

• Internal Clock Output

• Preassigned Atmel® MAC address that can be used on end product

• Capability to use MAC address into the onboard EEPROM

• IEEE® 802.15.4 compliant Transceiver

• 2.4GHz ISM band

• Rapid design-in with built-in Chip Antenna

• RF Test point using MS-147 RF connector

• Small physical footprint and low profile for optimum fit in very small application

boards

• Mesh networking capability

• Easy-to-use low cost development kit

• Single source of support for HW and SW

• Worldwide license-free operation

Note: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),

PHY_TX_PWR=0x0 (for TX current), All digit al out puts pulled hi gh.

Note: 2. Controller Sleep Mode – SLEEP_MODE_PWR_DOWN

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Table of Contents

1. Introduction ........................................................................................ 3

1.1 Summary ........................................................................................................... 3

1.2 Applications ....................................................................................................... 3

1.3 Abbreviations and Acronyms ............................................................................ 3

1.4 Related Documents ........................................................................................... 5

2. ZigBit Module Overview ..................................................................... 6

2.1 Overview ........................................................................................................... 6

3. Specification....................................................................................... 8

3.1 Electrical Characteristics ................................................................................... 8

3.1.1 Absolute Maximum Ratings ................................................................ 8

3.1.2 Power Supply ...................................................................................... 8

3.1.3 RF Characteristics .............................................................................. 9

3.2 Physical/Environmental Characteristics and Outline ....................................... 10

3.3 Pin Configuration ............................................................................................. 10

3.4 Antenna Orientation Recommendation ........................................................... 11

3.5 Mounting Information ...................................................................................... 11

3.6 Soldering Profile .............................................................................................. 14

3.7 Antenna Reference Designs ........................................................................... 14

4. Schematics ...................................................................................... 14

4.1 Handling Instructions ....................................................................................... 15

4.2 General Recommendations ............................................................................ 15

5. Persistence Memory ........................................................................ 15

6. Ordering Information ........................................................................ 16

7. Agency Certifications ....................................................................... 17

7.1 United States (FCC) ........................................................................................ 17

7.2 European Union (ETSI) ................................................................................... 17

7.3 Canada (IC) .................................................................................................... 18

8. Revision History ............................................................................... 19

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1. Introduction

1.1 Summary

ATZB-RF-233-1-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from Atmel

with a Built in RF Front End Module (FEM) that has an integrated Power amplifier and Low noise amplifier. This helps

the ZigBit reach a very high Link budget of upto +124dB. Based on the innovative mixed-signal hardware platform from

Atmel, this module uses the AT86RF233 [4]/2.4GHz ISM band Transceiver with the FEM on a very compact Module

design that provides the customer to integrate the module to any of the recommended Atmel’s Microcontrollers that the

application fits. The radio transceiver provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding

receiver sensitivity and high transmit output power enabling a very robust wireless communication. The module is

designed for wireless sensing, monitoring, control, data acquisition applications, to name a few. This ZigBit module

eliminates the need for costly and time-consuming RF development, and shortens time-to-market for wireless

applications.

The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed

and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.

1.2 Applications

The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing

mesh network, while optimizing network traffic and minimizing power consumption.

For detailed Software support information, please visit www.atmel.com/wireless.

The applications include, but are not limited to:

• Building automation & monitoring

o Lighting controls

o Wireless smoke- and CO-detectors

o Structural integrity monitoring

• HVAC monitoring & control

• Inventory management

• Environmental monitoring

• Security

• Water metering

• Industrial monitoring

o Machinery condition and performance monitoring

o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.

• Automated meter reading (AMR)

1.3 Abbreviations and Acronyms

ADC Analog-to-Digital Converter

API Application Programming Interface

DC Direct Current

DTR Data Terminal Ready

EEPROM Electrically Erasable Programmable Read-Onl y Memor y

ESD Electrostatic Discharge

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ETSI European Telecommunications Standards Institute

FCC Federal Communicati ons Commission

FEM Front End Module

GPIO General Purpose Input/Output

HAF High Frequency

HVAC Heating, Ventilating, and Air Conditioning

HW Hardware

IC Industry Canada

I2C Inter-Integrated Circuit

IEEE Institute of Electrical and Electronics Engineers

IRQ Interrupt Request

ISM Industrial, Scientific and Medical radio band

JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard

interface

LNA Low Noise Amplifier

MAC Medium Access Control layer

MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit

module

NRE Network layer

OEM Original Equipment Manufacturer

OTA Over-The-Air upgrade

PA Power Amplifier

PCB Printed Circuit Board

PER Package Error Ratio

RAM Random Access Memory

RF Radio Frequency

RPC Reduced Power Consumption

RTS/CTS Request to Send/ Clear to Send

RX Receiver

SMA Surface Mount Assembly

SoC System on Chip

SPI Serial Peripheral Interface

SW Software

TTM Time-To-Market

TX Transmitter

UART Universal Asynchronous Receiver/Transmitter

USART Universal Synchronous/Asynchronous Receiver/Transmitter

USB Universal Serial Bus

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ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications

802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network

1.4 Related Documents

[1] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to

6GHz http://www.hirose.co.jp/cataloge_hp/e35801505.pdf

[2] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wire less Personal Area Networks (LR-WPANs)

[3] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007

[4] AT86RF233 Datasheet in http://www.atmel.com/devices/AT86RF233.aspx?tab=documents

[5] AT24MAC602 I 2 C-Compatible (2-wire) 2-Kbit Serial EEPROM with a Factory-Programmed EUI-64 ™ Address

Plus an Embedded Unique 128-bit Serial Number

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2. ZigBit Module Overview

2.1 Overview

The ATZB-RF-233-1-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module with an

integrated FEM built-in. Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM

band transceiver and Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio

performance, ultra-low power consumption and exceptional ease of integration.

Figure 2-1. ATZB-RF-233-1-C Block diagram

This ZigBit module contains Atm el’s AT86RF233 2.4GHz ISM band Transceiver for ZigBee and IEEE 802.15.4 [1].

The compact board design of the Radio Transceiver with very minimal components on the RF path to Antenna

dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its sensitivity.

This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. The

MS-147 connector [1] can be used as an RF Test port.

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ZigBit Module contains a complete RF design with all the necessary passive components included. The module can be

easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module Evaluation

kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to develop

FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU solution, a

module-based solution offers considerable savings in development time and NRE cost per unit during the HW/FW

design, prototyping, and mass production phases of product development.

Depending on end-user design requirements, the ZigBit can operate as a sensor node, where it can be paired with a

host processor driving the module over a serial interface.

The MAC stack running on the host processor can then control data transmission. Thus very minimal firmware

customization is required for successful module design-in. Third-party sensors can then be connected directly to the

host MCU.

Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the EEPROM built-in the

module. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to

buy a MAC address separately for the product using the ZigBit.

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3. Specification

3.1 Electrical Characteristics

3.1.1 Absolute Maximum Ratings

Table 3-1. Absolute Maximum R atings (1)(2)

Parameter

Minimum

Maximum

Voltage on any pin, except RESET with respect to ground

-0.3V

3.6V (VDD max)

Input RF level

+10dBm

Current into Vcc pins

200mA

Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may o ccur. Under no

circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed

under "Absolute Maximum Ratings" may cause permanent damage to the device.

This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated

in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to

prevent permanent damage.

3.1.2 Power Supply

Table 3-2. Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25°C.

Parameter

Range

Unit

Supply voltage, VDD

2.0 to 3.6

Current consumption: TX ON, FEM O N (1)

157

Current consumption: RX ON, RPC, LNA Bypass

7.5

Current consumption: RX ON, RPC, LNA ON

12.5

Current consumption: RX ON, LNA ON

Current consum ptio n: T RX_OFF, FEM Sleep

337

µA

Sleep Current consumption: TRX Sleep, FEM Sleep

0.7

µA

Note 1: Output TX power (when measuring consumption in TX mode) is +19.4dBm.

Current consumption depends on multiple factors, including but not limited to, the board design and materials. When this module

is assembled on a base board, the MCU current also should be considered in estimating Active and Sleep currents of the

product

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3.1.3 RF Characteristics

Table 3-3. RF Characteristics (1).

Parameter

Condition

Range

Unit

Frequency band

2.4000 to 2.4835

GHz

Numbers of channe ls (North American)

Channel spacing

MHz

Transmitter output power

Adjusted in 7 steps

+2.6 to + 19.9

dBm

Receiver sensit iv ity

PER = 1%

-105

dBm

On-air data rate

250, upto 2000

Kbps

TX output/ RX input nominal impedance

For balanced

Range (2)

Open field, LoS, Elevated

1.96

Table 3-4. Region specific TX power settings to ensure Compli ance (3)

PHY_TX_PWR 3:0 Regist er v alue Power register setting

[dBm]

Output power [dBm] (typical values at RF

connector)

0x0E

-12

+10.8

0x0F

-17

+4.1

Note: 1. For detailed characteristics, please refer [4]

Note: 2. Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of

transmitter and receiver, with special conditions were there is minimal or no RF interference from other

sources. For best case orientation of the ZigBits to achieve maximum range, refer to section 3.4.

Note: 3. To ensure compliance, the following regional specific settings are to be ensured:

FCC and IC compl iance:

Operating the ZigBit from Channels 12 to 24 has no restrictions on Set power level.

Operating the ZigBit at Channel 11 requires limitation of TX output power to maximum +16dBm, the

power setting register value should be 0x0D or less

Operating the ZigBit at Channel 25 requires limitation of TX output power to maximum +13dBm, the

power setting register value should be 0x0E or less

ETSI Compliance: Operating the ZigBit in Europe requires setting TX Power to 0x0F for Channels 11 and 26.

All other channels can use a power setting of either 0x0E or 0x0F. This setting ensures compliance with ETSI

EN 300 328 clause 4.3.2.2 Maximum Power Spectral Density

Table 3-5. TX power across channels

Channel

PHY_TX_PWR 3:0

Typical Output power [dBm] (at RF connector)

0xD or less

+16.0

0x0

+21.4

0x0

+21.4

0x0

+21.4

15 0x0 +21.3

0x0

+21.3

17 0x0

+21.3

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0x0

+21.3

0x0

+21.3

0x0

+21.3

0x0

+21.3

0x0

+21.3

0x0

+21.2

0x0

+21.1

0xE

+13.0

26 0xE or less Restricted - Do not use in North America and

Canada

Restricted – Refer Note 2 for Europe

3.2 Physical/Environmental Characteristics and Outline

Table 3-6. Physical characteristics.

Parameters

Value

Comments

Size

25.0 x 20.0mm

Operating temperature range

-40°C to +85°C

-40°C to +85°C operational

3.3 Pin Configuration

Table 3-7. ATZB-RF-233-1-C Pinout description

Pin Out

descriptions

Function

AVSS

Analog Ground

AVSS

Analog Ground

DEVDD

Digital Power input pin

DEVDD

Digital Power input pin

/RST

REST active low

/SEL

SPI select, active low

MOSI

SPI data input

MISO

SPI data output

SCLK

SPI clock

DIG1

Reserved

FEM_CSD

Reserved

DIG3

RX TX Indication

DIG4

RX TX Indication (Inverted)

DIG2

Tx- Rx time-stamp

SLP_TR

Controls sleep, deep sleep, transmit start, receive states; active high

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Pin Out

descriptions

Function

SCL

TWI- EEPROM

SDA

TWI- EEPROM

FEM_CPS

Front end module select for RF_TX_RX

CLKM

Master Clock out put

IRQ

Interrupt request signal output

DVSS

Digital Ground

DVSS

Digital Ground

3.4 Antenna Or ientation Recommendation

The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this

illustration.

3.5 Mounting Information

The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on

the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded

via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and

losses.

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Figure 3-1. ATZB-RF-233-1-C Dimensions

Figure 3-2. ATZB-RF-233-1-C Pinout

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Figure 3-3. ATZB-RF-233-1-C Foot Print Dimensions

Figure 3-4. ATZB-RF-233-1-C Mounting Information

The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The

Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end

application.

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Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior

performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers

of the carrier board

The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be

equal to or greater than 25mm

3.6 Soldering Profile

The J-STD-020C-compliant soldering profile is recommended according to Table 3-8.

Table 3-8. Soldering profile(1)

Profile feature

Green package

Average ramp-up rate (217°C to peak)

3°C/s max

Preheat temperature 175°C ±25°C

180s max

Temperature maintained above 217°C 60s to 150s

Time within 5°C of actual peak temperature 20s to 40s

Peak temperature range

260°C

Ramp-down rate 6°C/s max

Time within 25°C to peak temperature

8 minutes

Note: 1. The package is backward compatible with PB/Sn soldering profile.

3.7 Antenna Reference Designs

Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board

material and thickness, shields, the material used for enclosure, the board neighborhood, and other components

adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.

General Recommendations:

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.

• Placing high profile components next to antenna should be avoided.

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board

edges also distorting antenna pattern.

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band

frequency.

The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of

high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna

pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.

4. Schematics

The following schematic drawings for the ATZB-RF-233-1-C are in the following order:

• Top level schematics

• AT86RF233 schematics

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4.1 Handling Instructions

The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is

galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection

coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this

should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying

the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housi ng of the product should ensure

suitable Ingress Protection standards are complied with.

The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect

electrical connection on the surfaces of connector.

The in-built chip antenna has been tuned for the particular design

4.2 General Recommendations

• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning

• Placing high profile components next to antenna should be avoided

• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges

also distorting antenna pattern

• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency

band

5. Persistence Memory

A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The

organization of the persistence memory is as follows:

Table 5-1. Persist en ce Memory

Data

Size

Structure Revision

2 bytes

MAC address(1)

8 bytes

Board information overall

49 bytes

Board information – PCBA Name 30 bytes

Board information – PCBA Serial number

10 bytes

Board information – PCBA Atmel Part Number 8 bytes

Board information – PCBA Revision 1 byte

Reserved

3 bytes

Xtal Calibration Value 1 byte

Reserved

7 bytes

Reserved

4 bytes

CRC

2 bytes

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ATZB-RF-233-1-C Zigbit contains AT24MAC602 which has a globally unique MAC address that can be assigned as the

physical address of a system hardware device or node. Persistence memory is stored in the First-half of the Standard 2-

Kbit EEPROM of AT24MAC602 starting from address 0x00.

Special commands are available to read the unique 64-bit MACID and the persistent memory via the I2C-compatible (2-

wire) serial interface (see section "Device Addressing” in AT24MAC602 [5] for details).

Note: 1 The MAC address stored inside the AT24MAC602 is a uniquely assigned ID for each ZigBit and owned by

Atmel. User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The

MAC ID can be read from the ZigBit using the Performance Analyzer Application that can be downloaded

from www.atmel.com/wireless

6. Ordering Information

Part number

Description

ATZB-RF-233-1-C 2.4GHz I EEE 802.1 5.4/ZigBee O EM module based on AT86RF233 Transceiver with MS-147 test

connector and chip antenna, Single unit

ATZB-RF-233-1-CR 2.4GHz I EEE 802.1 5.4/ZigBee O EM module based on AT86RF233 Transceiver with MS-147 test

connector and chip antenna, Tape & Reel

Note: Tape and reel quantity: 200.

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7. Agency Certi f ications

7.1 United States (FCC)

This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an

OEM manufacturer must comply with the following regulations:

The ATZB-RF-233-1-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is

not visible when the module is installed inside another device, then the outside of the device into which the

module is installed must also display a label referring to the enclosed module. This exterior label can use

wording such as the following:

IMPORTANT: Contains FCC ID: VW4A091729. This equipment complies with Part 15 of the FCC Rules. Operation

is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device

must accept any interference received, including interference that may cause undesired operation (FCC 15.19).

The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all

persons and must not be colocated or operating in conjunction with any other antenna or transmitter.

Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF

exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may

only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment

authorization.

IMPORTANT: Modifications not express ly approved by this company could void the user's authority to operate this

equipment (FCC section 15.21).

IMPORTANT: This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial environment. This equipment generates, uses, and

can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may

cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to

cause harmful interference in which case the user will be required to correct the interference at his own expense

(FCC section 15.105).

7.2 European Union (ETSI)

The ATZB-RF-233-1-C Module has been certified for use in European Union countries. If these modules are

incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized

EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and

kept on file as described in Annex II of the R&TTE Directive.

Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does

not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user

manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body

for compliance testing to all required standards.

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IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall

consist of the initials "CE" taking the following form:

The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the

apparatus.

The CE marking must be affixed visibly, legibly, and indelibly.

More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE

EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.

7.3 Canada (IC)

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two

conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including

interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en

compromettre le fonctionnement.

This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20 cm between the device and

the user or bystanders.

Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le

dispositif et l'utilisateur ou des tiers

CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the

user’s authority to operate the equipment.

The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another

device, then the device should display the label on it referring the enclosed module. In that case, the final end product

must be labelled in a visible area with the following:

“Contains Transmitter Module IC:11019A-091729”

“Contains IC: 11019A-091729”

Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à

l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le

produit final doit être étiqueté dans un endroit visible par le texte suivant:

“Contains Transmitter Module IC: 11019A-091729”

“Contains IC: 11019A-091729”

ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]

42192C−WIRELESS−08/2015

8. Revision History

Doc. Rev.

Date

Comments

42192C 08/2015 • Updated the table note Note 3:

This setting ensures compliance with ETSI EN 300 328 clause 4.3.2.2 Maximum

Power Spectral Density

42192B 03/2014 • Updated the mounting information drawimg Figure 3-4

•

Updated the section “Persistence”

42192A

11/2013

Initial revision.

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