SM0502 – SM1003
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 1
TM ®
www.MICROSEMI.com
Copyright 2007
Rev: 2009-02-25
RoHS Com
p
liant Versions
CONTROL DEVICES
Surface Mount – MELF PIN Diodes
.
DESCRIPTION
This line of ‘MELF’ high power PIN diodes are hermetically sealed
surface mount packaged devices with full face bonded chips for low
inductance construction. The MELF ceramic package has square end
terminations which are ideal for surface mount and pick and place
operations. The PIN diode chips are coated with a special hard glass
passivation which is required for high power applications and to
enhance the reliability resulting in MTBFs of greater than one million
hours.
RoHS compliant versions of these products meet RoHS requirements per EU
Directive 2002/95/EC. The standard terminal finish is gold unless otherwise
specified. Consult the factory if you have special requirements.
APPLICATIONS
The MELF diodes are used as switching, attenuating and phase
shifting elements from HF through 2 GHz and have breakdown
voltage ratings up to 500 volts. ‘Non-magnetic1’ .Cer-Met. (MELFs)
are also used as switching elements in MRI (magnetic resonance
imaging). Conventional Magnetic MELF packages are used in
Cellular, Beam Steering units (telephone via satellites) surface mount
applications, and Filter Switch banks for Frequency Hopping Radios.
APPLICATIONS/BENEFITS
Designed for Low Loss – Low
Distortion Applications
Switch – Filter Bank
T/R Control
Attenuators
MRI Switching
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating Symbol Value Unit
Maximum Leakage Current
@80% of Minimum Rated VB IR 500 nA
Forward Current (1us Pulse) IF 1 A
Storage Temperature TSTG -55 to +150 ºC
Operating Temperature TOP -55 to +150 ºC
KEY FEATURES
Non-Magnetic1 Versions Ideal for
MRI Applications
Very Low Inductance, Full Face
Bonding
Hi-Rel Hermetic Design
Surface Mount Devices Available
in Tape and Reel
RoHS Compliant2 Versions
Available
SM0502 – SM1003
IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com
Specifications are subject to change, consult factory for the latest information.
These devices are ESD sensitive and must be handled using ESD precautions.
1 ‘Non Magnetic’ refers to any products that
are designed with low and ultra low
magnetic materials for use in MRI systems
2 RoHS versions are supplied with a matte
tin finish.
SM0502 – SM1003
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 2
TM ®
www.MICROSEMI.com
Copyright 2007
Rev: 2009-02-25
RoHS Com
p
liant Versions
CONTROL DEVICES
Surface Mount – MELF PIN Diodes
ELECTRICAL PARAMETERS @ 25C (unless otherwise specified)
Model Number
Vb(V)
IR=10μA
(Min)
CT(pF)1
@50V
(Max)
Rs(Ω)2
@100 mA
(Max)
Rs(Ω)2
@200 mA
(Typ)
TL(uS)
.
(Typ)
P (˚C/W)
THERMAL
RESISTANCE
(Max)
SM0502 – M1 500 0.5 0.7 0.55 1.0 35
SM0504 – M1 500 0.6 0.6 0.45 1.5 20
SM0508 – M1 500 0.9 0.4 0.25 2.0 15
SM0509 – M1 500 1.2 0.35 0.2 2.5 15
SM0511 – M1 500 1.25 0.3 0.15 3.0 15
SM0512 – M1 500 1.5 0.25 0.12 3.5 15
SM1002 – M1 50 1.2 0.75@50mA 0.2 4.0 15
SM1003 – M1 35 1.2 @20V 0.5@10mA 0.1 0.6 25
Notes:
1- Capacitance (CT) is measured at F = 1 MHz
2- Series Resistance (RS) is measured at F = 100 MHz
RoHS and MRI Models
Base Model RoHS Compliant PN Non-Mag. / RoHS PN
SM0502 – M1 SMX0502 – M1 SMX0502MR – M1
SM0504 – M1 SMX0504 – M1 SMX0504MR – M1
SM0508 – M1 SMX0508 – M1 SMX0508MR – M1
SM0509 – M1 SMX0509 – M1 SMX0509MR – M1
SM0511 – M1 SMX0511 – M1 SMX0511MR – M1
SM0512 – M1 SMX0512 – M1 SMX0512MR – M1
SM1002 – M1 SMX1002 – M1 SMX1002MR – M1
SM1003 – M1 SMX1003 – M1 SMX1003MR – M1
E
EL
LE
EC
CT
TR
RI
IC
CA
AL
L
SM0502 – SM1003
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 3
TM ®
www.MICROSEMI.com
Copyright 2007
Rev: 2009-02-25
RoHS Com
p
liant Versions
CONTROL DEVICES
Surface Mount – MELF PIN Diodes
TYPICAL RS CUREVES
PACKAGE STYLE ‘M1’
SOLDER PAD LAYOUT
G
GR
RA
AP
PH
HS
S
