SM0502 - SM1003 CONTROL DEVICES Surface Mount - MELF PIN Diodes (R) TM RoHS Compliant Versions KEY FEATURES This line of `MELF' high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours. Non-Magnetic1 Versions Ideal for MRI Applications Very Low Inductance, Full Face Bonding Hi-Rel Hermetic Design Surface Mount Devices Available in Tape and Reel RoHS compliant versions of these products meet RoHS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements. 2 RoHS Compliant Versions Available www.MICROSEMI.com DESCRIPTION APPLICATIONS The MELF diodes are used as switching, attenuating and phase shifting elements from HF through 2 GHz and have breakdown voltage ratings up to 500 volts. `Non-magnetic1' .Cer-Met. (MELFs) are also used as switching elements in MRI (magnetic resonance imaging). Conventional Magnetic MELF packages are used in Cellular, Beam Steering units (telephone via satellites) surface mount applications, and Filter Switch banks for Frequency Hopping Radios. APPLICATIONS/BENEFITS Designed for Low Loss - Low Distortion Applications Switch - Filter Bank T/R Control Attenuators MRI Switching ABSOLUTE MAXIMUM RATINGS AT 25 C (UNLESS OTHERWISE SPECIFIED) Rating Value Unit IR 500 nA IF 1 A Storage Temperature TSTG -55 to +150 C Operating Temperature TOP -55 to +150 C Maximum Leakage Current @80% of Minimum Rated VB Forward Current (1us Pulse) IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com Specifications are subject to change, consult factory for the latest information. These devices are ESD sensitive and must be handled using ESD precautions. SM0502 - SM1003 Symbol 1` Non Magnetic' refers to any products that are designed with low and ultra low magnetic materials for use in MRI systems 2 RoHS versions are supplied with a matte tin finish. . Copyright 2007 Rev: 2009-02-25 Microsemi Microwave Products 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 1 SM0502 - SM1003 CONTROL DEVICES Surface Mount - MELF PIN Diodes (R) TM RoHS Compliant Versions P (C/W) THERMAL RESISTANCE (Min) (Max) (Max) (Typ) (Typ) SM0502 - M1 500 0.5 0.7 0.55 1.0 35 SM0504 - M1 500 0.6 0.6 0.45 1.5 20 SM0508 - M1 500 0.9 0.4 0.25 2.0 15 www.MICROSEMI.com ELECTRICAL PARAMETERS @ 25C (unless otherwise specified) Vb(V) CT(pF)1 Rs()2 TL(uS) Rs()2 I =10A @50V @100 mA @200 mA . R Model Number (Max) SM0509 - M1 500 1.2 0.35 0.2 2.5 15 SM0511 - M1 500 1.25 0.3 0.15 3.0 15 SM0512 - M1 500 1.5 0.25 0.12 3.5 15 SM1002 - M1 50 1.2 0.75@50mA 0.2 4.0 15 SM1003 - M1 35 1.2 @20V 0.5@10mA 0.1 0.6 25 Notes: 1- Capacitance (CT) is measured at F = 1 MHz 2- Series Resistance (RS) is measured at F = 100 MHz RoHS and MRI Models RoHS Compliant PN Non-Mag. / RoHS PN SM0502 - M1 SMX0502 - M1 SMX0502MR - M1 SM0504 - M1 SMX0504 - M1 SMX0504MR - M1 SM0508 - M1 SMX0508 - M1 SMX0508MR - M1 SM0509 - M1 SMX0509 - M1 SMX0509MR - M1 SM0511 - M1 SMX0511 - M1 SMX0511MR - M1 SM0512 - M1 SMX0512 - M1 SMX0512MR - M1 SM1002 - M1 SMX1002 - M1 SMX1002MR - M1 SM1003 - M1 SMX1003 - M1 SMX1003MR - M1 Microsemi Microwave Products 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 ELECTRICAL Copyright 2007 Rev: 2009-02-25 Base Model Page 2 SM0502 - SM1003 (R) TM CONTROL DEVICES Surface Mount - MELF PIN Diodes RoHS Compliant Versions TYPICAL RS CUREVES PACKAGE STYLE `M1' www.MICROSEMI.com SOLDER PAD LAYOUT GRAPHS Copyright 2007 Rev: 2009-02-25 Microsemi Microwave Products 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 3