Features
•
Three High-side and Three Low-side Drivers
•
Outputs Freely Configurable as Switch, Half Bridge or H-bridge
•
Capable of Switching All Kinds of Loads Such as DC Motors, Bulbs, Resistors,
Capacitors and Inductors
•
0.6A Continuous Current Per Switch
•
Low-side: RDSon < 1.5Ω Versus Total Temperature Range
•
High-side: RDSon < 2.0Ω Versus Total Temperature Range
•
Very Low Quiescent Current IS < 20 µA in Standby Mode
•
Outputs Short-circuit Protected
•
Overtemperature Prewarning and Protection
•
Undervoltage and Overvoltage Protection
•
Various Diagnosis Functions Such as Shorted Output, Open Load,
Overtemperature and Power Supply Fail
•
Serial Data Interface
•
Daisy Chaining Possible
•
SSO20 Package
1. Description
The T6817 is a fully protected driver interface designed in 0.8-µm BCDMOS technol-
ogy. It can be used to control up to 6 different loads by a microcontroller in automotive
and industrial applications.
Each of the 3 high-side and 3 low-side drivers is capable of driving currents up to
600 mA. The drivers are freely configurable and can be controlled separately from a
standard serial data interface. Therefore, all kinds of loads such as bulbs, resistors,
capacitors and inductors can be combined. The IC design is especially supportive of
H-bridges applications to drive DC motors.
Protection is guaranteed in terms of short-circuit conditions, overtemperature, under-
and overvoltage. Various diagnosis functions and a very low quiescent current in
standby mode open a wide range of applications. Meeting automotive qualifications in
the area of conducted interferences, EMC protection and 2 kV ESD protection provide
added value and enhanced quality for the exacting requirements of automotive
applications.
Dual Triple
DMOS Output
Driver with
Serial Input
Control
T6817
Rev. 4670C–BCD–09/05
2
4670C–BCD–09/05
T6817
Figure 1-1. Block Diagram
HS1HS2HS3
DI
CLK
INH
DO
CS
OV
-
protection
UV
-
protection
V
S
V
SVcc
Serial interface
Input register
Output register
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
S
I
S
T
CO
L
Dn.
u.
P
S
F
I
N
H
S
C
D
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
T
P
Fault
detect
Fault
detect Fault
detect Fault
detect
GND
GND
GND
GND
VS
Fault
detect Fault
detect
LS1LS2LS3
VS
VCC
Thermal
protection
Osc
Control
logic
Vcc
Power-on
reset
n.
u. n.
u. n.
u. n.
u. n.
u.
n.
u. n.
u. n.
u. n.
u. n.
u. n.
u.
2
4
3
5
18
12 14 16
8
15 17
13
1
10
11
19
6
7
GND
20
3
4670C–BCD–09/05
T6817
2. Pin Configuration
Figure 2-1. Pinning SSO20
GND
DI
CS
CLK
INH
VS
VS
LS3
n.c.
GND
GND
VCC
DO
LS1
HS1
LS2
HS2
GND
HS3
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Table 2-1. Pin Description
Pin Symbol Function
1 GND Ground; reference potential; internal connection to pin 10, 11, 13 and 20; cooling tab
2DI
Serial data input; 5-V CMOS logic level input with internal pull-down; receives serial data from the control
device, DI expects a 16-bit control word with LSB being transferred first
3CS
Chip-select input; 5-V CMOS logic level input with internal pull-up;
low = serial communication is enabled, high = disabled
4CLK
Serial clock input; 5-V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2 MHz)
5 INH Inhibit input; 5-V logic input with internal pull-down; low = standby, high = normal operating
6, 7 VS Power supply output stages HS1, HS2 and HS3
8LS3
Low-side driver output 3; power-MOS open drain with internal reverse diode: overvoltage protection by
active zenering; short-circuit protection; diagnosis for short and open load
9 n.c. Not connected
10 GND Ground (see pin 1) be consistant
11 GND Ground (see pin 1)
12 HS3 High-side driver output 3; power-MOS open drain with internal reverse diode: overvoltage protection by
active zenering; short-circuit protection; diagnosis for short and open load
13 GND Ground (see pin 1)
14 HS2 High-side driver output 2 (see pin 12) be consistant
15 LS2 Low-side driver output 2 (see pin 8)
16 HS1 High-side driver output 1 (see pin 12)
17 LS1 Low-side driver output 1 (see pin 8)
18 DO
Serial data output; 5-V CMOS logic level tri-state output for output (status) register data; sends 16-bit
status information to the microcontroller (LSB is transferred first); output will remain tri-stated unless
device is selected by CS = low, therefore, several ICs can operate on only one data output line only.
19 VCC Logic supply voltage (5V)
20 GND Ground (see pin 1)
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4670C–BCD–09/05
T6817
3. Functional Description
3.1 Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized
to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be trans-
ferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS
is high, pin DO is in tri-state condition. This output is enabled on the falling edge of CS. Output
data will change their state with the rising edge of CLK and stay stable until the next rising edge
of CLK appears. LSB (bit 0, TP) is transferred first.
Figure 3-1. Data Transfer Input Data Protocol
SRR LS1 HS1 LS2 HS2 LS3 HS3 n.u. n.u. n.u. n.u. n.u. n.u. OLD SCT SI
CS
DI
CLK
DO TP SLS1 SHS1 SLS2 SHS2 SLS3 SHS3 n.u. n.u. n.u. n.u. n.u. n.u. SCD INH PSF
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Table 3-1. Input Data Protocol
Bit Input Register Function
0SRR
Status register reset (high = reset; the bits PSF, SCD and overtemperature
shutdown in the output data register are set to low)
1 LS1 Controls output LS1 (high = switch output LS1 on)
2 HS1 Controls output HS1 (high = switch output HS1 on)
3 LS2 See LS1
4 HS2 See HS1
5 LS3 See LS1
6 HS3 See HS1
7 n.u. Not used
8 n.u. Not used
9 n.u. Not used
10 n.u. Not used
11 n.u. Not used
12 n.u. Not used
13 OLD Open load detection (low = on)
14 SCT
Programmable time delay for short circuit and overvoltage shutdown (short
circuit shutdown delay high/low = 100 ms/12.5 ms, overvoltage shutdown
delay high/low = 14 ms/3.5 ms
15 SI
Software inhibit; low = standby, high = normal operation
(data transfer is not affected by standby function because the digital part is
still powered)
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4670C–BCD–09/05
T6817
Note: Bit 0 to 15 = high: overtemperature shutdown
Table 3-2. Output Data Protocol
Bit
Output (Status)
Register Function
0TP
Temperature prewarning: high = warning (overtemperature shut-down,
see remark below)
1 Status LS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load (correct
load condition is detected if the corresponding output is switched off)
2 Status HS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load (correct
load condition is detected if the corresponding output is switched off)
3 Status LS2 Description, see LS1
4 Status HS2 Description, see HS1
5 Status LS3 Description, see LS1
6 Status HS3 Description, see HS1
7 n.u. Not used
8 n.u. Not used
9 n.u. Not used
10 n.u. Not used
11 n.u. Not used
12 n.u. Not used
13 SCD Short circuit detected: set high, when at least one output is switched off
by a short circuit condition
14 INH Inhibit: this bit is controlled by software (bit SI in input register) and
hardware inhibit (pin 17). High = standby, low = normal operation
15 PSF Power supply fail: over- or undervoltage at pin VS detected
Table 3-3. Status of the Input Register after Power on Reset
Bit 15
(SI)
Bit 14
(SCT)
Bit 13
(OLD)
Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3
(LS2)
Bit 2
(HS1)
Bit 1
(LS1)
Bit 0
(SRR)
HHHn.u.n.u.n.u.n.u.n.u.n.u.LLLLLLL
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4670C–BCD–09/05
T6817
3.2 Power-supply Fail
In case of over- or undervoltage at pin VS, an internal timer is started. When the undervoltage
delay time (tdUV, tdOV) programmed by the SCT bit is reached, the power supply fail bit (PSF) in
the output register is set and all outputs are disabled. When normal voltage is present again, the
outputs are enabled immediately. The PSF bit remains high until it is reset by the SRR bit in the
input register.
3.3 Open-load Detection
If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side switch and
a pull-down current for each low-side switch is turned on (open-load detection current IHS1-3,
ILS1-3). If VVS-VHS1-3 or VLS1-3 is lower than the open-load detection threshold (open-load condi-
tion), the corresponding bit of the output in the output register is set to high. Switching on an
output stage with the OLD bit set to low disables the open-load function for this output. If bit SI is
set to low, the open-load function is also switched off.
3.4 Overtemperature Protection
If the junction temperature exceeds the thermal prewarning threshold, TjPW set, the temperature
prewarning bit (TP) in the output register is set. When the temperature falls below the thermal
prewarning threshold, TjPW reset, the bit TP is reset. The TP bit can be read without transferring a
complete 16-bit data word: with CS = high to low, the state of TP appears at pin DO. After the
microcontroller has read this information, CS is set high and the data transfer is interrupted with-
out affecting the state of the input and output registers.
If the junction temperature exceeds the thermal shutdown threshold, Tj switch off, the outputs are
disabled and all bits in the output register are set high. The outputs can be enabled again when
the temperature falls below the thermal shutdown threshold, Tj switch on, and when a high has
been written to the SRR bit in the input register. Thermal prewarning and shutdown threshold
have hysteresis.
3.5 Short-circuit Protection
The output currents are limited by a current regulator. Current limitation takes place when the
overcurrent limitation and shutdown threshold (IHS1-3, ILS1-3) are reached. Simultaneously, an
internal timer is started. The shorted output is disabled when during a permanent short the delay
time (tdSd) programmed by the short-circuit timer bit (SCT) is reached. Additionally, the short-cir-
cuit detection bit (SCD) is set. If the temperature prewarning bit TP in the output register is set
during a short, the shorted output is disabled immediately and SCD bit is set. By writing a high to
the SRR bit in the input register, the SCD bit is reset and the disabled outputs are enabled.
3.6 Inhibit
There are two ways to inhibit the T6817:
1. Set bit SI in the input register to zero
2. Switch pin 5 (INH) to 0V
In both cases, all output stages are turned off but the serial interface stays active. The output
stages can be activated again by bit SI = 1 and by pin 5 (INH) switched back to 5V.
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4670C–BCD–09/05
T6817
Notes: 1. Threshold for undervoltage detection
2. Outputs disabled for VVS > VOV (threshold for overvoltage detection)
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameter Pin Symbol Value Unit
Supply voltage 6, 7 VVS –0.3 to +40 V
Supply voltage t < 0.5s; IS > –2A 6, 7 VVS –1 V
Supply voltage difference |VS_Pin6 – VS_Pin7|∆VVS 150 mV
Supply current 6, 7 IVS 1.4 A
Supply current t < 200 ms 6, 7 IVS 2.6 A
Logic supply voltage 19 VVCC –0.3 to 7 V
Input voltage 5 VINH –0.3 to 17 V
Logic input voltage 2 to 4 VDI, VCLK, VCS –0.3 to VVCC +0.3 V
Logic output voltage 18 VDO –0.3 to VVCC +0.3 V
Input current 5, 2 to 4 IINH, IDI, ICLK, ICS –10 to +10 mA
Output current 18 IDO –10 to +10 mA
Output current 8, 12, 14 to 17 ILS1 to ILS3
IHS1 to IHS3
Internal limited, see
output specification
Reverse conducting current (tPulse = 150 µs) 12, 14, 16
towards 6, 7 IHS1 to IHS3 17 A
Junction temperature range Tj–40 to +150 °C
Storage temperature range TSTG –55 to +150 °C
5. Thermal Resistance
All values refer to GND pins
Parameter Test Conditions Symbol Value Unit
Junction pin Measured to GND
Pins 1, 10, 11, 13 and 20 RthJP 25 K/W
Junction ambient RthJA 65 K/W
6. Operating Range
All values refer to GND pins
Parameter Test Conditions Symbol Min. Typ. Max. Unit
Supply voltage Pins 6, 7 VVS VUV (1) 40(2) V
Logic supply voltage Pin 19 VVCC 4.555.5V
Logic input voltage Pin 2 to 4 and 5 VINH, VDI, VCLK, VCS –0.3 VVCC V
Serial interface clock
frequency Pin 4 fCLK 2MHz
Junction temperature range Tj–40 150 °C
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4670C–BCD–09/05
T6817
Note: 1. Test pulse 5: VSmax = 40V
7. Noise and Surge Immunity
Parameter Test Conditions Value
Conducted interferences ISO 7637–1 Level 4(1)
Interference Suppression VDE 0879 Part 2 Level 5
ESD (Human Body Model) MIL-STM 5.1 – 1998 2 kV
ESD (Machine Model) JEDEC EIA / JESD 22 – A115-A 150V
8. Electrical Characteristics
7.5V < VVS < VOV; 4.5V < VVCC < 5.5V; INH = High; –40°C < Tj < 150°C; unless otherwise specified, all values refer to GND pins.
No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
1 Current Consumption
1.1 Quiescent current
(VS)
VVS < 16V, INH or
bit SI = low 6, 7 IVS 40 µA A
1.2 Quiescent current
(VCC)
4.5V < VVCC < 5.5V,
INH or bit SI = low 19 IVCC 20 µA A
1.3 Supply current (VS)
VVS < 16V normal
operating, all output
stages off,
6, 7 IVS 0.8 1.2 mA A
1.4 Supply current (VS)
VVS < 16V normal
operating, all output
stages on, no load
6, 7 IVS 10 mA A
1.5 Supply current (VCC) 4.5V < VVCC < 5.5V,
normal operating pin 19 IVCC 150 µA A
2 Internal Oscillator Frequency
2.1 Frequency (time
base for delay timers) fOSC 19 45 kHz A
3 Over- and Undervoltage Detection, Power-on Reset
3.1 Power-on reset
threshold 19 VVCC 3.4 3.9 4.4 V A
3.2 Power-on reset delay
time
After switching on
VVCC 19 tdPor 30 95 160 µs A
3.3 Undervoltage
detection threshold 6, 7 VUV 5.5 7.0 V A
3.4 Undervoltage
detection hysteresis 6, 7 ∆VUV 0.4 V A
3.6 Undervoltage
detection delay 6, 7 tdUV 721msA
3.7 Overvoltage
detection threshold 6, 7 VOV 18.0 22.5 V A
3.8 Overvoltage
detection hysteresis 6, 7 ∆VOV 1VA
3.9 Undervoltage
detection delay
Input register
bit 14 (SCT) = high
bit 14 (SCT) = low
tdOV
tdOV
7
1.75
21
5.25
ms
ms
A
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. Delay time between rising edge of CS after data transmission and switch on/off output stages to 90% of final level
9
4670C–BCD–09/05
T6817
4 Thermal Prewarning and Shutdown
4.1 Thermal prewarning TjPWset 125 145 165 °C A
4.2 Thermal prewarning TjPWreset 105 125 145 °C A
4.3 Thermal prewarning
hysteresis ∆TjPW 320 K A
4.4 Thermal shutdown Tj switch off 150 170 190 °C A
4.5 Thermal shutdown Tj switch on 130 150 170 °C A
4.6 Thermal shutdown
hysteresis ∆Tj switch off 320 K A
4.7
Ratio thermal
shutdown/thermal
prewarning
Tj switch off/
TjPW set 1.05 1.17 A
4.8
Ratio thermal
shutdown/thermal
prewarning
Tj switch on/
TjPW reset 1.05 1.2 A
5 Output Specification (LS1-LS6, HS1-HS6) 7.5V < VVS < VOV
5.1 On resistance IOut = 600 mA 8, 15,
17 RDS OnL 1.5 ΩA
5.2 On resistance IOut = –600 mA 12, 14,
16 RDS OnH 2.0 ΩA
5.3 Output clamping
voltage ILS1-3 = 50 mA 8, 15,
17 VLS1-3 40 60 V A
5.4 Output leakage
current
VLS1–3 = 40V
all output stages off
8, 15,
17 ILS1–3 10 µA A
5.5 Output leakage
current
VHS1-3 = 0V
all output stages off
2, 3,
12, 13,
15, 28
IHS1–3 –10 µA A
5.7 Inductive shutdown
energy
8, 12,
14 to
17
Woutx 15 mJ D
5.8 Output voltage edge
steepness
8, 12,
14 to
17
dVLS1–3/dt
dVHS1–3/dt 50 200 400 mV/µs A
5.9
Overcurrent limitation
and shutdown
threshold
8, 15,
17 ILS1–3 650 950 1250 mA A
5.10
Overcurrent limitation
and shutdown
threshold
12, 14,
16 IHS1–3 –1250 –950 –650 mA A
5.11 Overcurrent
shutdown delay time
Input register
bit 14 (SCT) = high
bit 14 (SCT) = low
tdSd
tdSd
8
1.0
12
1.5
16
2.0
ms
ms
A
A
5.12 Open load detection
current
Input register bit 13
(OLD) = low, output off
8, 15,
17 ILS1–3 60 200 µA A
8. Electrical Characteristics (Continued)
7.5V < VVS < VOV; 4.5V < VVCC < 5.5V; INH = High; –40°C < Tj < 150°C; unless otherwise specified, all values refer to GND pins.
No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. Delay time between rising edge of CS after data transmission and switch on/off output stages to 90% of final level
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4670C–BCD–09/05
T6817
5.13 Open load detection
current
Input register bit 13
(OLD) = low, output off
12, 14,
16 IHS1–3 –150 –30 µA A
5.14 Open load detection
current ratio
ILS1–3/
IHS1–3 1.2 A
5.15 Open load detection
threshold
Input register bit 13
(OLD) = low, output off
8, 15,
17 VLS1–3 0.6 2 V A
5.16 Open load detection
threshold
Input register bit 13
(OLD) = low, output off
12, 14,
16
VVS–
VHS1–3 0.6 2 V A
5.17 Output switch on
delay(1) RLoad = 1 kΩtdon 0.5 ms A
5.18 Output switch off
delay(1) RLoad = 1 kΩtdoff 1msA
6 Inhibit Input
6.1 Input voltage low
level threshold 5V
IL 0.3 ×
VVCC VA
6.2 Input voltage high
level threshold 5V
IH 0.7 ×
VVCC VA
6.3 Hysteresis of input
voltage 5∆VI100 700 mV A
6.4 Pull-down current VINH = VVCC 5I
PD 10 80 µA A
7 Serial Interface – Logic Inputs DI, CLK, CS
7.1 Input voltage low-
level threshold 2-4 VIL 0.3 ×
VVCC VA
7.2 Input voltage high-
level threshold 2-4 VIH 0.7 ×
VVCC VA
7.3 Hysteresis of input
voltage 2-4 ∆VI50 500 mV A
7.4 Pull-down current pin
DI, CLK VDI, VCLK = VVCC 2, 4 IPDSI 250µAA
7.5 Pull-up current
pin CS VCS = 0V 3 IPUSI –50 –2 µA A
8 Serial Interface - Logic Output DO
8.1 Output voltage low
level IOL = 3 mA 18 VDOL 0.5 V A
8.2 Output voltage high
level IOL = –2 mA 18 VDOH VVCC –
1V VA
8.3 Leakage current
(tri-state)
VCS = VVCC,
0 V < VDO < VVCC 18 IDO –10 10 µA A
8. Electrical Characteristics (Continued)
7.5V < VVS < VOV; 4.5V < VVCC < 5.5V; INH = High; –40°C < Tj < 150°C; unless otherwise specified, all values refer to GND pins.
No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. Delay time between rising edge of CS after data transmission and switch on/off output stages to 90% of final level
11
4670C–BCD–09/05
T6817
9. Serial Interface - Timing
Parameters Test Conditions
Timing
Chart No. Symbol Min. Typ. Max. Unit
DO enable after CS falling edge CDO = 100 pF 1 tENDO 200 ns
DO disable after CS rising edge CDO = 100 pF 2 tDISDO 200 ns
DO fall time CDO = 100 pF – tDOf 100 ns
DO rise time CDO = 100 pF – tDOr 100 ns
DO valid time CDO = 100 pF 10 tDOVal 200 ns
CS setup time 4 tCSSethl 225 ns
CS setup time 8 tCSSetlh 225 ns
CS high time Input register bit 14
(SCT) = high 9t
CSh 140 ms
CS high time Input register bit 14
(SCT) = low 9t
CSh 17.5 ms
CLK high time 5 tCLKh 225 ns
CLK low time 6 tCLKl 225 ns
CLK period time – tCLKp 500 ns
CLK setup time 7 tCLKSethl 225 ns
CLK setup time 3 tCLKSetlh 225 ns
DI setup time 11 tDIset 40 ns
DI hold time 12 tDIHold 40 ns
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4670C–BCD–09/05
T6817
Figure 9-1. Serial Interface Timing with Chart Numbers
CS
DO
1 2
CS
CLK
4
5
6
7
9
83
DI
CLK
DO
10 12
11
Inputs DI, CLK, CS: High level = 0.7 × V
CC
, low level = 0.3 ×V
CC
Output DO: High level = 0.8 × V
CC
, low level = 0.2 × V
CC
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4670C–BCD–09/05
T6817
10. Application
Figure 10-1. Application Circuit
10.1 Application Notes
It is strongly recommended that the blocking capacitors at VCC and VS be connected as close as
possible to the power supply and GND pins.
Recommended value for capacitors at VS:
Electrolythic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value for elec-
trolytic capacitor depends on external loads, conducted interferences and reverse conducting
current IHSX (see: Absolut Maximum Ratings).
Recommended value for capacitors at VCC:
Electrolythic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended that cooling areas be placed on the PCB as
close as possible to GND pins.
HS1HS2HS3
DI
CLK
INH
DO
CS
OV-
protection
UV-
protection
VS
VSVcc
Serial interface
Input register
Output register
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
S
I
S
T
CO
L
Dn.
u.
P
S
F
I
N
H
S
C
D
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
T
P
GND
GND
GND
GND
VS
LS1LS2LS3
VS
VCC
Thermal
protection
Osc
Control
logic
Vcc
Power-on
reset
n.
u. n.
u. n.
u. n.
u. n.
u.
n.
u. n.
u. n.
u. n.
u. n.
u. n.
u.
2
4
3
5
18
12 14 16
81517
13
1
10
11
19
6
7
GND
20
Vcc
5 V
+
13 V
BYT41D
Vs
+
VBatt
Fault
detect
Fault
detect
Fault
detect
Fault
detect Fault
detect Fault
detect
MM
µC
U5021M
Watchdog
Vcc
Reset
Trigger
Enable
14
4670C–BCD–09/05
T6817
12. Package Information
11. Ordering Information
Extended Type Number Package Remarks
T6817-TKSY SSO20 Power package, tube, Pb-free
T6817-TKQY SSO20 Power package, taped and reeled, Pb-free
technical drawings
according to DIN
specifications
Package SSO20
Dimensions in mm
6.75
6.50
0.25
0.65 5.85
1.30
0.15
0.05
5.7
5.3
4.5
4.3
6.6
6.3
0.15
20 11
110
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4670C–BCD–09/05
T6817
13. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No. History
4670C-BCD-09/05 • Pb-free logo on page 1 added
• Table “Ordering Information” on page 14 changed
4670B-BCD-05/05 • Put datasheet in a new template
• Table “Electrical Characteristics” rows 5.15 and 5.16 changed
Printed on recycled paper.
4670C–BCD–09/05
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