LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
IR Emitter and Detector
Product Data Sheet
LTE-C216R-14
Spec No.: DS50-2009-0017
Effective Date: 12/29/2011
Revision: D
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Features
* Package In 8mm Tape On 7" Diameter Reels.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared Reflow Solder Process
* EIA STD package.
* Meet ROHS, Green Product.
* Package type 1206
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
3. Specifications are subject to change without notice.
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ABSOLUTE MAXIMUM RATINGS AT TA=25℃
PARAMETER
MAXIMUM RATING
UNIT
Power Dissipation
100
mW
Peak Forward Current (300pps, 10μs pulse)
800
mA
Continuous Forward Current
60
mA
Reverse Voltage
5
V
Operating Temperature Range
-40℃ to + 85℃
Storage Temperature Range
-55℃ to + 100℃
Infrared Soldering Condition
260°C For 10 Seconds
Suggestion Profile:
Suggestion IR Reflow Profile For Pb Free Process
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ELECTRICAL OPTICAL CHARACTERISTICS AT TA=25℃
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITION
Radiant Intensity
IE
4
-
13
mW/sr
IF = 20 mA
Peak Emission Wavelength
λPeak
-
850
-
nm
IF = 50mA
Spectral Line Half-Width
Δλ
-
50
-
nm
IF = 50mA
Forward Voltage
VF
-
1.6
2.0
V
IF = 50mA
Reverse Current
IR
-
-
10
μA
VR = 5V
Rise/Fall Time
Tr/Tf
-
30
-
nS
10%~90%
Viewing Angle (See FIG.6)
2θ1/2
-
75
-
deg.
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TYPICAL ELECTRICAL / OPTICAL CHARACTERISTICS CURVES
(25℃ Ambient Temperature Unless Otherwise Noted)
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal
temperature for less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
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Notes:
1. All dimensions are in millimeters (inches).
2. Empty component pockets sealed with top cover tape.
3. 7 inch reel-3000 pieces per reel.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than one week hrs should be baked at about 60
deg C for at least 20 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering
Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Because different board designs use different number and types of devices, solder pastes, reflow ovens,
and circuit boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully
and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected
in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive
circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
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