ECG001F-G InGaP HBT Gain Block Applications * * * * * * Wireless Infrastructure CATV / SATV / MoCA Point to Point Defense & Aerospace Test & Measurement Equipment General Purpose Wireless E 6 Pin SOT-363 Package Product Features * * * * * * * F-G 01 0 CG Functional Block Diagram DC - 6 GHz 22 dB Gain at 1 GHz +12.5 dBm P1dB at1 GHz +25 dBm OIP3 at 1 GHz 3.4 dB Noise Figure Internally Matched to 50 Lead-free / green / RoHS-Compliant SOT-363 Package General Description Pin Configuration The ECG001F-G is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surfacemount package. At 1000 MHz, the ECG001F-G typically provides 22 dB of gain, +25 dBm Output IP3, and +12.5 dBm P1dB. Pin No. Label 3 6 1, 2, 4, 5 RF IN RF OUT GND The ECG001F-G consists of a Darlington-pair amplifier using the high reliability InGaP / GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low-cost, surface-mountable leadfree / green / RoHS-compliant SOT-363 package. All devices are 100% RF and DC tested. This broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies. In addition, the ECG001F-G will satisfy general amplification requirements in the DC to 6 GHz frequency range such as CATV and mobile wireless. Ordering Information Part No. Description ECG001F-G InGaP / GaAs HBT Gain Block Standard T/R size = 3000 pieces on a 7" reel Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint - 1 of 6 - Disclaimer: Subject to change without notice www.triquint.com ECG001F-G InGaP HBT Gain Block Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Min TCASE Tj for >106 hours MTTF -40 Rating Storage Temperature RF Input Power, CW, 50, T=25 C Device Current (ICC) -55 to 150 C +12 dBm 150 mA Operation of this device outside the parameter ranges given above may cause permanent damage. Typ Max Units +85 +160 C C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VSUPPLY = +5 V, TCASE = +25 C, RBIAS = 51 , 50 system Parameter Conditions Operational Frequency Range Gain Output P1dB Output IP3 (1) Gain Input Return Loss Output Return Loss Output P1dB Noise Figure Device Voltage Device Current Thermal Resistance, RTH Min Typ DC 22.2 +12.5 +25 20.7 35 18 +12.5 3.4 +3.4 30 270 Freq.=1000 MHz OIP3 Pout= -1 dBm / tone, f= 1 MHz 19.2 Freq.=2000 MHz +3.0 Max Units 6000 MHz dB dBm dBm dB dB dB dBm dB V mA C / W 21.8 +3.8 Typical RF Performance (1) Test conditions unless otherwise noted: VSUPPLY = +5 V, Icc = 30 mA (typ.), RBIAS = 51 , Temp. =+25 C, 50 System Parameter Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Typical 100 22.8 48 34 +11.6 +23.6 3.4 500 22.6 46 29 +11.6 +23.5 3.4 900 22.4 42 24 +12.6 +24.8 3.4 1900 20.9 35 18 +12.6 +26 3.4 Units 2140 20.6 29 17 +12.6 +25.6 3.4 2400 20.2 28 16 +12.8 +25.4 3.4 3500 18.6 22 13 +12.2 +23 5800 15.5 14 8 +11 MHz dB dB dB dBm dBm dB Notes: 1. Gain and return loss values presented above, and in the plots of the following section, are measured at the device level. Application specific performance values will differ in accordance with external components selected for the desired frequency band of operation. P1dB, OIP3 and NF data is measured using the application circuit shown on page 4. 2. Pout= -1 dBm / tone, 1 MHz tone spacing. Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint - 2 of 6 - Disclaimer: Subject to change without notice www.triquint.com ECG001F-G InGaP HBT Gain Block Typical RF Performance Test conditions unless otherwise noted: VSUPPLY = +5 V, Icc = 30 mA (typ.), RBIAS = 51 , 50 System Gain vs Frequency 24 Return Loss vs Frequency 0 Temp.=+25C 80 22 20 18 -20 ICC (mA) -10 |S11|, |S22| (dB) Gain (dB) ICC vs. VDE 100 Temp.=+25C Temp.=+25C |S11| |S22| 60 40 -30 20 16 -40 14 0 1 2 3 4 5 0 0 6 1 2 OIP3 vs. Frequency 28 3 4 5 6 3.2 3.3 Frequency (GHz) Frequency (GHz) Output P1dB vs. Frequency 16 3.4 3.5 3.6 VDE (V) Noise Figure vs. Frequency 5 +85C +85C 22 12 NF (dB) 24 4 -40C -40C P1dB (dBm) OIP3 (dBm) +25C 14 +25C 26 10 8 3 2 1 Temp.=+25C 6 20 500 1000 1500 2000 2500 3000 0 500 1000 Frequency (MHz) 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 Frequency (MHz) Frequency (MHz) Typical Device S-Parameters Test conditions unless otherwise noted: VDEVICE = +3.4 V, ICC = 30 mA, Temp. =+25 C, calibrated to device leads Frequency (MHz) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) -33.58 -24.53 -32.76 -28.56 -25.13 -28.01 -28.65 -28.35 -25.99 -22.91 -19.69 -17.30 -15.88 S11 (ang) 15.96 12.09 32.44 153.22 172.50 -117.92 -133.85 -142.02 -171.80 160.22 153.85 152.52 144.43 S21 (dB) 22.85 22.63 22.20 21.54 20.74 20.11 19.33 18.59 17.77 17.05 16.39 15.78 15.21 S21 (ang) 178.01 162.01 144.90 129.42 114.94 103.13 91.28 79.59 68.13 57.38 48.12 39.49 30.49 S12 (dB) -24.47 -24.14 -23.99 -23.56 -23.12 -22.71 -22.14 -21.68 -20.88 -20.50 -20.03 -19.55 -19.14 S12 (ang) -1.35 1.89 4.76 7.59 9.11 7.41 7.37 4.16 2.49 2.47 -0.55 -5.36 -6.76 S22 (dB) -28.60 -22.29 -25.75 -20.80 -17.59 -20.44 -18.13 -16.41 -14.29 -12.47 -11.36 -11.30 -11.31 S22 (ang) 3.58 -35.35 -100.14 -165.24 175.89 169.69 154.41 140.24 124.73 116.41 113.60 114.22 113.24 Device S-parameters are available for download at www.triquint.com Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint - 3 of 6 - Disclaimer: Subject to change without notice www.triquint.com ECG001F-G InGaP HBT Gain Block Application Circuit Vcc Icc = 30 mA J4 R4 Bias Resistor R4 J3 C4 Bypass Capacitor L1 C3 C2 U1 C1 C3 0.018 F L1 RF Choke RF IN RF OUT ECG001F C2 Blocking Capacitor C1 Blocking Capacitor Bill of Material (1) Reference Des. U1 L1 C1, C2 C3 C4 R4 (2) Value n/a 39 nH 56 pF 0.018 F n/a 51 Description Manuf. Part Number InGaP HBT Gain Block Wirewound Inductor, 0603 Chip Capacitor, 0603 Chip Capacitor, 0603 Do Not Place 1% Tolerance, 0805 TriQuint various various various ECG001F-G various Notes: 1. Component values listed for the application have been selected to achieve optimal broadband performance. 2. The value of R4 is dependent upon the supply voltage and provides bias stability over temperature. 3. The minimum recommended supply voltage is +5 V. 4 Recommended Component Values (1) Frequency (MHz) L1 C1, C2, C3 50 820 nH .018 uF 500 220 nH 1000 pF 900 68 nH 100 pF 1900 27 nH 68 pF 2200 22 nH 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF Notes: 1. The values for the components are dependent upon the intended frequency of operation. Recommended Bias Resistor Values VSUPPLY (V) R4 () Component Size Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint 5 53.3 0805 6 86.7 0805 8 153 1210 - 4 of 6 - 9 187 1210 10 220 2010 12 287 2010 Disclaimer: Subject to change without notice www.triquint.com ECG001F-G InGaP HBT Gain Block Package Marking and Dimensions Product Marking: The top surface of the component will be marked with a two-digit numeric lot code (shown as "XX") followed by a "4" designator. 3 4 SYMBOL MAX A - 1.10 (0.043) A1 0 0.10 (0.004) A2 5 -D- 0.70 (0.028) 1.00 (0.039) D 2.00 (0.079 BASIC E 2.10 (0.083) BASIC E/2 E1/2 E1 1.25 (0.049) BASIC L 0.21 (0.008) 0.41 (0.016) L1 0.42 (0.017) REF L2 0.15 (0.006) BASIC ? ?1 Notes: 1. Dimensions are in millimeters (Inches) 2. Dimensions and tolerances per ASME Y14.5M-1194. Package conforms to JEDEC MO-203, Issue B. -A- 2X .15 C A-B D e1 MIN 08 88 48 128 XX4 3 4 E1 2X .15 C D PIN 1 ID b 0.15 (0.006) 0.30 (0.012) c 0.08 (0.003) .30 C e 0.65 (0.026) BASIC 1.30 (0.051) BASIC BOTH SIDES e 0.22 (0.009) e1 E (6X) b 5 .10 C A-B D -B- TOP VIEW 8X 01 A2 -H- A L2 GAUGE PLANE c 6X .10 C ? A1 SEATING -CPLANE SIDE VIEW SEATING PLANE -C- PCB Mounting Pattern 0.762 [0.030] 16X O.254 (.010) PLATED THRU VIA HOLES 0.381 [0.015] 2X 1.207 [0.048] 2X 0.762 [0.030] 2.515 [0.099] 2X 0.914 [0.036] 1.524 [0.060] 2X 0.406 [0.016] 2X 0.387 [0.015] 2X 0.203 [0.01] 1.301 [0.051] 2X 0.773 [0.030] 2X 0.939 [0.037] 6.329 [0.249] 6 2X 1.270 [0.050] 4X 0.889 [0.035] 4X 0.889 [0.035] 4.064 [0.160] Notes: 1. All dimensions are in millimeters (inches). Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. 4. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical. 5. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10"). 6. The RF I/O trace transition shown is to a 30 mil wide line. Modify transition as required to interface with other line widths. Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint - 5 of 6 - Disclaimer: Subject to change without notice www.triquint.com ECG001F-G InGaP HBT Gain Block Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260 C maximum reflow temperature) and tin/lead (245 C maximum reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: NiPdAu ESD Rating: Value: Test: Standard: Class 1A 250 V to < 500 V Human Body Model (HBM) ESDA/JEDEC Standard JS-001-2012 RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). MSL Rating This product also has the following attributes: * Lead Free * Halogen Free (Chlorine, Bromine) * Antimony Free * TBBP-A (C15H12Br402) Free * PFOS Free * SVHC Free MSL Rating: Level 3 Test: 260 C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@triquint.com Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev. A 12-05-14 (c) 2014 TriQuint - 6 of 6 - Disclaimer: Subject to change without notice www.triquint.com