RClamp0501T Low Capacitance 1-Line ESD protection PROTECTION PRODUCTS - RailClamp(R) Description Features RailClamp(R) TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). Transient protection for data lines to ing in excess of 100MHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2. Mechanical Characteristics (R) The RClamp 0501T has a maximum capacitance of only 1.5pF. This allows it to be used on circuits operat- The RClamp0501T is in a 2-pin SLP1006P2T package measuring 1.0 x 0.6 x 0.4mm. The leads are spaced at a pitch of 0.65mm and feature a lead-free finish. Each device will protect one high-speed line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size, low capacitance, and high ESD surge capability makes them ideal for protection of high speed digital lines in cellular handsets and other portable electronic devices. IEC 61000-4-2 (ESD) 25kV (air), 20kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.4mm) Protects one data or I/O line Low capacitance: 1.5pF Low clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology SLP1006P2T package Molding compound flammability rating: UL 94V-0 Marking: Marking code Packaging: Tape and Reel Lead Finish: NiPdAu Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications Dimensions Cellular Handsets & Accessories Multimedia Card Interfaces Digital Signal Lines SIM Ports Keypads SD Lines Schematic & PIN Configuration 1.0 2 0.60 0.65 1 0.40 Maximum Dimensions (mm) Revision 11/02/2010 SLP1006P2T (Bottom View) 1 www.semtech.com RClamp0501T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20s) Pp k 150 Watts Peak Pulse Current (tp = 8/20s) IP P 10 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD +/- 25 +/- 20 kV TJ -55 to +125 C TSTG -55 to +150 C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V 9.7 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25C 0.100 A Clamping Voltage VC IPP = 3A, tp = 8/20s Pi n 2 to 1 12 V Clamping Voltage VC IPP = 10A, tp = 8/20s Pi n 2 to 1 15 V Forward Clamping Voltage VF IPP = 3A, tp = 8/20s Pi n 1 to 2 4 V Junction Capacitance Cj VR = 0V, f = 1MHz T = 25oC 0.6 1.5 pF Junction Capacitance Cj VR = 0V, f = 1MHz T = 0 to +85oC 0.5 1.7 pF (c) 2010 Semtech Corp. 2 6.9 www.semtech.com RClamp0501T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 20 10 Clamping Voltage -VC (V) Peak Pulse Power - P PP (kW) 18 1 0.1 16 14 12 10 8 6 Waveform Parameters: tr = 8s td = 20s 4 2 0 0.01 0.1 1 10 0 100 2 4 Pulse Duration - tp (us) 8 10 12 Peak Pulse Current - IPP (A) Normalized Capacitance vs. Reverse Voltage Forward Voltage vs. Peak Pulse Current 10 2 9 1.8 8 1.6 7 1.4 Cj(VR) / Cj(VR=0V) Forward Clamping Voltage (V) 6 6 5 4 3 Waveform Parameters: tr = 8s td = 20s 2 1 1.2 1 0.8 0.6 0.4 0.2 f = 1 MHz 0 0 0 2 4 6 8 0 10 1 2 3 4 5 Reverse Voltage (VR) Peak Pulse Current (A) ESD Clamping (8kV Contact per IEC 61000-4-2) Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: - 0.4325dB 800 MHz 5 0 dB 12 3 2: - 0.4268dB 900 MHz 4 3: - 0.5534dB 1.8 GHz -6 dB -12 dB 4: - 0.7752dB 2.5 GHz -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB Note: Data is taken with a 10x attenuator (c) 2010 Semtech Corp. 1 MHz START . 030 MHz 3 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com RClamp0501T PROTECTION PRODUCTS Applications Information Device Connection Options Equivalent Circuit Diagram These low capacitance TVS diodes are designed to provide common mode protection for one high-speed line. The device is unidirectional and may be used on lines where the signal polarity is positive. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. (c) 2010 Semtech Corp. 4 www.semtech.com RClamp0501T PROTECTION PRODUCTS Outline Drawing - SLP1006P2T A B D E DIM A A1 b D E e L R N aaa bbb TOP VIEW A SEATING PLANE aaa C C A1 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .015 .016 .017 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.37 0.40 0.43 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2T DIMENSIONS Y (C) DIM C G X Y Z Z G INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. (c) 2010 Semtech Corp. 5 www.semtech.com RClamp0501T PROTECTION PRODUCTS Marking Code Ordering Information 97 Part Number Qty per Reel Reel Size RClamp 0501T.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Notes: 1)Marking will also include line matrix date code Carrier Tape Specification Bo Ao Ko Device Orientation in Tape A0 0.70 +/-0.05 mm B0 1.15 +/-0.05 mm K0 0.55 +/-0.05 mm 97 97 97 97 97 Note: All dimensions in mm unless otherwise specified Pin 2 Cathode Location (Towards Sprocket Holes) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 (c) 2010 Semtech Corp. 6 www.semtech.com