CMOS linear image sensors S11105 series
8
Pin no. Symbol I/O Description Pin no. Symbol I/O Description
1 NC No connection 12 NC No connection
2 ST I Start pulse 13 NC No connection
3 CLK I Clock pulse 14 NC No connection
4 Vss GND 15 NC No connection
5 Vdd I Supply voltage 16 NC No connection
6 NC No connection 17 NC No connection
7 Trig O Trigger pulse for video signal
acquisition 18 NC No connection
8 Vdd I Supply voltage 19 NC No connection
9 Video O Video signal 20 NC No connection
10 EOS O End of scan 21 Vdd I Supply voltage
11 Vss GND 22 NC No connection
Pin no. Symbol I/O Description Pin no. Symbol I/O Description
1 Vss GND 9 Video O Video signal
2 Vdd I Supply voltage 10 EOS O End of scan
3 Vss GND 11 Vss GND
4 NC No connection 12 NC No connection
5 NC No connection 13 NC No connection
6 NC No connection 14 Vdd I Supply voltage
7 Trig O Trigger pulse for video signal
acquisition 15 ST I Start pulse
8 Vdd I Supply voltage 16 CLK I Clock pulse
Pin connections
S11105
S11105-01
Precautions
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electro-
static charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect
this device from surge voltages which might be caused by peripheral equipment.
(2) Light input window
If the incident window is contaminated or scratched, the output uniformity will deteriorate considerably, so care should be taken in
handling the window. Avoid touching it with bare hands.
The window surface should be cleaned before using the device. If dry cloth or dry cotton swab is used to rub the window surface,
static electricity may be generated, and therefore this practice should be avoided. Use soft cloth, cotton swab or soft paper moist-
ened with ethyl alcohol to wipe off dirt and foreign matter on the window surface.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Solder-
ing should be performed within 5 seconds at a soldering temperature below 260 °C.
(4) Refl ow soldering (S11105-01)
Soldering conditions may differ depending on the board size, refl ow furnace, etc. Check the conditions before soldering. A sudden
temperature rise and cooling may be the cause of trouble, so make sure that the temperature change is within 4 °C per second.
The bonding portion between the ceramic base and the glass may discolor after refl ow soldering, but this has no adverse effects on
the hermetic sealing of the product.
(5) Operating and storage environments
Handle the device within the temperature range specifi ed in the absolute maximum ratings. Operating or storing the device at an
excessively high temperature and humidity may cause variations in performance characteristics and must be avoided.
(6) UV exposure
This product is not designed to prevent deterioration of characteristics caused by UV exposure, so do not expose it to UV
light.