DM9161B
10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver
Fin al 2
Version: DM9161B-12-DS-F01
October 16, 2009
Table of Contents
1. General Description...................................................................3
2. Features ....................................................................................3
3. Block Diagram ...........................................................................4
4. Pin Configuration: ......................................................................5
5. Pin Description ..........................................................................6
5.1 Normal MII Interface, 21 pins ..................................................6
5.2 Media Interface, 4 pins ............................................................8
5.3 LED Interface, 3 pins ...............................................................8
5.4 Mode, 2 pins ............................................................................8
5.5 Bias and Clock, 4 pins.............................................................9
5.6 Power, 13 pins.........................................................................9
5.7 Table of Media Type Selection ................................................9
5.8 Pin Maps of Normal MII, Reduced MII, and 10Base-T GPSI
(7-Wired) Mode .................................................................. 10
6. LED Configuration ...................................................................11
6.1 LED Functional Description…………………………………....12
7. Functional Description .............................................................13
7.1 MII interface...........................................................................13
7.2 100Base-TX Operation..........................................................15
7.2.1 100Base-TX Transmit.........................................................15
7.2.1.1 4B5B Encoder .................................................................16
7.2.1.2 Scrambler ...................................................................... .16
7.2.1.3 Parallel to Serial Converter..............................................16
7.2.1.4 NRZ to NRZI Encoder .....................................................16
7.2.1.5 MLT-3 Converter .............................................................16
7.2.1.6 MLT-3 Driver....................................................................16
7.2.1.7 4B5B Code Group ...........................................................17
7.2.2 100Base-TX Receiver ........................................................18
7.2.2.1 Signal Detect ...................................................................18
7.2.2.2 Adaptive Equalizer...........................................................18
7.2.2.3 MLT-3 to NRZI Decoder ..................................................18
7.2.2.4 Clock Recovery Module...................................................18
7.2.2.5 NRZI to NRZ....................................................................18
7.2.2.6 Serial to Parallel ..............................................................18
7.2.2.7 Descrambler ....................................................................18
7.2.2.8 Code Group Alignment ....................................................18
7.2.2.9 4B5B Decoder .................................................................18
7.2.3 10Base-T Operation ...........................................................18
7.2.4 Collision Detection..............................................................19
7.2.5 Carrier Sense .....................................................................19
7.2.6 Auto-Negotiation.................................................................19
7.2.7 MII Serial Management ......................................................20
7.2.8 Serial Management Interface .............................................20
7.2.9 Management Interface – Read Frame
Structure ..............................................................................20
7.2.10 Management Interface – Write Frame Structure ..............20
7.2.11 Power Reduced Mode ......................................................21
7.2.12 Power Down Mode ...........................................................21
7.2.13 Reduced Transmit Power Mode.......................................21
7.2.14 Feedback Vout and Vin for 5V………………………….….21
7.3 HP Auto-MDIX Functional Description..........................................22
8. MII Register Description ..........................................................23
8.1 Basic Mode Control Register (BMCR) - 00............................24
8.2 Basic Mode Status Register (BMSR) - 01 .............................25
8.3 PHY ID Identifier Register #1 (PHYIDR1) - 02 ......................26
8.4 PHY ID Identifier Register #2 (PHYIDR2) - 03 ......................26
8.5 Auto-negotiation Advertisement Register (ANAR)
- 04 ......................................................................................27
8.6 Auto-negotiation Link Partner Ability Register (ANLPAR) - 0528
8.7 Auto-negotiation Expansion Register (ANER)
- 06 ......................................................................................29
8.8 DAVICOM Specified Configuration Register (DSCR) –16.....29
8.9 DAVICOM Specified Configuration and Status Register
(DSCSR) - 17 ......................................................................31
8.10 10Base-T Configuration / Status (10BTCSR) - 18...............32
8.11 DAVICOM Specified Interrupt Register - 21 ........................32
8.12 DAVICOM Specified Receive Error Counter Register (RECR) -
22.........................................................................................33
8.13 DAVICOM Specified Disconnect Counter Register (DISCR) -
23.........................................................................................33
8.14 DAVICOM Hardware Reset Latch State
Register (RLSR) - 24 ............................................................34
8.17 Power Saving Control Register (PSCR) – 29 ......................34
9. DC and AC Electrical Characteristics
9.1 Absolute Maximum Ratings (25°C).........................................35
9.2 Operating Conditions .............................................................35
9.3 DC Electrical Characteristics .................................................36
9.4 AC Electrical Characteristics & Timing
Waveform .............................................................................. 36
9.4.1 TP Interface ........................................................................36
9.4.2 Oscillator/Crystal Timing.....................................................36
9.4.3 Power On Reset Timing......................................................37
9.4.4 MDC/MDIO Timing .............................................................37
9.4.5 MDIO Timing when OUTPUT by STA ................................37
9.4.6 MDIO Timing when OUTPUT by DM9161B .......................37
9.4.7 100Base-TX Transmit Timing Parameters .........................38
9.4.8 100Base-TX Transmit Timing Diagram ..............................38
9.4.9 100Base-TX Receive Timing Parameters ..........................38
9.4.10 MII 100Base-TX Receive Timing Diagram .......................39
9.4.11 MII 10Base-T Nibble Transmit Timing Parameters ..........39
9.4.12 MII 10Base-T Nibble Transmit Timing
Diagram..........................................................................39
9.4.13 MII 10Base-T Receive Nibble Timing Parameters .......... 40
9.4.14 MII 10Base-T Receive Nibble Timing
Diagram..........................................................................40
9.4.15 Auto-negotiation and Fast Link Pulse Timing Parameters40
9.4.16 Auto-negotiation and Fast Link Pulse Timing Diagram ....41
9.4.17 RMII Receive Timing Diagram..........................................41
9.4.18 RMII Transmit Timing Diagram.........................................41
9.4.19 RMII Timing Diagram........................................................42
9.4.20 RMII Timing Parameter ....................................................42
9.4.21 Magnetics Selection Guide…………………………………43
10. Package Information..............................................................44
11. Order Information...................................................................45