XC5200-3PG223C - Xilinx, Inc.

November 5, 1998 (Version 5.2) 7-83

Features

• Low-cost, register/lat ch rich, SRAM based

reprogrammabl e architecture

-0.5µm three-layer metal CMOS process technology

- 256 to 1936 lo gic cells (3,000 to 23,000 “gates”)

- Price competitive with Gate Arrays

• System Level Features

- System performance beyond 50 MHz

- 6 levels of interconnect hierarchy

- VersaRing™ I/O Interface for pin-locking

- Dedi cated carry logic for high-spe ed arithmetic

functions

- Cascade chain for wide input fun ctions

- Built-in IEEE 1149.1 JTAG boundary scan test

circuitry on all I/O pins

- Inte rnal 3- sta te bussin g ca pa bilit y

- Four dedicated low-skew clock or signal distribution

nets

• Versatile I/ O and Packagin g

- Innovative VersaRing™ I/O interface provides a high

logic cell to I/O ratio, with up to 244 I/O signals

- Programmable output slew-r ate control maximizes

performance and reduces noi se

- Zero Flip-Flop hold time for input registers simplifies

system tim i ng

- Independent Output Enables for external bussing

- Footpr int com pa tibility in co mm o n packages within

the XC5200 Series and with the XC4000 Series

- Over 150 device/package combi nati ons, including

advanced BGA, TQ, and VQ packaging avail able

• Fully Supported by Xilinx Development System

- Automatic place and route software

- Wide selec tion o f PC and Workstation platforms

- Over 10 0 3r d-p ar ty Allian ce inte rface s

- Supported by shrink-wrap Foundation software

Description

The XC5200 Field-Programmable Gate Array Family is

engineered to deliver low cost. Building on experiences

gained with three previous successful SRAM FPGA fami-

lies, the XC5200 family brings a robust feature set to pro-

grammable logic design. The VersaBlock™ logic module,

the VersaRing I/O interface, and a rich hierarchy of inter-

connect resources combine to enhance design flexibility

and reduce time-to-market. Complete support for the

XC5200 family is delivered through the familia r Xilinx so ft-

ware e nviro nment . The XC5200 fami ly i s ful ly s upport ed o n

popular workstation and PC platforms. Popular design

entry methods are fully supported, including ABEL, sche-

matic capture, VHDL, and Verilog HDL synthesis. Design-

ers utilizing logic synthesis can use their existing tools to

design wit h the XC 5200 devices.

XC5200 Series

Field Programmable Gate Arrays

November 5, 1998 (Version 5.2) 07*

Produ ct Spe cif icat ion

Table 1: XC5200 Field-Programmable Gate Array Family Members

Device XC5202 XC5204 XC5206 XC5210 XC5215

Logic Cells 256 480 784 1,296 1,936

Max Logic Gates 3,000 6,000 10,000 16,000 23,000

Typical Gate Range 2,000 - 3,000 4,000 - 6,000 6,000 - 10,000 10,000 - 16,000 15,000 - 23,000

VersaBlo ck Arra y 8 x 8 10 x 12 14 x 14 18 x 18 22 x 22

CLBs 64 120 196 324 484

Flip-Flops 256 480 784 1,296 1,936

I/Os 84 124 148 196 244

TBUFs per Longline 1014162024

XC5200 Series Field Programmable Gate Arrays

7-84 November 5, 1998 (Version 5.2)

XC5200 Family Compared to

XC4000/Spartan™ and XC3000

Series

For read ers already f amiliar with the XC4 000/Spartan and

XC3000 FPGA Families, this section describes significant

differences between them and the XC5200 family. Unless

otherwise indicated, comparisons refer to both

XC4000/Spartan a nd XC3000 devices.

Conf igurable Logic Bloc k (CLB) Resour ces

Each XC5 200 CLB c ontai n s fo ur i nde pe nde nt 4- inp ut fu nc -

tion generators and four registers, which are configured as

four indepe ndent L ogic Cells™ ( LCs). The re gisters in eac h

XC5200 LC are optionally configurable as edge-triggered

D-type flip-flops or as transparent level-sensitive latches.

The XC5200 CLB includes dedicated carry logic that pro-

vides fast arithmetic carry capability. The dedicated carry

logic may also be used to cascade function generators for

implementing wide arithmetic functions.

XC4000 family:

XC5200 devices have no wide edge

decoders. Wide decoders are implemented using cascade

logic. A lthough sacrificing s peed for s ome des igns, lac k of

wide edge decoders reduces the die area and hence cost

of the X C5200.

XC4000/Spartan family:

XC5200 dedicated carry logic

differs from that of the XC4000/Spartan family in that the

sum is generated in an additional function generator in the

adjacent column. This design reduces XC5200 die size and

hence cost for many applications. Note, however, that a

loadable up/down counter requires the same number of

functio n gener ators in bo th families . XC3000 has no de di-

cated car ry.

XC4000/Spartan family:

XC5200 lookup tables are opti-

mized for cost and hence cannot implement RAM.

Input/Outpu t Block (IOB) Resources

The XC5200 family maintains footprint compatibility with

the XC4000 family, but not with the XC3000 family.

To minimize cost and maximize the number of I/O per Logic

Cell, the XC5200 I/O does not include flip-flops or latches.

For high performance paths, the XC5200 family provides

direct connections from each IOB to the registers in the

adjacent CLB in order to emulate IOB registers.

Each XC5200 I/O Pin provides a programmable delay ele-

ment to contro l input s et-up tim e. This element can be used

to avoid potential hold-time problems. Each XC5200 I/O

Pin is capab le of 8- mA source and sink currents.

IEEE 1149.1-type boundary scan is supported in each

XC5200 I/O.

Routing Reso ur ces

The XC5200 family provides a flexible coupling of logic and

local ro uti ng resou rces call ed the VersaB lock . The XC5 200

V er saBloc k elemen t inc ludes t he CLB, a Loc al In terconne ct

Matrix (LIM), and direct connects to neighboring Versa-

Blocks.

The XC5200 provides four global buffers for clocking or

high-f a nou t co ntro l s igna l s. E a ch bu f f er may b e sou rc ed by

means of its dedica ted pad or from any internal source.

Each XC5 200 TB UF ca n dr i ve up t o t wo h ori zo nt al a nd t w o

vertical Longlines. There are no internal pull-ups for

XC5200 Longlines.

Configura tion an d Read back

The XC5200 supports a new configuration mode called

Express mode.

XC4000/Spartan family:

The XC5200 family provides a

global reset but not a global s et.

XC5200 devices use a different co nfigu r atio n proces s than

that of t he XC 30 00 fami ly, bu t use t he s ame p ro cess as t h e

XC4000 and Spartan families.

XC30 00 f amily:

Although their configuration processes dif-

fer, XC5200 devices may be used in daisy chains with

XC3000 devices.

XC3000 family:

The XC5200 PROGRAM pin is a sin-

gle-function input pin that overrides all other inputs. The

PROGRAM pin does not exist in XC3000.

Table 2: Xilinx Field-Programmable Gate Array

Families

Parameter XC5200 Spartan XC4000 XC3000

CLB function

generators 4332

CLB inputs 20 9 9 5

CLB outputs 12 4 4 2

Global buffers 4 8 8 2

User RAM no yes yes no

Edge decoders no no yes no

Cascade ch ain yes no no no

Fast carry logic yes yes yes no

Internal 3-state yes yes yes yes

Boundary scan yes yes yes no

Slew-rate control yes yes yes yes

November 5, 1998 (Version 5.2) 7-85

XC5200 Series Field Programmable Gate Arrays

XC30 00 fami l y:

XC52 00 devices support an additional pro-

gramming mode: Peripheral Synchronous.

XC3000 family:

The XC5200 family does not support

Powe r-down, but of fer s a Glo bal 3-s tate input th at doe s not

reset any flip-flops.

XC3000 family:

The XC5200 family does not provide an

on-chip crystal oscillator amplifier, but it does provide an

interna l oscilla tor from which a variet y of fre quencie s up to

12 MHz are available.

Architectural Overview

Figure 1 presents a simplified, conceptual overview of the

XC5200 architecture. Similar to conventional FPGAs, the

XC5200 family consists of programmable IOBs, program-

mable logic blocks, and programmable interconnect. Unlike

other FPGAs, however, the logic and local routing

resources of the XC5200 family are combined in flexible

Ver saBlocks (Figure 2). General-purpose routing connects

to the VersaBlock through the General Routing Matrix

(GRM).

VersaBlock: Abundant Local Routing Plus

Versatile Logic

The basi c logi c ele ment i n each VersaBlo ck str uct ure is t he

Logic Cell, shown in Figure 3. Each LC contains a 4-input

function generator (F), a storage device (FD), and control

logic. There are five independent inputs and three outputs

to each LC. The independence of the inputs and outputs

allows the software to maximize the resource utilization

within each LC. Each Logic Cell also contains a direct

feedthrough path that does not sacrifice the use of either

the fun ction gen erator or th e register ; this featu re is a first

for F PGAs. The storage dev ice is conf igurable as either a D

flip-flop or a latch. The control logic consists of carry logic

for fast implementation of arithmetic functions, which can

also be configured as a cascade chain allowing decode of

very wide input functions.

Figure 1: XC5200 Architectural Overview

Figure 2: VersaBlock

Figure 3: XC5200 Logic Cell (Four LCs per CLB)

X4955

GRM

Input/Output Blocks (IOBs)

Versa-

Block

GRM

Versa-

Block

VersaRing

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

VersaRing

X5707

CLB

Direct Connects

GRM

LIM

LC3

LC2

LC1

LC0

X4956

F3 F

CI CE CK CLR

XC5200 Series Field Programmable Gate Arrays

7-86 November 5, 1998 (Version 5.2)

The XC5200 CLB consists of four LCs, as shown in

Figure 4. Each CLB has 20 independent inputs and 12

independent outputs. The top and bottom pairs of LCs can

be configured to implement 5-input functions. The chal-

lenge of FPGA implementation software has always been

to maximize the usage of logic resources. The XC5200

family addresses this issue by surrounding each CLB with

two types of local interconnect — the Local Interconnect

Matrix (LIM) and direct connects. These two interconnect

resources, combined with the CLB, form the VersaBlock,

repr esent ed in Figure 2.

The LIM provides 100% connectivity of the inputs and out-

puts of each LC in a given CLB. The benefit of the LIM is

that no general routing resources are required to connect

feedback paths within a CLB. The LIM connects to the

GRM via 24 bidirectional nodes.

The direct connects all ow immediate connections to neigh-

boring CLBs, once again without using any of the general

interconnect. These two layers of local routing resource

improve the granularity of the archi tecture, effectively mak-

ing the XC5200 family a “sea of logic cells.” Each

Versa-Block has four 3-state buffers that share a common

enable line and directly drive horizontal and vertical Lon-

glines, creating robust on-chip bussing capability. The

Ve rsaBlock allows fa st, local impl ementation of logic func-

tions, effec tively imple menting user desi gns in a hierarch i-

cal fashion. These resources also minimize local routing

congestion and improve the efficiency of the general inter-

connect, which is used for connecting larger groups of

logic. It is this combination of both fine-grain and

coar se-grain architecture attributes that maximize lo gic uti-

lization in the XC5200 family. This symmetrical structure

takes full advantage of the third metal layer, freeing the

placement software to pack user logic optimally with mini-

mal routing restrictions.

VersaRing I/O Interface

The interface between the IOBs and core logic has been

redesigned in the X C5200 family. The IOB s are completely

decoupled from the core logic. The XC5200 IOBs contain

dedicated boundary-scan logic for added board-level test-

ability, but do not include input or output registers. This

approach allows a maximum number of IOBs to be placed

around the device, improving the I/O-to-gate ratio and

decreasing the cost per I/O. A “freeway” of interconnect

cells surrounding the device forms the VersaRing, which

provides connections from the IOBs to the internal logic.

These incremental routing resources provide abundant

connections from each IOB to the nearest VersaBlock, in

addition to Longline connections surrounding the device.

The VersaRing eliminates the historic trade-off between

high logic utilization and pin placement flexibility. These

increm ent al e dge re so urce s giv e u se rs incre ase d flex ibilit y

in preassigning (i.e., locking) I/O pins before completing

their log ic designs. T his ability a ccelerate s time-to-mar ket,

since PCBs and other system components can be manu-

factured concurrent with the logic design.

General Routing Matrix

The GRM is functionally similar to the switch matrices

found in other architectures, but it is novel in its tight cou-

pling to the logic resources contained in the VersaBlocks.

Advanced simulation tools were used during the develop-

ment of the XC5200 architecture to determine the optimal

level of routing resources required. The XC5200 family

contains six levels of interconnect hierarchy — a series of

Figure 4: Configurable Logic Block

X4957

F3 F

LC3

LC2

LC1

LC0

F3 F

CI CE CK CLR

LC0

November 5, 1998 (Version 5.2) 7-87

XC5200 Series Field Programmable Gate Arrays

single-length lines, double-length lines, and Longlines all

routed through the GRM. The direct connects, LIM, and

logic-cell feedthrough are contained within each

Versa-Block. Throughout the XC 5200 interconnect, an effi-

cient m ultiplexing sc heme, in c ombination with three layer

metal ( TLM), w as us ed to imp rove th e over all efficiency of

silicon usage.

Performance Ov erv iew

The XC5200 family has been benchmarked with many

designs running synchronous clock rates beyond 66 MHz.

The perf ormance of an y desi gn depends on the circuit to be

implem en te d, a nd t he d elay thro ug h th e co m bin at or ial an d

sequential logic elements, plus the delay in the intercon-

nect routing. A rough estimate of timing can be made by

assuming 3-6 ns per logic level, which includes direct-con-

nect routing delays, depending on speed grade. More

accurate estimations can be made using the information in

the Switching Characteristic Guideline section.

Taking Ad van tage of Reconfigu ration

FPGA de vice s can be recon figur ed to ch ange l ogic fu nction

while re sident in th e system . This cap ability giv es the s ys-

tem designer a new degree of freedom not available with

any othe r typ e of logic.

Hardware can be changed as easily as software. Design

updates or modifications are easy, and can be made to

produ cts alrea dy in the fie ld. A n FPG A ca n ev en be re co n-

figured dynamically to perform different functions at differ-

ent times .

Reconfigurable logic can be used to implement system

self-diagnostics, creat e systems capable of being reconfig-

ured for different environments or operations, or implement

multi-purpose hardware for a given application. As an

added benefit, using reconfigurable FPGA devices simpli-

fies hardware design and debugging and shortens product

time-to-market.

Detailed Functional Description

Configurable Lo gic Blocks (CLBs)

Figure 4 shows the logic in the XC5200 CLB, which con-

sists of four Logic Cells (LC[3:0]). Each Logic Cell consists

of an independent 4-input Lookup Table (LUT), and a

D-Type flip-flop or latch w ith common c lock, clock enable,

and clear, but individually selectable clock polarity. Addi-

tional logic features provided in the CLB are:

• An indepen dent 5-i nput LUT by combining two 4-input

LUTs.

• High-speed carry propagate logic.

• High-speed patt ern decoding.

• High-speed direct co nnecti on to flip-flop D-inputs.

• Individual selection of either a transparent,

level-sensitive latch or a D flip-flop.

• Four 3-state buffers with a shared Output Enable.

5-Input Functions

Figure 5 illustrates how the outputs from the LUTs from

LC0 and LC1 can be combined with a 2:1 multiplexer

(F5_MUX) to provide a 5-input function. The outputs from

the LUTs of LC2 and LC3 can be similarly combined.

Figure 5: Two LUTs in Parallel Combined to Create a

5-in put Function

out

QQout

CLR LC0

CKCE

5-Input Function

F5_MUX

LC1

X5710

XC5200 Series Field Programmable Gate Arrays

7-88 November 5, 1998 (Version 5.2)

Carry Functi on

The XC5200 family supports a carry-logic feature that

enhances the performance of arithmetic functions such as

counte rs, a dders, etc. A c arry m ultiplexe r (CY_ MUX) sym -

bol is used to indicate the XC5200 carr y logic. This symbol

represents the dedicated 2:1 multiplexer in each LC that

performs the one-bit high-speed carry propagate per logic

cell (four b its per CLB).

While the carry propagate is performed inside the LC, an

adjacent LC must be used to complete the arithmetic func-

tion. Figure 6 represents an example of an adder function.

The carry propagate is performed on the CLB shown,

which al so gener ates the hal f-su m for the f our-bit ad der . An

adjacent CLB is responsible for XORing the half-sum with

the corresponding carry-out. Thus an adder or counter

requires two LCs per bit. Notice that the carry chain

requires an initialization stage, which the XC5200 family

accomplishes using the carry initialize (CY_INIT) macro

and one ad ditional LC. The carry ch ain can propagate ver-

tically up a colum n of CLBs.

The XC5200 library contains a set of Relationally-Placed

Macros (RPMs) and arithmetic functions designed to take

advantage of the dedicated carry logic. Using and modify-

ing thes e macros m akes it much easie r to impl ement cus-

Figure 6: XC5200 CY_MUX Used for Adder C arry Propagate

XOR

F=0

carry out

carry3

LC3

LC2

carry in

CY_MUX

DO DO

LC1

LC0

CKCE CLR

half sum0

carry0

half sum2

half sum1

carry1

carry2

half sum3

A3 and B3

to any two

A2 and B2

to any two

A1 and B1

to any two

A0 and B0

to any two

XOR

LC3

LC2

LC1

LC0

CE CLR

sum0

sum2

sum1

sum3

Initialization of

carry chain (One Logic Cell) X5709

November 5, 1998 (Version 5.2) 7-89

XC5200 Series Field Programmable Gate Arrays

tomized RPMs, freeing the designer from the need to

become an expert on architectures.

Cascade Function

Each CY_MUX can be connected to the CY_MUX in the

adjacent LC to provide cascadable decode logic. Figure 7

illustrate s ho w the 4- input func tion gener ator s can be con-

figured to take advantage of these four cascaded

CY_MUX es. Not e that AND and OR cas cadi ng are sp ecif ic

cases of a general decode. In AND cascading all bits are

decoded equal to logic one, while in OR cascading all bits

are decoded equal to logic zero. The flexibility of the LUT

achieves this result. The XC5200 library contains gate

macr os designed to take advantag e of thi s function.

CLB Flip-Flops and Latches

The CLB can pass the combinatorial output(s) to the inter-

connect network, but can also store the combinatorial

results or other incoming data in flip-flops, and connect

their outputs to the interconnect network as well. The CLB

stor age elements can also be configured as latches.

Data Inputs and Outputs

The source of a storage element data input is programma-

ble. It is driven by the function F, or by the Direct In (DI)

block input. The flip-flops or latches drive the Q CLB out-

puts.

Four fast feed-through paths from DI to DO are available,

as shown in Figure 4. This bypass is sometimes used by

the automated router to repower internal signals. In addi-

tion to the storage element (Q) and direct (DO) outputs,

there is a combinatorial output (X) that is always sourced

by the Lookup Table.

The four edge-triggered D-type flip-flops or level-sensitive

latches have common clock (CK) and clock enable (CE)

inputs. Any of the clock inputs can also be permanently

enabled. Storage element functionality is described in

Table 3.

Clock Input

The f lip- flo ps ca n b e trig g ered o n e ith er th e risin g or fa lling

clock edge. The clock pin is shared by all four storage ele-

ments with individual polarity control. Any inverter placed

on the clock input is automatically absorbed into the CLB.

Clock Enable

The cloc k enable si gnal (CE) is active High. The CE pin is

shared by the four storage elements. If left unconnected

for any, the clock enable for that storage element defaults

to th e active stat e. CE is not inve rtible within the CLB.

Clear

An as ynchro nous st orage el ement input ( CLR) ca n be us ed

to reset all four flip-flops or latches in the CLB. This input

Figure 7: X C5200 CY _MUX Used f or Deco der Cascade

Logic

A15

A14

A13

A12

A11

A10

AND

F=0

cascade out

out

LC3

LC2

CI cascade in

CY_MUX

LC1

Initialization of

carry chain (One Logic Cell)

LC0

CE CLR

AND

X5708

Table 3: CLB Storage Element Functionality

(active rising edge is shown)

Mode CK CE CLR D Q

Po wer- Up or

GR XXXX0

Flip-Flop XX1X0

__/ 1* 0* D D

0X0*XQ

Latch 11*0*XQ

01*0*DD

Both X 0 0* X Q

Legend:

__/

Don’t care

Rising edge

Input is Low or unconnected (default value)

Input is High or unconnected (def aul t value)

XC5200 Series Field Programmable Gate Arrays

7-90 November 5, 1998 (Version 5.2)

can al so be i n dep en den tly dis ab l ed for any fl ip -f lop . C LR i s

active High. It is not invertible within the CLB.

Global Reset

A separate Global Reset line clears each storage element

during power-up, reconfiguration, or when a dedicated

Reset net is driven active. This global net (GR) does not

compete with other routing resources; it uses a dedicated

distribu tio n ne two r k.

GR can be driven from any user-programmable pin as a

global reset input. To use this global net, place an input pad

and input buffer in the schematic or HDL code, driving the

GR pin of t he STARTUP symbol. (See Figure 9.) A specific

pin location can be assigned to this input using a LOC

attribute or property, just as with any other user-program-

mable pad. An inverter can optionally be inserted after the

input buffer to invert the sense of the Global Reset signal.

Alt ernatively, GR can be driven from any internal node.

Using FPGA Flip-Flops and Latches

The abundance of flip-flops in the XC5200 Series invites

pipel ined designs . This is a powe rful w ay of inc reasi ng per -

formance by breaking the function into smaller subfunc-

tions and execu ting th em in parallel, passing on the results

throu gh p i pe li ne f li p- f lops . This me th od sh ould be se ri ous l y

considered wherever throughput is more important than

latency.

To include a CLB flip-flop, place the appropriate library

symbo l. For ex a mple, FD CE is a D- ty pe f li p-fl o p wit h cl oc k

enable and asynchronous clear. The corresponding latch

symbol is called LDCE.

In XC5200-Series devices, the flip-flops can be used as

registers or shift registers without blocking the function

generators from performing a different, perhaps unrelated

task. This ability increases the functional capacity of the

devices.

The CLB setup time is specified between the function gen-

erator inputs and the clock input CK. Therefore, the sp eci-

fied CLB flip-flop setup time includes the delay through the

function generator.

Three-State Buffers

The XC5200 family has four dedicated Three-State Buffers

(TBUFs, or BUFTs in the schematic library) per CLB (see

Figure 9). The four buffers are individually configurable

through four configuration bits to operate as simple

non-inverting buffers or in 3-state mode. When in 3-state

mode the CLB output enable (TS) control signal drives the

enable to all four buffers. Each TBUF can drive up to two

horiz ontal an d/or t wo verti cal Lon glines . These 3-state buf f-

ers can be used to implement multiplexed or bidirectional

buses on the horizontal or vertical longlines, saving logic

resources.

The 3 -state buffer ena ble is an active -High 3-sta te (i.e. an

active-Low enable), as shown in Table 4.

Another 3-state buffer with similar access is located near

each I/O block along the right and left edges of the array.

The longlines driven by the 3-state buffers have a weak

keeper at each end. This circuit prevents undefined float-

ing levels. However, it is overridden by any driver. To

ensur e th e lo n glin e go es hi gh wh en n o bu ffers ar e on , a dd

an addi tiona l BUFT to driv e the outpu t Hig h durin g all o f th e

previously undefined states.

Figure 10 shows how to use the 3-state buffers to imple-

ment a multiplexer. The selection is accomplished by the

buffer 3-sta te signal.

PAD

IBUF

GTS

CLK DONEIN

Q1Q4

STARTUP

X9009

Figure 8: Schematic Symbols for Global Reset

Table 4: Three-Stat e Buffer Functionality

IN T OUT

X1Z

IN 0 IN

CLB

LC3

LC2

LC1

LC0

CLB

Horizontal

Longlines

X9030

Figure 9: X C5200 3-S tate Buffers

November 5, 1998 (Version 5.2) 7-91

XC5200 Series Field Programmable Gate Arrays

Input/ Ou tp u t Bloc ks

User-configurable input/output blocks (IOBs) provide the

interface between external package pins and the internal

logic. Each IOB c ontrols one package pi n and can be con-

figured for input , output, or bidirectional signals.

The I/O block, shown in Figure 11, consists of an input

buffer and an output buffer. The output driver is an 8-mA

full-rail CMOS buffer with 3-state control. Two slew-rate

control modes are supported to minimize bus transients.

Both t he o utput bu ffer and th e 3-s t at e co nt ro l a re in ve rt ibl e .

The input buffer has globally selected CMOS or TTL input

thres holds. T he input buf fer is i nvertibl e and also provides a

programmable delay line to assure reliable chip-to-chip

set-up and hold times. Minimum ESD protection is 3 KV

using the Human Body Model.

IOB Input Signals

The XC5200 inputs can be globally configured for either

TTL (1.2V) or CMOS thresholds, using an option in the bit-

stream generation software. There is a slight hysteresis of

about 300mV.

The inputs of XC5200-Series 5-Volt devices can be driven

by the output s of any 3. 3-V ol t devic e, if the 5-V ol t inputs are

in TTL mo de .

Supported sources for XC5200-Series device inputs are

show n in Table 5.

Optional Delay Guarantees Zero Hold Time

XC520 0 devices do not have storag e elements in the IOB s.

However, XC5200 IOBs can be efficiently routed to CLB

flip-flops or latches to store the I/O signals.

The d ata inpu t to th e re gister can opt iona lly be d elaye d by

several nanoseconds. With the delay enabled, the setup

time o f the input flip -flop is increa sed so that n ormal clock

routing does not result in a positive hold-time requirement.

A positive hold time requirement can lead to unreliable,

temperature- or processing-dependent operation.

The input flip-flop setup time is defined between the data

measured at the device I/O pin and the clock input at the

CLB (not at the clock pin). Any routing delay from the

device clock pin to the clock input of the CLB must, there-

fore , be subtracted from this setup time to arrive at the real

setup time requirement relative to the device pins. A short

specified setup time might, therefore, result in a negative

setup time at the device pins, i.e., a positive hold-time

requirement.

When a dela y i s i nser t ed on th e dat a l i ne, mor e c loc k de lay

can be tolerated without causing a positive hold-time

requi rement. Sufficien t delay elimin ates the po ssibility of a

data hold-time requirement at the external pin. The maxi-

mum delay is therefore inserted as the software default.

The XC5200 IOB has a one-tap delay element: either the

delay is inser ted (defau lt), or it is no t. The dela y guaran tees

a zero hold time with respect to clocks routed through any

of the XC5200 global clock buffers. (See “Global Lines” on

page 96 for a description of the global clock buffers in the

XC5200.) For a shorter input register setup time, with

ABCN

Z = D

• A + D

• B + D

• C + D

• N

~100 kΩ

"Weak Keeper"

X6466

BUFT BUFT BUFT BUFT

Figure 10: 3-State Buffer s Implement a Multiplexer

Figure 11: XC5200 I/O Block

PAD

Vcc

X9001

Input

Buffer Delay

Pullup

Pulldown

Slew Rate

Control

Output

Buffer

Table 5: Supported Sources for XC5200-Series Device

Inputs

Source

XC5200 I nput Mode

5 V,

TTL 5 V,

CMOS

Any device, Vcc = 3.3 V,

CMOS ou tp ut s √Unreliable

Data

Any device, Vc c = 5 V,

TTL outputs √

Any device, Vc c = 5 V,

CMOS ou tp ut s √√

XC5200 Series Field Programmable Gate Arrays

7-92 November 5, 1998 (Version 5.2)

non-zero hold, attach a NODELAY attribute or property to

the flip-flop or i nput buffer.

IOB Output Signals

Output signals can be optionally inverted within the IOB,

and pass directly to the pad. As with the inputs, a CLB

flip-flop or latch can be used to store the output signal.

An active-High 3-state signal can be used to place the out-

put buffer in a high-impedance state, implementing 3-state

outputs or bidirectional I/O. Under configuration control,

the output (OUT) and output 3-state (T) signals can be

inverted. The polarity of these signals is independently

configured for each IOB.

The XC 5200 d evice s pro vide a g uaran teed outp ut si nk cur -

rent of 8 mA.

Supported destinations for XC5200-Series device outputs

are shown in Table 6.(For a detailed discussion of how to

interface between 5 V and 3.3 V devices, see the 3V Prod-

ucts sectio n of

The Programmable Logic Data Bo ok

An ou tput can be conf igu red a s ope n-dr ain (op en-c olle ctor )

by placing an OBUFT symbol in a schematic or HDL code,

then tying the 3-state pin (T) to the output signal, and the

input pin (I) to Ground. (See Figure 12.)

Table 6: Supported Destinations for XC5200-Series

Outputs

Output Slew Rate

The slew rate of each output buffer is, by default, reduced,

to minimiz e powe r bus tran sients when switch ing no n-cr iti-

cal signal s. For critical sig nals, attach a FAST a ttribute or

prop erty to the output buffer or fli p-flop.

For XC5200 devices, maximum total capacitive load for

simultaneous fast mode switching in the same direction is

200 pF for all package pins between each Power/Ground

pin pair. For some XC5200 devices, additional internal

Power/Ground pin pairs are connected to special Power

and Ground planes within the packages, to reduce ground

bounce.

For slew-rate limited outputs this total is two times larger for

each device type: 400 pF for XC5200 devices. This maxi-

mum capacitive load should not be exceeded, as it can

resul t in ground bounce of grea ter than 1. 5 V amplit ude and

more than 5 ns duration. This level of ground bounce may

cause undesired transient behavior on an output, or in the

internal lo gic. This restriction is common to all high-speed

digital ICs, and is not particular to Xilinx or the XC5200

Series.

XC5200-Series devices have a feature called “Soft

Start -up, ” desi gned to red uce gr ound bo unce when all out-

puts are turned on simultaneously at the end of configura-

tion. When the configuration process is finished and the

device starts up, the first activation of the outputs is auto-

matically slew-rate limited. Immediately following the initial

activation of the I/O, the slew rate of the individual outputs

is determined by the individual configuration option for

each IOB.

Global Three-State

A separate Global 3-State line (not shown in Figure 11)

forces all FPGA outputs to the high-impedance state,

unless boundary scan is enabled and is executing an

EXTEST instruction. This global net (GTS) does not com-

pete w ith other r outi ng r esou rces; it u ses a d edica ted d ist ri-

bution network.

GTS can be driven from any user-programmable pin as a

global 3-state input. To use this global net, place an input

pad and input buffer in the schematic or HDL code, driving

the GTS pin of the STARTUP symbol. A specific pin loca-

tion can be assigned to this input using a LOC attribute or

propert y, ju st as with an y other user-pr ogrammab le pad. An

inverter can optionally be inserted after the input buffer to

inver t the sens e of th e Global 3 -State s ignal. Using GTS i s

similar to Global Reset. See Figure 8 on page 90 for

details. Alternatively, GTS can be driven from any internal

node.

Other IOB Options

There are a number of other programmable options in the

XC5200-Series IOB.

Pull-up and Pull-down Resistors

Programmable IOB pull-up and pull-down resistors are

useful for tying unused pins to Vcc or Ground to minimize

power consumption and reduce noise sensitivity. The con-

figurable pull-up resistor is a p-channel transistor that pulls

Destination

XC5200 Output Mode

5 V,

CMOS

XC5200 device, VCC=3.3 V,

CMOS-thres hold inputs √

Any ty pical devic e, VCC = 3.3 V,

CMOS-thres hold inputs some1

1. Only if desti nation device has 5-V tolerant inputs

Any device, VCC = 5 V,

TTL-threshold inputs √

Any device, VCC = 5 V,

CMOS-thres hold inputs √

X6702

OPAD

OBUFT

Figure 12: Open-Drain Output

November 5, 1998 (Version 5.2) 7-93

XC5200 Series Field Programmable Gate Arrays

to Vc c. The conf igurabl e pull- down resi stor is an n-chan nel

transistor that pulls to Ground.

The value of these resistors is 20 kΩ − 100 kΩ. This high

value makes them unsuitable as wired-AND pull-up resis-

tors.

The pul l-up re sistor s for mos t user-pr ogrammabl e IOBs ar e

active during the configuration process. See Table 13 on

page 124 for a list of pins with pull-ups active before and

during configurati on.

After configuration, voltage levels of unused pads, bonded

or unbonded, must be valid logic levels, to reduce noise

sensitivity and avoid excess current. Therefore, by default,

unused pads are configured with the internal pull-up resis-

tor active. Alternatively, they can be individually configured

with the pull-down resistor, or as a driven output, or to be

driven by an external source. To activate the internal

pull-up, attach the PULLUP library component to the net

attached to the pad. To activate the internal pull-down,

attach the PULLDOWN library component to the net

attached to the pad.

JTAG Support

Embedded logic attached to the IOBs contains test struc-

tures compatible with IEEE Standard 1149.1 for boundary

scan testing, simplifying board-level testing. More informa-

tion is provided in “Boundary Scan” on page 98.

Oscillator

XC5200 dev ices includ e an intern al oscillato r. This osc illa-

tor is used to clock the power- on tim e-ou t, clea r con figur a-

tion memory, and source CCLK in Master configuration

modes . The osc illat or ru ns at a nom in al 1 2 M Hz fr e quen cy

that varies with process, Vcc, and temper ature. The output

CCLK frequency is selectable as 1 MHz (default), 6 MHz,

or 12 MHz.

The XC5200 oscillator divides the internal 12-MHz clock or

a user clock. The user then has the choice of dividing by 4,

16, 64, or 256 for the “OSC1” output and dividing by 2, 8,

32, 128, 1024, 4096, 16384, or 65536 for the “OSC2” out-

put. The division is specified via a “DIVIDEn_BY=x”

attribute on the symbol, where n=1 for OSC1, or n=2 for

OSC2. These frequencies can vary by as much as -50% or

+ 50%.

The OSC5 macro is used where an internal oscillator is

required. The CK_DIV macro is applicable when a user

clock input is spec ified (se e Figure 13).

VersaBlock Routing

The General Routing Matrix (GRM) connects to the

Versa-Block via 24 bidirectional ports (M0-M23). Excluding

direct connections, global nets, and 3-statable Longlines,

all VersaBlock i np ut s and ou tp ut s conne ct to th e GRM v i a

these 24 ports. Four 3-statable unidirectional signals

(TQ0-TQ3) drive out of the VersaBlock directly onto the

horizontal and vertical Longlines. Two horizontal global

nets and two vertical global nets connect directly to every

CLB cloc k pin; the y can conn ect to ot her CLB inp uts via th e

GRM. Each CLB also has four unidirectional direct con-

nects to each of its four neighboring CLBs. These direct

connects can also feed directly back to the CLB (see

Figure 14).

In ad dit i on , ea ch C LB ha s 1 6 dir ec t in p ut s, four d ire ct con -

nections from each of the neighboring CLBs. These direct

connections provide high-speed local routing that

bypasses the GRM.

Local Interconnect Matrix

The L ocal Int erconne ct Matr ix (LIM) is b uilt from input and

output multiplexers. The 13 CLB outputs (12 LC outputs

plus a Vcc/GND signal) connect to the eight VersaBlock

outputs via the output multiplexers, which consist of eight

fully populated 13-to-1 multiplexers. Of the eight

VersaBlock outputs, four signals drive each neighboring

CLB dir ectly, and pro vide a d irect f eedback path to the inp ut

multiplexers. The four remaining multiplexer outputs can

drive the GRM through four TBUFs (TQ0-TQ3). All eight

multiplexer outputs can connect to the GRM through the

bidi rect i on al M0- M23 s ign al s . A ll eigh t s igna l s al so c on nect

to the input multiplexers and are potential inputs to that

CLB.

OSCS

CK_DIV

OSC1

OSC2

5200_14

Figure 13: XC5200 Oscillator Macros

XC5200 Series Field Programmable Gate Arrays

7-94 November 5, 1998 (Version 5.2)

CLB inputs have several possible sources: the 24 signals

from the GRM, 16 direct connections from neighboring

VersaBlocks, four signals from global, low-skew buffers,

and the four signals from the CLB output multiplexers.

Unlike the output multiplexers, the input multiplexers are

not fully populated; i.e., only a subset of the available sig-

nals ca n be con nected to a given CLB in put. The fle xibility

of LUT input swapping and LUT mapping compensates for

this limitation. For example, if a 2-input NAND gate is

required, it can be mapped into any of the four LUTs, and

use any two of the four input s to the LUT.

Direct Connects

The unidirectional direct-connect segments are connected

to the logic input/output pins through the CLB input and out-

put mul t ipl e xe r ar ra ys, and th us bypa ss t he g ene ra l rou t i ng

matr ix altogeth er. These lines increase the routing channel

utilization, while simultaneously reducing the delay

incurred i n speed-critical connections.

The direct connects also provide a high-speed path from

the edge CLBs to the VersaRing input/output buffers, and

thus reduce pin-to-pin set-up time, clock-to-out, and combi-

nation al propagation delay. Direct connects from the input

buffers to the CLB DI pin (direct flip-flop input) are only

available on the left and right edges of the device. CLB

look-up table inputs and combinatorial/registered outputs

have direct connects to input/output buffers on all four

sides.

The direct connects are ideal for developing customized

RPM cells. Using direct connects improves the macro per-

formance, and leaves the other routing channels intact for

improved r outing . Direct connects can also ro ute through a

CLB using one of the four cell-feed through path s.

General Routing Matrix

The G enera l Routin g Matrix, show n in Figure 15, provides

flexible bidirectio nal connect ions to the Local Int erconnect

Figure 14: VersaBlock Details

To GRM

M0-M23

CLB

CLK

Direct North

Direct to

East

Longlines

and GRM

TQ0-TQ3

Global Nets

Feedback

Direct West

Direct South

CLR CIN

COUT

VCC /GND

North 4

South 4

East 4

West 4

LC3

LC2

LC1

LC0

Output

Multiplexers

Input

Multiplexers 84

X5724

November 5, 1998 (Version 5.2) 7-95

XC5200 Series Field Programmable Gate Arrays

Matrix through a hierarchy of different-length metal seg-

ments in both the horizont al and vertical directions. A pro-

grammable interconnect point (PIP) establishes an electri-

cal connection between two wire segments. The PIP, con-

sisting of a pass transistor switch controlled by a memory

element, provides bidirectional (in some cases, unidirec-

tional) connection between two adjoining wires. A collec-

tion of PIPs inside the General Routing Matrix and in the

Local Interconnect Matrix provides connectivity between

various types of metal segments. A hierarchy of PIPs and

associated routing segments combine to provide a power-

ful interconnect hier archy:

• Forty bidirectional single-length segments per CLB

provide ten routing channels to each of the four

neighboring CLBs in four directions.

• Sixteen bidirectional double-length segments per CLB

provide four routi ng channels to each of four other

(non- ne igh b or ing ) CL B s in fou r direc tio ns.

• Eight horizontal and eight vertical bidirectional Longline

Figure 15: XC5200 In terconnect Structure

X4963

Versa-

Block

GRM

Single-length Lines

Double-length Lines

Direct Connects

Longlines and Global Lines

Six Levels of Routing Hierarchy

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Versa-

Block

GRM

Local Interconnect Matrix

Logic Cell Feedthrough

Path (Contained within each

Logic Cell)

LIM5

CLB

Direct Connects

LIM

LC3

LC2

LC1

LC0

GRM

XC5200 Series Field Programmable Gate Arrays

7-96 November 5, 1998 (Version 5.2)

segme nts span the width and height of the chip,

respectively.

Two low-skew horizontal and vertical unidirectional glo-

bal-line segments span each row and column of the chip,

respectively.

Single- and Double-Length Lines

The single- and double-length bidirectional line segments

make up the bulk of the routing channels. The dou-

ble-length lines hop across every other CLB to reduce the

propag ati on dela ys in s peed -crit ical net s. Rege nerat ing t he

signal strength is recommended after traversing three or

four s uch segm ents. Xilinx place-an d-route so ftware a uto-

matically connects buffers in the path of the signal as nec-

essary. Single- and double-length lines cannot drive onto

Longlines and global lines; Longlines and global lines can,

however, drive onto single- and double-length lines. As a

general rule, Longline and global-line connections to the

general routing matrix are unidirectional, with the signal

direction from these lines toward the routing matrix.

Longlines

Longl ines ar e used for hig h-fan-o ut sig nals, 3 -state b usses ,

low-skew nets, and faraway destination s. Row and column

split ter PI Ps in the mid dle of the ar ray ef fect ively doub le the

total number of Longlines by electrically dividing them into

two separated half-lines. Longlines are driven by the

3-state b uffer s in e a ch CLB, an d a r e d riv en by si m ilar bu ff-

ers at the periphery of the array from the VersaRing I/O

Interface.

Bus- oriented desi gns ar e easil y impl emented by usin g Lon-

gli nes i n co njun ctio n wit h t he 3 -stat e buffers in th e CLB and

in the VersaRing. Additionally, weak keeper cells at the

periphery retain the last valid logic level on the Longlines

when all buffers are in 3- state mode.

Longlines connect to the single-length or double-length

lines, or to the logic inside the CLB, through the General

Routing Matrix. The only manner in which a Longline can

be driven is through the four 3-state buffers; therefore, a

Longline-to-Longline or single-line-to-Longline connection

through PIPs in the General Routing Mat r ix is not possibl e.

Again, as a general rule, long- and global-line connections

to the General Routing Matrix are unidirectional, with the

signal direction from these lines toward the routing matrix.

The XC52 00 f amil y has no p ull -u ps o n t he e nds o f t he Lon-

glines sourced by TBUFs, unlike the XC4000 Series. Con-

sequen t l y, wired fu nc tio ns (i .e. , WAND and WORAN D ) a nd

wide multiplexing functions requiri ng pull-ups for undefined

stat es (i. e ., bus ap pli c ati on s) must be im pl eme nt ed in a dif -

ferent way. In the case of the wired functions, the same

functionality can be achieved by taking advantage of the

carry/cascade logic described above, implementing a wide

logic fu nction in p lace of the wired functio n. In the c ase of

3-stat e bus a pplicat ions, t he user must i nsure that all states

of the multiplexing function are defined. This process is as

simple as adding an additional TBUF to drive the bus High

when the previously undefined states are activated.

Global Lines

Global buffers in Xilinx FPGAs are special buffers that drive

a dedicated routing network called Global Lines, as shown

in Figure 16. This network is intended for high-fanout

cloc ks or othe r control signals , to maxi mize spe ed and min-

imiz e skewing whil e distributing the signal to many loads.

The XC5200 family has a total of four global buffers (BUFG

symbol in the library), each with its own dedicated routing

channel. Two are distributed vertically and two horizontally

throughout the FPGA.

The global lines provide direct input only to the CLB clock

pins. The global lines also connect to the General Routing

Matrix to provide access from these lines to the function

generators and other c ontrol signals.

Four clock input pads at the corners of the chip, as shown

in Figure 16, prov ide a high -speed , low-sk ew cloc k netwo rk

to each of the four global-line buffers. In addition to the ded-

icated pad, the global lines can be sourced by internal

logic. PIPs from several routing channels within the Ver-

saRing can also be configured to drive the global-line buff-

ers.

Details of all the programmable interconnect for a CLB is

shown in Figure 17.

Figure 16: Global Lines

GCK1 GCK4

GCK3

GCK2

X5704

November 5, 1998 (Version 5.2) 7-97

XC5200 Series Field Programmable Gate Arrays

CLB

DOUBLEGLOBAL CARRY SINGLE LONG

DIRECT

DOUBLE

SINGLE

LONG

GLOBAL

x9010

Figure 17: Detail of Programmable Interconnect A ssociated with XC5200 Series CLB

XC5200 Series Field Programmable Gate Arrays

7-98 November 5, 1998 (Version 5.2)

VersaR ing Inp ut/Ou tpu t Interface

The VersaRing, shown in Figure 18, is positioned between

the core logic and the pad ring; it has all the routing

resources of a VersaBlock without the CLB logic. The Ver-

saRing decouples the core logic from the I/O pads. Each

VersaRi n g Cell provides up to four pad-cell connec tion s on

one side, and connects directly to the CLB ports on the

other sid e.

Boundary Scan

The “bed o f nails” has been the trad itional met hod of testi ng

electronic assemblies. This approach has become less

appropriate, due to closer pin spacing and more sophisti-

cated assembly methods like surface-mount technology

and multi-layer boards. The IEEE boun dary scan sta ndard

1149.1 was developed to facilitate board-level testing of

electronic assemblies. Design and test engineers can

imbed a standard test logic structure in their device to

achieve high fault coverage for I/O and internal logic. This

structure is easily implemented with a four-pin interface on

any bou ndary scan- compatib le IC. IEEE 1149.1-c ompatible

devi ces may be seri al daisy- chaine d toget her , connec ted in

parallel, or a combination of the two.

XC5200 devices support all the mandatory boundary-scan

instructions specified in the IEEE standard 1149.1. A Test

Access Port (TAP) and registers are provided that imple-

ment the EXTEST, SAMPLE/PRELOAD, and BYPASS

instructions. The TAP can also support two USERCODE

instructions. When the boundary scan configuration option

is selected, three normal user I/O pins become dedicated

inputs for these functions. Another user output pin

becomes the dedicated boundary scan output.

Boundary-scan operation is independent of individual IOB

configuration and package type. All IOBs are treated as

independently controlled bidirectional pins, including any

unbonded IOBs. Retaining the bidirectional test capability

after configuration prov ides flexibility for interconnect test-

ing.

Also, internal signals can be captured during EXTEST by

connecting them to unbonded IOBs, or to the unused out-

puts in IOBs used as unidirectional input pins. This tech-

nique partially compensates for the lack of INTEST

support.

The user can serially load commands and data into these

devices to control the driving of their outputs and to exam-

ine their inputs. This method is an improvement over

bed-of-nails testing. It avoids the need to over-drive device

outputs, and it reduces the user interface to four pins. An

optio nal fift h pin, a re set for the c ontrol logic, is describe d in

the standard but is not implemented in Xilinx devices.

The dedicated on-chip logic imple menting the IEEE 1149.1

funct i ons i n cl u des a 16- st a te mach in e, an in str uc t ion r eg i s-

ter and a number of data registers. The functional details

can be found in the IEEE 1149.1 specification and are also

discussed in the Xilinx application note XAPP 017:

“Bound-

ary Scan in XC4000 and X C5200 Se ries de vice s”

Figure 19 on page 99 is a diagram of the XC5200-Series

boundary scan logic. It includes three bits of Data Register

per IOB, the IEEE 1149.1 Test Access Port controller, and

the Instruction R e gist er with decodes.

The public boundary-scan instructions are always available

prior to conf igurati on. Afte r config urati on, the pu blic ins truc-

tions and any USERCODE instructions are only available if

specified in the design. While SAMPLE and BYPASS are

available during configuration, it is recommended that

boundary-scan operations not be performed during this

transitory period.

In addition to the test instructions outlined above, the

boundar y-sca n circui try can be used t o config ure the FPGA

device, and to rea d back the conf iguration data.

All of the XC4000 boundary-scan modes are supported in

the XC5200 family. Three additional outputs for the User-

Figure 18: VersaRing I/O Interface

GRM

VersaBlock

VersaRing

GRM

VersaBlock

10 Interconnect

Interconnect

Pad

X5705

November 5, 1998 (Version 5.2) 7-99

XC5200 Series Field Programmable Gate Arrays

senting the decoding of the corresponding state of the

boundary-s can internal state machine.

D Q

IOB

BYPASS

IOB IOB

TDO

TDI

IOB IOB IOB

TDO

TDI

IOB

IOB IOB

IOB

IOB IOB IOB IOB IOB

D Q

IOB

D Q

0DQ

DATA IN

IOB.T

IOB.O

IOB.I

IOB.O

IOB.T

IOB.I

IOB.O

SHIFT/

CAPTURE CLOCK DATA

DATAOUT UPDATE EXTEST

X1523_01

INSTRUCTION REGISTER

BYPASS

Figure 19: XC5200-Series Boundary Scan Logic

XC5200 Series Field Programmable Gate Arrays

7-100 November 5, 1998 (Version 5.2)

XC52 00-Ser ies de vic es ca n al so be confi gure d th rough the

boundary scan logic. See XAPP 017 for more information.

Data Registers

The primary data register is the boundary scan register.

For each IOB pin in the FPGA, bonded or not, it includes

three bits for In, Out and 3-State Control. Non-IOB pins

have appropriate partial bit population for In or Out only.

PROGRAM, CCLK and DONE are not included in the

boundary scan register. Each EXTEST CAPTURE-DR

state captures al l In, Ou t, and 3-State pins.

The data register also includes the following non-pin bits:

TDO.T, and TDO.O, which are always bits 0 and 1 of the

data register, respectively, and BSCANT.UPD, which is

always the last bit of the data register. T hese three bound-

ary scan bit s are spe cia l-pur p ose Xilinx te st sig na ls.

The other standard data register is the single flip-flop

BYPASS register. It synchronizes data being passed

through the FPGA to the next downstream boundary scan

device.

The FPGA provides two additional data registers that can

be specified using the BSCAN macro. The FPGA provides

two user pins (BSCAN.SEL1 and BSCAN.SEL2) which are

the deco des of two use r instruction s, USER 1 and USER 2.

For these instructions, two corresponding pins

(BSCA N.TDO1 an d BSCAN.TDO 2) allow user scan data to

be shifted out on TDO. The data register clock

(BSCAN.DRCK) is available for control of test logic which

the user may wish to implement with CLBs. The NAND of

TCK and RUN-TEST -IDLE is also provided (BSCAN.IDLE).

Instruction Set

The XC5200-Series boundary scan instruction set also

includes instructions to configure the devi ce and read back

the configuration data. The instruction set is coded as

show n in Table 7.

Table 7: Boundary Scan Instructions

Bit Sequence

The bit sequence within each IOB is: 3-State, Out, In. The

data-register cells for the TAP pins TMS, TCK, and TDI

have an OR-gate that permanently disables the output

buffer if boundary-scan operation is selected. Conse-

quentl y , it is i mpossi ble fo r the outp uts in IO Bs used b y TAP

inputs to conflict with TAP operation. TAP data is taken

directly from the pin, and cannot be overwritten by injected

bound ary-scan dat a.

The primary global clock inputs (PGCK1-PGCK4) are

taken di re ctl y f ro m t he pin s, a nd ca nno t be ov er wri tt en w i th

boundary-scan data. However , if necessary, it is possible to

drive the clock input from boundary scan. The external

clock source is 3-stated, and the clock net is driven with

boundary scan data through the output driver in the

cloc k-pad I OB. If t he cl ock-pad I OBs ar e used f or non-cl ock

signals, the data may be overwritten normally.

Pull-up and pull-down resistors remain active during

boundary scan. Before and during configuration, all pins

are pulled up. After configuration, the choice of internal

pull-up or pull-down resistor must be taken into account

when designing test vectors to detect open-circuit PC

traces.

From a cavity-up view of the chip (as shown in XDE or

Epic), starting in the upper right chip corner, the boundary

scan data-register bits are ordered as shown in Table 8.

The device-specific pinout tables for the XC5200 Series

incl ude the boundar y scan locations for each IOB pi n.

Table 8: Boundary Scan Bit Sequence

BSDL (Boundary Scan Description Language) files for

XC5200-Series devices are available on the Xilinx web site

in the File Download area.

Including Boundary Scan

If boun dary scan is onl y to be used d urin g con figur ati on, n o

speci al eleme nts nee d be in cluded i n the s chematic or HDL

code. In this case, the special boundary scan pins TDI,

TMS, TCK and TDO can be used for user functions after

configuration.

To indi cate that bou ndary scan rema in enable d after confi g-

urati on, includ e the BSCAN libr ary symbol an d connect pa d

symbols to the TDI, TMS, TCK and TDO pins, as shown in

Figure 20.

Instruction I2

I1 I0 Test

Selected TDO Sourc e I/O Data

Source

0 0 0 EXTEST DR DR

0 0 1 SAMPLE/PR

ELOAD DR Pin/Logic

0 1 0 USER 1 BSCAN.

TDO1 User Logic

0 1 1 USER 2 BSCAN.

TDO2 User Logic

1 0 0 READBACK Readback

Data Pin/Logic

1 0 1 CONFIGURE DOUT Disabled

1 1 0 Reserved ——

1 1 1 BYPASS Bypass

Bit Position I/O Pad Location

Bit 0 (TDO) Top-edge I/O pads (right to left)

Bit 1 ...

... Left-edge I/O pads ( top to bottom)

... Bottom-edge I/O pads (left to right)

... Right-edge I/O pads (bottom to top)

Bit N (TDI) BSCANT.UPD

November 5, 1998 (Version 5.2) 7-101

XC5200 Series Field Programmable Gate Arrays

Even if the boundary scan symbol is used in a schematic,

the input pins TMS, TCK, and TDI can still be used as

input s to be routed t o interna l logic. Care must b e taken not

to force the chip into an undesired boundary scan state by

inadvertently applying boundary scan input patterns to

these pins. The simplest way to prevent this is to keep

TMS High, and then apply whatever signal is desired to TDI

and TCK.

Avoiding Inad vertent Boundary Scan

If TMS or TCK is used as user I/O, care must be taken to

ensure that at leas t one o f thes e p ins is he ld co nsta nt du r-

ing configuration. In some applications, a situation may

occur where TMS or TCK is driven during configuration.

This may cause the device to go i nto boundary scan mode

and disrupt the configuration process.

To prevent activation of boundary scan during configura-

tion, do either of the fol lowing:

• TMS: Tie High to put the Test Access Port controller

in a benign RESET state

• TCK: Tie High or L ow—do not toggle this clock in put.

For more inform ation regarding boundary sca n, ref er to the

Xilinx Application Note XAPP 017, “

Boundary Scan in

XC40 00 and XC5200 Devices

.“

Power Distribution

Powe r for the FP GA is dis tribu ted th rough a grid t o achiev e

high noise immunity and isolation between logic and I/O.

Inside the FPGA, a dedicated Vcc and Ground ring sur-

rounding the logic array provides power to the I/O drivers,

as shown in Figure 21. An independent matrix of Vcc and

Grou nd lin es suppl ies the interio r logi c of the device.

This power distribution grid provides a stable supply and

grou nd for all internal logic, provid ing th e extern al package

power pins are all connected and appropri atel y decoupled.

Typically, a 0.1 µF capacitor connected near the Vcc and

Ground pins of the package will provide adequate decou-

pling.

Output buffe rs capabl e of drivi ng/sinki ng the speci fied 8 mA

loads u nder specif ied worst -case cond itions may be capa-

ble of driving/sinking up to 10 times as much current under

best case condit ions.

Noise can be reduced by minimizing external load capaci-

tance and reducing simultaneous output transitions in the

same direction. It may also be benefi cial to loca te heav ily

loaded out put bu f fers near the Gro und pad s. The I/O B lock

output buffers have a slew-rate limited mode (default)

which should be used where output rise and fall times are

not speed-critical.

Pin Descriptions

There are three types of pins in the XC5200-Series

devices:

• Permanently dedicat e d pins

• User I/O pins that can have special functions

• Unrest r icted user-p rogrammable I/O pins.

Befor e and dur ing co nfigurat ion, al l out puts not used fo r the

configuration process are 3-stated and pulled high with a

20 kΩ - 100 kΩ pull-up resistor.

After configuration, if an IOB is unused it is configured as

an inpu t with a 20 kΩ - 100 kΩ pull-up resistor.

Device pins for XC5200-Series devices are described in

Table 9. Pin functions during configuration for each of the

seven configuration modes are summarized in “Pin Func-

TDI

TMS

TCK

TDO1

TDO2

TDO

DRCK

IDLE

SEL1

SEL2

RESET

UPDATE

SHIFT

BSCAN

To User

Logic

IBUF

Optional

From

User Logic

To User

Logic

X9000

Figure 20: Boundary Scan Schematic Example

GND

Ground and

Vcc Ring for

I/O Drivers

Vcc

GND

Vcc

Logic

Power Grid

X5422

Figure 21: XC5200-Series Power Distribution

XC5200 Series Field Programmable Gate Arrays

7-102 November 5, 1998 (Version 5.2)

tion s D ur ing Co nf igu ra ti o n” on p ag e 124, in t he “Conf ig ura -

tion Timing” section.

Table 9: Pin Descriptions

Pin Name

I/O

During

Config.

I/O

After

Config. Pin Description

Permanently Dedicated Pi ns

VCC I I Five or more (de pending on package) connect ions to th e nominal +5 V supply vo ltage .

All must be connected, and each mus t be decoupled with a 0.01 - 0.1 µF capacitor to

Ground.

GND I I Four or more (depending on package type) connections to Grou nd. All must be con-

nected.

CCLK I or O I

During configuration, Configuration Clock (CCLK) is an output in Master modes or Asyn-

chronous Peripheral mode, but is an input in Slave mode, Synchronous Peripheral

mode , and Express mode. After configuration, CCLK has a weak pull-up resistor and

can be selected as the Readback Clock. There is no CCLK High time restriction on

XC52 00-Series devices, except d uring Readback . See “Violating the Ma ximum High

and Low Time Speci ficatio n for the R eadback Cl ock” on pag e 113 for an expla natio n of

this except ion.

DONE I/O O

DONE i s a bid irect ion al si gnal w ith an o pti onal i nter nal pul l-up resi stor. As an ou tput , it

indicates the completion of the configuration process. As a n input, a Low level on

DONE can be configur ed to delay the gl obal logic initialization and the enabling of out-

puts.

The exact timing, the clock source for the Low-to-High transiti on, and the opt ional

pull -up resi stor ar e select ed as opti ons in the program t hat crea tes the co nfigu ration bi t-

stream. The resistor is included by def ault.

PROGRAM II

PROGRAM is an active Low input that forces the FPGA to clear its configuration mem-

ory. I t is us ed t o ini t iat e a co nf igur at i on cy cle . W he n PR OG RAM go es High , the FPGA

executes a comple te clea r cycle, befo re it goe s into a WAIT state and releases INIT.

The PROGRAM pin has an optional weak pull-up after configuration.

User I/O Pins That Can Have Special Functions

RDY/BUSY OI/O

During Peripheral mode configuration, this p in indic ates when it is appropriate to write

another byte of data into the FPGA. The same status is also available on D7 in Asyn-

chronous Peripheral mode, if a read operation is performed when the device is selected.

After configuration, RDY/BUSY is a user -p ro gr a mm a ble I/O pin.

RDY/BUSY is pulled High with a hig h -impedance pull-up prior to INIT going High.

RCLK OI/O

During Master Paral lel configuration, each change on the A0-A17 outputs is preceded

by a rising edge on R CL K , a redundant output signal. RCLK is useful for clocked

PROMs. It is rarely used during configuration. After configuration, RCLK is a user- pro-

grammable I/O pin.

M0, M1, M2 I I/O

As Mode inputs, these pins a r e sampled before the start of configuration to determine

the confi guration mode to be used. After configura tion, M 0, M1, and M2 become us-

er-programmable I/O.

Duri ng confi guratio n, these pins hav e weak pul l-up res istors . For the most po pular con -

fig uration m ode, Slave S erial, t he mode pin s can t hus be left unconnec ted. A pul l-down

resistor value of 3.3 kΩ is rec ommended for other modes.

TDO O O

If bo undary scan i s used, this pi n is the Test D ata Out put. If boundar y scan is not used,

this pin is a 3-state output, after configuration is completed.

This pin can be user output only when called out by special schematic defi nitions. To

use t his p in, place the l ibra ry comp onent TDO i nstead of t he usua l pa d symbo l. An out -

put buffer must still be used.

November 5, 1998 (Version 5.2) 7-103

XC5200 Series Field Programmable Gate Arrays

TDI, TCK,

TMS II/O

or I

(JTAG)

If boundary scan is used, these pins are Test Data In, Test Clock, and Test Mode Select

inpu ts respe ctively. They com e directl y from the pads, by passing t he IOBs. These pins

can also be used as inputs to the CLB lo gic after conf igura tion is completed.

If th e B SCAN symbo l is no t pl a ced in t he de sig n, al l bou nd ar y s ca n fu nct i ons ar e i nhi b -

ited once configuration is completed, and these pins become user-programmable I/O.

In this case, they must be called out by special schematic definitions. To use these pins,

plac e th e li brary c ompon ents TDI, TCK, an d TMS inst ead o f the u sual pa d symbo ls. In-

put or output buffers must still be used.

HDC O I/O High During Configuration (HDC) is driven High until the I/O go active. It is available as

a control output indicating that configuration is not yet completed. After configuration,

HDC is a user-programmable I/O pin.

LDC OI/O

Low During Configuration (LDC) is dri ven Low unti l the I/O go active. It is avai lable as a

control o utput i ndicating that configuration is not yet completed. Aft e r confi guration,

LDC is a user-programmable I/O pin.

INIT I/O I/O

Before an d during configur ation , INIT is a bidirectional signal. A 1 kΩ - 10 kΩ exte rn al

pull-up r esistor is recommended.

As an active-Low open-drain output, INIT is held Low during the power stabilization and

internal clearing of the configuration memory. As an active-Low input, it can be used

to hold the FPGA in the inter nal WAIT state before the start of conf iguration. Master

mode dev ices stay in a WAIT state an ad ditional 50 to 250 µs after INIT has gone High.

Duri ng conf igura tion, a Low on this output indicates that a configuration data error has

occurred. After the I/O go active, INIT i s a user-programmable I/O pin.

GCK1 -

GCK4 Weak

Pull-up I or I/O

Four Global inputs each drive a dedicated internal global net with short delay and min-

imal skew. These i nternal glob al nets can also be dr iven from int ernal logic. If not used

to drive a global net, any of these pi ns is a user-programmable I/O pin.

The G CK1-GCK4 pins p r ovide the shortest path to the four Global Buffers . Any input

pad symbol connected directly to the input of a BUFG symbol is automatically placed on

one of these pins.

CS0, CS1,

WS, RS II/O

These four inputs are used in Asynchronous Peripheral mode. The chip is selected

when CS0 is Low and CS1 is High. While the chip is selected, a Low on Write Strobe

(WS) loads the data present on the D0 - D7 inputs into the internal data buffer. A Low

on Read Strobe (RS) changes D 7 in to a s ta tu s out pu t — H igh i f Read y , L ow i f Bu sy —

and drive s D0 - D 6 Hig h.

In Express mode, CS1 is used a s a serial-enable signal fo r dais y-chaining.

WS and RS shou ld be mutu ally exc lusiv e, but if b oth are Low simult aneousl y, the Wr ite

Strobe overrides. After configuration, these are user-programmable I/ O pins.

A0 - A17 O I/O During Master Parallel configuration, these 18 output pins address the configuration

EPROM. After configuration, they are user-programmable I/O pins .

D0 - D7 I I/O During Master Parallel , Periphe ral, a nd Expres s confi guration , thes e eight i nput pins re-

ceive configurat ion data. After configuration, they are user-programmabl e I/O pins.

DIN I I/O During Slave Serial or Master Serial configuration, DIN is the serial configuration data

input receiving data on the rising edge of CCLK. During Parallel configuration, DIN is

the D0 input. After config uration, DIN i s a user- programmable I/O pin.

DOUT O I/O

During configur ation in any mode but Express mode, DOUT is the serial configuration

data output that c an drive the DIN of dais y-chain ed sl ave FPGAs. DOUT dat a chan ges

on the falling edge of CCLK.

In Express mode, DOUT is the status outpu t that can driv e the CS1 of daisy-chained

FPGA s, to enable and disable downstream devices.

Aft er conf iguration, DOUT is a user-progr ammable I/O pin.

Table 9: Pin Descriptions (Continued)

Pin Name

I/O

During

Config.

I/O

After

Config. Pin Description

XC5200 Series Field Programmable Gate Arrays

7-104 November 5, 1998 (Version 5.2)

Configuration

Confi guration is the process of loading design-specific pro-

gram ming d ata into one or more FPGAs to define the func-

tional operation of the internal blocks and their

interconnections. This is somewhat like loading the com-

mand registers of a programmable peripheral chip.

XC52 00-S er ies dev ic es use s e ve ral hun dr ed b i ts o f c on fig -

uration data per CLB and its associated interconnects.

Each configuration bit defines the state of a static memory

cell that co nt ro ls e i th er a f un ct ion loo k- u p t ab le b i t, a m u lti-

plexer input, or an interconnect pass transistor. The devel-

opment system translates the design into a netlist file. It

automatically partitions, places and routes the logic and

generates the configuration data in PROM format.

Special Purpose Pins

Three configuration mode pins (M2, M1, M0) are sampled

prior to configuration to determine the configuration mode.

After configuration, these pins can be used as auxiliary I/O

connections. The development system does not use these

resources unless they are explicitly specified in the design

entry. This is done by placing a special pad symbol called

MD2, MD 1, or MD0 instead of the input or output pad s ym-

bol.

In XC5200-Series devices, the mode pins have weak

pull-up resistors during configuration. With all three mode

pins Hig h, Sl ave S e rial m ode is se lec te d, whi c h is t he m ost

popular configuration mode. Therefore, for the most com-

mon configuration mode, the mode pins can be left uncon-

nected. (Note, however, that the internal pull-up resistor

valu e can be a s hi gh as 10 0 kΩ.) Aft er co nfi gura tio n, th ese

pins can individually have weak pull-up or pull-down resis-

tors, as specified in the design. A pull-down resistor value

of 3.3kΩ is recommended.

These pins are located in the low er l eft chip corner a nd are

near the readback nets. This location allows convenient

routing if compatibility with the XC2000 and XC3000 family

conventions of M0/RT, M1/RD is desired.

Configurat ion Modes

XC5200 devices have seven configuration modes. These

modes a re se lec ted b y a 3-bi t in put c ode a pplie d to t he M2 ,

M1, and M0 inputs. There are three self-loading Master

mode s, two Pe r iph er a l modes, and a S er ial S lav e mo d e,

Note :*P eri pheral Sync hronous can be considered byte-wide

Slave Parallel

whic h is u se d prim ari l y f o r d ai sy -c ha i ned de vi ce s. T he se v-

enth mode, called Express mode, is an additional slave

mode that allows high-speed parallel configuration. The

coding for mode selection is sh own in Table 10.

Note that the smallest package, VQ64, only supports the

Master Serial, Slave Serial, and Express modes. A detail ed

description of each configuration mode, with timing infor-

matio n, is inclu ded late r in t his da ta shee t. Du ring con figu -

ration, some of the I/O pins are used temporarily for the

configuration process. All pins used during configuration

are sh own in Table 13 on page 124.

Master Modes

The three Master modes use an internal oscillator to gener-

ate a Conf igurat ion Cloc k ( CCLK) f or d riv ing po tent ial sla ve

devices. They also generate address and timing for exter-

nal PROM(s) co ntaining the configuration data.

Master Parallel (Up or Down) modes generate the CCLK

signal and PROM addresses and receive byte parallel

data. The data is internally serialized into the FPGA

data-frame format. The up and down selection generates

starting addresses at either zero or 3FFFF, for compatibility

with different microprocessor addressing conventions. The

Unrestricted User-Programmable I/O Pins

I/O Weak

Pull-up I/O These pins can be configured to be input and/or output after configuration is completed.

Before configuration is completed, these pins have an internal high-value pull-up resi s-

tor (20 kΩ - 100 kΩ) that defines the logic level as High.

Table 9: Pin Descriptions (Continued)

Pin Name

I/O

During

Config.

I/O

After

Config. Pin Description

Table 10: Configuration Modes

Mode M2 M1 M0 CCLK Data

Master Serial 0 0 0 output Bit-Serial

Slave S er ial 1 1 1 input B it-S e r ial

Master

Parallel Up 1 0 0 output Byte-Wide,

increment

from 00 00 0

Master

Parallel Down 1 1 0 output Byte-Wide,

decrement

from 3FFFF

Peripheral

Synchronous* 0 1 1 input Byte-Wide

Peripheral

Asynchronous 1 0 1 output Byte-Wide

Express 0 1 0 input Byte-Wide

Reserved 001 ——

November 5, 1998 (Version 5.2) 7-105

XC5200 Series Field Programmable Gate Arrays

Maste r Se rial mode gener ates CCLK and r eceiv es th e con -

figurati on data in serial f orm fro m a Xilin x serial-co nfigura-

tion PRO M.

CCLK sp eed is s elec table as 1 MHz (d efaul t), 6 MH z, or 12

MHz. Configuration always starts at the default slow fre-

quency, then can switch to the higher frequency during the

first frame. Frequency tolerance is -50% to +50%.

Peripheral Modes

The two Peripheral modes accept byte-wide data from a

bus. A RDY/BUSY status is available as a handshake sig -

nal. In Asynchronous Peripheral mode, the internal oscilla-

tor generates a CCLK burst signal that serializes the

byte- w ide d at a. CCLK ca n al s o dr iv e s lav e de vi ce s. I n t he

synchronous mode, an externally supplied clock input to

CCLK serializes the data.

Slave Serial Mode

In Slave Serial mode, the FPGA receives serial configura-

tion data on the rising edge of CCLK and, after loading its

configuration, passes additional data out, resynchronized

on the next falling edge of CCLK.

Multiple slave devices with identical configurations can be

wired with parallel DIN inputs. In this way, multiple devices

can be configured simultaneously.

Serial Daisy Chain

Multiple devices with different configurations can be con-

nected together in a “daisy chain,” and a single combined

bitstream used to c onfig ure the chain of slave device s.

To configure a daisy chain of devices, wire the CCLK pins

of all devices in parallel, as shown in Figure 28 on page

114. Connect the DOUT of each device to the DIN of the

next. The lead or master FPGA and following slaves each

passes resynchronized configuration data coming from a

single source. The header data, including the length count,

is passed through and is captured by each FPGA when it

recognizes the 0010 preamble. Following the length-count

data, each FPGA outputs a High on DOUT until it has

received its required number of data fram es.

After an FPGA has received its configuration data, it

passes on any additional fram e start bits and configura tion

data on DOUT. When the total number of configuration

clocks applied af ter memory initia lization equals the value

of the 24-bit length count, the FPGAs begin the start-up

sequence and become operational together. FPGA I/O are

norm ally rel eased two CCLK cycl es after the la st confi gura-

tion bit is received. Figure 25 on page 109 shows the

start-up timing for an XC52 00-Ser ies device.

The daisy-chained bitstream is not simply a concatenation

of the individ ual bitstr eam s. The PR OM f ile fo rma tter must

be us ed t o c ombine the bits trea ms for a d ais y-cha ined con-

figuration.

Multi-Family Daisy Chain

All Xilinx FPGAs of the XC2000, XC3000, XC4000, and

XC520 0 Seri es us e a c ompati ble b it stream form at an d ca n,

therefore, be connected in a daisy chain in an arbitrary

sequence. There is, however, one limitation. If the chain

contai n s XC5 200 -Se ri es d ev i ce s, t h e ma st e r n orm all y can-

not be an XC2000 or XC3000 device.

The r eason f or t his r ule i s sh own i n F igur e 25 on p age 10 9.

Since all devices in the chain store the same length count

value and generate or receive one common sequence of

CCLK pulses, they a ll recognize length-count mat ch on the

same CCLK edge, as indicated on the left edge of

Figure 25. The master device then generates additional

CCLK pulses until it reaches its fini sh point F. The different

families generate or require different numbers of additional

CCLK pulses until they reach F. Not r eaching F means that

the device does not really finish its configuration, although

DONE may have gone High, the outputs became active,

and the internal reset was released. For the

XC5200-Series device, not reaching F means that read-

back cannot be initiated and most boundary scan instruc-

tions cannot be used.

The user has some control over the relative timing of these

events and c an, t here fore , make sure that th ey oc cur a t th e

proper t ime and the finish point F is reached. T iming is con-

trolled using opt ions in the bi tstream gener ation software.

XC5200 devices always have the same number of CCLKs

in the power up delay, independent of the configuration

mode, un li ke the XC300 0/X C4000 S eri es dev ice s. To guar-

antee all devices in a daisy chain have finished the

power-up delay, tie the INIT pins together, as shown in

Figure 27.

XC3000 Master with an XC5200-Series Slave

Some designers want to use an XC3000 lead device in

peripheral mode and have the I/O pins of the

XC5200-Series devices all available for user I/O. Figure 22

provides a solution for t hat case.

This solution requires one CLB, one IOB and pin, and an

internal oscillator with a frequency of up to 5 MHz as a

clock source. The XC3000 master device must be config-

ured with late Internal Reset, which is the default option.

One CLB and one IOB in the lead XC3000-family device

are used to gener ate the addit ional CCLK pu lse require d by

the XC5200-Series devices. When the lead device

removes the internal RESET sig nal, the 2-bit shift register

responds to its clock input and generates an active Low

output signal for the duration of the subsequent clock

period. An external connection between this output and

CCLK thus creates the extra CCLK pulse.

XC5200 Series Field Programmable Gate Arrays

7-106 November 5, 1998 (Version 5.2)

Express Mode

Express mode is similar to Slave Serial mode, except the

data is presented in parallel format, and is clocked into the

targe t devi ce a byte at a ti me rath er than a b it at a time. T he

data is loaded in parallel into eight different columns: it is

not internally serialized. Eight bits of configuration data are

loaded with every CCLK cycle, therefore this configuration

mode runs at eight times the data rate of the other six

modes . In this mo de the XC 5200 fa mily is capa ble of su p-

porti ng a CCLK freque ncy of 10 MHz, w hich is equiv alent to

an 80 MHz serial rate, because eight bits of configuration

data are being loaded per C CLK cycle. An XC5210 in the

Express mode, for instance, can be configured in about 2

ms. Th e Ex pr es s mode do es no t su pp ort C RC err or c heck -

ing, but does support constant-field error checking. A

length count is not used in Express mode.

In the Express configuration mode, an external signal

drives the CCLK input(s). The first byte of parallel configu-

ration data must be available at the D inputs of the FPGA

devices a shor t set -u p time be fo re th e se co nd risin g C CL K

edge. Subsequent data bytes are clocked in on each con-

secutive rising CCLK edge. S ee Figure 38 on page 123.

Bitstream generation currently generates a bitstream suffi-

cien t to pro gram in al l confi gurati on modes e xcept Ex press .

Extra CCLK cycles are necessary to complete the configu-

ration, since in this mode data is read at a rate of eight bits

per CCLK cycle instead of one bit per cycle. Normally the

entire start-up sequence requires a number of bits that is

equal to the number of CCLK cycles n eeded. An addi tional

five CCLKs (equivalent to 40 extra bits) will guarantee com-

pletion of configuration, regardless of the start-up options

chosen.

Multiple slave devices with identical configurations can be

wired with parallel D0-D7 inputs. In this way, multiple

devices can be configured simultaneously.

Pseudo Da isy Chain

Multiple devices with different configurations can be con-

nected toget her in a pseu do daisy chai n, provid ed that all of

the devices are in Express mode. A single combined bit-

stream is used to configure the chain of Express mode

devices, but the input data bus must drive D0-D7 of each

devic e. Tie High t he CS1 p in o f the firs t devi ce t o be conf ig-

ured, or lea ve it f loa ting i n the XC5200 sinc e it h as an in ter-

nal pull-up. Connect the DOUT pin of each FPGA to the

CS1 pin of the next device in the chain. The D0-D7 inputs

are wired to each device in parallel. The DONE pins are

wired together, with one or more internal DONE pull-ups

activated. Alternatively, a 4.7 kΩ external resistor can be

used, if desired. (See Figure 37 on page 122.) CCLK pin s

are tied toge ther.

The requirement that all DONE pins in a daisy chain be

wired to ge th er app l i es on l y to E xpr ess mod e, an d o nly if al l

devices in the chain are to become active simultaneously.

All devices in Express mode are synchronized to the DONE

pin. User I/O for each device become active after the

DONE pin for that device goes High. (The exact timing is

determined by options to the bitstream generation soft-

ware.) Since the DONE pin is open-drain and does not

drive a High value, tying the DONE pins of all devices

together prevents all devices in the chain from going High

until the last device in the chain has completed its configu-

ration cycle.

The status pin DOUT is pulled L OW two in ternal-os cillator

cycles (nominally 1 MHz) after INIT is recognized as High,

and rema ins Low un til t he d evice ’ s con fig urati on memo ry is

full. Then DOUT is pulled Hig h to signal th e next device in

the chain to accept the configuration data on the D7-D0

bus. Al l de v ice s re c ei ve and r ecog ni z e t he si x by te s of pre-

amble and length count, irrespective of the level on CS1;

but subsequent frame data is accepted only when CS1 is

High and the device’s configuration memory is not already

full.

Setting CCLK Frequency

For Mast er mod es, CCLK can be gen er at ed in o ne o f th ree

frequencies. In the default slow mode, the frequency is

nominally 1 MHz. In fast CCLK mode, the frequency is

nominally 12 MHz. In medium CCLK mode, the frequency

is nomin al ly 6 MH z. The fr eq uen cy ra ng e is -50 % to + 50%.

The frequency is selected by an option when running the

bits trea m gener ation soft war e. If an XC5 200-Se ries Master

is driving an XC3000- or XC2000-family slave, slow CCLK

mode must be used. Slow mode is the default.

Output

Connected

to CCLK

OE/T

Reset

X5223

etc

Active Low Output

Active High Output

Figure 22: CCLK Generation for XC3000 Master

Driving an XC5200-Series Slave

Table 11: XC5200 Bitstr eam Format

Data Type Val u e Occurrences

Fill Byte 11111111 Once per bit-

stream

Preamble 11110010

Length Count er COUNT(23:0 )

Fill Byte 11111111

November 5, 1998 (Version 5.2) 7-107

XC5200 Series Field Programmable Gate Arrays

Data Stream Format

The data stream (“bitstream”) forma t is identical for all con-

figurat ion modes, with the exception of Exp ress mode . In

Express mode, the device becomes active when DONE

goes High, therefore no l ength count is required. Addition-

all y, CRC error check ing is not suppo rted i n Expr ess mo de.

The data stream formats are shown in Table 11. Express

mode data is shown with D0 at the left and D7 at the right.

For all other modes, bit-seri al data is read from left to right,

and byte-parallel data is effectively assembled from this

serial bitstream, with the first bit in each byte assigned to

D0.

The configuration data stream begins with a string of eight

ones, a preamble code, followed by a 24-bit length count

and a separator field of ones (or 24 fill bits, in Express

mode). This header is followed by the actual configuration

data in frames. The length and number of frames depends

on the devic e ty pe (see Table 12). Ea ch fr ame b egins with

a start field and ends with an error check. In all modes

except Express mode, a postamble code is required to sig-

nal the end of data for a single device. In all cases, addi-

tional start-up bytes of data are required to provide four

cloc ks fo r the startup seq uence at the end of configuration.

Long daisy chains require additional startup bytes to shift

the last data through the chain. All startup bytes are

don’t-cares; these bytes are not included in bitstreams cre-

ated by the Xilinx software.

In Express mode, only non-CRC error checking is sup-

porte d. I n all o th er modes , a se lec t ion of C RC o r non-C R C

error checki ng is allowe d by the bit stream gener ation so ft-

ware. The non-CRC error checking tests for a designated

end-of -fr ame f ield for e ach fram e. For CR C err or c hecki ng,

the software calculates a running CRC and inserts a unique

four-bit partial check at the end of each frame. The 11-bit

CRC check of the last frame of an FPGA includes the last

seven data bits.

Detec tion of a n err or r esul ts in th e sus pensi on of dat a load -

ing and the pulling down of the INIT pin. In Master modes,

CCLK and address signals continue to operate externally.

The user must de tect IN IT and initialize a new configuration

by puls ing the PROGRAM pin Low or cycling Vcc.

Cyclic Redundancy Check (CRC) for

Configura tion an d Read back

The Cyclic Redundancy Check is a method of error detec-

tion in data transmission applications. Generally, the trans-

mitting system performs a calculation on the serial

bitstream. The result of this calculation is tagged onto the

data stream as additional check bits. The receiving system

perfor ms an id entic al ca lcu lati on on the bits tre am and com-

pares the result with the received checksum.

Each data frame of the configuration bitstream has four

error bits at the end, as shown in Table 11. If a frame data

error is detected during the loading of the FPGA, the con-

figuration process with a potentially corrupted bitstream is

termi nated . The FPG A pull s the I NIT pin L ow and goe s int o

a Wait state.

Durin g Readba ck, 11 bits of t he 16-bi t chec ksum are ad ded

to the end of the Readback data stream. The checksum is

computed using the CRC-16 CCITT polynomial, as shown

in Figure 23. The c hecks um consists of the 11 most signifi-

cant bi ts o f the 16-b it code. A c hange in the c hecksu m indi-

cates a change in the Readback bitstream. A comparison

to a pre vious che cksum is mean ingful on ly if the rea dback

data is independent of the current device state. CLB out-

puts should not be included (Read Capture option not

used). Stat isti call y, one error o ut of 2048 migh t go un detec-

ted.

Start Byte 11111110 Once per data

frame

Dat a F r ame * DATA (N-1 :0)

Cyclic Redundancy Check or

Constan t Fiel d Check CRC(3:0) or

0110

Fill Nibble 1111

Extend Write Cycle FFFFFF

Postamble 11111110 Once per de-

vice

Fill Bytes (30) FFFF…FF

Start-Up Byte FF Once per bit-

stream

*Bits per Frame (N) depends on device si ze, as desc ri bed for

table 11.

Tabl e 11: X C5200 Bit st r ea m Fo r m at

Data Type Value Occurrences

Table 12 : Internal Configuration Data S tructure

Device VersaBlock

Array

PROM

Size

(bits)

Xilinx

Serial PROM

Needed

XC52028 x 842,416XC1765E

XC520410 x 1270,704XC17128E

XC520614 x 14106,288XC17128E

XC521018 x 18165,488XC17256E

XC521522 x 22237,744XC17256E

Bits per Frame = (34 x num ber of Rows) + 28 for th e top + 28 for

the bottom + 4 splitter bits + 8 start bits + 4 error check bits + 4 fill

bits * + 24 extended write bits

= (34 x number of Ro ws) + 100

* In the XC5202 (8 x 8), there are 8 fill bits per f rame, not 4

Number of Frames = (12 x num ber of Column s) + 7 for the left

edge + 8 for the right edge + 1 splitter bit

= (12 x number of Co lu mn s) + 16

Program Data = (B i ts per Fram e x Number of Fram es) + 48

header bits + 8 postamble bits + 240 fill bits + 8 start-up bits

= (Bits per Frame x Number of Frames) + 304

PROM Size = Program Data

XC5200 Series Field Programmable Gate Arrays

7-108 November 5, 1998 (Version 5.2)

Configuration Sequen ce

There ar e f ou r majo r s t eps i n t he XC5200 -S er ies po wer- up

configuration sequence.

• Power-On Time-Out

• Initialization

• Configuration

• Start-Up

The full process is illustrated in Figure 24.

Power-On Time-Out

An internal power-on reset circuit is triggered when power

is ap pli ed . Wh en VCC reaches the voltage at which portions

of the FPGA begin to operate (i.e., performs a

write-and-read test of a sample pair of configuration mem-

ory bits), the programmable I/O buffers are 3-stated with

active high-impedance pull-up resistors. A time-out delay

— nom inally 4 ms — is initia ted to allow the p ower-supply

voltage to stabilize. For correct operation the power supply

must reach VCC(min) by the end of the time-out, and must

not dip below it thereafter.

There is no distinction between master and slave modes

with regard to the time-out delay. Instead, the INIT line is

used to ensure that all daisy-chained devices have com-

plet ed in itia liz ation. Sinc e XC20 00 devi ces do n ot ha ve th is

signal, extra care must be taken to guarantee proper oper-

ation when daisy-chaining them with XC5200 devices. For

proper operation with XC3000 devices, the RESET signal,

which is used in XC3000 to delay configuration, should be

connected to INIT.

If the time -out d elay is ins ufficient, configu rat ion s hould b e

delayed by holding the INIT pin Low until the power supply

has reac he d op e ra tin g leve ls.

This delay is applied only on power-up. It is not applied

when reconfiguring an FPGA by pulsing the PROGRAM

pin Lo w. During all three ph ases — Powe r-on, Init iali zati on,

and Configuration — DONE is held Low; HDC, LDC, and

INIT are active; DOUT is driven; and all I/O buffers are dis-

abled.

Initialization

This phase clears the configuration memory and estab-

lishes the configuration mode.

The configuration memory is cleared at the rate of one

frame per internal clock cycle (nominally 1 MHz). An

open-drain bidirectional signal, INIT, is released when the

configuration memory is completely cleared. The device

then te sts for the abse nce of an extern al active -low lev el on

INIT. The mode li nes are sampled two internal clock cycles

later (nominally 2 µs).

The master device waits an additional 32 µs to 256 µs

(nominally 64-128 µs) to provid e adequ ate t ime for all of th e

slav e devices to r ecognize th e release of IN IT as well. Then

the ma ster device enters the Configuration phase.

2345678910111213 141

X15 X16

SERIAL DATA IN

10 151413121110 9 8 7 651111

CRC – CHECKSUM

LAST DATA FRAME

START BIT

X1789

Polynomial: X16 + X15 + X2 + 1

Readback Data Stream

Figure 23: Circuit for Generating CRC-16

Figure 24: Confi guration Sequence

INIT

High? if

Master

Sample

Mode Lines

Load One

Configuration

Data Frame

Frame

Error

Pass

Configuration

Data to DOUT

VCC

Yes

Operational

Start-Up

Sequence

Yes

~1.3 µs per Frame

Master CCLK

Goes Active after

50 to 250 µs

Pull INIT Low

and Stop

X9017

EXTEST*

SAMPLE/PRELOAD*

BYPASS

CONFIGURE*

(*only when PROGRAM = High)

SAMPLE/PRELOAD

BYPASS

EXTEST

SAMPLE PRELOAD

BYPASS

USER 1

USER 2

CONFIGURE

READBACK

If Boundary Scan

is Selected

Config-

uration

memory

Full

CCLK

Count Equals

Length

Count

Completely Clear

Configuration

Memory

LDC Output = L, HDC Output = H

Boundary Scan

Instructions

Available:

I/O Active

Generate

One Time-Out Pulse

of 4 ms PROGRAM

= Low

Yes

November 5, 1998 (Version 5.2) 7-109

XC5200 Series Field Programmable Gate Arrays

XC4000E/EX

XC5200/

UCLK_SYNC

XC4000E/EX

XC5200/

UCLK_NOSYNC

XC4000E/EX

XC5200/

CCLK_SYNC

XC4000E/EX

XC5200/

CCLK_NOSYNC

XC3000

XC2000

CCLK

GSR Active

UCLK Period

DONE IN

Di Di+1 Di+2

U2 U3 U4

U2 U3 U4C1

Synchronization

Uncertainty

Di Di+1

DONE

I/O

GSR Active

DONE

I/O

GSR Active

DONE

C1 C2

C1 U2

C3 C4

C2 C3 C4

I/O

GSR Active

DONE

I/O

DONE

Global Reset

I/O

DONE

Global Reset

I/O

F = Finished, no more

configuration clocks needed

Daisy-chain lead device

must have latest F

Heavy lines describe

default timing

CCLK Period

Length Count Match

X6700

C1, C2 or C3

Figure 25: Start-up Timing

XC5200 Series Field Programmable Gate Arrays

7-110 November 5, 1998 (Version 5.2)

Configuration

The l ength cou nter b egins c ounting immediat ely upo n entr y

into the configuration state. In slave-mode operation it is

important to wait at least two cycles of the internal 1-MHz

clock oscillator after INIT is recognized before toggling

CCLK and feeding the serial bitstream. Configuration will

not begin until the internal configuration logic reset is

released, which happens two cycles after INIT goes High.

A master device’s configuration is delayed from 32 to 256

µs to ens ure proper o peration with an y slave de vices dri ven

by the master device.

The 0010 preamble code, included for all modes except

Express mode, indicates that the following 24 bits repre-

sent t he len gt h c ount . Th e le ngt h c ou nt i s the t ot al numbe r

of co nf i gu ra tio n c l ock s ne ed ed to l o ad t he compl e te c on fig -

uration data. (Four additional configuration clocks are

required to complete the configuration process, as dis-

cussed below.) After the preamble and the length count

have be en pas sed t hrou gh to all de vices in t he dais y ch ain,

DOUT is held High to prevent frame start bits from reaching

any daisy-chained devices. In Express mode, the length

count bits are ignored, and DOUT is held Low, to disable

the ne xt device in the pseudo dai sy chain.

A spe cifi c conf igu ratio n bi t, ea rly i n th e firs t fr ame of a mas-

ter device, controls the configuration-clock rate and can

increase it by a factor of eight. Therefore, if a fast configu-

ration clock is selected by the bitstream, the slower clock

rate is used until this configuration bit is detect ed.

Each frame has a start field followed by the frame-configu-

rati on da ta b its a nd a frame err or f ield. If a f rame data erro r

is detected, the FPGA halts loading, and signals the error

by pullin g the open -drain INIT pin Low. After all configura-

tion frames have been loaded into an FPGA, DOUT again

follows the input data so that the remaining data is passed

on to the next device. In Express mode, when the first

device is fully programmed, DOUT goes High to enable the

next device in the chai n.

Delaying Configuration After Power-Up

To delay master mode configuration after power-up, pull

the bidirectional INIT pin Low, using an open-collector

(open-drain) driv er. (See Figure 12.)

Using an open-collector or open-drain driver to hold INIT

Low before the beginning of master mode configuration

causes the FPGA to wait after completing the configuration

memory clear operation. When INIT is no longer he ld L ow

externally, the device determine s its configuration mode by

captu ri n g its mod e pins , and is rea dy to st ar t t he conf i g ura -

tion proces s. A maste r device waits up to an addi tional 250

µs to make sure that any slaves in the optional daisy chain

have seen that INIT is High.

Start-Up

Start-up is the transition from the configuration process to

the intended user operation. This transition involves a

change from one clock source to another, and a change

from interfacing parallel or serial configuration data where

most ou tputs are 3-sta ted, t o normal operati on with I/O pi ns

active in the user-system. Start-up must make sure that

the user-logic ‘wakes up’ gracefully, that the outputs

become ac t ive w i tho ut c au sin g c onten t io n wi th t he c o nf igu-

ration signals, and that the internal flip-flops are released

from the global Reset at the right time.

Figure 25 describes start-up timing for the three Xilinx fam-

ilies in detail. Express mode configuration always uses

either CCLK_S YNC or UCLK_SYNC timing, the other con-

figur ati on mod es can use a ny of t he f our t iming sequ ences.

To acce ss the i nterna l start- up signal s, place the STARTUP

library symbol.

Start-up Timing

Different F PGA fa milie s ha ve different star t-u p seque nc es .

The XC2 000 fami ly g oes t hrou gh a fi xed seque nce. D ONE

goes H igh and the i ntern al g lobal Reset is de -act ivat ed on e

CCLK period after the I/O become active.

The XC3 000A family offers som e flexibility. DONE can be

programmed to go High one CCLK period before or after

the I/O beco me active. Independent of DONE, the internal

global Reset is de-activated one CCLK period before or

after the I/O become active.

The XC4000/XC5200 Series offers additional flexibility.

The three ev ents — DO NE going High, the internal Re set

being de-activa ted, and the user I/O going active — can all

occur in any arbitrary sequence. Each of them can occur

one CCLK pe ri o d befo re or af t er, or simultan eou s w it h, any

of the others. This relative timing is selected by means of

software options in the bi tstream generati on software.

The default option, and the most practical one, is for DONE

to go Hig h first, di sconnecti ng the conf iguratio n data s ource

and avoiding any contention when the I/Os become active

one cl ock l ater. Re set i s then rel eased an othe r cloc k pe riod

later to make sure that user-operation starts from stable

internal conditions. This is the most common sequence,

shown with heavy lines in Figure 25, but the designer can

modify it to meet particular requirements.

Normal ly, the start -up se quence is cont rolled by the intern al

device oscillator output (CCLK), which is as ynchronous to

the system clock.

XC4000/XC5200 Series offers another start-up clocking

option, UCLK_NOSYNC. The three events described

above ne ed not be trigger ed by CCLK. They can , as a con-

figuration opti on, be triggered by a user clock. This means

that the device can wake up in synchronism with the user

system .

November 5, 1998 (Version 5.2) 7-111

XC5200 Series Field Programmable Gate Arrays

When the UCLK_SYNC option is enabled, the user can

externally hold the open-dr ain DONE output Low, and thus

stall all further progress in the start-up sequence until

DONE is r eleased and h as go ne Hig h. This op tion ca n be

used to forc e synchr onizatio n of se veral FP GAs to a c om-

mon user clock, or to guarantee that all devices are suc-

cessfully configured before any I/Os go active.

If either of these two options is selected, and no user clock

is sp ecifi ed in t he des ign or att ached to the dev ice, the c hip

coul d r each a po i nt w her e t he conf i gura ti o n o f th e de v ice is

complete and the Done pin is asserted, but the outputs do

not become active. The solution is either to recreate the

bitstream specifying the start-up clock as CCLK, or to sup-

ply the appropriate user clock.

Start-up Sequence

The Start-up sequence begins when the configuration

memor y i s ful l , and t he to ta l nu mbe r o f co nf igu ra ti o n cl oc ks

received since INIT went High equals the loaded value of

the lengt h co un t.

The next rising clock edge sets a flip-flop Q0, shown in

Figure 26. Q0 is the leading bit of a 5-bit shift register. The

outputs of th is register can be programmed to control three

events.

• The release of the open-drain DONE output

• The chan ge of configuration-rel ated pins to the user

function, activating all IOBs.

• The ter m ination of the global Set/Reset initialization of

all CLB and IOB storage elements.

The DONE pin can als o be w ire- AN Ded wi th D ONE pins of

other FPGAs or with other external signals, and can then

be used as input to bit Q3 of the start-up register. This is

called “Start-up Timing Synchronous to Done In” and is

selecte d by either CCL K_SYNC or UCLK_SYN C.

When D ONE is not u sed as an i nput, t he opera tion is called

“Start-up Timing Not Synchronous to DONE In,” and is

selecte d by either CCL K_NO SYNC or UCLK_NOSYN C.

As a configuration option, the start-up control register

beyond Q0 can be clocked either by subsequent CCLK

pulses or from an on-chip user net called STARTUP.CLK.

These signals can be accessed by placing the STARTUP

library symb ol.

Start-up from CCLK

If CCLK is used to drive the start-up, Q0 through Q3 pro-

vide the timing. Heavy lines in Figure 25 show the default

timing, which is compatible with XC2000 and XC3000

devices using early DONE and late Reset. The thin lines

indicate all other possible timing options.

Start -up from a User Clock (STARTU P.CLK)

When, instead of CCLK, a user-supplied start-up clock is

sele ct ed , Q1 i s used to br i dg e t he un know n pha se r elat i on -

ship between CCLK and the user clock. This arbitration

causes an unavoidable one-cycle uncertainty in the timing

of the rest of the start-up sequence.

DONE Goes High to Signal End of Configuration

In all configuration modes except Express mode,

XC5200-Series devices read the expected length count

from the bitstream and store it in an internal register. The

lengt h cou nt var ies accord ing to t he num ber of d evi ces an d

the composition of the daisy chain. Each device also

counts the number of CCLKs dur ing con figur ation .

Two conditions have to be met in order for the DONE pin to

go high:

• the chi p's internal memory must be full, and

• the configuration length count must be met,

exactly

This is important because the counter that determines

when the length count is met begins with the very first

CCLK, not the first one after the preamble.

Therefore, if a stray bit is inserted before the preamble, or

the data source is not ready at the time of the first CCLK,

the internal counter that holds the number of CCLKs will be

one ahead of the actual number of data bits read. At the

end o f configuratio n, the config uration mem ory will be full,

but the number of bits in the internal counter will not match

the expected length coun t.

As a con sequence, a Master mode device will con tinue to

send out CCLKs until the internal counter turns over to

zero, and then reaches the correct length count a second

time. This will tak e several seco nds [224 ∗ CC LK period]

— whic h is some times inte rprete d as the devic e not c onfig-

uring at all.

If it is not possible to have the data ready at the time of the

first CCLK, the problem can be avoided by increasing the

number in the length count by t he appropriate value.

In Ex pr es s m od e , th er e is no le ng th co un t. T h e DONE pin

for e ach devic e goes Hig h when th e device h as recei ved its

quota of configuration data. Wiring the DONE pins of sev-

eral devices together delays start-up of all devices until all

are fully configured.

Note that DONE is an open-drain output and does not go

High unless an internal pull-up is activated or an external

pull-up is attached. The internal pull-up is activated as the

default by the bitstream generation software.

Release of User I/O After DONE Goes High

By de fa ult , th e us er I/O a re re le as ed on e CCL K cy cle af te r

the DONE pin goes High. If CCLK is not clocked after

DONE goes High, the outputs remain in their initial state —

3-stated, with a 20 kΩ - 100 kΩ pull-up. The delay from

XC5200 Series Field Programmable Gate Arrays

7-112 November 5, 1998 (Version 5.2)

DONE High to active user I/O is controlled by an option to

the bitstream generation software.

Release of Global Reset After DONE Goes High

By de fault , Gl obal R ese t (GR) i s r eleas ed tw o CCLK c ycle s

after the D ONE pin go es High . If CC LK is not clock ed twic e

after DONE g oes High, all flip-flops are held in their initial

reset state. The delay from DONE High to GR inactive is

controlled by an option to the bitstream generation soft-

ware.

Configuration Complete After DONE Goes High

Three full CCLK cycles are required after the DONE pin

goes H igh, as sh own in Figure 25 on page 109. If CCLK is

not clocked three times after DONE goes High, readback

cannot be initiated and most boundary scan instructions

cannot be used.

Configuration Th ro ugh the Boun dary Scan

Pins

XC5200-Series devices can be configured through the

boundary scan pins.

For deta ile d in for m at ion , r efer to th e Xilin x a pplica tio n n ote

XAPP017, “

Boundary Scan in XC4000 and XC5200

Devices

.”

Readback

The user can read back the content of configuration mem-

ory and the level of certain internal nodes without interfer-

ing with the normal operation of the device.

Readback not only reports the downloaded configuration

bits, but can also include the present state of the device,

represented by the content of all flip-flops and latches in

CLBs.

DONE

GR ENABLE

GR INVERT

STARTUP.GR

STARTUP.GTS

GTS INVERT

GTS ENABLE

CONTROLLED BY STARTUP SYMBOL

IN THE USER SCHEMATIC (SEE

LIBRARIES GUIDE)

GLOBAL RESET OF

ALL CLB FLIP-FLOPS/LATCHES

IOBs OPERATIONAL PER CONFIGURATION

GLOBAL 3-STATE OF ALL IOBs

Q3 Q1/Q4

DONE

STARTUP

Q0 Q1 Q2 Q3 Q4

" FINISHED "

ENABLES BOUNDARY

SCAN, READBACK AND

CONTROLS THE OSCILLATOR

FULL

LENGTH COUNT

CLEAR MEMORY

CCLK

STARTUP.CLK

USER NET

CONFIGURATION BIT OPTIONS SELECTED BY USER X9002

Figure 26: Start-up Logic

November 5, 1998 (Version 5.2) 7-113

XC5200 Series Field Programmable Gate Arrays

Note that in XC5200-Series devices, configuration data is

not

inverted with respect to configuration as it is in XC2000

and XC3000 families.

Readb ack of E xpress mod e bitstr eams re sults in data that

does not resemble the original bitstream, because the bit-

stream for m at differ s fro m othe r mod es .

XC5200-Series Readback does not use any dedicated

pins, but uses four internal nets (RDBK.TRIG,

RDBK.DATA, RDBK.RIP and RDBK.CLK) that can be

routed to any IOB. To access the internal Readback sig-

nals, place the READBACK library symbol and attach the

appro pr iat e pa d sym b ols , as sh own in Figure 27.

After Readback has been initiated by a Low-to-High transi-

tion on RDBK.TRIG, the RDBK.RIP (Read In Progress)

output goes High on the next rising edge of RDBK.CLK.

Subsequent rising edges of this clock shift out Readback

data on the RDBK.DATA net.

Readback data does not include the preamble, but starts

with five dummy bits (all High) followed by the Start bit

(Low) of the first frame. The first two data bits of the first

frame are always High.

Each f ra m e e n ds with fo ur er ro r che ck bits. Th ey are r ea d

back as High . The last seven bits of the last frame are also

read back as High. An additional Start bit (Low) and an

11-bit Cyclic Redundancy Check (CRC) signature follow,

before RDBK.RIP returns Low.

Readback Op tion s

Readback options are: Read Capture, Read Abort, and

Clock Select. They are set with the bitstream generation

software.

Read Capture

When the Read Capture option is selected, the readback

data stream includes sampled values of CLB and IOB sig-

nals. The rising edge of RDBK.TRIG latches the inverted

valu es of th e CLB o utputs a nd the IOB outp ut and input sig-

nals. Note that while the bits describing configuration

(int erco nnec t and func ti on gene rators ) are

not

inve rted, t he

CLB an d IOB output signals

are

inverte d.

When th e Read Captur e option is not sele cted, th e values

of the capture bits reflect the configuration data originally

written to those memory locations.

The readback signals are located in the lower-left corner of

the de vice.

Read Abort

When the Read Abort option is selected, a High-to-Low

transition on RDBK.TRIG terminates the readback opera-

tion and prepares the logic to accept another trigger.

After an aborted readback, additional clocks (up to one

readbac k c lock per co nfi gura tion f rame ) may be r equir ed t o

re-in itial ize the cont rol logic . The status of rea dback is indi -

cated by the output control net RDBK.RIP. RDBK.RIP is

High whenever a readback is in progress.

Clock Select

CCLK is the default clock. However, the user can insert

another clock on RDBK.CLK. Readback control and data

are clocked on rising edges of RDBK.CLK. If readback

must be in hibite d for secu rity reasons, th e readb ack contr ol

nets are simply not connected.

Violating the Maximum High and Low Time

Specification for the Readba ck Clock

The readback clock has a maximum High and Low time

specification. In some cases, this s pecification c annot be

met. For example, if a processor is controlling readback,

an inte rrupt may force it to stop in th e middle of a readbac k.

This necessitates stopping the clock, and thus violating the

specification.

The sp ecification is mandator y only on clocking da ta at the

end of a frame prior to the next start bit. The transfer mech-

anism will load the data to a shift register during the last six

clock cycles of the frame, prior to the start bit of the follow-

ing frame. This loading process is dynamic, and is the

sourc e of th e ma xim u m High an d Low time re qu ir em e nt s.

Therefore, the specification only applies to the six clock

cycles prior to and including any start bit, including the

clocks before the first start bit in the readback data stream.

At othe r ti mes , the fra me da ta is al re ady i n th e re gis te r an d

the register is not dynamic. Thus, it can be shifted out just

like a regular shif t register.

The us er must p recisely calcu late the lo cation of the read-

back data relative to the frame. The system must keep

track of the position within a data frame, and disable inter-

rupts before frame boundar ies. Fr ame le ngths an d data for-

mats ar e liste d in Table 11 and Table 12.

Readback with the XChe cker Cable

The XChecker Universal Download/Readback Cable and

Logic Probe uses the readback feature for bitstream verifi-

cation. It can also display selected internal signals on the

PC or workstation screen, functioning as a low-cost in-cir-

cuit emu l at or.

READBACK

DATA

RIP

TRIG

CLK READ_DATA

OBUF MD1

MD0 READ_TRIGGER

IBUF

X1786

IF UNCONNECTED,

DEFAULT IS CCLK

Figure 27: Readback S chematic Example

XC5200 Series Field Programmable Gate Arrays

7-114 November 5, 1998 (Version 5.2)

Configuration Timing

The seven configuration modes are discussed in detail in

this section. Timing specifications are included.

Slave Serial Mode

In Slave Serial mode, an external signal drives the CCLK

input of th e FPGA. The s er i al co nf i gu ra tio n bit s tr eam mus t

be available at the DIN input of the lead FPGA a short

setup time before each rising CCLK edge.

The lead FPGA then presents the preamble data—and all

data that overflows the lead de vice—on its DOUT pin.

There is an internal delay of 0.5 CCLK periods, which

mean s th at D OUT ch an g es o n th e fa llin g CCLK e dg e, a nd

the next FPGA in the daisy chain accepts data on the sub-

sequent rising CCLK edge.

Figure 28 shows a full master/slave system. An

XC5200-Series device in Slave Serial mode should be con-

necte d as sh ow n in the thir d de vice fro m the lef t.

Slave S erial mode is sel ected b y a <111> on the mo de pins

(M2, M1, M0). Slave Ser ial is the defau lt mode if the mod e

pins ar e l eft unc on ne ct ed , a s they ha ve weak pul l- up r es i s-

tors during configuration.

Note: Configuration must be delayed until the INIT pins of all dai sy -chained FPGAs are Hi gh.

Figure 29: Slave Serial Mode Programming Switching Characte ristics

XC5200

MASTER

SERIAL

Spartan,

XC4000E/EX,

XC5200

SLAVE

XC3100A

SLAVE

XC1700E

PROGRAM

NOTE:

M2, M1, M0 can be shorted

to Ground if not used as I/O

NOTE:

M2, M1, M0 can be shorted

to VCC if not used as I/O

M0 M1

DOUT

CCLK CLK

VCC

+5 V

DATA

CE CEO

VPP

RESET/OE DONE

DIN

LDC

INIT INIT

DONE

PROGRAM PROGRAM D/P INIT

RESET

CCLK

DIN

CCLK

DINDOUT DOUT

M0 M1 M1 PWRDN

(Low Reset Option Used)

4.7 KΩ

3.3 KΩ

3.3 KΩ3.3 KΩ

3.3 KΩ

VCC

X9003_01

N/C

Figure 28: Master/Slave Serial Mode Circuit Diagram

4TCCH

Bit n Bit n + 1

Bit nBit n - 1

3TCCO

5TCCL

2TCCD

1TDCC

DIN

CCLK

DOUT

(Output)

X5379

Description Symbol Min Max Units

CCLK

DIN setup 1 TDCC 20 ns

DIN hold 2 TCCD 0ns

DIN to DOUT 3 TCCO 30 ns

High time 4 TCCH 45 ns

Low time 5 TCCL 45 ns

Frequency FCC 10 MHz

November 5, 1998 (Version 5.2) 7-115

XC5200 Series Field Programmable Gate Arrays

Master Serial Mode

In Master Serial mode, the CCLK output of the lead FPGA

drives a Xilinx Serial PROM that feeds the FPGA DIN input.

Each rising edge of the CCLK output increments the Serial

PROM int ernal address coun ter. The next data bit is put on

the SPR OM dat a output, co nnected t o the FP GA DIN pin.

The lead FPGA accepts this data on the subsequent rising

CCLK edge.

The lead FPGA then presents the preamble data—and all

data that overflows the lead device—on its DOUT pin.

There is an internal pipeline delay of 1.5 CCLK periods,

which means that DOUT changes on the falling CCLK

edge, and the next FPGA in the daisy chain accepts data

on the subsequent rising CCLK edge.

In the bitstream generation software, the user can specify

Fast ConfigRate, which, starting several bits into the first

fra me, inc reas es th e CCLK fr eque ncy by a f acto r of twe lve .

The val ue incr eases fr om a nomi nal 1 MH z, to a nominal 12

MHz. Be sure that the serial PROM and slaves are fast

enough to support this data rate. The Medium ConfigRate

option changes the frequency to a nominal 6 MHz.

XC2000, XC3000/A, and XC3100A devices do not support

the Fast or Medium ConfigRate options.

The SPROM CE input can be driven from either LDC or

DONE . Us ing LDC avoids potential contention on the DIN

pin, if this pin is configured as user-I/O, but LDC is then

restricted to be a permanently High user output after con-

figuration. Using DONE can also avoid contention on DIN,

provided th e DONE bef ore I/O enable option is invoked.

Figure 28 on page 114 shows a full master/slave system.

The leftmost device is in Master Serial mode.

Master Serial mode is selected by a <000> on the mode

pins (M2, M1, M0).

Notes: 1. At power-up, V cc mus t rise from 2.0 V to Vcc m i n in les s th an 25 m s, otherwise delay configur ati on by pulling P ROGRAM

Low until Vcc is valid.

2. Master Serial mode timing is based on testing in slave mode.

Figure 30: Master Serial Mode Programming Switching Ch aracteristics

In the two Master Parallel modes, the lead FPGA directly

addresses an industry-standard byte-wide EPROM, and

accepts eight data bits just before incrementing or decre-

menting the address outputs.

The eight data bits are serialized in the lead FPGA, which

then presents the preamble data—and all data that over-

flows the le ad de vic e— on its DOUT pin . Th er e is an in te r-

nal delay of 1.5 CCLK periods, after the rising CCLK edge

that accepts a byte of data (and also changes the EPROM

address) until the falling CCLK edge that makes the LSB

(D0) of this byte appear at DOUT. This means that DOUT

changes on the falling CCLK edge, and the next FPGA in

the daisy chain accepts data on the subsequent rising

CCLK edge.

The PROM address pins can be incremented or decre-

mented, depending on the mode pin settings. This option

allows th e FP GA to sh ar e th e P R OM with a wid e va rie ty of

microprocessors and microcontrollers. Some processors

must boot fro m the bottom of memory (all zeros) while oth-

ers must boot from the top. The FPGA is flexible and can

load i ts confi gurat ion bi ts trea m from ei the r end of t he mem-

ory.

Master Parallel Up mode is selected by a <100> on the

mode pins (M2, M1, M0). The EPROM addresses start at

00000 and increment.

Maste r Parallel Down mode is selecte d by a <110 > on the

mode pins. The EPROM addresses start at 3FFFF and

decrement.

Serial Data In

CCLK

(Output)

Serial DOUT

(Output)

1TDSCK

2TCKDS

n n + 1 n + 2

n – 3 n – 2 n – 1 n

X3223

Description Symbol Min Max Units

CCLK DIN setup 1 TDSCK 20 ns

DIN hold 2 TCKDS 0ns

XC5200 Series Field Programmable Gate Arrays

7-116 November 5, 1998 (Version 5.2)

M0 M1

DOUT

VCC

PROGRAM

CCLK

DIN

M0 M1 M2

DOUT

PROGRAM

EPROM

(8K x 8)

(OR LARGER)

A10

A11

A12

DONE

N/C

XC5200/

XC4000E/EX/

Spartan

SLAVE

DATA BUS

CCLK

A15

A14

A13

A12

A11

A10

INIT

. . .

. . . USER CONTROL OF HIGHER

ORDER PROM ADDRESS BITS

CAN BE USED TO SELECT BETWEEN

ALTERNATIVE CONFIGURATIONS

DONE

TO DIN OF OPTIONAL

DAISY-CHAINED FPGAS

A16 . . .

A17 . . .

HIGH

LOW

X9004_01

TO CCLK OF OPTIONAL

DAISY-CHAINED FPGAS

3.3 K

4.7K

NOTE:M0 can be shorted

to Ground if not used

as I/O. XC5200

Master

Parallel

Figure 31: Master Parallel Mode Circuit Diagram

November 5, 1998 (Version 5.2) 7-117

XC5200 Series Field Programmable Gate Arrays

Note: 1. At power-up, VCC must rise from 2.0 V to VCC min in less then 25 ms, otherwise delay configur ation by pulling P ROGRAM

Low until VCC is Valid.

2. The first Data byte is loade d and CCLK starts at the end of the firs t RCLK active cycle (ris i ng edge).

This timing diagram shows th at the EPROM requirements are extremely relaxed. EPROM access time can be longer than

500 ns. EPROM data outpu t has no hold-time requirements.

Figure 32: Master Parallel Mode Programming Switching Characteristics

Address for Byte n

Byte

2TDRC

Address for Byte n + 1

D7D6

A0-A17

(output)

D0-D7

RCLK

(output)

CCLK

(output)

DOUT

(output)

1TRAC

7 CCLKs CCLK

3TRCD

te n - 1 X6078

Description Symbol Min Max Units

CCLK Delay to Add ress valid 1 TRAC 0 200 ns

Data setup time 2 TDRC 60 ns

Data hold time 3 TRCD 0ns

XC5200 Series Field Programmable Gate Arrays

7-118 November 5, 1998 (Version 5.2)

Synchronous Peripheral Mode

Synchronous Peripheral mode can also be considered

Slave Parallel mode. An external signal drives the CCLK

input (s) of th e FPGA (s). The f irst byte o f par alle l conf ig ura-

tion data must be available at the Data inputs of the lead

FPGA a short setup time before the rising CCLK edge.

Subsequent data bytes are clocked in on every eigh th con-

secutive rising CCLK edge.

The same CCLK edge that accepts data, also causes the

RDY/BUSY output to go High for one CCLK period. The pin

name is a mis no m er. In Synchron ou s P e riph er al m od e it is

really an ACKNOWLEDGE signal. Synchronous operation

does n ot re quir e t his r es pon se, but it i s a me an i ngful s ig nal

for test purposes. Note that RDY/BUSY is pulled High with

a high-impedance pul lup prior to INIT goi ng High.

The lead FPGA serializes the data and presents the pre-

amble data (and all d a ta that overflows the lead device) on

its DOUT pin . Th er e is an int erna l d elay o f 1 .5 CCL K per i-

ods, which means that DOUT changes on the falling CCLK

edge, and the next FPGA in the daisy chain accepts data

on the subsequent rising CCLK edge.

In order to complete the serial s h ift operation, 10 additional

CCLK rising edges are required after the last data byte has

been loaded, plus one more CCLK cycle for each

daisy-chained device.

Synchronous Peripheral mode is selected by a <011> on

the mode pins (M2, M1, M0).

X9005

CONTROL

SIGNALS

DATA BUS

PROGRAM

DOUT

M0 M1 M2

0-7

INIT DONE

PROGRAM

4.7 kΩ

3.3 kΩ

RDY/BUSY

VCC

OPTIONAL

DAISY-CHAINED

FPGAs

NOTE:

M2 can be shorted to Ground

if not used as I/O

CCLK

CLOCK

PROGRAM

DOUT

XC5200E/EX

SLAVE

M0 M1

N/C

DIN

INIT DONE

CCLK

N/C

XC5200

SYNCHRO-

NOUS

PERIPHERAL

Figure 33: Synchronous Peripheral Mode Circuit Diagram

November 5, 1998 (Version 5.2) 7-119

XC5200 Series Field Programmable Gate Arrays

Notes: 1. Peripheral S ynchronous mod e can be considered Slave Par al l el mode. An exter nal CCLK provides timing, cl ocking in th e

first data byte on the second ris i ng edge of CCLK after INIT goes high. Subsequent data bytes are cl ocked in on every

eighth co nsecutive ris i ng edge of CCLK.

2. The RDY/BUSY l ine goes High for one CCLK peri od after data has been clocked in, although synchr onous operation does

not require such a respons e.

3. The pin name RDY/BUS Y is a misnomer. In synchro nous periphe ral m ode this is really an ACKNOWLEDGE si gnal.

4.Note that dat a starts to shi f t out serial l y on t he DOUT pi n 0.5 CCLK periods after it was loaded in parallel. Therefore,

additional CCLK pulses are clearl y required after the last byte has b een l oaded.

Figure 34: Synchronous Peripheral Mode Programming Swit ching Characteristics

DOUT

CCLK

1 2 3456 7

BYTE

0BYTE

BYTE 0 OUT BYTE 1 OUT

RDY/BUSY

INIT

X6096

CCL

D0 - D7

Description Symbol Min Max Units

CCLK

INIT (High) setup time 1 TIC 5µs

D0 - D7 setup time 2 TDC 60 ns

D0 - D7 hold time 3 TCD 0ns

CCLK High time TCCH 50 ns

CCLK Low time TCCL 60 ns

CCLK Frequency FCC 8MHz

XC5200 Series Field Programmable Gate Arrays

7-120 November 5, 1998 (Version 5.2)

Asynchro no us Perip her al Mode

Write to FPGA

Asynchronous Peripheral mode uses the trailing edge of

the logic AND condition of WS and CS0 be i ng Lo w and RS

and CS1 being High to accept byte-wide data from a micro-

proce ss or bu s. In t he l ead FPGA, t hi s d at a i s loa de d i n to a

double-buffered UART-like parallel-to-serial converter and

is serially shifted into the internal logic.

The lead FPGA presents the preamble data (and all data

that overflows the lead device) on its DOUT pin. The

RDY/BUSY output from the lead FPGA acts as a hand-

shake sig nal to the microprocessor. RDY/BUSY goes Low

when a byt e has been rec eived, and goes Hig h again when

the byte-wide input buffer has transferred its information

into the shift register , and the buffer is ready to receive new

data. A new write may be started immediately, as soon as

the RDY/BUSY output has gone Low, acknowledging

receipt of the prev ious data. Write m ay not be te rminated

until RDY/BUSY is H igh a gain for o ne CC LK peri od. Note

that RDY/BUSY is pulled High with a high-impedance

pull-up prior to INIT going High.

The length of the BUSY signal depends on the activity in

the UART. If the shift register was empty when the new

byte was received, the BUSY signal lasts for only two

CCLK periods. If the shift register was still full when the

new byte was rece ived , the BUSY s i gn al c an b e a s lo ng a s

nine CCLK pe rio d s.

Note that after the last byte has been entered, only seven

of its bits ar e shifted out. CCLK remains High with DOUT

equal t o bit 6 (the next-t o-last bit) of the last byte ente red.

The READY/BUSY handshake can be ignored if the delay

from any one Write to the end of the next Write is guaran-

teed to be longer than 10 CCLK periods.

Status Read

The logic AND condition of the CS0, CS1 and RS inputs

puts the device status on the Dat a bus.

• D7 High indicat es Ready

• D7 Low in dicate s Busy

• D0 through D6 go unconditionally High

It is ma nd ator y th at t he whol e st a rt -u p seq uen c e b e s t arte d

and completed by one byte-wide input. Otherwise, the pins

used as Write Strobe or Chip Enable might become active

outputs and interfere with the final byte transfer. If this

transfer does not occur, the start-up sequence is not com-

pleted all the way to the finish (point F in Figur e 25 on pag e

109).

In this ca se, at worst, the inte rnal reset is no t released. A t

best, Readback and Boundary Scan are inhibited. The

length-count value, as generated by the software, ensures

that these problems never occur.

Although RDY/BUSY is brought out as a separate signal,

microprocessors can more easily read this information on

one of the data lines. For this purpose, D7 represents the

RDY/BUSY status when RS is Low, WS is High, and the

two chip select lines are both active.

Asynchronous Peripheral mode is selected by a <101> on

the mode pins (M2, M1, M0).

ADDRESS

BUS

DATA

BUS

ADDRESS

DECODE

LOGIC

CS0

...

RDY/BUSY

PROGRAM

D0–7 CCLK

DOUT DIN

M0 M1

N/C N/C N/C

CS1

CONTROL

SIGNALS INIT

REPROGRAM

OPTIONAL

DAISY-CHAINED

FPGAs

VCC

DONE

X9006

3.3 kΩ

4.7 kΩ4.7 kΩ

3.3 kΩ

XC5200

ASYNCHRO-

NOUS

PERIPHERAL

PROGRAM

CCLK

DOUT

M0 M1

INIT

DONE

XC5200/

XC4000E/EX

SLAVE

Figure 35: Asynchronous Peripheral Mode Circuit Diagram

November 5, 1998 (Version 5.2) 7-121

XC5200 Series Field Programmable Gate Arrays

Notes: 1. Configuration must be del ayed until I NIT pins of all dai sy-chained FPGAs are high.

2. The time from the end of WS to CCLK cycle for the new byte of data depends on the completion of previous byte processing

and the phase of internal timing generator for CCLK.

3. CCLK and DOUT timing is tested in s la ve mode.

4. TBUSY indicates that the double-buffered parallel-to-serial converter is not yet ready to receive new data. The shortest TBUSY

occurs when a byte is loaded i nto an empty parallel-t o -serial co nverter. The longes t TBUSY occurs when a new word is

loaded into t he i nput register before the second-level buffer has st arted shift i ng out data.

This t iming diag ram show s very rel axed re quirem ents. Data need not be held bey ond the r ising ed ge of WS. RDY/BUSY will

go acti ve within 60 ns af te r th e en d o f WS. A new write may be asserted immediately afte r RDY/BUSY goes Low, but write

may not be terminated until RDY/BUSY has been H igh for one CCLK per iod.

Figure 36: Asynchronous Peripheral Mode Programming Switching Characteristics

Previous Byte D6 D7 D0 D1 D2

1TCA

2TDC

TWTRB

3TCD

6TBUSY

READY

BUSY

RS, CS0

WS, CS1

WS/CS0

RS, CS1

D0-D7

CCLK

RDY/BUSY

DOUT

Write to LCA Read Status

X6097

Description Symbol Min Max Units

Write

Effective Write time

(CSO, WS=Low; RS, CS1=High 1T

CA 100 ns

DIN setup time 2 TDC 60 ns

DIN hold time 3 TCD 0ns

RDY

RDY/BUSY delay after end of

Write or Read 4T

WTRB 60 ns

RDY/BUSY active after beginning

of Read 760ns

RDY/BUSY Low output (Note 4) 6 TBUSY 2 9 CCLK

periods

XC5200 Series Field Programmable Gate Arrays

7-122 November 5, 1998 (Version 5.2)

Express Mod e

Expre ss mo de is sim ilar to S lave Seria l mode , excep t that

data is processed one byte per CCLK cycle instead of one

bit per CCLK cycle. An external source is used to drive

CCLK, wh ile b yt e-wid e d a ta is lo ade d d ir ect ly into th e co n-

figuration data shift registers. A CCLK frequency of 10

MHz is equivalent to an 80 MHz serial rate, because eight

bits of configuration data are loaded per CCLK cycle.

Express mode does not support CRC error checking, but

does support constant-field error checking.

In Express mode, an external signal drives the CCLK input

of the FPGA device. The first byte of parallel configuration

data must be available at the D inpu ts of the FPGA a short

setup time before the second rising CCLK edge. Subse-

quent data bytes are clocked in on each consecutive rising

CCLK edge.

If the first device is configured in Express mode, additional

devices may be daisy-chained only if every device in the

chain is also con figured in Expres s mode . CCLK p ins are

tied together and D0-D7 pins are tied together for all

devices along the chain. A status signal is passed from

DOUT to CS1 of successive devices along the chain. The

lead de vice in the chai n has its CS1 i nput tied Hi gh (or float -

ing, since there is an internal pullup). Frame data is

accept ed on ly when CS1 is Hig h and the devic e’s config u-

ration memory is not already full. The status pin DOUT is

pulled Low two internal-oscillator cycles after INIT is r ec og-

nized as High, and remains Low until the device’s configu-

ration memory is full. DOUT is then pulled High to signal

the nex t devi ce in t he chai n to acc ept t he conf igurati on dat a

on the D0-D7 bus.

The DONE pins of all devices in the chain should be tied

together, with one or more active internal pull-ups. If a

large number of devices are included in the chain, deacti-

vate some of the internal pull-ups, since the Low-driving

DONE pin of the last device in the chain must sink the cur-

rent from all pull-ups in the chain. The DONE pull-up is

activated by default. It can be deactivated using an option

in the bitstr eam generation softwar e.

XC5200 devices in Express mode are always synchronized

to DONE. The device becomes active after DONE goes

High. DONE is an open-drain output. With the DONE pins

tied t ogether , theref ore, the ex ternal DONE si gnal st ays low

until all dev ices are c onf igured , th en al l dev ices in the da isy

chain become active simultaneously. If the DONE pin of a

device is left unconnected, the device becomes active as

soon as that device has been configured.

Express mode is selected by a <010> on the mode pins

(M2, M1, M0).

INIT

CCLK CCLK

XC5200

M0 M1 M2

CS1

D0-D7

DATA BUS

PROGRAM

INIT

CCLK

PROGRAM

INIT

DOUT

DONEDONE

DOUT

To Additional

Optional

Daisy-Chained

Devices

To Additional

Optional

Daisy-Chained

Devices

NOTE:

M2, M1, M0 can be shorted

to Ground if not used as I/O

Optional

Daisy-Chained

XC5200

M0 M1

VCC

4.7KΩ

3.3 kΩ

CS1

D0-D7

PROGRAM

X6611_01

Figure 37: Express Mode Circuit Dia gram

November 5, 1998 (Version 5.2) 7-123

XC5200 Series Field Programmable Gate Arrays

Note: If not dr iv en by the preceding DOUT, CS1 must rema i n high until the dev i ce i s f ul l y configured.

Figure 38: Express Mode Programming Switching Characteristics

X5087

BYTE

CCLK

FPGA Filled

INIT

TDC

TCD

TIC

D0-D7

Serial Data Out

(DOUT)

RDY/BUSY

CS1

BYTE

1BYTE

2BYTE

Internal INIT

Description Symbol Min Max Units

CCLK

INIT (High) Setup time required 1 TIC 5µs

DIN Setup time required 2 TDC 30 ns

DIN hold time required 3 TCD 0ns

CCLK High time TCCH 30 ns

CCLK Low time TCCL 30 ns

CCLK frequency FCC 10 MHz

XC5200 Series Field Programmable Gate Arrays

7-124 November 5, 1998 (Version 5.2)

Notes: 1. A shaded table cell repres ents a 20-kΩ to 100-kΩ pul l- up resistor before and dur i ng configurat i on.

2. (I) represents an input (O) represents an output.

3. INIT is an open-drain out put during co nf ig uration.

Table 13. Pin Funct ions During Conf igura t ion

CONFI G URATI ON MODE: <M2:M1:M0 > USER

OPERATION

SLAVE

<1:1:1> MASTER-SER

<0:0:0> SYN.PERIPH

<0:1:1> ASYN.PERIPH

<1:0:1> MASTER-HIGH

<1:1:0> MASTER-LOW

<1:0:0> EXPRESS

<0:1:0>

A16 A16 GCK1-I/O

A17 A17 I/O

TDI TDI TDI TDI TDI TDI TDI TDI-I/O

TCK TCK TCK TCK TCK TCK TCK TCK-I/O

TMS TMS TMS TMS TMS TMS TMS TMS-I/O

I/O

M1 (HIGH) (I) M1 (L O W) (I) M1 (HIGH) (I) M1 (LOW) (I) M1 (HIGH) (I) M1 (LOW) (I) M1 (HIGH) (I) I/O

M0 (HIGH) (I) M0 (L O W) (I) M0 (HIGH) (I) M0 (HIGH) (I) M0 (LOW) (I) M0 (LOW) (I) M0 (LOW) (I) I/O

M2 (HIGH) (I) M2 (L O W) (I) M2 (LOW) (I ) M 2 (HIGH) (I ) M2 (HIGH) (I) M2 (HIGH) (I) M2 (LOW) (I) I/O

GCK2-I/O

HDC (HIGH) HDC (HIGH) HDC (HIGH) HDC (HIGH) HDC (HIGH) HDC (HIGH) HDC (HIGH) I/O

LDC (LOW)LDC (LOW)LDC (LOW)LDC (LOW)LDC (LOW)LDC (LOW)LDC (LOW) I/O

INIT-ERROR INIT-ERROR INIT-ERROR INIT-ERROR INIT-ERROR INIT-ERROR INIT-ERROR I/O

I/O

DONE DONE DONE DONE DONE DONE DONE DONE

PROGRAM (I) PROGRAM (I) PROGRAM (I) PROGRAM (I) PROGRAM (I) PROGRAM (I) PROGRAM (I) PROGRAM

DATA 7 (I) DATA 7 (I) DATA 7 (I) DATA 7 (I) DATA 7 (I) I/O

GCK3-I/O

DATA 6 (I) DATA 6 (I) DATA 6 (I) DATA 6 (I) DATA 6 (I) I/O

DATA 5 (I) DATA 5 (I) DATA 5 (I) DATA 5 (I) DATA 5 (I) I/O

CSO (I) I/O

DATA 4 (I) DATA 4 (I) DATA 4 (I) DATA 4 (I) DATA 4 (I) I/O

DATA 3 (I) DATA 3 (I) DATA 3 (I) DATA 3 (I) DATA 3 (I) I/O

RS (I) I/O

DATA 2 (I) DATA 2 (I) DATA 2 (I) DATA 2 (I) DATA 2 (I) I/O

DATA 1 (I) DATA 1 (I) DATA 1 (I) DATA 1 (I) DATA 1 (I) I/O

RDY/BUSY RDY/BUSY RCLK RCLK I/O

DIN (I) DIN (I ) DATA 0 (I) DATA 0 (I) DATA 0 (I) DATA 0 (I) DATA 0 (I) I/O

DOUT DOUT DOUT DOUT DOUT DOUT DOUT I/O

CCLK (I) CCLK (O) CCLK (I) CCLK ( O) CCLK (O) CCLK (O) CCLK (I) CCLK (I)

TDO TDO TDO TDO TDO TDO TDO TDO-I/O

WS (I) A0 A0 I/O

A1 A1 GCK4-I/O

CS1 (I) A2 A2 CS1 (I) I/O

A3 A3 I/O

A4 A4 I/O

A5 A5 I/O

A6 A6 I/O

A7 A7 I/O

A8 A8 I/O

A9 A9 I/O

A10 A10 I/O

A11 A11 I/O

A12 A12 I/O

A13 A13 I/O

A14 A14 I/O

A15 A15 I/O

ALL OTHERS

November 5, 1998 (Version 5.2) 7-125

XC5200 Series Field Programmable Gate Arrays

Configuration Switching Characteristics

VALID

PROGRAM

INIT

Vcc

POR

ICCK

TCCLK

CCLK OUTPUT or INPUT

M0, M1, M2 DONE RESPONSE

<300 ns

>300 ns

RE-PROGRAM

X1532 (Required)

I/O

Master Modes

Description Symbol Min Max Units

Power-On-Reset TPOR 215 ms

Program Latency TPI 670µs per CLB column

CCLK (output) Delay

period (slo w)

period (fast)

TICCK

TCCLK

640

100

375

3000

375

µs

Slave and Periphera l Mod es

Description Symbol Min Max Units

Power-On-Reset TPOR 215 ms

Program Latency TPI 670µs per CLB column

CCLK (input) Delay (required)

perio d (r eq uir e d) TICCK

TCCLK

100 µs

Note: At power-up, VCC must rise from 2.0 to VCC min in less than 15 ms, othe rwi se delay conf i guration using P ROGRAM until

VCC is valid.

XC5200 Series Field Programmable Gate Arrays

7-126 November 5, 1998 (Version 5.2)

XC5200 Program Readback Switching Characteristic Guidelines

Testing of t he swi tc hi ng par ame t ers is mod eled af te r t est i ng m ethod s sp eci fie d by MI L- M-385 10/ 60 5. Al l dev ic es ar e 10 0%

funct ion ally test ed. Int ernal timi ng parame ters a re no t mea sure d dire ctl y. They are d erive d fr om ben chmar k t iming patt erns

that are taken at device introduction, prior to an y proces s impro vements.

The followi ng guidelines reflect wor st-case values over the recommended operating conditi ons.

Note 1: Timing parameter s appl y to all speed grades.

Note 2: rdbk.TRIG is High prior to Finished, Finished will trigger the first Readback

Description Symbol Min Max Units

rdbk.TRIG rdbk.TRIG setup to initiate and abort Readback

rdbk.T RIG ho l d to init iat e an d ab or t Re ad ba ck 1

2TRTRC

TRCRT

200

50 -

-ns

rdclk.1 rdbk.DATA delay

rdbk.RIP delay

High time

Low time

TRCRD

TRCRR

TRCH

TRCL

250

500

RTRC

TRCRT

RCL

RCRR

RCH

RCRD

DUMMY DUMMY

rdbk.DATA

rdbk.RIP

rdclk.I

rdbk.TRIG

Finished

Internal Net

VALID

RTL

X1790

VALID

November 5, 1998 (Version 5.2) 7-127

XC5200 Series Field Programmable Gate Arrays

XC5200 Switching Characteristics

Definition of Terms

In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as

follows:

Advance: Initial estimates based on simula tion an d/or extrapolation from other speed grades, devices, or dev ice

families. Use as estimates, not for production.

Preliminary: Based on preliminary characterizati on. Further changes are not expected.

Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.1

XC5200 Operating Con ditions

XC5200 DC Characteristics Over Operating Conditions

XC5200 Absolute Maximu m Ratings

1. Notwith st andi ng the definition of the abo ve terms, al l spec i fications are subject to change without notice.

Symbol Description Min Max Units

VCC Supply voltage relative to GND Commercial: 0°C to 85°C junction 4.75 5.25 V

Supply voltage relative to GND I ndustrial: -40°C to 100°C junction 4.5 5.5 V

VIHT High-level input voltage — TTL configuration 2.0 VCC V

VILT Lo w-level input voltage — TTL configuration 0 0.8 V

VIHC High-level input voltage — CMOS confi guration 70% 100% VCC

VILC Low-level input voltage — CMOS configuration 0 20% VCC

TIN Input signal transition time 250 ns

Symbol Description Min Max Units

VOH High-level output voltage @ IOH = -8.0 mA, VCC min 3.86 V

VOL Low-level output voltage @ IOL = 8.0 mA, VCC max 0.4 V

ICCO Quiescent FPGA supply current (Note 1) 15 mA

IIL Leakage current -10 +10 µA

CIN Input capacitance (sample tested) 15 pF

IRIN Pad pull-up (when selected) @ VIN = 0V (sam p l e tes te d) 0.02 0.30 mA

Note: 1. With no output current loads, all package pins at Vcc or GND, either TTL or CMOS inputs, and the FPGA configured with a

tie option.

Symbol Description Units

VCC Supply voltage relative to GND -0.5 to +7.0 V

VIN Input voltage with respect to GND -0.5 to VCC +0.5 V

VTS Voltage appl ied to 3-state output -0.5 to VCC +0.5 V

TSTG Storage temperature (ambient) -65 to +150 °C

TSOL Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm) +260 °C

TJJuncti on tem p er at ur e in pla st i c pac ka ge s +125 °C

Juncti on tem p er at ur e in ce ra m ic pac k a ge s +150 °C

Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings onl y, and functional operation of the dev i ce at these or any other condit i ons beyond those listed und er Recommended

Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may

affect device reliability.

XC5200 Series Field Programmable Gate Arrays

7-128 November 5, 1998 (Version 5.2)

XC5200 Global Buffer Switching Characteristic Guidelines

Testing of the switching parameters is modeled af ter tes ting me thods specif ied by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark

timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more

detailed, more precise, and more up-to-date timing information, use the values provided by the timing calculator and used

in the simula to r.

XC5200 Longline Switching Characteristic Guidelines

Testing of the switching parameters is modeled af ter tes ting me thods specif ied by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark

timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more

detailed, more precise, and more up-to-date timing information, use the values provided by the timing calculator and used

in the simula to r.

Speed Grade-6-5-4-3

Description Symbol Device Max

(ns) Max

(ns)

Global Signal Distribution

From pad through global buffer, to any clock ( CK) TBUFG XC5202 9.1 8.5 8.0 6.9

XC5204 9.3 8.7 8.2 7.6

XC5206 9.4 8.8 8.3 7.7

XC5210 9.4 8.8 8.5 7.7

XC5215 10.5 9.9 9.8 9.6

Speed Grade -6 -5 -4 -3

Description Symbol Device Max

(ns) Max

(ns)

TBUF dr ivin g a Long line

I to Longline, while TS is Low; i.e., buffer is constantly ac-

tive

TIO XC5202 6.0 3.8 3.0 2.0

XC5204 6.4 4.1 3.2 2.3

XC5206 6.6 4.2 3.3 2.7

XC5210 6.6 4.2 3.3 2.9

XC5215 7.3 4.6 3.8 3.2

TS going Low to Longline going from floating High or Low

to active Low or High TON XC5202 7.8 5.6 4.7 4.0

XC5204 8.3 5.9 4.9 4.3

XC5206 8.4 6.0 5.0 4.4

XC5210 8.4 6.0 5.0 4.4

XC5215 8.9 6.3 5.3 4.5

TS going High to TBUF going i nactive, not driving

Longline TOFF XC52xx 3.0 2.8 2.6 2.4

Note: 1. Die-siz e-dependent parameters are based upon X C5215 character i zat i on. Pro duction specifications will vary with array

size.

TBUF

November 5, 1998 (Version 5.2) 7-129

XC5200 Series Field Programmable Gate Arrays

XC5200 CLB Switching Characteristic Guidelines

Testing of the switching parameters is modeled af ter tes ting me thods specif ied by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark

timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more

detailed, more precise, and more up-to-date timing information, use the values provided by the timing calculator and used

in the simula to r.

Speed Grade -6 -5 -4 -3

Description Symbol Min

(ns) Max

(ns) Min

(ns) Max

(ns) Min

(ns) Max

(ns) Min

(ns) Max

(ns)

Combinatorial Delays

F inputs to X output TILO 5.6 4.6 3.8 3.0

F inputs via transparent latch to Q TITO 8.0 6.6 5.4 4.3

DI inputs to DO outp u t (Logic -C ell

Feedthrough) TIDO 4.3 3.5 2.8 2.4

F inputs via F5_MUX to DO output TIMO 7.2 5.8 5.0 4.3

Carry Delay s

Incremental delay per bit TCY 0.7 0.6 0.5 0.5

Carry-in overhead from DI TCYDI 1.8 1.6 1.5 1.4

Carry-in overhead from F TCYL 3.7 3.2 2.9 2.4

Carry-out overhea d to DO TCYO 4.0 3.2 2.5 2.1

Seque ntial Dela ys

Clock (CK) to out (Q) (Flip-Flop) TCKO 5.8 4.9 4.0 4.0

Gate (Latc h enable) going active to out (Q) TGO 9.2 7.4 5.9 5.5

Set-up Time Before Clock (CK)

F inputs TICK 2.3 1.8 1.4 1.3

F inputs via F5_MUX TMICK 3.8 3.0 2.5 2.4

DI input TDICK 0.8 0.5 0.4 0.4

CE input TEICK 1.6 1.2 0.9 0.9

Hold Times After Clock (CK)

F inputs TCKI 00 0 0

F inputs via F5_MUX TCKMI 00 0 0

DI input TCKDI 00 0 0

CE input TCKEI 00 0 0

Clock W idths

Clock High Time TCH 6.0 6.0 6.0 6.0

Clock Low Time TCL 6.0 6.0 6.0 6.0

Togg le Frequency (MHz) (Note 3) FTOG 83 83 83 83

Reset De lays

Width (High) TCLRW 6.0 6.0 6.0 6.0

Delay from CLR to Q (Flip-Flop) TCLR 7.7 6.3 5.1 4.0

Delay from CLR to Q (Latch) TCLRL 6.5 5.2 4.2 3.0

Global Reset Delays

Width (High) TGCLRW 6.0 6.0 6.0 6.0

Delay from internal GR to Q TGCLR 14.7 12.1 9.1 8.0

Note: 1. The CLB K to Q output del ay (TCKO) of any CLB, plus the shor test possi b l e in terconnec t del ay, is alw ays longer than the

Data In hold-time requi rem ent (TCKDI) of any CLB on the same di e.

2. Ti ming is based upon the XC5215 device. For other devices, see Timing Calculator .

3. Maximu m fl ip -flop toggle rate for expo rt cont rol purposes.

XC5200 Series Field Programmable Gate Arrays

7-130 November 5, 1998 (Version 5.2)

XC5200 Guaranteed Input and Output Parameters (Pin-to-Pin)

All v alue s l is t ed b elow ar e te ste d di r ectl y, and guar an te ed ove r t he op erat i n g co nd iti o ns. Th e s ame par ame te rs ca n al so b e

derived indirectly from the Global Buffer specifications. The delay calculator uses this indirect method, and may

overestimate because of worst-case assumptions. When there is a discrepancy between these two methods, the values

lis ted belo w should be used, and the derived values should be considered conservative overest imates.

Speed Grade -6 -5 -4 -3

Description Symbol Device Max

(ns) Max

(ns)

Global Clock to Output Pad (fast) TICKOF

(Max)

XC5202 16.9 15.1 10.9 9.8

XC5204 17.1 15.3 11.3 9.9

XC5206 17.2 15.4 11.9 10.8

XC5210 17.2 15.4 12.8 11.2

XC5215 19.0 17.0 12.8 11.7

Global Clock to Output Pad (slew-limited) T ICKO

(Max)

XC5202 21.4 18.7 12.6 11.5

XC5204 21.6 18.9 13.3 11.9

XC5206 21.7 19.0 13.6 12.5

XC5210 21.7 19.0 15.0 12.9

XC5215 24.3 21.2 15.0 13.1

Input Set-up Time (no de lay ) to CL B Flip-F lop TPSUF

(Min)

XC5202 2.5 2.0 1.9 1.9

XC5204 2.3 1.9 1.9 1.9

XC5206 2.2 1.9 1.9 1.9

XC5210 2.2 1.9 1.9 1.8

XC5215 2.0 1.8 1.7 1.7

Input Hold Time (no de lay) to CLB Flip- Flop TPHF

(Min)

XC5202 3.8 3.8 3.5 3.5

XC5204 3.9 3.9 3.8 3.6

XC5206 4.4 4.4 4.4 4.3

XC5210 5.1 5.1 4.9 4.8

XC5215 5.8 5.8 5.7 5.6

Input Set-up Time (with de lay ) to CL B Flip-F lop D I Input T PSU XC5202 7.3 6.6 6.6 6.6

XC5204 7.3 6.6 6.6 6.6

XC5206 7.2 6.5 6.4 6.3

XC5210 7.2 6.5 6.0 6.0

XC5215 6.8 5.7 5.7 5.7

Input Set-up Time (with delay) to CLB Flip-Flop F Input TPSUL

(Min)

XC5202 8.8 7.7 7.5 7.5

XC5204 8.6 7.5 7.5 7.5

XC5206 8.5 7.4 7.4 7.4

XC5210 8.5 7.4 7.4 7.3

XC5215 8.5 7.4 7.4 7.2

Input Hold T ime (with delay) to CLB Flip-Flop TPH

(Min)

XC52xx 0000

Note: 1. These measurements assume that the CLB flip-flop uses a direct interconnect to or from the IOB. The INREG/ OUTREG

properties, or XACT-Performance, can be used to assure that direct connects are used. tPSU applies only to the CLB in put

DI that bypasses th e loo k-up table, which only offers d ir ect connec ts to IOBs on the left an d right edges of t he di e. tPSUL

applies to the CLB inputs F that feed the look-up table, which offers direct connect to IOBs on all four edges, as do the CLB

Q outputs.

2. When testing output s (f ast or slew-li mited), hal f of the outputs on one si de of the dev ice are switchin g.

Global Clock-to-Output Delay

Direct

ConnectIOB

CLB

FAST

BUFG

Global Clock-to-Output Delay

Direct

ConnectIOB

CLB

BUFG

Input

Set-up

& Hold

Time

F,DI

IOB(NODELAY) Direct

Connect CLB

BUFG

Input

Set-up

& Hold

Time

Direct

Connect CLB

IOB(NODELAY) F,DI

BUFG

Input

Set-up

& Hold

Time

IOB Direct

Connect CLB

BUFG

Input

Set-up

& Hold

Time

IOB Direct

Connect CLB

BUFG

Input

Set-up

& Hold

Time

IOB Direct

Connect CLB

BUFG

F,DI

November 5, 1998 (Version 5.2) 7-131

XC5200 Series Field Programmable Gate Arrays

XC5200 IOB Switching Character istic Guidelines

Testing of the switching parameters is modeled af ter tes ting me thods specif ied by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark

timing patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more

detailed, more precise, and more up-to-date timing information, use the values provided by the timing calculator and used

in the simula to r.

Speed Grade -6 -5 -4 -3

Description Symbol Max

(ns) Max

(ns)

Input

Propagation Delays from CMOS or TTL Levels

Pad to I (no delay) TPI 5.7 5.0 4.8 3.3

Pad to I (with delay) TPID 11.4 10.2 10.2 9.5

Output

Propagation Delays to CMOS or TTL Levels

Output (O) to Pad (fast) TOPF 4.6 4.5 4.5 3.5

Output (O) to Pad (slew-limited) TOPS 9.5 8.4 8.0 5.0

From clock (CK) to out put pad (fast), using direct connect between Q

and output (O) TOKPOF 10.1 9.3 8.3 7.5

From clock (CK) to output pad (slew-l imited), using direct connect be-

tween Q and output (O) TOKPOS 14.9 13.1 11.8 10.0

3-state to Pad active (fast) TTSONF 5.6 5.2 4.9 4.6

3-state to Pad active (slew-limited) TTSONS 10.4 9.0 8.3 6.0

Internal GTS to Pad active TGTS 17.7 15.9 14.7 13.5

Note: 1. Timing is measured at pin threshold, with 50-pF external capacitan ce loads. Slew-limited output rise/ fall tim es are

approxi m ately two times longer than fast output ri se/fall times.

2. Unused and unbonded IOB s are configur ed by default as inpu ts with internal pull-up resistors.

3. Ti ming is based upon the XC5215 device. For other devices, see Timing Calculator .

XC5200 Series Field Programmable Gate Arrays

7-132 November 5, 1998 (Version 5.2)

XC5200 Boundary Scan (JTAG) Switching Character istic G uidelines

The fol lowing guid elines ref lect worst -case valu es over the rec ommended oper ating condi tions. They are expres sed in units

of na noseconds and apply to all XC5200 devices unless otherwise noted.

Speed Grade -6 -5 -4 -3

Description Symbol Min Max Min Max Min Max Min Max

Setup and Hold

Input (TDI) to clock (TCK)

setup time

Input (TDI) to clock (TCK)

hold time

Input (TMS) to clock (TCK)

setup time

Input (TMS) to clock (TCK)

hold time

TTDITCK

TTCKTDI

TTMSTCK

TTCKTMS

30.0

15.0

30.0

15.0

30.0

15.0

30.0

15.0

Propagation Delay

Clock (TCK) to Pad (TDO) TTCKPO 30.0 30.0 30.0 30.0

Clock

Clock (TCK) High

Clock (TCK) Low TTCKH

TTCKL

30.0

30.0 30.0

30.0

FMAX (MHz) FMAX 10.0 10.0 10.0 10.0

Note 1: Input pad setup and hol d times are specified with respect to the internal clock.

November 5, 1998 (Version 5.2) 7-133

XC5200 Series Field Programmable Gate Arrays

Device-Specific Pinout Tables

Device-s pecific ta bles inclu de all pack ages fo r each XC 5200- Series de vice. Th ey follow the pad lo cations around th e die,

and include boundary scan register locations.

Pin Locations for XC5202 Devices

The following table may contain pinout information for unsupported device/package combinations. Please see the

availability charts elsewhere in the XC5200 Series data sheet for availability information.

Pin Description VQ64* PC84 PQ100 VQ100 TQ144 PG156 Boundary Scan Order

VCC - 2 92 89 128 H3 -

1. I/O (A8) 57 3 93 90 129 H1 51

2. I/O (A9) 58 4 94 91 130 G1 54

3. I/O - - 95 92 131 G2 57

4. I/O - - 96 93 132 G3 63

5. I/O (A10) - 5 97 94 133 F1 66

6. I/O (A11) 59 6 98 95 134 F2 69

GND - - - - 137 F3 -

7. I/O (A12) 60 7 99 96 138 E3 78

8. I/O (A13) 61 8 100 97 139 C1 81

9. I/O (A14) 62 9 1 98 1 42 B1 90

10. I/O (A15) 63 10 2 99 143 B2 93

VCC 64113100144C3 -

GND - 12 4 1 1 C4 -

11. GCK 1 (A16, I/O) 1 13 5 2 2 B3 102

12. I/O (A17) 2 14 6 3 3 A1 105

13. I/O (TDI) 3 15 7 4 6 B4 111

14. I/O (TCK) 4 16 8 5 7 A3 114

GND - - - - 8 C6 -

15. I/O (TMS) 5 17 9 6 11 A5 117

16. I/O 6 18 10 7 12 C7 123

17. I/O - - - - 13 B7 126

18. I/O - - 11 8 14 A6 129

19. I/O - 19 12 9 15 A7 135

20. I/O 7 20 13 10 16 A8 138

GND 8 21 14 11 17 C8 -

VCC 9 22 15 12 18 B8 -

21. I/O - 23 16 13 19 C9 141

22. I/O 10 24 17 14 20 B9 147

23. I/O - 18 15 21 A9 150

24. I/O - - - 22 B10 153

25. I/O - 25 19 16 23 C10 159

26. I/O 11 26 20 17 24 A10 162

GND - - - 27 C11 -

27. I/O 12 27 21 18 28 B12 165

28. I/O - 22 19 29 A13 171

29. I/O 13 28 23 20 32 B13 174

30. I/O 14 29 24 21 33 B14 177

31. M1 (I/O) 15 30 25 22 34 A15 186

GND - 31 26 23 35 C13 -

32. M0 (I/O) 16 32 27 24 36 A16 189

VCC - 33 28 25 37 C14 -

33. M2 (I/O) 17 34 29 26 38 B15 192

34. GCK 2 (I/ O) 18 35 30 27 39 B16 195

XC5200 Series Field Programmable Gate Arrays

7-134 November 5, 1998 (Version 5.2)

35. I/O (HDC) 19 36 31 28 40 D14 204

36. I/O - - 32 29 43 E14 207

37. I/O (LDC) 20 37 33 30 44 C16 210

GND - - - - 45 F14 -

38. I/O - 38 34 31 48 F16 216

39. I/O 21 39 35 32 49 G14 219

40. I/O - - 36 33 50 G15 222

41. I/O - - 37 34 51 G16 228

42. I/O 22 40 38 35 52 H16 231

43. I/O (ERR, INIT) 23 41 39 36 53 H15 234

VCC 24 42 40 37 54 H14 -

GND 25 43 41 38 55 J14 -

44. I/O 26 44 42 39 56 J15 240

45. I/O 27 45 43 40 57 J16 243

46. I/O - - 44 41 58 K16 246

47. I/O - - 45 42 59 K15 252

48. I/O 28 46 46 43 60 K14 255

49. I/O 29 47 47 44 61 L16 258

GND - - - - 64 L14 -

50. I/O - 48 48 45 65 P16 264

51. I/O 30 49 49 46 66 M14 267

52. I/O - 50 50 47 69 N14 276

53. I/O 31 51 51 48 70 R16 279

GND - 52 52 49 71 P14 -

DONE 32 53 53 50 72 R15 -

VCC 33 54 54 51 73 P13 -

PROG 34 55 55 52 74 R14 -

54. I/O (D7) 35 56 56 53 75 T16 288

55. GCK 3 (I/ O) 36 57 57 54 76 T15 291

56. I/O (D6) 37 58 58 55 79 T14 300

57. I/O - - 59 56 80 T13 303

GND - - - - 81 P11 -

58. I/O (D5) 38 59 60 57 84 T10 306

59. I/O (CS0) - 60 61 58 85 P10 312

60. I/O - - 62 59 86 R10 315

61. I/O - - 63 60 87 T9 318

62. I/O (D4) 39 61 64 61 88 R9 324

63. I/O - 62 65 62 89 P9 327

VCC 40 63 66 63 90 R8 -

GND 41 64 67 64 91 P8 -

64. I/O (D3) 42 65 68 65 92 T8 336

65. I/O (RS) 43 66 69 66 93 T7 339

66. I/O - - 70 67 94 T6 342

67. I/O - - - - 95 R7 348

68. I/O (D2) 44 67 71 68 96 P7 351

69. I/O - 68 72 69 97 T5 360

GND - - - - 100 P6 -

70. I/O (D1) 45 69 73 70 101 T3 363

71. I/O

(RCLK-BUSY/RDY) - 70 74 71 102 P5 366

72. I/O (D0, DIN) 46 71 75 72 105 P4 372

73. I/O (DOUT) 47 72 76 73 106 T2 375

Pin Description VQ64* PC84 PQ100 VQ100 TQ144 PG156 Boundary Scan Order

November 5, 1998 (Version 5.2) 7-135

XC5200 Series Field Programmable Gate Arrays

* VQ64 package supports Master Serial, Slave Serial, and Express configuration modes only.

Additional No Conn ect (N.C.) Con n ection s on TQ1 44 Packa ge

Notes: Boundary Scan Bit 0 = TDO.T

Boundary Scan B it 1 = TDO.O

Boundary S can B i t 1056 = BSCAN.UP D

Pin Locations for XC5204 Devices

The following table may contain pinout information for unsupported device/package combinations. Please see the

availability charts elsewhere in the XC5200 Series data sheet for availability information.

CCLK 48 73 77 74 107 R2 -

VCC - 74 78 75 108 P3 -

74. I/O (TDO) 49 75 79 76 109 T1 0

GND - 76 80 77 110 N3 -

75. I/O (A0, WS)50778178111R1 9

76. GCK 4 (A1 , I /O) 51 78 82 79 112 P2 15

77. I/O (A2, CS1) 52 79 83 80 115 P1 18

78. I/O (A3) - 80 84 81 1 16 N1 21

GND - - - - 118 L3 -

79. I/O (A4) - 81 85 82 1 21 K3 27

80. I/O (A5) 53 82 86 83 122 K2 30

81. I/O - - 87 84 123 K1 33

82. I/O - - 88 85 124 J1 39

83. I/O (A6) 54 83 89 86 125 J2 42

84. I/O (A7) 55 84 90 87 126 J3 45

GND 56 1 91 88 127 H2 -

TQ144

135 9 41 67 98 117

136 10 42 68 99 119

140 25 46 77 103 120

141 26 47 78 104

4 30 62 82 113

5 31 63 83 114

Pin Description PC84 PQ100 VQ100 TQ144 PG156 PQ160 Boundary Scan Order

VCC 2 92 89 128 H3 142 -

1. I/O (A8) 3 93 90 129 H1 143 78

2. I/O (A9) 4 94 91 130 G1 144 81

3. I/O - 95 92 131 G2 145 87

4. I/O - 96 93 132 G3 146 90

5. I/O (A10) 5 97 94 133 F1 147 93

6. I/O (A11) 6 98 95 134 F2 148 99

7. I/O - - - 135 E1 149 102

8. I/O - - - 136 E2 150 105

GND - - - 137 F3 151 -

9. I/O - - - - D1 152 111

10. I/O - - - - D2 153 114

11. I/O (A12) 7 99 96 138 E3 154 117

12. I/O (A13) 8 100 97 139 C1 155 123

13. I/O - - - 140 C2 156 126

Pin Description VQ64* PC84 PQ100 VQ100 TQ144 PG156 Boundary Scan Order

XC5200 Series Field Programmable Gate Arrays

7-136 November 5, 1998 (Version 5.2)

14. I/O - - - 141 D3 157 129

15. I/O (A14) 9 1 98 142 B1 158 138

16. I/O (A15) 10 2 99 143 B2 159 141

VCC 11 3 100 144 C3 160 -

GND 12 4 1 1 C4 1 -

17. GCK1 (A16, I/O ) 13 5 2 2 B3 2 150

18. I/O (A17) 14 6 3 3 A1 3 153

19. I/O - - - 4 A2 4 159

20. I/O - - - 5 C5 5 162

21. I/O (TDI) 15 7 4 6 B4 6 165

22. I/O (TCK) 16 8 5 7 A3 7 171

GND - - - 8 C6 10 -

23. I/O - - - 9 B5 11 174

24. I/O - - - 10 B6 12 177

25. I/O (TMS) 17 9 6 11 A5 13 180

26. I/O 18 10 7 12 C7 14 183

27. I/O - - - 13 B7 15 186

28. I/O - 11 8 14 A6 16 189

29. I/O 19 12 9 15 A7 17 195

30. I/O 20 13 10 16 A8 18 198

GND 21141117C819 -

VCC 22151218B820 -

31. I/O 23 16 13 19 C9 21 201

32. I/O 24 17 14 20 B9 22 207

33. I/O - 18 15 21 A9 23 210

34. I/O - - - 22 B10 24 213

35. I/O 25 19 16 23 C10 25 219

36. I/O 26 20 17 24 A10 26 222

37. I/O - - - 25 A11 27 225

38. I/O - - - 26 B11 28 231

GND - - - 27 C11 29 -

39. I/O 27 21 18 28 B12 32 234

40. I/O - 22 19 29 A13 33 237

41. I/O - - - 30 A14 34 240

42. I/O - - - 31 C12 35 243

43. I/O 28 23 20 32 B13 36 246

44. I/O 29 24 21 33 B14 37 249

45. M1 (I/O) 30 25 22 34 A15 38 258

GND 31262335C1339 -

46. M0 (I/O) 32 27 24 36 A16 40 261

VCC 33282537C1441 -

47. M2 (I/O) 34 29 26 38 B15 42 264

48. GCK2 (I/O) 35 30 27 39 B16 43 267

49. I/O (HDC) 36 31 28 40 D14 44 276

50. I/O - - - 41 C15 45 279

51. I/O - - - 42 D15 46 282

52. I/O - 32 29 43 E14 47 288

53. I/O (LDC) 37 33 30 44 C16 48 291

54. I/O - - - - E15 49 294

55. I/O - - - - D16 50 300

GND - - - 45 F14 51 -

56. I/O - - - 46 F15 52 303

Pin Description PC84 PQ100 VQ100 TQ144 PG156 PQ160 Boundary Scan Order

November 5, 1998 (Version 5.2) 7-137

XC5200 Series Field Programmable Gate Arrays

57. I/O - - - 47 E16 53 306

58. I/O 38 34 31 48 F16 54 312

59. I/O 39 35 32 49 G14 55 315

60. I/O - 36 33 50 G15 56 318

61. I/O - 37 34 51 G16 57 324

62. I/O 40 38 35 52 H16 58 327

63. I/O (ERR, INIT) 41 39 36 53 H15 59 330

VCC 42403754H1460 -

GND 43413855J1461 -

64. I/O 44 42 39 56 J15 62 336

65. I/O 45 43 40 57 J16 63 339

66. I/O - 44 41 58 K16 64 348

67. I/O - 45 42 59 K15 65 351

68. I/O 46 46 43 60 K14 66 354

69. I/O 47 47 44 61 L16 67 360

70. I/O - - - 62 M16 68 363

71. I/O - - - 63 L15 69 366

GND - - - 64 L14 70 -

72. I/O - - - - N16 71 372

73. I/O - - - - M15 72 375

74. I/O 48 48 45 65 P16 73 378

75. I/O 49 49 46 66 M14 74 384

76. I/O - - - 67 N15 75 387

77. I/O - - - 68 P15 76 390

78. I/O 50 50 47 69 N14 77 396

79. I/O 51 51 48 70 R16 78 399

GND 52524971P1479 -

DONE 53 53 50 72 R15 80 -

VCC 54545173P1381 -

PROG 55 55 52 74 R14 82 -

80. I/O (D7) 56 56 53 75 T16 83 408

81. GCK3 (I/O) 57 57 54 76 T15 84 411

82. I/O - - - 77 R13 85 420

83. I/O - - - 78 P12 86 423

84. I/O (D6) 58 58 55 79 T14 87 426

85. I/O - 59 56 80 T13 88 432

GND - - - 81 P11 91 -

86. I/O - - - 82 R11 92 435

87. I/O - - - 83 T11 93 438

88. I/O (D5) 59 60 57 84 T10 94 444

89. I/O (CS0) 60 61 58 85 P10 95 447

90. I/O - 62 59 86 R10 96 450

91. I/O - 63 60 87 T9 97 456

92. I/O (D4) 61 64 61 88 R9 98 459

93. I/O 62 65 62 89 P9 99 462

VCC 63666390R8100 -

GND 64676491P8101 -

94. I/O (D3) 65 68 65 92 T8 102 468

95. I/O (RS) 66 69 66 93 T7 103 471

96. I/O - 70 67 94 T6 104 474

97. I/O - - - 95 R7 105 480

98. I/O (D2) 67 71 68 96 P7 106 483

Pin Description PC84 PQ100 VQ100 TQ144 PG156 PQ160 Boundary Scan Order

XC5200 Series Field Programmable Gate Arrays

7-138 November 5, 1998 (Version 5.2)

Additional No Connect (N.C .) Connections for PQ160 Package

Notes: Boundary Scan Bit 0 = TDO.T

Boundary Scan B it 1 = TDO.O

Boundary S can B i t 1056 = BSCAN.UP D

99. I/O 68 72 69 97 T5 107 486

100. I/O - - - 98 R6 108 492

101. I/O - - - 99 T4 109 495

GND - - - 100 P6 110 -

102. I/O (D1) 69 73 70 101 T3 113 498

103. I/O

(RCLK-BUSY/RDY) 70 74 71 102 P5 114 504

104. I/O - - - 103 R4 115 507

105. I/O - - - 104 R3 116 510

106. I/O (D0, DIN) 71 75 72 105 P4 117 516

107. I/O (DOUT) 72 76 73 106 T2 118 519

CCLK 73 77 74 107 R2 119 -

VCC 74 78 75 108 P3 120 -

108. I/O (TDO) 75 79 76 109 T1 121 0

GND 76 80 77 110 N3 122 -

109. I/O (A0, WS) 77 81 78 111 R1 123 9

110. GCK4 (A1, I/O) 78 82 79 112 P2 124 15

111. I/O - - - 113 N2 125 18

112. I/O - - - 114 M3 126 21

113. I/O (A2, CS1) 79 83 80 115 P1 127 27

114. I/O (A3) 80 84 81 116 N1 128 30

115. I/O - - - 117 M2 129 33

116. I/O - - - - M1 130 39

GND - - - 118 L3 131 -

117. I/O - - - 119 L2 132 42

118. I/O - - - 120 L1 133 45

119. I/O (A4) 81 85 82 121 K3 134 51

120. I/O (A5) 82 86 83 122 K2 135 54

121. I/O - 87 84 123 K1 137 57

122. I/O - 88 85 124 J1 138 63

123. I/O (A6) 83 89 86 125 J2 139 66

124. I/O (A7) 84 90 87 126 J3 140 69

GND 1 91 88 127 H2 141 -

PQ160

83089111136

93190112

Pin Description PC84 PQ100 VQ100 TQ144 PG156 PQ160 Boundary Scan Order

November 5, 1998 (Version 5.2) 7-139

XC5200 Series Field Programmable Gate Arrays

Pin Locations for XC5206 Devices

The following table may contain pinout information for unsupported device/package combinations. Please see the

availability charts elsewhere in the XC5200 Series data sheet for availability information.

Pin Desc ript ion PC84 PQ100 VQ100 T Q144 PQ160 TQ176 PG191 PQ208 Boundary Scan Order

VCC 2 92 89 128 142 155 J4 183 -

1. I/ O (A 8) 3 93 90 129 143 156 J3 184 87

2. I/ O (A 9) 4 94 91 130 144 157 J2 185 90

3. I/O - 95 92 131 145 158 J1 186 93

4. I/O - 96 93 132 146 159 H1 187 99

5. I/O - - - - - 160 H2 188 102

6. I/O - - - - - 161 H3 189 105

7. I/ O (A 10) 5 97 94 133 147 162 G1 190 11 1

8. I/ O (A 11) 6 98 95 134 148 163 G2 191 11 4

9. I/O - - - 135 149 164 F1 192 117

10. I/O - - - 136 150 165 E1 193 123

GND - - - 137 151 166 G3 194 -

11. I/O - - - - 152 168 C1 197 126

12. I/O - - - - 153 169 E2 198 129

13. I/O (A12) 7 99 96 138 15 4 170 F3 199 138

14. I/O (A13) 8 100 97 139 155 171 D 2 200 141

15. I/O - - - 140 156 172 B1 201 150

16. I/O - - - 141 157 173 E3 202 153

17. I/O (A14) 9 1 98 142 158 174 C2 203 162

18. I/O (A15) 10 2 99 143 159 175 B2 204 165

VCC 11 3 100 144 160 176 D3 205 -

GND 1241111D42 -

19. GCK1 (A16, I/O) 13 5 2 2 2 2 C3 4 17 4

20. I/O (A17) 14 6 3 3 3 3 C4 5 177

21. I/O - - - 4 4 4 B3 6 183

22. I/O - - - 5 5 5 C5 7 186

23.I/O (TDI) 1574666A28 189

24.I/O (TCK) 1685777B49 195

25. I/O - - - - 8 8 C6 10 198

26. I/O - - - - 9 9 A3 11 201

GND - - - 8 10 10 C7 14 -

27. I/O - - - 9 11 11 A4 15 207

28. I/O - - - 10 12 12 A5 16 210

29. I/O (TMS) 17 9 6 11 13 13 B7 1 7 213

30. I/O 18 10 7 12 14 14 A6 18 219

31. I/O - - - - - 15 C8 19 222

32. I/O - - - - - 16 A7 20 225

33. I/O - - - 13 15 17 B8 21 234

34.I/O - 118141618A822 237

35. I/O 19 12 9 15 17 19 B9 23 246

36. I/O 20 13 10 16 18 20 C9 24 249

GND 21 1411171921D925 -

VCC 22 1512182022D1026 -

37. I/O 23 16 13 19 21 23 C10 27 255

38. I/O 24 17 14 20 22 24 B10 28 258

39.I/O - 1815212325A929 261

40. I/O - - - 22 24 26 A10 30 267

41. I/O - - - - - 27 A11 31 270

XC5200 Series Field Programmable Gate Arrays

7-140 November 5, 1998 (Version 5.2)

42. I/O - - - - - 28 C11 32 273

43. I/O 25 19 16 23 25 29 B11 33 279

44. I/O 26 20 17 24 26 30 A12 34 282

45. I/O - - - 25 27 31 B12 35 285

46. I/O - - - 26 28 32 A13 36 291

GND - - - 27 29 33 C12 37 -

47. I/O - - - - 30 34 A15 40 294

48. I/O - - - - 31 35 C13 41 297

49. I/O 27 21 18 28 32 36 B14 42 303

50. I/O - 22 19 29 33 37 A16 43 306

51. I/O - - - 30 34 38 B15 44 309

52. I/O - - - 31 35 39 C14 45 315

53. I/O 28 23 20 32 36 40 A17 46 318

54. I/O 29 24 21 33 37 41 B16 47 321

55. M1 (I/O) 30 25 22 34 38 42 C15 48 330

GND 31 2623353943D1549 -

56. M0 (I/O) 32 27 24 36 40 44 A18 50 333

VCC 33 2825374145D1655 -

57. M2 (I/O) 34 29 26 38 42 46 C16 56 336

58. GCK2 (I/O) 35 30 27 39 43 47 B17 5 7 339

59. I/O (HDC) 36 31 28 40 44 48 E16 58 348

60. I/O - - - 41 45 49 C17 59 351

61. I/O - - - 42 46 50 D17 60 354

62. I/O - 32 29 43 47 51 B18 61 360

63. I/O (LDC) 37 33 30 44 48 52 E17 62 363

64. I/O - - - - 49 53 F16 63 372

65. I/O - - - - 50 54 C18 64 375

GND - - - 45 51 55 G16 67 -

66. I/O - - - 46 52 56 E18 68 378

67. I/O - - - 47 53 57 F18 69 384

68. I/O 38 34 31 48 54 58 G17 70 387

69. I/O 39 35 32 49 55 59 G18 71 390

70. I/O - - - - - 60 H16 72 396

71. I/O - - - - - 61 H17 73 399

72. I/O - 36 33 50 56 62 H18 74 402

73.I/O - 3734515763J1875 408

74. I/O 40 38 35 52 58 64 J17 76 411

75. I/O (ERR, INIT)41 3936535965J1677 414

VCC 42 4037546066J1578 -

GND 43 4138556167K1579 -

76. I/O 44 42 39 56 62 68 K16 80 420

77. I/O 45 43 40 57 63 69 K17 81 423

78. I/O - 44 41 58 64 70 K18 82 426

79.I/O - 4542596571L1883 432

80. I/O - - - - - 72 L17 84 435

81. I/O - - - - - 73 L16 85 438

82. I/O 46 46 43 60 66 74 M18 86 444

83. I/O 47 47 44 61 67 75 M17 87 447

84. I/O - - - 62 68 76 N18 88 450

85. I/O - - - 63 69 77 P18 89 456

GND - - - 64 70 78 M16 90 -

86. I/O - - - - 71 79 T18 93 459

Pin Desc ript ion PC84 PQ100 VQ100 T Q144 PQ160 TQ176 PG191 PQ208 Boundary Scan Order

November 5, 1998 (Version 5.2) 7-141

XC5200 Series Field Programmable Gate Arrays

87. I/O - - - - 72 80 P17 94 468

88. I/O 48 48 45 65 73 81 N16 95 471

89. I/O 49 49 46 66 74 82 T17 96 480

90. I/O - - - 67 75 83 R17 97 483

91. I/O - - - 68 76 84 P16 98 486

92. I/O 50 50 47 69 77 85 U18 99 492

93. I/O 51 51 48 70 78 86 T16 100 495

GND 52 52 49 71 79 87 R16 101 -

DONE 53 53 50 72 80 88 U17 103 -

VCC 54 54 51 73 81 89 R15 106 -

PROG 55 55 52 74 82 90 V18 108 -

94. I/O (D7) 5 6 56 53 75 83 91 T15 109 504

95. GCK3 (I/O) 57 57 54 76 84 92 U16 110 507

96. I/O - - - 77 85 93 T14 111 516

97. I/O - - - 78 86 94 U15 112 519

98. I/O (D6) 58 58 55 79 87 95 V17 113 522

99. I/O - 59 56 80 88 96 V16 114 528

100. I/O - - - - 89 97 T13 115 531

101. I/O - - - - 90 98 U14 116 534

GND - - - 81 91 99 T12 119 -

102. I/O - - - 82 92 100 U13 120 540

103. I/O - - - 83 93 101 V13 121 543

104. I/O (D5) 59 60 57 84 94 102 U12 122 552

105. I/O (CS0) 60 61 58 85 95 103 V12 123 555

106. I/O - - - - - 104 T11 124 558

107. I/O - - - - - 105 U11 125 564

108. I/O - 62 59 86 96 106 V11 126 567

109. I/O - 63 60 87 97 107 V10 127 570

110. I/O (D4) 61 64 61 88 98 108 U10 128 576

111. I/O 62 65 62 89 99 109 T10 129 579

VCC 63 66 63 90 100 110 R10 130 -

GND 64 67 64 91 101 111 R9 131 -

112. I/O (D3) 65 68 65 92 102 112 T9 132 58 8

113. I/O (RS) 66 69 66 93 103 113 U9 133 591

114. I/O - 70 67 94 104 114 V9 134 600

115. I/O - - - 95 105 115 V8 135 603

116. I/O - - - - - 116 U8 136 612

117. I/O - - - - - 117 T8 137 615

118. I/O (D2) 67 71 68 96 106 118 V7 138 618

119. I/O 68 72 69 97 107 119 U7 139 624

120. I/O - - - 98 108 120 V6 140 627

121. I/O - - - 99 109 121 U6 141 630

GND - - - 100 110 122 T7 142 -

122. I/O - - - - 111 123 U5 145 636

123. I/O - - - - 112 124 T6 146 639

124. I/O (D1) 69 73 70 101 113 125 V 3 147 642

125. I/O

(RCLK-BUSY/RD

70 74 71 102 114 126 V2 148 648

126. I/O - - - 103 115 127 U4 149 651

127. I/O - - - 104 116 128 T5 150 654

128. I/O (D0, DIN) 71 75 72 105 117 129 U3 151 660

129. I/O (DOUT) 72 76 73 106 118 130 T4 152 663

Pin Desc ript ion PC84 PQ100 VQ100 T Q144 PQ160 TQ176 PG191 PQ208 Boundary Scan Order

XC5200 Series Field Programmable Gate Arrays

7-142 November 5, 1998 (Version 5.2)

Additional No Conn ect (N.C .) Conn ection s for PQ2 08 and TQ176 Packag es

Notes: Boundary Scan Bit 0 = TDO.T

Boundary Scan B it 1 = TDO.O

Boundary S can B i t 1056 = BSCAN.UP D

Pin Locations for XC5210 Devices

The following table may contain pinout information for unsupported device/package combinations. Please see the

availability charts elsewhere in the XC5200 Series data sheet for availability information.

CCLK 73 77 74 107 119 131 V1 153 -

VCC 74 78 75 108 120 132 R4 154 -

130. I/O (TDO) 75 79 76 109 121 133 U2 159 -

GND 76 80 77 110 122 134 R3 160 -

131. I/O (A0, WS) 77 81 78 111 123 135 T3 161 9

132. GCK4 (A1, I/O) 78 82 79 112 124 136 U1 162 15

133. I/O - - - 113 125 137 P3 163 18

134. I/O - - - 114 126 138 R2 164 21

135. I/O (A2, CS1) 79 83 80 115 127 139 T2 165 27

136. I/O (A3) 80 84 81 116 12 8 140 N3 166 30

137. I/O - - - 117 129 141 P2 167 33

138. I/O - - - - 130 142 T1 168 42

GND - - - 118 131 143 M3 171 -

139. I/O - - - 119 132 144 P1 172 45

140. I/O - - - 120 133 145 N1 173 51

141. I/O (A4) 81 85 82 121 13 4 146 M2 174 54

142. I/O (A5) 82 86 83 122 13 5 147 M1 175 57

143. I/O - - - - - 148 L3 176 63

144. I/O - - - - 136 149 L2 177 66

145. I/O - 87 84 123 137 150 L1 178 69

146. I/O - 88 85 124 138 151 K1 179 75

147. I/O (A6) 83 89 86 125 13 9 152 K 2 180 78

148. I/O (A7) 84 90 87 126 14 0 153 K 3 181 81

GND 1 91 88 127 141 154 K4 182 -

PQ208 TQ176

195 1 39 65 104 143 158 167

196 3 51 66 105 144 169

206 12 52 91 107 155 170

207 13 53 92 117 156

208 38 54 102 118 157

Pin Desc ript ion PC84 PQ100 VQ100 T Q144 PQ160 TQ176 PG191 PQ208 Boundary Scan Order

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

VCC 2 128 142 155 183 J4 VCC* 212 -

1. I/O (A8) 3 129 143 156 184 J3 E8 213 111

2. I/O (A9) 4 130 144 157 185 J2 B7 214 114

3. I/O - 131 145 158 186 J1 A7 215 117

4. I/O - 132 146 159 187 H1 C7 216 123

5. I/O - - - 160 188 H2 D7 217 126

6. I/O - - - 161 189 H3 E7 218 129

November 5, 1998 (Version 5.2) 7-143

XC5200 Series Field Programmable Gate Arrays

7. I/O (A10) 5 133 147 162 190 G1 A6 220 135

8. I/O (A11) 6 134 148 163 191 G2 B6 221 138

VCC ------VCC*222 -

9. I/O - - - - - H4 C6 223 141

10. I/O - - - - - G4 F7 224 150

11. I/O - 135 149 164 192 F1 A5 225 153

12. I/O - 136 150 165 193 E1 B5 226 162

GND - 137 151 166 194 G3 GND* 227 -

13. I/O - - - - 195 F2 D6 228 165

14. I/O - - - 167 196 D1 C5 229 171

15. I/O - - 152 168 197 C1 A4 230 174

16. I/O - - 153 169 198 E2 E6 231 177

17. I/O (A12) 7 138 154 170 199 F3 B4 232 183

18. I/O (A13) 8 139 155 171 200 D2 D5 233 186

19. I/O - - - - - F4 A3 234 189

20. I/O - - - - - E4 C4 235 195

21. I/O - 140 156 172 201 B1 B3 236 198

22. I/O - 141 157 173 202 E3 F6 237 201

23. I/O (A14) 9 142 158 174 203 C2 A2 238 210

24. I/O (A15) 10 143 159 175 204 B2 C3 239 213

VCC 11 144 160 176 205 D3 VCC* 240 -

GND 12 1 1 1 2 D4 GND* 1 -

25. GCK1 (A16, I/O) 13 2 2 2 4 C3 D4 2 222

26. I/O (A17) 14 3 3 3 5 C4 B1 3 225

27. I/O - 4 4 4 6 B3 C2 4 231

28. I/O - 5 5 5 7 C5 E5 5 234

29. I/O (TDI) 15 6 6 6 8 A2 D3 6 237

30. I/O (TCK) 16 7 7 7 9 B4 C1 7 243

31. I/O - - 8 8 10 C6 D2 8 246

32. I/O - - 9 9 11 A3 G6 9 249

33. I/O - - - - 12 B5 E4 10 255

34. I/O - - - - 13 B6 D1 11 258

35. I/O - - - - - D5 E3 12 261

36. I/O - - - - - D6 E2 13 267

GND - 8 10 10 14 C7 GND* 14 -

37. I/O - 9 11 11 15 A4 F5 15 270

38. I/O - 10 12 12 16 A5 E1 16 273

39. I/O (TMS) 17 11 13 13 17 B7 F4 17 279

40. I/O 18 12 14 14 18 A6 F3 18 282

VCC ------VCC*19 -

41. I/O - - - - - D7 F2 20 285

42. I/O - - - - - D8 F1 21 291

43. I/O - - - 15 19 C8 G4 23 294

44. I/O - - - 16 20 A7 G3 24 297

45. I/O - 13 15 17 21 B8 G2 25 306

46. I/O - 14 16 18 22 A8 G1 26 309

47. I/O 19 15 17 19 23 B9 G5 27 318

48. I/O 20 16 18 20 24 C9 H3 28 321

GND 21 17 19 21 25 D9 GND* 29 -

VCC 2218 20 22 26D10VCC*30 -

49. I/O 23 19 21 23 27 C10 H4 31 327

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

XC5200 Series Field Programmable Gate Arrays

7-144 November 5, 1998 (Version 5.2)

50. I/O 24 20 22 24 28 B10 H5 32 330

51. I/O - 21 23 25 29 A9 J2 33 333

52. I/O - 22 24 26 30 A10 J1 34 339

53. I/O - - - 27 31 A11 J3 35 342

54. I/O - - - 28 32 C11 J4 36 345

55. I/O - - - - - D11 J5 38 351

56. I/O - - - - - D12 K1 39 354

VCC ------VCC*40 -

57. I/O 25 23 25 29 33 B11 K2 41 357

58. I/O 26 24 26 30 34 A12 K3 42 363

59. I/O - 25 27 31 35 B12 J6 43 366

60. I/O - 26 28 32 36 A13 L1 44 369

GND - 27 29 33 37 C12 GND* 45 -

61. I/O - - - - - D13 L2 46 375

62. I/O - - - - - D14 K4 47 378

63. I/O - - - - 38 B13 L3 48 381

64. I/O - - - - 39 A14 M1 49 387

65. I/O - - 30 34 40 A15 K5 50 390

66. I/O - - 31 35 41 C13 M2 51 393

67. I/O 27 28 32 36 42 B14 L4 52 399

68. I/O - 29 33 37 43 A16 N1 53 402

69. I/O - 30 34 38 44 B15 M3 54 405

70. I/O - 31 35 39 45 C14 N2 55 411

71. I/O 28 32 36 40 46 A17 K6 56 414

72. I/O 29 33 37 41 47 B16 P1 57 417

73. M1 (I/O) 30 34 38 42 48 C15 N3 58 426

GND 3135 39 43 49D15GND*59 -

74. M0 (I/O) 32 36 40 44 50 A 18 P2 60 429

VCC 3337 41 45 55D16VCC*61 -

75. M2 (I/O) 34 38 42 46 56 C16 M4 62 432

76. GCK2 (I/O) 35 39 43 47 57 B17 R2 63 435

77. I/O (HDC) 36 40 44 48 58 E16 P3 64 444

78. I/O - 41 45 49 59 C17 L5 65 447

79. I/O - 42 46 50 60 D17 N4 66 450

80. I/O - 43 47 51 61 B18 R3 67 456

81. I/O (LDC) 37 44 48 52 62 E17 P4 68 459

82. I/O - - 49 53 63 F16 K7 69 462

83. I/O - - 50 54 64 C18 M5 70 468

84. I/O - - - - 65 D18 R4 71 471

85. I/O - - - - 66 F17 N5 72 474

86. I/O - - - - - E15 P5 73 480

87. I/O - - - - - F15 L6 74 483

GND - 45 51 55 67 G16 GND* 75 -

88. I/O - 46 52 56 68 E18 R5 76 486

89. I/O - 47 53 57 69 F18 M6 77 492

90. I/O 38 48 54 58 70 G17 N6 78 495

91. I/O 39 49 55 59 71 G18 P6 79 504

VCC ------VCC*80 -

92. I/O - - - 60 72 H16 R6 81 507

93. I/O - - - 61 73 H17 M7 82 510

94. I/O - - - - - G15 N7 84 516

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

November 5, 1998 (Version 5.2) 7-145

XC5200 Series Field Programmable Gate Arrays

95. I/O - - - - - H15 P7 85 519

96. I/O - 50 56 62 74 H18 R7 86 522

97. I/O - 51 57 63 75 J18 L7 87 528

98. I/O 40 52 58 64 76 J17 N8 88 531

99. I/O (ERR, IN IT) 41 53 59 65 77 J16 P8 89 534

VCC 42 54 60 66 78 J15 VCC* 90 -

GND 43 55 61 67 79 K15 GND* 91 -

100. I/O 44 56 62 68 80 K16 L8 92 540

101. I/O 45 57 63 69 81 K17 P9 93 543

102. I/O - 58 64 70 82 K18 R9 94 546

103. I/O - 59 65 71 83 L18 N9 95 552

104. I/O - - - 72 84 L17 M9 96 555

105. I/O - - - 73 85 L16 L9 97 558

106. I/O - - - - - L15 R10 99 564

107. I/O - - - - - M15 P10 100 567

VCC ------VCC*101 -

108. I/O 46 60 66 74 86 M18 N10 102 570

109. I/O 47 61 67 75 87 M17 K9 103 576

110. I/O - 62 68 76 88 N18 R11 104 579

111. I/O - 63 69 77 89 P18 P11 105 588

GND - 64 70 78 90 M16 GND* 106 -

112. I/O - - - - - N15 M10 107 591

113. I/O - - - - - P15 N11 108 600

114. I/O - - - - 91 N17 R12 109 603

115. I/O - - - - 92 R18 L10 110 606

116. I/O - - 71 79 93 T18 P12 111 612

117. I/O - - 72 80 94 P17 M11 112 615

118. I/O 48 65 73 81 95 N16 R13 113 618

119. I/O 49 66 74 82 96 T17 N12 114 624

120. I/O - 67 75 83 97 R17 P13 115 627

121. I/O - 68 76 84 98 P16 K10 116 630

122. I/O 50 69 77 85 99 U18 R14 117 636

123. I/O 51 70 78 86 100 T16 N13 118 639

GND 52 71 79 87 101 R16 GND* 119 -

DONE 53 72 80 88 103 U17 P14 120 -

VCC 54 73 81 89 106 R15 VCC* 121 -

PROG 55 74 82 90 108 V18 M12 122 -

124. I/O (D7) 56 75 83 91 109 T15 P15 123 648

125. GCK3 (I/O) 57 76 84 92 110 U16 N14 124 651

126. I/O - 77 85 93 111 T14 L11 125 660

127. I/O - 78 86 94 112 U15 M13 126 663

128. I/O - - - - - R14 N15 127 666

129. I/O - - - - - R13 M14 128 672

130. I/O (D6) 58 79 87 95 113 V17 J10 129 675

131. I/O - 80 88 96 114 V16 L12 130 678

132. I/O - - 89 97 115 T13 M15 131 684

133. I/O - - 90 98 116 U14 L13 132 687

134. I/O - - - - 117 V15 L14 133 690

135. I/O - - - - 118 V14 K11 134 696

GND - 81 91 99 119 T12 GND* 135 -

136. I/O - - - - - R12 L15 136 699

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

XC5200 Series Field Programmable Gate Arrays

7-146 November 5, 1998 (Version 5.2)

137. I/O - - - - - R11 K12 137 708

138. I/O - 82 92 100 120 U13 K13 138 711

139. I/O - 83 93 101 121 V13 K14 139 714

VCC ------VCC*140 -

140. I/O (D5) 59 84 94 102 122 U12 K15 141 720

141. I/O (CS0) 60 85 95 103 123 V12 J12 142 723

142. I/O - - - 104 124 T11 J13 144 726

143. I/O - - - 105 125 U11 J14 145 732

144. I/O - 86 96 106 126 V11 J15 146 735

145. I/O - 87 97 107 127 V10 J11 147 738

146. I/O (D4) 61 88 98 108 128 U10 H13 148 744

147. I/O 62 89 99 109 129 T10 H14 149 747

VCC 63 90 100 110 130 R10 VCC* 150 -

GND 64 91 101 111 131 R9 GND* 151 -

148. I/O (D3) 65 92 102 112 132 T9 H12 152 756

149. I/O (RS) 66 93 103 113 133 U9 H11 153 759

150. I/O - 94 104 114 134 V9 G14 154 768

151. I/O - 95 105 115 135 V8 G15 155 771

152. I/O - - - 116 136 U8 G13 156 780

153. I/O - - - 117 137 T8 G12 157 783

154. I/O (D2) 67 96 106 118 138 V7 G11 159 786

155. I/O 68 97 107 119 139 U7 F15 160 792

VCC ------VCC*161 -

156. I/O - 98 108 120 140 V6 F14 162 795

157. I/O - 99 109 121 141 U6 F13 163 798

158. I/O - - - - - R8 G10 164 804

159. I/O - - - - - R7 E15 165 807

GND - 100 110 122 142 T7 GND* 166 -

160. I/O - - - - - R6 E14 167 810

161. I/O - - - - - R5 F12 168 816

162. I/O - - - - 143 V5 E13 169 819

163. I/O - - - - 144 V4 D15 170 822

164. I/O - - 111 123 145 U5 F11 171 828

165. I/O - - 112 124 146 T6 D14 172 831

166. I/O (D1) 69 101 113 125 147 V3 E12 173 834

167. I/O (RCLK-BUSY/RDY) 70 102 114 126 148 V2 C15 174 840

168. I/O - 103 115 127 149 U4 D13 175 843

169. I/O - 104 116 128 150 T5 C14 176 846

170. I/O (D0, DIN) 71 105 117 129 151 U3 F10 177 855

171. I/O (DOUT) 72 106 118 130 152 T4 B15 178 858

CCLK 73 107 119 131 153 V1 C13 179 -

VCC 74 108 120 132 154 R4 VCC* 180 -

172. I/O (TDO) 75 109 121 133 159 U2 A15 181 -

GND 76 110 122 134 160 R3 GND* 182 -

173. I/O (A0 , WS ) 77 111 123 135 161 T3 A14 183 9

174. GCK4 (A1, I/O) 78 112 124 136 162 U1 B13 184 15

175. I/O - 113 125 137 163 P3 E11 185 18

176. I/O - 114 126 138 164 R2 C12 186 21

177. I/O (CS1, A2) 79 115 127 139 165 T2 A13 187 27

178. I/O (A3) 80 116 128 140 166 N3 B12 188 30

179. I/O - - - - - P4 F9 189 33

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

November 5, 1998 (Version 5.2) 7-147

XC5200 Series Field Programmable Gate Arrays

Additional No Connect (N.C .) Connections for PQ208 and PQ 24 0 Packag es

Notes: * Pins labeled VCC* are internally bonded to a VCC plane within the BG225 package. The external pins are: B2, D8, H15, R8,

B14, R1, H1, and R15.

Pins labeled GND* are internally bonded to a ground plane within the BG225 package. The external pins are: A1, D12, G7,

G9, H6, H8 , H10, J8, K8, A8 , F8, G8 , H2 , H7 , H9, J7, J9, M8.

Boundary Scan B it 0 = TDO.T

Boundary Scan B it 1 = TDO.O

Boundary S can B i t 1056 = BSCAN.UP D

Pin Locations for XC5215 Devices

The following table may contain pinout information for unsupported device/package combinations. Please see the

availability charts elsewhere in the XC5200 Series data sheet for availability information.

180. I/O - - - - - N4 D11 190 39

181. I/O - 117 129 141 167 P2 A12 191 42

182. I/O - - 130 142 168 T1 C11 192 45

183. I/O - - - - 169 R1 B11 193 51

184. I/O - - - - 170 N2 E10 194 54

- ------GND* -

GND - 118 131 143 171 M3 - 196 -

185. I/O - 119 132 144 172 P1 A11 197 57

186. I/O - 120 133 145 173 N1 D10 198 66

187. I/O - - - - - M4 C10 199 69

188. I/O - - - - - L4 B10 200 75

VCC ------VCC*201 -

189. I/O (A4) 81 121 134 146 174 M2 A10 202 78

190. I/O (A5) 82 122 135 147 175 M1 D9 203 81

191. I/O - - - 148 176 L3 C9 205 87

192. I/O - - 136 149 177 L2 B9 206 90

193. I/O - 123 137 150 178 L1 A9 207 93

194. I/O - 124 138 151 179 K1 E9 208 99

195. I/O (A6) 83 125 139 152 180 K2 C8 209 102

196. I/O (A7) 84 126 140 153 181 K3 B8 210 105

GND 1 127 141 154 182 K4 GND* 211 -

PQ208 PQ240

1 53 105 157 208 22 143 219

354107158 37 158

51 102 155 206 83 195

52 104 156 207 98 204

Pin Description PC84 TQ144 PQ160 TQ176 PQ208 PG223 BG225 PQ240 Boundary Scan

Order

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

VCC 142 183 212 K1 VCC* VCC* -

1. I/O (A8) 143 184 213 K2 E8 D14 138

2. I/O (A9) 144 185 214 K3 B7 C14 141

3. I/O 145 186 215 K5 A7 A15 147

4. I/O 146 187 216 K4 C7 B15 150

5. I/O - 188 217 J1 D7 C15 153

6. I/O - 189 218 J2 E7 D15 159

7. I/O (A10) 147 190 22 0 H1 A6 A16 162

XC5200 Series Field Programmable Gate Arrays

7-148 November 5, 1998 (Version 5.2)

8. I/O (A11) 148 191 22 1 J3 B 6 B16 165

9. I/O - - - H2 - C17 171

10. I/O - - - G1 - B18 174

VCC - - 222 E1 VCC* VCC* -

11. I/O - - 223 H3 C6 C18 177

12. I/O - - 224 G2 F7 D17 183

13. I/O 149 192 225 H4 A5 A20 186

14. I/O 150 193 226 F2 B5 B19 189

GND 151 194 227 F1 GND* GND* -

15. I/O - - - H5 - C19 195

16. I/O - - - G3 - D18 198

17. I/O - 195 228 D1 D6 A21 201

18. I/O - 196 229 G4 C5 B20 207

19. I/O 152 197 230 E2 A4 C20 210

20. I/O 153 198 231 F3 E6 B21 213

21. I/O (A 12) 154 199 23 2 G5 B4 B22 219

22. I/O (A 13) 155 200 23 3 C1 D5 C21 222

23. I/O - - - F4 - D20 225

24. I/O - - - E3 - A23 234

25. I/O - - 234 D2 A3 D21 237

26. I/O - - 235 C2 C4 C22 243

27. I/O 156 201 236 F5 B3 B24 246

28. I/O 157 202 237 E4 F6 C23 249

29. I/O (A14) 158 203 23 8 D3 A2 D22 258

30. I/O (A15) 159 204 23 9 C3 C3 C24 261

VCC 160 205 240 A2 VCC* VCC* -

GND 1 2 1 B1 GND* GND* -

31. GCK1 (A16, I/O) 2 4 2 D4 D4 D23 270

32. I/O (A17) 3 5 3 B2 B1 C25 273

33. I/O 4 6 4 B3 C2 D24 279

34. I/O 5 7 5 E6 E5 E23 282

35. I/O (TDI) 6 8 6 D5 D3 C26 285

36. I/O (TCK) 7 9 7 C4 C1 E 24 294

37. I/O - - - A3 - F24 297

38. I/O - - - D6 - E25 303

39. I/O 8 10 8 E7 D2 D26 306

40. I/O 9 11 9 B4 G6 G24 309

41. I/O - 12 10 C5 E4 F25 315

42. I/O - 13 11 A4 D1 F26 318

43. I/O - - 12 D7 E3 H23 321

44. I/O - - 13 C6 E2 H24 327

45. I/O - - - E8 - G25 330

46. I/O - - - B5 - G26 333

GND 10 14 14 A5 GND* GND* -

47. I/O 11 15 15 B6 F5 J23 339

48. I/O 12 16 16 D8 E1 J24 342

49. I/ O (TM S) 13 17 17 C7 F4 H25 345

50. I/O 14 18 18 B7 F3 K23 351

VCC - - 19 A6 VCC* VCC* -

51. I/O - - 20 C8 F2 L24 354

52. I/O - - 21 E9 F1 K25 357

53. I/O - - - B8 - L25 363

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

November 5, 1998 (Version 5.2) 7-149

XC5200 Series Field Programmable Gate Arrays

54. I/O - - - A8 - L26 366

55. I/O - 19 23 C9 G4 M23 369

56. I/O - 20 24 B9 G3 M24 375

57. I/O 15 21 25 E10 G2 M25 378

58. I/O 16 22 26 A9 G1 M26 381

59. I/O 17 23 27 D10 G5 N24 390

60. I/O 18 24 28 C10 H3 N25 393

GND 19 25 29 A10 GND* GND* -

VCC 20 26 30 A11 VCC* VCC* -

61. I/O 21 27 31 B10 H4 N26 399

62. I/O 22 28 32 B11 H5 P25 402

63. I/O 23 29 33 C11 J2 P23 405

64. I/O 24 30 34 E11 J1 P24 411

65. I/O - 31 35 D11 J3 R26 414

66. I/O - 32 36 A12 J4 R25 417

67. I/O - - - B12 - R24 423

68. I/O - - - A13 - R23 426

69. I/O - - 38 E12 J5 T26 429

70. I/O - - 39 B13 K1 T25 435

VCC - - 40 A16 VCC* VCC* -

71. I/O 25 33 41 A14 K2 U24 438

72. I/O 26 34 42 C13 K3 V25 441

73. I/O 27 35 43 B14 J6 V24 447

74. I/O 28 36 44 D13 L1 U23 450

GND 29 37 45 A15 GND* GND* -

75. I/O - - - B15 - Y26 453

76. I/O - - - E13 - W25 459

77. I/O - - 46 C14 L2 W24 462

78. I/O - - 47 A17 K4 V23 465

79. I/O - 38 48 D14 L3 AA26 471

80. I/O - 39 49 B16 M1 Y25 474

81. I/O 30 40 50 C15 K5 Y24 477

82. I/O 31 41 51 E14 M2 AA25 483

83. I/O - - - A18 - AB25 486

84. I/O - - - D15 - AA24 489

85. I/O 32 42 52 C16 L4 Y23 495

86. I/O 33 43 53 B17 N1 AC26 498

87. I/O 34 44 54 B18 M3 AA23 501

88. I/O 35 45 55 E15 N2 AB24 507

89. I/O 36 46 56 D16 K6 AD25 510

90. I/O 37 47 57 C17 P1 AC24 513

91. M1 (I/O) 38 48 58 A20 N3 AB23 522

GND 39 49 59 A19 GND* GND* -

92. M0 (I/O) 40 50 60 C18 P2 AD24 525

VCC 41 55 61 B20 VCC* VCC* -

93. M2 (I/O) 42 56 62 D17 M4 AC23 528

94. GCK2 (I/O) 43 57 63 B 19 R2 AE2 4 531

95. I/O (HDC) 44 58 64 C19 P3 A D23 540

96. I/O 45 59 65 F16 L5 AC22 543

97. I/O 46 60 66 E17 N4 AF24 546

98. I/O 47 61 67 D18 R3 AD22 552

99. I/O (LDC) 4 8 62 68 C20 P4 AE23 555

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

XC5200 Series Field Programmable Gate Arrays

7-150 November 5, 1998 (Version 5.2)

100. I/O - - - F17 - AE22 558

101. I/O - - - G16 - AF23 564

102. I/O 49 63 69 D19 K7 AD20 567

103. I/O 50 64 70 E18 M5 AE21 570

104. I/O - 65 71 D20 R4 AF21 576

105. I/O - 66 72 G17 N5 AC19 579

106. I/O - - 73 F18 P5 AD19 582

107. I/O - - 74 H16 L6 AE20 588

108. I/O - - - E19 - AF20 591

109. I/O - - - F19 - AC18 594

GND 51 67 75 E20 GND* GND* -

110. I/O 52 68 76 H17 R5 AD18 600

111. I/O 53 69 77 G18 M6 AE19 603

112. I/O 54 70 78 G19 N6 AC17 606

113. I/O 55 71 79 H18 P6 AD17 612

VCC - - 80 F20 VCC* VCC* -

114. I/O - 72 81 J16 R6 AE17 615

115. I/O - 73 82 G20 M7 AE16 618

116. I/O - - - H20 - AF16 624

117. I/O - - - J18 - AC15 627

118. I/O - - 84 J19 N7 AD15 630

119. I/O - - 85 K16 P7 AE15 636

120. I/O 56 74 86 J20 R7 AF15 639

121. I/O 57 75 87 K17 L7 AD14 642

122. I/O 58 76 88 K18 N8 AE14 648

123. I/ O (ERR, INIT) 59 77 89 K19 P8 AF14 651

VCC 60 78 90 L20 VCC* VCC* -

GND 61 79 91 K20 GND* GND* -

124. I/O 62 80 92 L19 L8 AE13 660

125. I/O 63 81 93 L18 P9 AC13 663

126. I/O 64 82 94 L16 R9 AD13 672

127. I/O 65 83 95 L17 N9 AF12 675

128. I/O - 84 96 M20 M9 AE12 678

129. I/O - 85 97 M19 L9 AD12 684

130. I/O - - - N20 - AC12 687

131. I/O - - - M18 - AF11 690

132. I/O - - 99 N19 R10 AE11 696

133. I/O - - 100 P20 P10 AD11 699

VCC - - 101 T20 VCC* VCC* -

134. I/O 66 86 102 N18 N10 AE9 702

135. I/O 67 87 103 P19 K9 AD9 708

136. I/O 68 88 104 N17 R11 AC10 711

137. I/O 69 89 105 R19 P11 AF7 714

GND 70 90 106 R20 GND* GND* -

138. I/O - - - N16 - AE8 720

139. I/O - - - P18 - AD8 723

140. I/O - - 107 U20 M10 AC9 726

141. I/O - - 108 P17 N11 AF6 732

142. I/O - 91 109 T19 R12 AE7 735

143. I/O - 92 110 R18 L10 AD7 738

144. I/O 71 93 111 P16 P12 AE6 744

145. I/O 72 94 112 V20 M11 AE5 747

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

November 5, 1998 (Version 5.2) 7-151

XC5200 Series Field Programmable Gate Arrays

146. I/O - - - R17 - AD6 750

147. I/O - - - T18 - AC7 756

148. I/O 73 95 113 U19 R13 AF4 759

149. I/O 74 96 114 V19 N12 AF3 768

150. I/O 75 97 115 R16 P13 AD5 771

151. I/O 76 98 116 T17 K10 AE3 774

152. I/O 77 99 117 U18 R14 AD4 780

153. I/O 78 100 118 X20 N13 AC5 783

GND 79 101 119 W20 GND* GND* -

DONE 80 103 120 V18 P14 AD3 -

VCC 81 106 121 X19 VCC* VCC* -

PROG 82 108 122 U17 M12 AC4 -

154. I/O (D7) 83 109 123 W19 P15 AD2 792

155. GCK3 (I/O) 84 110 124 W18 N14 AC3 795

156. I/O 85 111 125 T15 L11 AB4 804

157. I/O 86 112 126 U16 M13 AD1 807

158. I/O - - 127 V17 N15 AA4 810

159. I/O - - 128 X18 M14 AA3 816

160. I/O - - - U15 - AB2 819

161. I/O - - - T14 - AC1 828

162. I/O (D6) 87 113 129 W17 J10 Y3 831

163. I/O 88 114 130 V16 L12 AA2 834

164. I/O 89 115 131 X17 M15 AA1 840

165. I/O 90 116 132 U14 L13 W4 843

166. I/O - 117 133 V15 L14 W3 846

167. I/O - 118 134 T13 K11 Y2 852

168. I/O - - - W16 - Y1 855

169. I/O - - - W15 - V4 858

GND 91 119 135 X16 GND* GND* -

170. I/O - - 136 U13 L15 V3 864

171. I/O - - 137 V14 K12 W2 867

172. I/O 92 120 138 W14 K13 U4 870

173. I/O 93 121 139 V13 K14 U3 876

VCC - - 140 X15 VCC* VCC* -

174. I/O (D5) 94 122 141 T12 K15 V2 879

175. I/O (CS0) 95 123 142 X14 J12 V1 882

176. I/O - - - X13 - T1 888

177. I/O - - - V12 - R4 891

178. I/O - 124 144 W12 J13 R3 894

179. I/O - 125 145 T11 J14 R2 900

180. I/O 96 126 146 X12 J15 R1 903

181. I/O 97 127 147 U11 J11 P3 906

182. I/O (D4) 98 128 148 V11 H13 P2 912

183. I/O 99 129 149 W11 H14 P1 915

VCC 100 130 150 X10 VCC* VCC* -

GND 101 131 151 X11 GND* GND* -

184. I/O (D3) 102 132 152 W10 H12 N2 924

185. I/O (RS) 103 133 153 V10 H11 N4 927

186. I/O 104 134 154 T10 G14 N3 936

187. I/O 105 135 155 U10 G15 M1 939

188. I/O - 136 156 X9 G13 M2 942

189. I/O - 137 157 W9 G12 M3 948

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

XC5200 Series Field Programmable Gate Arrays

7-152 November 5, 1998 (Version 5.2)

190. I/O - - - X8 - M4 951

191. I/O - - - V9 - L1 954

192. I/O (D2) 106 138 159 W8 G11 J1 960

193. I/O 107 139 160 X7 F15 K3 963

VCC - - 161 X5 VCC* VCC*

194. I/O 108 140 162 V8 F14 J2 966

195. I/O 109 141 163 W7 F13 J3 972

196. I/O - - 164 U8 G10 K4 975

197. I/O - - 165 W6 E15 G1 978

GND 110 142 166 X6 GND* GND*

198. I/O - - - T8 - H2 984

199. I/O - - - V7 - H3 987

200. I/O - - 167 X4 E14 J4 990

201. I/O - - 168 U7 F12 F1 996

202. I/O - 143 169 W5 E13 G2 999

203. I/O - 144 170 V6 D15 G3 1002

204. I/O 111 145 171 T7 F11 F2 1008

205. I/O 112 146 172 X3 D14 E2 1011

206. I/O (D1) 113 147 173 U6 E12 F3 1014

207. I/O (RCLK-BUSY/RDY) 114 148 174 V5 C15 G4 1020

208. I/O - - - W4 - D2 1023

209. I/O - - - W3 - F4 1032

210. I/O 115 149 175 T6 D13 E3 1035

211. I/O 116 150 176 U5 C14 C2 1038

212. I/O (D0, DIN) 117 151 177 V4 F10 D3 1044

213. I/O (DOUT) 118 152 178 X1 B15 E4 1047

CCLK 119 153 179 V3 C13 C3 -

VCC 120 154 180 W1 VCC* VCC* -

214. I/O (TDO) 121 159 181 U4 A15 D4 0

GND 122 160 182 X2 GND* GND* -

215. I/O (A0, WS) 123 161 183 W2 A14 B3 9

216. GCK4 (A1, I/O ) 124 162 184 V2 B13 C4 15

217. I/O 125 163 185 R5 E11 D5 18

218. I/O 126 164 186 T4 C12 A3 21

219. I/O (A2, CS1) 127 165 187 U3 A13 D6 27

220. I/O (A3) 128 166 188 V1 B12 C6 30

221. I/O - - - R4 - B5 33

222. I/O - - - P5 - A4 39

223. I/O - - 189 U2 F9 C7 42

224. I/O - - 190 T3 D11 B6 45

225. I/O 129 167 191 U1 A12 A6 51

226. I/O 130 168 192 P4 C11 D8 54

227. I/O - 169 193 R3 B11 B7 57

228. I/O - 170 194 N5 E10 A7 63

229. I/O - - 195 T2 - D9 66

230. I/O - - - R2 - C9 69

GND 131 171 196 T1 GND* GND* -

231. I/O 132 172 197 N4 A11 B8 75

232. I/O 133 173 198 P3 D10 D10 78

233. I/O - - 199 P2 C10 C10 81

234. I/O - - 200 N3 B10 B9 87

VCC - - 201 R1 VCC* VCC* -

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

November 5, 1998 (Version 5.2) 7-153

XC5200 Series Field Programmable Gate Arrays

Additional No Conn ect (N.C.) Con n ection s for HQ 208 an d HQ 240 Packages

Notes: * Pins labeled VCC* are internall y bonded to a VCC plane wi thin the BG22 5 and B G 352 packages . The ex ternal pins for t he

BG225 are: B2, D8, H15, R8, B14, R1, H1, and R15. The external pins for the BG352 are: A10, A17, B2, B25, D13, D19, D7,

G23, H4, K1, K2 6, N2 3, P 4, U1, U26, W23, Y4, AC1 4, AC20, AC8, AE2, AE2 5, AF10, and AF17.

Pins labeled GND* are internally bonded to a ground plane within the BG225 and BG352 packages. The external pins for the

BG225 are: A1, D12, G7, G9, H6, H8, H10, J8, K8, A8, F8, G8, H2, H7, H9, J7, J9, M8. The external pins for the BG352 are:

A1, A2, A5, A8, A14, A19, A22, A25, A26, B1, B26, E1, E26, H1, H26, N1, P26, W1, W26, AB1, AB26, AE1, AE26, AF1,

AF13, AF19, AF2, AF22, AF25, AF26, AF5, AF8.

Boundary Scan B it 0 = TDO.T

Boundary Scan B it 1 = TDO.O

Boundary S can B i t 1056 = BSCAN.UP D

235. I/O - - - M5 - B11 90

236. I/O - - - P1 - A11 93

237. I/ O (A4) 134 174 202 N1 A10 D12 99

238. I/ O (A 5) 135 175 20 3 M 3 D9 C12 102

239. I/O - 176 205 M2 C9 B12 105

240. I/O 136 177 206 L5 B9 A12 111

241. I/O 137 178 207 M1 A9 C13 114

242. I/O 138 179 208 L4 E9 B13 117

243. I/ O (A 6) 139 180 20 9 L3 C8 A13 126

244. I/ O (A 7) 140 181 21 0 L2 B8 B14 129

GND 141 182 211 L1 GND* GND* -

HQ208 HQ240

206 102 219

207 104 22

208 105 37

1 107 83

3 155 98

51 156 143

52 157 158

53 158 204

54 - -

Pin Descri p tion PQ1 60 HQ20 8 HQ240 PG299 BG225 BG35 2 Boun d ar y Scan O r der

XC5200 Series Field Programmable Gate Arrays

7-154 November 5, 1998 (Version 5.2)

Product Availability

User I/O Per Package

Ordering Information

PINS 64 84 100 100 144 156 160 176 191 208 208 223 225 240 240 299 352

TYPE

Plast.

VQFP

Plast.

PLCC

Plast.

PQFP

Plast.

VQFP

Plast.

TQFP

Ceram.

PGA

Plast.

PQFP

Plast.

TQFP

Ceram.

PGA

High-Perf.

QFP

Plast.

PQFP

Ceram.

PGA

Plast.

BGA

High-Perf.

QFP

Plast.

PQFP

Ceram.

PGA

Plast.

BGA

CODE

VQ64*

PC84

PQ100

VQ100

TQ144

PG156

PQ160

TQ176

PG191

HQ208

PQ208

PG223

BG225

HQ240

PQ240

PG299

BG352

XC5202

-6 CI CI CI CI CI CI

-5 CI CI CI CI CI CI

-4CCCCCC

-3CCCCCC

XC5204

-6 CI CI CI CI CI CI

-5 CI CI CI CI CI CI

-4 CCCCCC

-3 CCCCCC

XC5206

-6 CI CI CI CI CI CI CI CI

-5 CI CI CI CI CI CI CI CI

-4 CCCC CCC C

-3 CCCC CCC C

XC5210

-6 CI CI CI CI CI CI CI CI

-5 CI CI CI CI CI CI CI CI

-4 C C CC CCC C

-3 C C CC CCC C

XC5215

-6 CI CI CI CI CI CI

-5 CCCCCC

-4 CCCCCC

-3 CCCCCC

7/8/98

C = Commercial TJ = 0° to +85°C

I= Industrial TJ = -40°C to +100°C

* VQ64 package support s Master Seri al , S la ve S eri al , and Express configur at ion modes only.

Device Max

I/O Package Type

VQ64 PC84 PQ100 VQ100 TQ144 PG156 PQ160 TQ176 PG191 HQ208 PQ208 PG223 BG225 HQ240 PQ240 PG299 BG352

XC5202 84 52 65 81 81 84 84

XC5204 124 65 81 81 117 124 124

XC5206 148 65 81 81 117 133 148 148 148

XC5210 196 65 117 133 149 164 196 196 196

XC5215 244 133 164 196 197 244 244

7/8/98

XC5210-6PQ208C

Package Type

Number of Pins

Temperature Range

Speed Grade

Device Type

Example:

November 5, 1998 (Version 5.2) 7-155

XC5200 Series Field Programmable Gate Arrays

Revisions

Version Description

12/97 Rev 5.0 added -3, -4 specificati on

7/98 Rev 5.1 added Spartan family to compar ison, removed HQ304

11/98Rev 5.2 All specifications made final.