XC9267 Series ETR05054-002 36V Operation 600mA Synchronous Step-Down DC/DC Converters GENERAL DESCRIPTION The XC9267 series are 36V operation synchronous step-down DC/DC converter ICs with a built-in P-channel MOS driver transistor and N-channel MOS switching transistor. The XC9267 series has operating voltage range of 3.0V~36.0V and high-efficiency power supply up to an output current of 600mA. Low ESR capacitors such as ceramic capacitors can be used for the load capacitor (CL). A 0.75V reference voltage source is incorporated in the IC, and the output voltage can be set to a value from 1.0V to 25.0V using external resistors (RFB1, RFB2). 1.2MHz or 2.2MHz can be selected for the switching frequency. The soft-start time is internally set to 2.0ms (TYP.), but can be adjusted to set a longer time using an external resistor and capacitor. With the built-in UVLO function, the driver transistor is forced OFF when input voltage becomes 2.7V or lower. The output state can be monitored using the power good function. Internal protection circuits include over current protection and thermal shutdown circuits to enable safe use. APPLICATIONS FEATURES : 3.0 ~ 36V (Absolute Max 40V) Electric Meter Input Voltage Range Gas Detector Output Voltage Range Various Sensor FB Voltage : 0.75V1.5% Oscillation Frequency : 1.2MHz, 2.2MHz Output Current : 600mA Control Methods : PWM control Soft-start Time : Adjustable by RC Protection Circuits : Over Current Protection : Thermal Shutdown Output Capacitor : Ceramic Capacitor Operating Ambient Temperature : - 40 ~ + 105 Packages : SOT-89-5 (Without Power Good) : USP-6C (With Power Good) Industrial Equipment Home appliance 1.0 ~ 25V Efficiency88%@12V5V, 300mA Environmentally Friendly TYPICAL APPLICATION CIRCUIT EU RoHS Compliant, Pb Free TYPICAL PERFORMANCE CHARACTERISTICS XC9267B75Cxx (VIN=12V, VOUT=5V, fOSC=1.2MHz) L CIN 2.2F CFB EN/SS L=6.8H(CLF5030NIT-6R8), CIN=4.7Fx2(C2012X6S1H475K) CL=10Fx2 (C3216X7R1E106K) Lx 100 RFB1 90 FB CL RFB2 RPG GN D PG 10Fx2 Efficiency :EFFI[%] VIN 80 70 60 50 40 30 20 10 0 0.1 1 10 100 1000 Output Current :IOUT[mA] 1/30 XC9267 Series BLOCK DIAGRAM XC9267 Series Diodes inside the circuit are an ESD protection diodes and a parasitic diodes. 2/30 XC9267 Series PRODUCT CLASSIFICATION Ordering Information XC9267-(*1) PWM control DESIGNATOR ITEM SYMBOL Type B Refer to Selection Guide FB Voltage 75 0.75V C 1.2MHz D 2.2MHz Oscillation Frequency - (*1) Packages DESCRIPTION PR-G(*1) SOT-89-5 (1,000pcs/Reel) ER-G(*1) USP-6C (3,000pcs/Reel) The "-G" suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. Selection Guide B TYPE FUNCTION SOT-89-5 USP-6C Chip Enable Yes Yes UVLO Yes Yes Thermal Shutdown Yes Yes Soft Start Yes Yes Power-Good - Yes Current Limitter (Automatic Recovery) Yes Yes 3/30 XC9267 Series PIN CONFIGURATION VIN EN/SS 5 2 4 6 1 Lx EN/SS 5 2 GND PG 4 3 FB VIN 1 2 3 Lx GND FB SOT-89-5 (TOP VIEW) USP-6C (BOTTOM VIEW) * The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 2) pin. PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 1 Lx Switching Output 2 2 GND Ground 3 3 FB Output Voltage Sense - 4 PG Power-good Output 4 5 EN/SS Enable Soft-start 5 6 VIN Power Input SOT-89-5 USP-6C 1 4/30 XC9267 Series FUNCTION CHART PIN NAME EN/SS (*1) SIGNAL STATUS L Stand-by H Active OPEN Undefined State(*1) Please do not leave the EN/SS pin open. Each should have a certain voltage PIN NAME PG CONDITION SIGNAL VFB > VPGDET H (High impedance) VFB VPGDET L (Low impedance) EN/SS = H Thermal Shutdown L (Low impedance) EN/SS = L UVLO (VIN < VUVLO1) Stand-by Undefined State L (Low impedance) ABSOLUTE MAXIMUM RATINGS Ta=25 PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ +40 V EN/SS Pin Voltage VEN/SS -0.3 ~ +40 V FB Pin Voltage VFB -0.3 ~ +6.2 V PG Pin Voltage(*1) VPG -0.3 ~ +6.2 V PG Pin Current(*1) IPG 8 Lx Pin Voltage VLx Lx Pin Current ILx Power Dissipation SOT-89-5 USP-6C(DAF) Pd -0.3 ~ VIN + 0.3 or +40 mA (*2) 1800 1750 (JESD51-7 board) (*4) 1250 (JESD51-7 board) (*4) V mA mW Surge Voltage VSURGE +46(*3) V Operating Ambient Temperature Topr -40 ~ +105 Storage Temperature Tstg -55 ~ +125 * All voltages are described based on the GND pin. (*1) For the USP-6C Package only. (*2) The maximum value should be either V +0.3 or 40 in the lowest. IN (*3) Applied Time400ms (*4) The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. 5/30 XC9267 Series ELECTRICAL CHARACTERISTICS XC9267series PARAMETER Ta=25 SYMBOL CONDITIONS VFB=0.739V0.761V, VFB Voltage when Lx pin voltage changes from"H" level to "L" level MIN. TYP. MAX. UNIT CIRCUIT 0.739 0.750 0.761 V FB Voltage VFBE Setting Output Voltage Range (*1) VOUTSET - 1 - 25 V - Operating Input Voltage Range (*1) VIN - 3 - 36 V - UVLO Detect Voltage VUVLOD VEN/SS=12V,VIN:2.8V2.6V,VFB=0V VIN Voltage which Lx pin voltage holding "H" level 2.6 2.7 2.8 V UVLO Release Voltage VUVLOR VEN/SS=12V,VIN:2.7V2.9V,VFB=0V VIN Voltage which Lx pin voltage holding "L" level 2.7 2.8 2.9 V Quiescent Current Iq XC9267B75C - 180 350 - 290 500 A XC9267B75D Stand-by Current ISTBY VIN=12V, VEN/SS=VFB=0V - 1.65 2.50 A XC9267B75C 1.098 1.200 1.302 fOSC Connected to external components, IOUT=200mA MHz XC9267B75D 2.013 2.200 2.387 Oscillation Frequency VFB=0.825V Minimum On Time tONMIN Connected to external components - 85 (*2) - ns Minimum Duty Cycle DMIN VFB=0.825V - - 0 % Maximum Duty Cycle DMAX VFB=0.675V 100 - - % Lx SW "H" On Resistance RLxH VFB=0.675V, ILx=200mA 1.20 1.38 (*2) - - 0.60 Lx SW "L" On Resistance RLxL Highside Current Limit (*3) ILIMH VFB=VFBEx0.98 1.00 1.30 - A Internal Soft-Start Time tSS1 VFB=0.675V 1.6 2.0 2.4 ms External Soft-Start Time tSS2 VFB=0.675V RSS=430K, CSS=0.47F 21 26 33 ms 0.638 0.675 0.712 V VFB=0.712V0.638V, RPG:100k pull-up to 5V VFB Voltage when PG pin voltage changes from"H" level to "L" level PG detect voltage (*4) VPGDET PG Output voltage (*4) VPG VFB=0.6V, IPG=1mA - - 0.3 V Efficiency (*5) EFFI Connected to external components, VIN=12V, VOUT=5V, IOUT=300mA - 88 - % FB Voltage Temperature Characteristics VFB/ (ToprVFBE) -40Topr105 - 100 - ppm/ Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V, VPG:OPEN (*4) Peripheral parts connection conditions L=6.8H,RFB1=680k,RFB2=120k,CFB=18pF,CL=10Fx2parallel, CIN=2.2F (*1) Please use within the range of VOUT/VINtONMIN[ns]xfOSC[MHz]x10-3 (*2) Design reference value. This parameter is provided only for reference. (*3) Current limit denotes the level of detection at peak of coil current. (*4) For the USP-6C Package only. (*5) EFFI = {(output voltage) x (output current)} / {(input voltage) x (input current)} x 100 6/30 XC9267 Series ELECTRICAL CHARACTERISTICS(Continued) XC9267 series Ta=25 ARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT FB "H" Current IFBH VIN=VEN/SS=36V, VFB=3.0V -0.1 - 0.1 A FB "L" Current IFBL VIN=VEN/SS=36V, VFB=0V -0.1 - 0.1 A EN/SS "H" Voltage VEN/SSH VEN/SS=0.3V2.5V, VFB=0.71V VEN/SS Voltage when Lx pin voltage changes from "L" level to "H" level 2.5 - 36 V EN/SS "L" Voltage VEN/SSL VEN/SS=2.5V0.3V, VFB=0.71V VEN/SS Voltage when Lx pin voltage changes from "H" level to "L" level - - 0.3 V EN/SS "H" Current IEN/SSH VIN=VEN/SS=36V, VFB=0.825V - 0.1 0.3 A EN/SS "L" Current IEN/SSL VIN=36V, VEN/SS=0V, VFB=0.825V -0.1 - 0.1 A Thermal Shutdown Temperature TTSD Junction Temperature - 150 - - Hysteresis Width THYS Junction Temperature - 25 - - Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V, VPG:OPEN (*4) (*4) For the USP-6C Package only. 7/30 XC9267 Series TEST CIRCUITS CIRCUIT VIN A Probe EN/SS L V VOUT Lx V CFB PG CIN A RFB1 CL FB V GND RFB2 CIRCUIT Probe VIN V Probe EN/SS CIN Lx V PG FB V GND V V 100k CIRCUIT Probe VIN RSS =430k Probe EN/SS V CIN Lx V PG FB V GND CSS =0.47F * PG Pin is USP-6C Package only. 8/30 V 100k XC9267 Series TEST CIRCUITS(Continued) CIRCUIT VIN A EN/SS A Lx V V PG FB A GND V CIRCUIT Probe VIN V Probe EN/SS CIN V Lx RPG =100k PG FB V GND V V Probe * PG Pin is USP-6C Package only. 9/30 XC9267 Series TYPICAL APPLICATION CIRCUIT L VIN Lx CIN RFB1 CFB EN/SS FB CL RFB2 RPG GND PG Inductance value setting For the XC9267 Series, operation is optimized by setting the following inductance value according to the set frequency and setting output voltage. fOSCSET: Frequency setting , VOUTSET: Output voltage setting Typical Examples fOSCSET conditions 1VVOUTSET2V 2VVOUTSET3.3V 1.2MHz 3.3VVOUTSET6V 6VVOUTSET25V L 1VVOUTSET2V 2VVOUTSET3.3V 2.2MHz 2.2MHz CL 10/30 - TDK CLF5030NIT-3R3N Coilcraft XEL4030-332ME Taiyo Yuden NRS4018T3R3MDGJ Tokyo Coil SHP0420P-F3R3NAP TDK CLF5030NIT-4R7N Coilcraft XEL4030-472ME Taiyo Yuden NRS5024T4R7MMGJ Tokyo Coil SHP0530P-F4R7AP TDK CLF5030NIT-6R8N Coilcraft XEL4030-682ME Taiyo Yuden NRS5024T6R8MMGJ Tokyo Coil SHP0530P-F6R8AP TDK CLF5030NIT-100N Taiyo Yuden NRS5040T100MMGJ Tokyo Coil SHP0530P-F100AP TDK CLF5030NIT-1R5N Coilcraft XEL4030-152ME Taiyo Yuden NRS4018T1R5NDGJ Tokyo Coil SHP0420P-F1R6NAP TDK CLF5030NIT-2R2N Coilcraft XEL4030-222ME Taiyo Yuden NRS4018T2R2MDGJ Tokyo Coil SHP0420P-F2R2NAP TDK CLF5030NIT-3R3N VALUE 3.3H 4.7H 6.8H 10H 1.5H 1.6H 2.2H XEL4030-332ME Taiyo Yuden NRS4018T3R3MDGJ Tokyo Coil SHP0420P-F3R3NAP TDK CLF5030NIT-4R7N Coilcraft XEL4030-472ME Taiyo Yuden NRS5024T4R7MMGJ Tokyo Coil SHP0530P-F4R7AP VIN20V TDK C2012X6S1H475K125AC 4.7F/50V VIN20V TDK C2012X6S1H475K125AC 4.7F/50V 2parallel VIN20V TDK C2012X7R1H225K125AC 2.2F/50V VIN20V TDK C2012X7R1H225K125AC 2.2F/50V 2parallel C2012X7R1A106K125AC 10F/10V 2parallel C3216X7R1E106K160AB 10F/25V 2parallel C3225X7R1H106M250AC 10F/50V 2parallel 6VVOUTSET25V CIN PRODUCT NUMBER Coilcraft 3.3VVOUTSET6V 1.2MHz MANUFACTURER - TDK 3.3H 4.7H XC9267 Series TYPICAL APPLICATION CIRCUIT(Continued) < Output voltage setting > The output voltage can be set by adding an external dividing resistor. The output voltage is determined by the equation below based on the values of RFB1 and RFB2. VOUT=0.75Vx (RFB1+RFB2)/RFB2 With RFB2200k and RFB1+RFB21M <CFB setting> Adjust the value of the phase compensation speed-up capacitor CFB using the equation below. C FB = A target value for fzfb of about fzfb = 1 2 x fzfb x RFB1 1 is optimum. 2 C L x L Setting Example To set output voltage to 5V with fosc=1.2MHz, CL=10Fx2, L=6.8H When RFB1=680k, RFB2=120k, VOUTSET=0.75Vx (680k+120k) / 120k=5.0V And fzfb is set to a target of 13.65 kHz using the above equation, CFB=1/ (2xx13.65 kHzx680k) =17.15pF. A capacitor of E24 series is 18pF. XC9267B75Cxx / fOSC=1.2MHz XC9267B75Dxx / fOSC=2.2MHz VOUTSET RFB1 RFB2 L CFB fzfb VOUTSET RFB1 RFB2 L CFB fzfb 1.2V 120k 200k 3.3H 68pF 19.6kHz 1.2V 120k 200k 1.5H 47pF 29.1kHz 3.3V 510k 150k 4.7H 18pF 16.4kHz 3.3V 510k 150k 2.2H 12pF 24.0kHz 5.0V 680k 120k 6.8H 18pF 13.7kHz 5.0V 680k 120k 3.3H 12pF 19.6kHz 12V 360k 24k 10H 39pF 11.3kHz 12V 360k 24k 4.7H 27pF 16.4kHz <Soft-start Time Setting> The soft-start time can be adjusted by adding a capacitor and a resistor to the EN/SS pin. Soft-start time (tSS2) is approximated by the equation below according to values of VEN/SS, RSS, and CSS. tss2=CssxRssx ln ( VEN/SS / (VEN/SS-1.45) ) Setting Example When CSS=0.47F, RSS=430k and VEN/SS=12V, tSS2=0.47x10-6 x 430 x 103 x (ln (12/ (12-1.45)) =26ms (Approx.) *The soft-start time is the time from the start of VEN/SS until the output voltage reaches 90% of the set voltage. If the EN/SS pin voltage rises steeply without connecting CSS and RSS (RSS=0), Output rises with taking the soft-start time of tSS1=2.0ms (TYP.) which is fixed internally. RSS EN/SS VEN/SS VEN/SS CSS 90 % of se tting voltage VOUT tSS1 tSS2 11/30 XC9267 Series OPERATIONAL EXPLANATION The XC9267 series consists internally of a reference voltage supply with soft-start function, error amp, PWM comparator, ramp wave circuit, oscillator circuit, phase compensation (Current feedback) circuit, current limiting circuit, current limit PFM circuit, High-side driver Tr., Low-side driver Tr., buffer drive circuit, internal power supply (LocalReg) circuit, under-voltage lockout (UVLO) circuit, gate clamp (CLAMP) circuit, thermal shutdown (TSD) circuit, power good comparator, PWM control block and other elements. The voltage feedback from the FB pin is compared to the internal reference voltage by the error amp, the output from the error amp is phase compensated, and the signal is input to the PWM comparator to determine the ON time of switching during PWM operation. The output signal from the error amp is compared to the ramp wave by the PWM comparator, and the output is sent to the buffer drive circuit and output from the LX pin as the duty width of switching. This operation is performed continuously to stabilize the output voltage. The driver transistor current is monitored at each switching by the phase compensation (Current feedback) circuit, and the output signal from the error amp is modulated as a multi-feedback signal. This allows a stable feedback system to be obtained even when a low ESR capacitor such as a ceramic capacitor is used, and this stabilizes the output voltage. XC9267 Series VIN Current SENSE LocalReg EN/SS Chip Enable each circuit Thermal Shutdown High Side Buffer Operation Enable Lx Low Side Buffer each circuit + + Err Amp FB Current Limit Gate CLAMP Under Voltage Lock Out Vref Soft Start Current feed back PWM Comparator - PWM Control LOGIC GND - Ramp Wave Oscillator - PG (USP-6C Package Only) + PowerGood Comparator * Diodes inside the circuits are ESD protection diodes and parasitic diodes. <Reference voltage source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. <Oscillator circuit> The oscillator circuit determines switching frequency.1.2MHz or 2.2MHz is available for the switching frequency. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation. <Error amplifier> The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal voltage divider, RFB1 and RFB2. When a voltage is lower than the reference voltage, then the voltage is fed back, the output voltage of the error amplifier increases. The error amplifier output is fixed internally to deliver an optimized signal to the mixer. 12/30 XC9267 Series OPERATIONAL EXPLANATION(Continued) <Current limiting> The current limiting circuit of the XC9267 series monitors the current that flows through the High-side driver transistor and Low-side driver transistor, and when over-current is detected, the current limiting function activates. (1) High-side driver Tr. current limiting The current in the High-side driver Tr. is detected to equivalently monitor the peak value of the coil current. The High-side driver Tr. current limiting function forcibly turns off the High-side driver Tr. when the peak value of the coil current reaches the Highside driver current limit value ILIMH. High-side driver Tr. current limit value ILIMH=1.3A (TYP.) (2) Low-side driver Tr. current limiting The current in the Low-side driver Tr. is detected to equivalently monitor the bottom value of the coil current. The Low-side driver Tr. current limiting function operates when the High-side driver Tr. current limiting value reaches ILIMH. The Low-side driver Tr. current limiting function prohibits the High-side driver Tr. from turning on in an over-current state where the bottom value of the coil current is higher than the Low-side driver Tr. current limit value ILIML. Low side driver Tr. current limit value ILIML=0.9A (TYP.) The current foldback circuit operates control to lower the switching frequency fOSC. When the over-current state is released, normal operation resumes. Current Limit ILIMH=1.3A(TYP.) ILIML=0.9A(TYP.) ILX 0A VLX VOUT 0V 13/30 XC9267 Series OPERATIONAL EXPLANATION(Continued) <Soft-start function> The output voltage of XC9267 rises with soft start by slowly raising the reference voltage. The rise time of this reference voltage is the soft start time. The soft-start time is set to tss1 (TYP. 2.0ms) which is fixed internally or to the time set by adding a capacitor and a resistor to the EN / SS pin whichever is later. <Thermal shutdown> The thermal shutdown (TSD) as an over temperature limit is built in the XC9267 series. When the junction temperature reaches the detection temperature, the driver transistor is forcibly turned off. When the junction temperature falls to the release temperature while in the output stop state, restart takes place by soft-start. <UVLO> When the VIN pin voltage falls below VUVLO1 (TYP. 2.7V), the driver transistor is forcibly turned off to prevent false pulse output due to instable operation of the internal circuits. When the VIN pin voltage rises above VUVLO2 (TYP. 2.8V), the UVLO function is released, the soft-start function activates, and output start operation begins. Stopping by UVLO is not shutdown; only pulse output is stopped and the internal circuits continue to operate. <Power good> On USP-6C Package, the output state can be monitored using the power good function. The PG pin is an Nch open drain output, therefore a pull-up resistance (approx. 100k) must be connected to the PG pin. CONDITIONS EN/SS=H EN/SS=L 14/30 VFB > VPGDET VFB VPGDET Thermal Shutdown UVLO (VIN < VUVLO1) Stand-by SIGNAL H (High impedance) L (Low impedance) L (Low impedance) Undefined State L (Low impedance) XC9267 Series NOTE ON USE 1) In the case of a temporary and transient voltage drop or voltage rise. If the absolute maximum ratings are exceeded, the IC may be deteriorate or destroyed. Case 1 If a voltage exceeding the absolute maximum rating is applied to this IC due to chattering by a mechanical switch or an external surge voltage, etc., take measures using a protection circuit such as TVS. L VIN Lx CIN CFB EN/SS RFB1 FB CL TVS RFB2 RPG GN D PG Case 2 Under conditions where the input voltage is less than the output setting voltage, the absolute maximum rating of the Lx pin may be exceeded, and an overcurrent may flow in the parasitic diode inside the IC. If excessive current flows in the parasitic diode, take measures such as adding the SBD between VOUT and VIN. SBD VOUT L VIN Lx CIN CFB EN/SS RFB1 FB CL RFB2 RPG GN D PG 2) Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded. 3) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which components to select. Be especially careful of the capacitor characteristics and use X7R or X5R (EIA standard) ceramic capacitors. The capacitance decrease caused by the bias voltage may become remarkable depending on the external size of the capacitor. 4) The DC/DC converter of this IC uses a current-limiting circuit to monitor the coil peak current. If the potential dropout voltage is large or the load current is large, the peak current will increase, which makes it easier for current limitation to be applied which in turn could cause the operation to become unstable. When the peak current becomes large, adjust the coil inductance and sufficiently check the operation. The following formula is used to show the peak current. Peak Current: Ipk = (VIN - VOUT) x VOUT / VIN / (2 x L x fOSC) + IOUT L: Coil Inductance [H] fOSC: Oscillation Frequency [Hz] IOUT: Load Current [A] 5) If there is a large dropout voltage, a circuit delay could create the ramp-up of coil current with staircase waveform exceeding the current limit. 6) Even in the PWM control, the intermittent operation occurs and the ripple voltage becomes higher, when the minimum On Time is faster than 85ns (typ.) as well as the dropout voltage is large and output current is small. 15/30 XC9267 Series NOTE ON USE(Continued) 7 The ripple voltage could be increased when switching from discontinuous conduction mode to continuous conduction mode and at switching to 100% Duty cycle. Please evaluate IC well on customer's PCB. 8) If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the soft start function may not work properly and it may cause the larger inrush current and bigger ripple voltages. 9) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 10) Instructions of pattern layouts The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible. (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and GND pins. (2) Please mount each external component as close to the IC as possible. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. (4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Please note that internal driver transistors bring on heat because of the load current and ON resistance of Highside driver transistor, Lowside driver transistor. Please make sure that the heat is dissipated properly, especially at higher temperatures. 16/30 XC9267 Series <Reference Pattern Layout> USP-6C Layer 1 Layer 2 Layer 3 Layer 4 SOT-89-5 Layer 1 Layer 2 Layer 3 Layer 4 17/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current XC9267B75Cxx (VIN =12V, VOUT=3.3V, fOSC=1.2MHz) XC9267B75Cxx (VIN =12V, VOUT=5V, fOSC =1.2MHz) 100 90 80 70 60 50 40 30 20 10 0 L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) Efficiency :EFFI[%] Efficiency :EFFI[%] L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 0.1 1 10 100 100 90 80 70 60 50 40 30 20 10 0 0.1 1000 Output Current :IOUT [mA] 100 90 80 70 60 50 40 30 20 10 0 Efficiency :EFFI[%] Efficiency :EFFI[%] 100 1000 L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1 10 100 Output Current :IOUT [mA] 10 XC9267B75Dxx (VIN =12V, VOUT=5V, fOSC =2.2MHz) XC9267B75Dxx (VIN =12V, VOUT=3.3V, OSC=2.2MHz) 0.1 1 Output Current :IOUT [mA] 100 90 80 70 60 50 40 30 20 10 0 0.1 1000 1 10 100 1000 Output Current :IOUT [mA] (2) Output Voltage vs. Output Current XC9267B75Cxx (VIN =12V, VOUT=3.3V, fOSC=1.2MHz) XC9267B75Cxx (VIN =12V, VOUT=5V, fOSC =1.2MHz) L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 3.60 5.30 3.50 5.20 Output Voltage : V OUT [V] Output Voltage : V OUT [V] L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 3.40 3.30 3.20 3.10 3.00 1 18/30 10 100 Output Current :IOUT [mA] 1000 5.10 5.00 4.90 4.80 4.70 1 10 100 Output Current :IOUT [mA] 1000 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Output Current XC9267B75Dxx (VIN =12V, VOUT=3.3V, fOSC=2.2MHz) XC9267B75Dxx (VIN =12V, VOUT=5V, fOSC =2.2MHz) L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 3.60 5.30 3.50 5.20 Output Voltage : V OUT [V] Output Voltage : V OUT [V] L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 3.40 3.30 3.20 3.10 3.00 1 10 100 Output Current :IOUT [mA] 5.10 5.00 4.90 4.80 4.70 1 1000 10 100 1000 Output Current :IOUT [mA] XC9267B75Cxx (VIN =12V, VOUT=5V, fOSC =1.2MHz) XC9267B75Dxx (VIN =12V, VOUT=5V, fOSC =2.2MHz) L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 100 90 80 70 60 50 40 30 20 10 0 100 90 80 70 60 50 40 30 20 10 0 Ripple Voltage :Vr[mV] Ripple Voltage :Vr[mV] (3) Ripple Voltage vs. Output Current 0.1 1 10 100 1000 0.1 1 10 (4) FB Voltage vs. Ambient Temperature XC9267B75xxx FB Voltage :V FB [V] 0.755 0.750 0.745 0.740 -25 0 25 50 75 100 Ambient Temperature :Ta[] 125 UVLO Voltage :V UVLO1,V UVLO2[V] VIN=12V -50 1000 (5) UVLO Voltage vs. Ambient Temperature XC9267B75xxx 0.760 100 Output Current :IOUT [mA] Output Current :IOUT [mA] 3.0 VUVLO 1(Dete ctVoltage ) 2.9 VUVLO 2(ReleaseVo ltag e) 2.8 2.7 2.6 2.5 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[] 19/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Oscillation Frequency vs. Ambient Temperature XC9267B75Dxx (fOSC =2.2MHz) VIN=12V 1440 1360 1280 1200 1120 1040 960 -50 -25 0 25 50 75 100 125 Oscillation Frequency:f OSC[kHz] Oscillation Frequency:f OSC[kHz] XC9267B75Cxx (fOSC =1.2MHz) VIN=12V 2650 2500 2350 2200 2050 1900 1750 -50 -25 0 25 Ambient Temperature :Ta[] (7) Stand-by Current vs. Ambient Temperature 3.0 2.0 1.0 0.0 -25 0 25 50 75 100 Ambient Temperature :Ta[] Lx SW ON Resistance :RON[] Stand-by Current :IST B [A] 100 125 XC9267B75xxx VIN=12V -50 75 (8) Lx SW ON Resistance vs. Ambient Temperature XC9267B75xxx 4.0 50 Ambient Temperature :Ta[] VIN=12V 2.0 Highside SW. Lowside SW. 1.5 1.0 0.5 0.0 -50 125 -25 0 25 50 75 100 Ambient Temperature :Ta[] 125 (9) Quiescent Current vs. Ambient Temperature XC9267B75Dxx (fOSC =2.2MHz) XC9267B75Cxx (fOSC =1.2MHz) VIN=12V 350 300 250 200 150 100 50 350 300 250 200 150 100 50 0 0 -50 20/30 VIN=12V 400 Quiescent Current :Iq[A] Quiescent Current :Iq[A] 400 -25 0 25 50 75 100 Ambient Temperature :Ta[] 125 -50 -25 0 25 50 75 Ambient Temperature :Ta[] 100 125 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Internal Soft-Start Time vs. Ambient Temperature (11) External Soft-Start Time vs. Ambient Temperature XC9267B75xxx VIN=12V 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 External lSoft-StartTime :tSS2[ms] Internal Soft-StartTime :tSS1[ms] XC9267B75xxx VIN=12V, R SS=430k, C SS=0.47F 35 30 25 20 15 -50 -25 Ambient Temperature :Ta[] (12) PG Detect Voltage vs. Ambient Temperature 0 25 50 75 100 Ambient Temperature :Ta[] (13) PG Output Voltage vs. Ambient Temperature XC9267B75xxx VIN=12V PG Output Voltage :V PG[V] PG Detect Voltage :V PGDET [V] XC9267B75xxx 0.75 125 0.70 0.65 0.60 VIN=12V, I PG =1mA 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[] -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[] (14) EN/SS Voltage vs. Ambient Temperature XC9267B75xxx VIN=12V EN/SS Voltage :VENSS [V] 4.0 EN/SS"H" EN/SS"L" 3.0 2.0 1.0 0.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[] 21/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=12V, VOUT =3.3V, I OUT =10mA300mA VIN=24V, VOUT =3.3V, I OUT =10mA300mA L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div IOUT =10mA300mA IOUT =10mA300mA V OUT : 200mV/div V OUT : 200mV/div XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=12V, VOUT =5.0V, I OUT =10mA300mA VIN=24V, VOUT =5.0V, I OUT =10mA300mA L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div IOUT =10mA300mA IOUT =10mA300mA V OUT : 200mV/div V OUT : 200mV/div XC9267B75Dxx fOSC=2.2MHz VIN=12V, VOUT =3.3V, I OUT =10mA300mA L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div IOUT =10mA300mA V OUT : 200mV/div 22/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response XC9267B75Dxx fOSC=2.2MHz XC9267B75Dxx fOSC=2.2MHz VIN=12V, VOUT =5.0V, I OUT =10mA300mA VIN=24V, VOUT =5.0V, I OUT =10mA300mA L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div IOUT =10mA300mA IOUT =10mA300mA V OUT : 200mV/div V OUT : 200mV/div (16) Input Transient Response XC9267B75Cxx fOSC=1.2MHz VIN=8V16V, VOUT =3.3V, I OUT =300mA L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) XC9267B75Cxx fOSC=1.2MHz VIN=16V32V, VOUT =3.3V, I OUT =300mA L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div V IN=8V16V V IN=16V32V V OUT : 200mV/div V OUT : 200mV/div XC9267B75Cxx fOSC=1.2MHz VIN=8V16V, VOUT =5.0V, I OUT =300mA L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) XC9267B75Cxx fOSC=1.2MHz VIN=16V32V, VOUT =5.0V, I OUT =300mA L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div V IN=8V16V V IN=16V32V V OUT : 200mV/div V OUT : 200mV/div 23/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (16) Input Transient Response XC9267B75Dxx fOSC=2.2MHz L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div V IN=8V16V V OUT : 200mV/div XC9267B75Dxx fOSC=2.2MHz VIN=8V16V, VOUT =5.0V, I OUT =300mA L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) XC9267B75Dxx fOSC=2.2MHz VIN=16V32V, VOUT =5.0V, I OUT =300mA L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div V IN=8V16V V IN=16V32V V OUT : 200mV/div V OUT : 200mV/div (17) EN/SS Rising Response XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=12V, VENSS=012V, VOUT =3.3V, I OUT =300mA VIN=24V, VENSS=024V, VOUT =3.3V, I OUT =300mA L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VEN/SS=0V12V 24/30 V OUT : 2V/div VEN/SS=0V24V V OUT : 2V/div XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17) EN/SS Rising Response XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=12V, VENSS=012V, VOUT =5V, I OUT =300mA VIN=24V, VENSS=024V, VOUT =5V, I OUT =300mA L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VEN/SS=0V12V VEN/SS=0V24V V OUT : 2V/div V OUT : 2V/div XC9267B75Dxx fOSC=2.2MHz VIN=12V, VENSS=012V, VOUT =3.3V, I OUT =300mA L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div VEN/SS=0V12V V OUT : 2V/div XC9267B75Dxx fOSC=2.2MHz XC9267B75Dxx fOSC=2.2MHz VIN=12V, VENSS=012V, VOUT =5V, I OUT =300mA VIN=24V, VENSS=024V, VOUT =5V, I OUT =300mA L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) L=3.3H(CLF5030NIT-3R3), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VEN/SS=0V12V VEN/SS=0V24V V OUT : 2V/div V OUT : 2V/div 25/30 XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (18) VIN Rising Response XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=012V, VENSS=012V, VOUT =3.3V, I OUT =300mA VIN=024V, VENSS=024V, VOUT =3.3V, I OUT =300mA L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=4.7H(CLF5030NIT-4R7), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VIN=0V12V V OUT : 2V/div VIN=0V24V V OUT : 2V/div XC9267B75Cxx fOSC=1.2MHz XC9267B75Cxx fOSC=1.2MHz VIN=012V, VENSS=012V, VOUT =5V, I OUT =300mA VIN=024V, VENSS=024V, VOUT =5V, I OUT =300mA L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) L=6.8H(CLF5030NIT-6R8), C IN=4.7Fx2(C2012X6S1H475K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VEN/SS=0V12V VEN/SS=0V24V V OUT : 2V/div XC9267B75Dxx fOSC=2.2MHz VIN=012V, VENSS=012V, VOUT =3.3V, I OUT =300mA L=2.2H(CLF5030NIT-2R2), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div VEN/SS=0V12V 26/30 V OUT : 2V/div V OUT : 2V/div XC9267 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (18) VIN Rising Response XC9267x75D fOSC=2.2MHz XC9267B75Dxx fOSC=2.2MHz VIN=012V, VENSS=012V, VOUT =5V, I OUT =300mA VIN=024V, VENSS=024V, VOUT =5V, I OUT =300mA L=3.3H(CLF5030NIT-3R3N-D), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) L=3.3H(CLF5030NIT-3R3N-D), C IN=2.2Fx2(C2012X7R1H225K) C L=10Fx2 (C3216X7R1E106K) 1.0ms/div 1.0ms/div VEN/SS=0V12V VEN/SS=0V24V V OUT : 2V/div V OUT : 2V/div 27/30 XC9267 Series PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLIN / LAND PATTERN SOT-89-5 SOT-89-5 PKG THERMAL CHARACTERISTICS Standard Board SOT-89-5 Power Dissipation JESD51-7 Board Standard Board USP-6C USP-6C Power Dissipation USP-6C PKG JESD51-7 Board 28/30 XC9267 Series MARKING RULE SOT-89-5 represents product series, products type, 2 5 4 PRODUCT SERIES MARK 5 1 XC9267B75***-G USP-6C Under dot 1 2 3 represents Oscillation Frequency USP-6C(Under dot) 3 2 1 6 5 MARK Oscillation Frequency PRODUCT SERIES N 1.2MHz XC9267B75C**-G U 2.2MHz XC9267B75D**-G 4 represents production lot number 0109, 0A0Z, 119Z, A1A9, AAAZ, B1ZZ repeated (GIJOQW excluded)* No character inversion used. 29/30 XC9267 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 30/30