TLP155E TOSHIBA Photocoupler GaAAs IRED + Photo IC TLP155E Plasma Display Panel (PDP) Industrial Inverter MOS FET / IGBT Gate Driver Unit: mm 5 4 4.55 +0.25 -0.15 6 The Toshiba TLP155E consists of GaAAs infrared light emitting diodes and integrated high gain, high-speed photodetectors. The TLP155E is housed in the SO6 package. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 15 kV/s. TLP155E is suitable for direct gate driving circuit for IGBTs or power MOSFETs. +0.25 7.0 0.4 Buffer logic type (Totem pole output) z Package type: z Peak Output Current : z Guaranteed performance over temperature: z Threshold Input Current: IFLH = 7.5 mA (max) z Propagation delay time : tpLH / tpHL = 200ns (max) z Common mode transient immunity : 15kV/s min z Isolation voltage : 3750 Vrms (min) z UL approved : UL1577, File No.E67349 z c-UL approved :CSA Component Acceptance Service No. 5A, File No.E67349 Option(V4) VDE under application : EN60747-5-2 Maximum operating insulation voltage : 707 Vpk Highest permissible over voltage : 6000 Vpk (Note) When a EN60747-5-2 approved type is needed, Please designate the "option(V4)" 0.15 0.1 2.1 0.1 3.7 -0.15 0.4 z z 3 1 0.5 min 1.27 SO6 2.54 IOP = 0.6A (max) -40 to 100 JEDEC JEITA TOSHIBA 11-4L1 weight: 0.08 g (typ) Pin Configuration (Top View) 1 1:ANODE 3:CATHODE 4:GND 5:VO (Output) 6:VCC 6 5 3 4 SHIELD Truth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L Schematic ICC 6 (M1) VCC IF 1+ Construction Mechanical Ratings Creepage distance 5.0 mm (min) Clearance distance 5.0 mm (min) Insulation thickness 0.4 mm (min) VF 3- (M2) SHIELD 1 IO 5 VO 4 GND 2012-08-09 TLP155E Absolute Maximum Ratings (Ta = 25 C) CHARACTERISTIC SYMBOL Forward Current LED Forward Current Derating Pulse Forward Current (Ta 92C) UNIT IF 20 mA IF /C -0.63 mA/C IFPT 1 A VR 5 V (Note 1) Reverse Voltage Tj 125 C "H" Peak Output Current (Note2) IOPH -0.6 A "L" Peak Output Current (Note2) IOPL 0.6 A Output Voltage VO 35 V Supply Voltage VCC 35 V Tj 125 C Junction Temperature DETECTOR RATING Junction Temperature Operating frequency (Note3) f 250 kHz Operating Temperature Range Topr -40 to 100 C Storage Temperature Range Tstg -55 to 125 C Lead Soldering Temperature (10 s) Isolation Voltage (AC,1 min.,R.H. 60%,Ta=25C) (Note 4) Tsol 260 C BVs 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width 1 s, 300pps. Note 2: Exponential waveform pulse width PW 2 s, f 10 kHz, VCC=20V, Ta=-40~100C Note 3: Exponential waveform pulse width PW 80 ns, IOPH-0.25A, IOPL0.25A, VCC=20V, Ta=-40~100C Note 4: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN Input Current, High Level (Note 1) IFLH 10 Input Voltage, Low Level VFHL 0 Supply Voltage* VCC 10 IOPH/ IOPL Topr Peak output current Operating Temperature TYP. MAX UNIT - 15 mA - 0.8 V - 30 V - - 0.2 A -40 - 100 C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 1: Input signal rise time (fall time) < 0.5 s. 2 2012-08-09 TLP155E Electrical Characteristics (Ta = -40 to 100 C, unless otherwise specified) Symbol Test Circuit VF IF = 10 mA, Ta = 25 C VF/Ta Input reverse current IR Input capacitance CT Characteristics Forward voltage Temperature coefficient of forward voltage "H" Level Output current (Note 1) "L" Level "H" Level IOPH1 IOPH2 IOPL1 IOPL2 VOH Test Condition Min Typ.* Max Unit 1.40 1.55 1.80 V IF = 10 mA -1.8 mV/C VR = 5 V, Ta = 25 C 10 A V =0 V, f = 1 MHz, Ta = 25 C 60 pF 1 VCC = 15 V IF = 10 mA V6-5 = 4 V -0.5 -0.2 V6-5 = 10 V -0.4 2 VCC = 15 V IF = 0 mA V5-4 = 2 V 0.2 0.5 3 VCC = 10 V Output voltage V5-4 = 10 V 0.4 IO = -100 mA, IF = 10 mA 6.0 8.4 IO = 100 mA, VF = 0.8 V 0.3 1.0 IF = 10 mA 1.5 3.0 IF = 0 mA 1.5 3.0 A V "L" Level VOL 4 "H" Level ICCH 5 "L" Level ICCL 6 VCC = 10 to 20 V VO=Open Threshold input current LH IFLH VCC = 15 V, VO > 1 V 1.0 7.5 mA Threshold input voltage HL VFHL VCC = 15 V, VO < 1 V 0.8 V VCC 10 30 V Supply current Supply voltage mA *All typical values are at Ta=25C. Note : This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 1: Duration of IO time 50 s, 1 pulse Isolation Characteristics (Ta = 25 C) Characteristic Capacitance input to output Isolation resistance Symbol CS RS Test Condition VS = 0 V , f = 1MHz R.H. 60 %, VS = 500 V BVS Typ. Max Unit 0.8 pF 12 (Note 1) 1x10 10 14 3750 AC, 1 second, in oil 10000 DC, 1 minute, in oil 10000 AC, 1 minute Isolation voltage (Note 1) Min Vrms Vd c Note 1: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. 3 2012-08-09 TLP155E Switching Characteristics (NOTE)(Ta = -40 to 100 C, unless otherwise specified) Characteristics Propagation delay time Symbol LH tpLH HL tpHL LH tpLH HL Propagation delay skew (Note 1) Switching time dispersion tpHL Test Circuit Test Condition Min Typ.* Max 120 170 120 170 IF = 0 10 mA 50 120 200 IF = 10 0 mA 50 120 200 IF = 0 10 mA -85 85 IF = 0 10 mA 5 50 Ta = 25 C IF = 0 10 mA Ta = 25 C IF = 10 0 mA VCC = 20 V Rg = 30 7 tpsk Cg = 1 nF f=250kHz Duty=50% | tpHL-tpLH | Output rise time (10-90 %) tr IF = 0 10 mA 35 Output fall time (90-10 %) tf IF = 10 0 mA 15 IF = 10 mA VO (min) = 16 V -15 Common mode transient immunity at HIGH level output VCM =1000 CMH 8 Common mode transient immunity at LOW level output CML Vp-p VCC = 20 V Ta = 25 C Unit ns kV/s IF = 0 mA VO (max) = 1 V 15 ( * ): All typical values are at Ta = 25 C. Note : A ceramic capacitor (0.1 F) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Propagation delay skew is defined as the difference between the largest and smallest propagation delay times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc). 4 2012-08-09 TLP155E Test Circuit 1: IOPH 1 Test Circuit 2: IOPL 1 6 6 V6-5 A IOPH 5 0.1F IF 3 5 VCC 3 4 Test Circuit 3: VOH 1 6 1 VO 5 0.1F 3 VCC V5-4 4 Test Circuit 4: VOL V IF 0.1F IOPL A 6 0.1F VOL VF IO 5 VCC 3 4 V IO VCC 4 *VOH =VCC-VO Test Circuit 5: ICCH 6 IF 5 3 Test Circuit 6: ICCL ICCH 1 6 ICCL A A 0.1F 0.1F 5 VCC 3 4 5 VCC 4 2012-08-09 TLP155E Test Circuit 7: tpLH, tpHL, tr, tf, |tpHL-tpLH| IF=10mA (P.G) (f=250kHz, duty=50%, tr=tf=5ns) 6 1 3 0.1 F IF VO Rg = 30 5 Cg = 1 nF IF tr VOH tf VCC 90% 50% 10% VO 4 tpHL tpLH VOL Test Circuit 8: CMH, CML IF 6 1 VCM SW A B 5 1000 V 90% 0.1F VO 10% tr VCC tf * SW A: IF = 10 mA 4 3 VO VCM + - 1V * SW B: IF = 0 mA CML = CMH = - CMH 16V CML 800 V tr (s) 800 V tf (s) CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the LOW (HIGH) state. 6 2012-08-09 TLP155E IF IF (mA) IF - Ta (mA) IF - V F Input forward voltage VF Input forward current Input forward current Ta = 100C 80C 50C 25C 0C -20C -40C (V) This curve shows the maximum limit to the input forward current. Ambient temperature VCC = 15 V VO > 1 V Threshold input current (L/H) IFLH (mA) PO Output power dissipation Ambient temperature Ta (C) Ambient temperature Ta (C) ICCH - Ta ICCH (mA) ICCL - Ta (mA) (C) IFLH - Ta (mW) PO - Ta Ta IF = 10 mA VCC = 30 V Low-level supply current High-level supply current ICCL IF = 0 mA VCC = 30 V Ambient temperature Ta (C) Ambient temperature 7 Ta (C) 2012-08-09 TLP155E VOL - Ta VOH - Ta (V) IF = 10 mA IO = -100 mA High-level output voltage Low-level output voltage VOH VOL (V) VF = 0.8 V IO = 100mA VCC = 10 V VCC = 30 V Ambient temperature Ta (C) VCC= 30 V VCC = 10 V Ambient temperature VCC = 15 V IF = 0 mA Ta = 100C Ta = 25C VCC = 15 V IF = 10 mA Ta = -40C Ta = 100C Ta = 25C Ta = -40C Peak low-level output current IOPL (A) Peak high-level output current tpLH, tpHL, |tpHL - tpLH| - VCC Ta = 25C, f = 250 kHz, Duty = 50% Rg = 30 , Cg = 1 nF, IF = 10 mA tpLH tpHL |tpHL tpLH| Supply voltage VCC (V) IOPH (A) tpLH, tpHL, |tpHL - tpLH| - Ta Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) (C) (VOH - VCC) - IOPH High-level output voltage drop VOH - VCC (V) Low-level output voltage VOL (V) VOL - IOPL Ta IF = 10 mA, f = 250 kHz, Duty = 50% Rg = 30 , Cg = 1 nF, VCC = 20 V tpLH tpHL |tpHL tpLH| Ambient temperature 8 Ta (C) 2012-08-09 TLP155E Propagation delay time, Pulse width distortion tpLH, tpHL, |tpHL - tpLH| (ns) tpLH, tpHL, |tpHL - tpLH| - IF Ta = 25C, f = 250 kHz, Duty = 50% Rg = 30 , Cg = 1 nF, VCC = 20 V tpLH tpHL |tpHL tpLH| Input forward current IF (mA) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 9 2012-08-09 TLP155E PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering 1) When Using Soldering Reflow z An example of a temperature profile when Sn-Pb eutectic solder is used: (C) z An example of a temperature profile when lead(Pb)-free solder is used: (C) z Reflow soldering must be performed once or twice. z The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) z Apply preheating of 150 C for 60 to 120 seconds. z Mounting condition of 260 C and less within 10 seconds is recommended. z Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) z Complete soldering within 10 seconds for lead temperature not exceeding 260 C or within 3 seconds not exceeding 350 C . z Heating by soldering iron must be only once per 1 lead 10 2012-08-09 TLP155E (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 C to 35 C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 11 2012-08-09 TLP155E Specification for Embossed-Tape Packing (TPL)(TPR) for SO6 Coupler 1. Applicable Package Package Product Type SO6 Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP155E (TPL) Tape type Device name 3. Tape Dimensions 3.1 Specification Classification Are as Shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 Device Orientation 12 2012-08-09 TLP155E 3.3 Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. +0.1 1.5 -0 A G K0 12.0 0.3 B D E 0.3 0.05 F 1.6 0.1 2.95 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: 0.1 Symbol Dimension Remark A 4.0 B 7.6 D 5.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 8.0 G 4.0 +0.1 Cumulative error -0.3 (max) per 10 feed holes +0.1 Cumulative error -0.3 (max) per 10 feed holes K0 2.6 Internal space 13 2012-08-09 TLP155E 3.6 Reel A C U B (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. E W1 W2 Figure 3 Reel Form Table 4 Reel Dimensions Unit: mm Symbol Dimension A 380 2 B 80 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 13.5 0.5 W2 17.5 1.0 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP155E (TPL) 3000 pcs Quantity (must be a multiple of 3000) Tape type Device name 14 2012-08-09 TLP155E RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 15 2012-08-09