PNS40010ER - NXP - Datasheet.Live

1. Product profile

1.1 General description

High power dens ity, standard switching time PN-rectifier with high-efficiency plan ar

technology, encapsulated in a small and flat lead SOD123W Surface-Mounted

Device (SMD) plastic package.

1.2 Features and benefits

Forward current IF ≤ 1 A

Reverse voltage VR ≤ 400 V

Standard switchin g time

Low forward voltage

Low reverse curre nt

Low inductance

Small and flat lead SMD plastic

package

Package height typ. 1 mm

High power capability

AEC-Q101 qualified

1.3 Applications

General-purpose rectification

Reverse polarity protection

Standard switching applications

1.4 Quick reference data

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

PNS40010ER

400 V, 1 A high power density, standard switching time

PN-rectifier

Rev. 2 — 21 August 2012 Product data sheet

SOD123W

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current Tsp ≤160°C --1.4A

VRRM repetitive peak reverse

voltage - - 400 V

VRreverse voltage - - 400 V

IFSM non-repetitive peak

forward current Tj(init) =25°C; t

p= 8 ms; square wave - - 32 A

VFforward voltage IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj=25°C - 0.93 1.1 V

IF(AV) average fo rw ard

current δ= 0.5 ; f = 20 kHz; Tamb ≤115 °C;

square wave [1] --1A

δ= 0.5 ; f = 20 kHz; Tsp ≤170 °C;

square wave --1A

Product data sheet Rev. 2 — 21 August 2012 2 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

2. Pinning information

3. Ordering information

4. Marking

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 K cathode

SOD123W

2 A anode

006aab040

Tabl e 3. Orderi ng information

Type number Package

Name Description Version

PNS40010ER SOD123W plastic surface mounted package; 2 lead s SOD123W

Table 4. Marking codes

Type number Marking code

PNS40010ER EH

Product data sheet Rev. 2 — 21 August 2012 3 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

5. Limiting values

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[4] Device mounted on a ceramic PCB, AI2O3, standard footprint.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Device mounted on an FR4 PCB, AI2O3, standard footprint.

[4] Soldering point of cathode tab.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse voltage - 400 V

VRreverse voltage - 400 V

VRMS RMS voltage - 280 V

IFforward current Tsp ≤160 °C - 1.4 A

IF(AV) average fo rw ard current δ= 0.5 ; f = 20 kHz; square wave;

Tamb ≤115 °C [1] -1A

δ= 0.5 ; f = 20 kHz; Tsp ≤170 °C;

square wave -1A

IFSM non-repetitive peak forward

current square wave; Tj(init) =25°C; t

p=8ms - 32 A

Ptot total power dissipation Tamb ≤25 °C [2] - 750 mW

[3] - 1300 mW

[4] - 2300 mW

Tjjunction temperature - 175 °C

Tamb ambient temperature -55 175 °C

Tstg storage temperature -65 175 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance

from junction to

ambient

in free air [1] - - 200 K/W

[2] --115K/W

[3] --65K/W

Rth(j-sp) thermal resistance

from junction to solder

point

[4] --15K/W

Product data sheet Rev. 2 — 21 August 2012 4 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

FR4 PCB, standard footprint

Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

FR4 PCB, mounting pad for cathode 1 cm2

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-003979

102

103

Zth(j-a)

(K/W)

10-1

tp (s)

10-3 102103

10110-2 10-1

duty cycle =

0.75 0.5

0.33 0.25

0.2

0.1

0.02

0.01

0.05

aaa-003980

102

103

Zth(j-a)

(K/W)

10-1

tp (s)

10-3 102103

10110-2 10-1

duty cycle =

0.75 0.5

0.33 0.25

0.2

0.1

0.02

0.01 0

0.05

Product data sheet Rev. 2 — 21 August 2012 5 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

7. Characteristics

Ceramic PCB, Al2O3, standard footprint

Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-003981

102

103

Zth(j-a)

(K/W)

10-1

tp (s)

10-3 102103

10110-2 10-1

duty cycle =

10.75

0.5 0.33

0.25 0.2

0.1

0.02

0.01

0.05

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 0.5 A; tp≤300 µs; δ≤0.02 ;

Tj=25°C - 0.89 1.05 V

IF= 0.7 A; tp≤300 µs; δ≤0.02 ;

Tj=25°C - 0.91 1.07 V

IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj=25°C - 0.93 1.1 V

IF= 0.5 A; tp≤300 µs; δ≤0.02 ;

Tj= 125 °C - 0.76 0.92 V

IF= 0.7 A; tp≤300 µs; δ≤0.02 ;

Tj= 125 °C - 0.78 0.95 V

IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj= 125 °C - 0.81 0.98 V

IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj=-40°C - 1.01 1.18 V

IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj= 150 °C - 0.78 0.95 V

IF=1A; t

p≤300 µs; δ≤0.02 ;

Tj= 175 °C - 0.75 0.92 V

Product data sheet Rev. 2 — 21 August 2012 6 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

IRreverse current VR=400V; T

j= -40 °C - 0.1 10 nA

VR=400V; T

j= 25 °C - 0.001 1 µA

VR=400V; T

j= 125 °C - 1 50 µA

VR=400V; T

j= 150 °C - 5 250 µA

VR=400V; T

j= 175 °C - 10 500 µA

Cddiode capacitance VR= 4 V; f = 1 MHz; Tamb =25°C - 8 20 pF

trr reverse recovery time IF= 0.5 A; IR=1A; I

R(meas) =0.25A;

Tamb =25°C -0.81.8µs

Table 7. Characteristics …continued

Symbol Parameter Conditions Min Typ Max Unit

(1) Tj = 175 °C

(2) Tj = 150 °C

(3) Tj = 125°C

(4) Tj = 85 °C

(5) Tj = 25 °C

(6) Tj = −40 °C

(1) Tj = 175 °C

(2) Tj = 150 °C

(3) Tj = 125 °C

(4) Tj = 85 °C

(5) Tj = 25 °C

(6) Tj = −40 °C

Fig 4. Forward current as a function of forward

voltage; typical values Fig 5. Reverse current as a function of reverse

voltage; typical values

aaa-003982

VF (V)

0.0 1.51.00.5

10-2

10-3

10-1

(A)

10-4

(1)

(2)

(3)

(4) (5) (6)

aaa-003983

10-4

10-5

10-6

10-7

10-8

10-9

10-10

10-11

(A)

10-12

VR (V)

0 400300100 200

(1)

(2)

(3)

(4)

(5)

(6)

Product data sheet Rev. 2 — 21 August 2012 7 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

f = 1 MHz; Tamb = 25 °C Tamb = 25 °C

Fig 6. Diod e capacitance as a function of reverse

voltage; typical values Fig 7. Non-repetitive peak forward current as a

function of puls e du ra tion; typical values

Tj = 175 °C

(1) δ = 0.1

(2) δ = 0.2

(3) δ = 0.5

(4) δ = 1

Tj = 175 °C

(1) δ = 1

(2) δ = 0.9

(3) δ = 0.8

(4) δ = 0.5

Fig 8. Average forward power dissipation as a

function of average forwa rd current; typical

values

Fig 9. Average reverse power di ssipation as a

function of reverse volta ge; typ ical values

VR (V)

0 400300100 200

aaa-003984

(pF)

tp (μs)

102104

103

aaa-003985

102

103

IFSM

(A)

IF(AV) (A)

0.0 1.51.00.5

aaa-003986

0.4

0.8

1.2

PF(AV)

(W)

0.0

(1)

(2)

(3)

(4)

VR (V)

0 400300100 200

aaa-003987

1.5

3.0

4.5

PR(AV)

(mW)

0.0

(1)

(2)

(3)

(4)

Product data sheet Rev. 2 — 21 August 2012 8 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

FR4 PCB, standard footprint

Tj = 175 °C

(1) δ = 1 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 175 °C

(1) δ = 1 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig 10. Average forward current as a function of

ambient temperature; typical values Fig 11. Average forward current as a function of

ambient temperature; typical values

Ceramic PCB, Al2O3, standard footprint

Tj = 175 °C

(1) δ = 1 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Tj = 175 °C

(1) δ = 1 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig 12. Average forward current as a function of

ambient temperature; typical values Fig 13. Average forward current as a function of solder

point temperature; typica l values

Tamb (°C)

0 20015050 100

aaa-003988

0.5

1.0

1.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tamb (°C)

0 20015050 100

aaa-003989

0.5

1.0

1.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tamb (°C)

0 20015050 100

aaa-003990

0.5

1.0

1.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tsp (°C)

0 20015050 100

aaa-003991

0.5

1.0

1.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Product data sheet Rev. 2 — 21 August 2012 9 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

8. Test information

The current ratings for the typical waveforms are calculated according to the equations:

IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with

IRMS defined as RMS current.

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stre ss te st qu alif ication for discrete semiconductors, and is

suitable for use in automotive applications.

Fig 14. Reverse recovery time: test circuit and waveforms

Fig 15. Duty cycle definition

trr

(1)

+ IFt

output signal

trtpt

10 %

90 %

input signal

V = VR + IF × RS

RS = 50

D.U.T.

Ri = 50

SAMPLING

OSCILLOSCOPE

mga881

tcy

006aac658

duty cycle δ =

tcy

Product data sheet Rev. 2 — 21 August 2012 10 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

9. Package outline

10. Soldering

Fig 16. Package outline SOD123W

08-11-06Dimensions in mm

2.8

2.4

3.7

3.3

1.05

0.75

1.9

1.5

0.6

0.3

0.22

0.10

1.1

0.9

Fig 17. Reflow soldering footprint for SOD123W

2.9

2.8

4.4

1.62.1 1.2

(2×)

1.1

(2×)

solder lands

solder resist

occupied area

solder paste

1.1

(2×)

1.2

(2×)

sod123w_fr

Dimensions in mm

Product data sheet Rev. 2 — 21 August 2012 11 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

11. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PNS40010ER v.2 20120821 Product data sheet - PNS40010ER v.1

Modifications: •Data sheet status updated

PNS40010ER v.1 20120615 Preliminary data sheet - -

Product data sheet Rev. 2 — 21 August 2012 12 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in this document may have changed sinc e this documen t was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URLhttp://www.nxp.com.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modificati ons or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of informati on included herein and shall have

no liability for the consequences of use of such info rmation.

Draft — The document is a draft version onl y. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sh eet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors doe s not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semico nductors’ aggregate and cumulat ive liability t owards

customer for the products described herein shall be limited in accordance

with theTerms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersed es an d r eplaces all inf ormation supplied pri or

to the publication hereof.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless ot herwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own

risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does no t accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Document status[1] [2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary spec ification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 21 August 2012 13 of 14

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published athttp://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

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Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

reenChip,HiPerSmart,HITAG,I²C-bus

logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE

Ultralight,MoReUse,QLPAK,Silicon

Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia

andUCODE — are trademarks of NXP B.V.

HD Radio andHD Radio logo — are trademarks of iBiquity Digital

Corporation.

13. Contact information

For more information, please visit:http://www.nxp.com

For sales office addresses, please send an email to:salesaddresses@nxp.com

NXP Semiconductors PNS40010ER

400 V, 1 A high power density, standard switching time PN-rectifier

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 21 August 2012

Document identifier: PNS40010ER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . .9

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . .9

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

13 Contact information. . . . . . . . . . . . . . . . . . . . . .13