Network Clock Generator, Two Outputs
AD9575
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
FEATURES
Fully integrated VCO/PLL core
0.39 ps rms jitter from 12 kHz to 20 MHz at 156.25 MHz
0.15 ps rms jitter from 1.875 MHz to 20 MHz at 156.25 MHz
0.40 ps rms jitter from 12 kHz to 20 MHz at 106.25 MHz
0.15 ps rms jitter from 637 kHz to 10 MHz at 106.25 MHz
Input crystal frequency of 19.44 MHz, 25 MHz, or
25.78125 MHz
Pin selectable divide ratios for 33.33 MHz, 62.5 MHz,
100 MHz, 106.25 MHz, 125 MHz, 155.52 MHz, 156.25 MHz,
159.375 MHz, 161.13 MHz, and 312.5 MHz outputs
LVDS/LVPECL/LVCMOS output format
Integrated loop filter
Space saving 4.4 mm × 5.0 mm TSSOP
100 mA power supply current (LVDS output)
120 mA power supply current (LVPECL output)
3.3 V operation
APPLICATIONS
GbE/FC/SONET line cards, switches, and routers
CPU/PCI-E applications
Low jitter, low phase noise clock generation
GENERAL DESCRIPTION
The AD9575 provides a highly integrated, dual output clock
generator function including an on-chip PLL core that is
optimized for network clocking. The integer-N PLL design is
based on the Analog Devices, Inc., proven portfolio of high
performance, low jitter frequency synthesizers to maximize line
card performance. Other applications with demanding phase
noise and jitter requirements also benefit from this part.
The PLL section consists of a low noise phase frequency detector
(PFD), a precision charge pump (CP), a low phase noise voltage
controlled oscillator (VCO), and pin selectable feedback and
output dividers.
By connecting an external crystal, popular network output fre-
quencies can be locked to the input reference. The output divider
and feedback divider ratios are pin programmable for the required
output rates. No external loop filter components are required,
thus conserving valuable design time and board space.
The AD9575 is available in a 16-lead, 4.4 mm × 5.0 mm TSSOP
and can be operated from a single 3.3 V supply. The temperature
range is −40°C to +85°C.
FUNCTIONAL BLOCK DIAGRAM
V
DD × 5
GND × 5
AD9575
XTAL
OSC
VCO
PFD/CP
THIRD-ORDER
LPF
DIVIDERS
100MHz
TO 3 12.5M Hz
LVDS OR
LVPECL
LVCMOS 33.33MHz/
62.5MHz/SEL1
LDO
08462-001
SEL0
SEL
Figure 1.
AD9575
Rev. A | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
PLL Characteristics ...................................................................... 3
LVDS Clock Output Jitter (Typ/Max) ........................................ 4
LVPECL Clock Output Jitter (Typ/Max) ................................... 4
Output Frequency Select ............................................................. 5
Clock Outputs ............................................................................... 5
Timing Characteristics ................................................................ 5
Power .............................................................................................. 6
Crystal Oscillator .......................................................................... 6
Timing Diagrams .......................................................................... 6
Absolute Maximum Ratings ............................................................7
Thermal Resistance .......................................................................7
ESD Caution...................................................................................7
Pin Configuration and Function Descriptions ..............................8
Typical Performance Characteristics ..............................................9
Terminology .................................................................................... 11
Theory of Operation ...................................................................... 12
Phase Frequency Detector (PFD) and Charge Pump ............ 12
Power Supply ............................................................................... 12
LVPECL Clock Distribution ..................................................... 12
LVDS Clock Distribution .......................................................... 13
LVCMOS Clock Distribution ................................................... 13
Typical Application Circuit ....................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 14
REVISION HISTORY
3/10—Rev. 0 to Rev. A
Changes to Features Section............................................................ 1
Changes to Table 1, Table 2, and Table 3 ....................................... 4
Changes to Table 4 and Table 6 ....................................................... 5
Changes to Table 7 and Table 8 ....................................................... 6
Changes to Table 12 .......................................................................... 8
Added Figure 11; Renumbered Figures Sequentially ................ 10
Changes to Figure 13 ...................................................................... 10
Changes to Theory of Operation Section and Figure 19 ........... 12
Changes to Figure 24 ...................................................................... 13
1/10—Revision 0: Initial Version
AD9575
Rev. A | Page 3 of 16
SPECIFICATIONS
Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are
given over the full VS and TA (−40°C to +85°C) variation.
PLL CHARACTERISTICS
Table 1.
LVDS LVCMOS LVPECL
Parameter Min Typ Max Min Typ Max Min Typ Max Unit
PHASE NOISE CHARACTERISTICS
PLL Noise (100 MHz Output)
At 1 kHz −123 −122 dBc/Hz
At 10 kHz −128 −129 dBc/Hz
At 100 kHz −131 −131 dBc/Hz
At 1 MHz −150 −151 dBc/Hz
At 10 MHz −156 −158 dBc/Hz
At 30 MHz −156 −158 dBc/Hz
PLL Noise (106.25 MHz Output)
At 1 kHz −121 −121 dBc/Hz
At 10 kHz −127 −128 dBc/Hz
At 100 kHz −130 −130 dBc/Hz
At 1 MHz −149 −150 dBc/Hz
At 10 MHz −156 −158 dBc/Hz
At 30 MHz −156 −159 dBc/Hz
PLL Noise (125 MHz Output)
At 1 kHz −120 −120 dBc/Hz
At 10 kHz −126 −127 dBc/Hz
At 100 kHz −128 −129 dBc/Hz
At 1 MHz −148 −150 dBc/Hz
At 10 MHz −155 −157 dBc/Hz
At 30 MHz −156 −158 dBc/Hz
PLL Noise (155.52 MHz Output)
At 1 kHz −118 −118 dBc/Hz
At 10 kHz −123 −123 dBc/Hz
At 100 kHz −125 −125 dBc/Hz
At 1 MHz −147 −149 dBc/Hz
At 10 MHz −155 −157 dBc/Hz
At 30 MHz −156 −157 dBc/Hz
PLL Noise (156.25 MHz Output)
At 1 kHz −118 −118 dBc/Hz
At 10 kHz −124 −125 dBc/Hz
At 100 kHz −126 −127 dBc/Hz
At 1 MHz −146 −148 dBc/Hz
At 10 MHz −155 −157 dBc/Hz
At 30 MHz −155 −157 dBc/Hz
PLL Noise (159.375 MHz Output)
At 1 kHz −118 −118 dBc/Hz
At 10 kHz −124 −125 dBc/Hz
At 100 kHz −126 −126 dBc/Hz
At 1 MHz −146 −147 dBc/Hz
At 10 MHz −155 −156 dBc/Hz
At 30 MHz −155 −157 dBc/Hz
AD9575
Rev. A | Page 4 of 16
LVDS LVCMOS LVPECL
Parameter Min Typ Max Min Typ Max Min Typ Max Unit
PLL Noise (161.132812 MHz Output)
At 1 kHz −118 −119 dBc/Hz
At 10 kHz −122 −123 dBc/Hz
At 100 kHz −126 −126 dBc/Hz
At 1 MHz −144 −146 dBc/Hz
At 10 MHz −154 −156 dBc/Hz
At 30 MHz −155 −156 dBc/Hz
PLL Noise (312.5 MHz Output)
At 1 kHz −112 −112 dBc/Hz
At 10 kHz −119 −119 dBc/Hz
At 100 kHz −120 −120 dBc/Hz
At 1 MHz −140 −142 dBc/Hz
At 10 MHz −152 −154 dBc/Hz
At 30 MHz −153 −155 dBc/Hz
PLL Noise (33.33 MHz Output)
At 1 kHz −131 dBc/Hz
At 10 kHz −138 dBc/Hz
At 100 kHz −140 dBc/Hz
At 1 MHz −155 dBc/Hz
At 5 MHz −155 dBc/Hz
PLL Noise (62.5 MHz Output)
At 1 kHz −126 dBc/Hz
At 10 kHz −133 dBc/Hz
At 100 kHz −134 dBc/Hz
At 1 MHz −150 dBc/Hz
At 5 MHz −152 dBc/Hz
Spurious Content −70 −70 dBc
PLL Figure of Merit −217 −217 dBc/Hz
LVDS CLOCK OUTPUT JITTER (TYP/MAX)
Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Maximum (max) values are given over the full VS
and TA (−40°C to +85°C) variation.
Table 2.
Jitter Integration
Bandwidth
100
MHz
106.25
MHz
125
MHz
155.52
MHz
156.25
MHz
159.375
MHz
161.13
MHz
312.5
MHz Unit
12 kHz to 20 MHz 0.38/0.50 0.40/0.54 0.37/0.47 0.41/0.54 0.39/0.51 0.38/0.51 0.44/0.61 0.36/0.48 ps rms
1.875 MHz to 20 MHz 0.15/0.27 ps rms
637 kHz to 10 MHz 0.15/0.21 ps rms
LVPECL CLOCK OUTPUT JITTER (TYP/MAX)
Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Maximum (max) values are given over the full VS
and TA (−40°C to +85°C) variation.
Table 3.
Jitter Integration
Bandwidth
100
MHz
106.25
MHz
125
MHz
155.52
MHz
156.25
MHz
159.375
MHz
161.13
MHz
312.5
MHz Unit
12 kHz to 20 MHz 0.36/0.46 0.44/0.68 0.36/0.45 0.40/0.52 0.39/0.64 0.41/0.62 0.43/0.69 0.38/0.49 ps rms
1.875 MHz to 20 MHz 0.19/0.54 ps rms
637 kHz to 10 MHz 0.22/0.35 ps rms
AD9575
Rev. A | Page 5 of 16
OUTPUT FREQUENCY SELECT
Minimum (min) and maximum (max) values are given over the full VS and TA (−40°C to +85°C) variation.
Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
Select Pins (SEL0/SEL1)
Logic 1 Voltage 0.83 × VS + 0.2 V
Logic 0 Voltage 0.33 × VS − 0.2 V
Logic 1 Current 190 μA Pull-up to VS
Logic 0 Current 150 μA Pull-down to GND
CLOCK OUTPUTS
Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are
given over the full VS and TA (−40°C to +85°C) variation.
Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
LVDS CLOCK OUTPUT Termination = 100 Ω differential; default
Output Frequency 312.5 MHz
Differential Output Voltage (VOD) 250 340 450 mV See Figure 2 for definition
Delta VOD 25 mV
Output Offset Voltage (VOS) 1.125 1.25 1.375 V
Delta VOS 25 mV
Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND
Duty Cycle 45 50 55 %
LVPECL CLOCK OUTPUT
Output Frequency 312.5 MHz
Output High Voltage (VOH) VS − 1.5 VS − 1.05 VS − 0.8 V
Output Low Voltage (VOL) VS − 2.5 VS − 1.75 VS − 1.7 V
Differential Output Voltage (VOD) 430 640 800 mV See Figure 2 for definition
Duty Cycle 45 50 55 %
LVCMOS CLOCK OUTPUT
Output Frequency 62.5 MHz
Output High Voltage (VOH) VS − 0.1 V
Output Low Voltage (VOL) 0.1 V
Duty Cycle 45 50 55 %
TIMING CHARACTERISTICS
Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
LVDS
Termination = 100 Ω differential; CLOAD = 0 pF;
CAC = 0.1 μF
Output Rise Time, tRL 150 200 300 ps 20% to 80%, measured differentially
Output Fall Time, tFL 150 200 300 ps 80% to 20%, measured differentially
LVPECL
Termination = 200 Ω to GND; CLOAD = 0 pF;
CAC = 0.1 μF
Output Rise Time, tRL 180 250 300 ps 20% to 80%, measured differentially
Output Fall Time, tFL 180 250 300 ps 80% to 20%, measured differentially
LVCMOS
Termination = 50 Ω to 0 V; CLOAD = 5 pF;
CAC = 0.1 μF
Output Rise Time, tRC 0.50 0.70 1.10 ns 20% to 80%
Output Fall Time, tFC 0.50 0.70 1.10 ns 80% to 20%
AD9575
Rev. A | Page 6 of 16
POWER
Table 7.
Parameter Min Typ Max Unit
POWER SUPPLY 3.0 3.3 3.6 V
POWER SUPPLY CURRENT
LVDS 100 130 mA
LVPECL 120 160 mA
CRYSTAL OSCILLATOR
Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
CRYSTAL SPECIFICATION Parallel resonant/fundamental mode
Frequency 19.44 25 25.78125 MHz
ESR 40 Ω
Load Capacitance 14 pF Cx/2 (see Figure 24) + parasitic capacitance
Phase Noise −138 dBc/Hz At 1 kHz offset
Stability −30 +30 ppm
TIMING DIAGRAMS
DIFFERENTIAL
SIGNAL
V
OD
80%
20%
50%
t
RL
t
FL
08462-003
SINGLE-ENDED
LVCMOS
5pF LOAD
80%
20%
t
RC
t
FC
0
8462-004
Figure 2. LVDS or LVPECL Timing and Differential Amplitude Figure 3. LVCMOS Timing
AD9575
Rev. A | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter Rating
VDD, VDDA, VDDX, VDD_CMOS to GND −0.3 V to +3.6 V
XO1, XO2 to GND −0.3 V to VS + 0.3 V
LVDS/LVPECL OUT, LVDS/LVPECL OUT,
CMOS OUT/SEL1, SEL0 to GND
−0.3 V to VS + 0.3 V
Junction Temperature1 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
1 See Table 10 for θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 10. Thermal Resistance1
Package Type θJA Unit
16-Lead TSSOP (RU-16) 90.3 °C/W
1 Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
ESD CAUTION
AD9575
Rev. A | Page 8 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
VDDA
VDDX
XO1
GNDA
GNDX
XO2
GNDA
VDDA
16
15
14
13
12
11
10
9
GND
LVDS /LV P E CL O UT
LVDS /LV P E CL O UT
CMOS OUT/SEL1
GND_CMOS
VDD_CMOS
VDD
SEL0
AD9575
TOP VIEW
(No t to Scale)
08462-005
Figure 4. Pin Configuration
Table 11. Pin Function Descriptions
Pin No. Mnemonic Description
1, 7 GNDA Analog Ground.
2, 8 VDDA Analog Power Supply (3.3 V).
3 VDDX Crystal Oscillator Power Supply.
4, 5 XO1, XO2 External Crystal.
6 GNDX Crystal Oscillator Ground.
9 GND_CMOS Ground for LVCMOS Output.
10 CMOS OUT/SEL1 LVCMOS Output/Output Frequency Select.
11 VDD_CMOS Power Supply for LVCMOS Output.
12 VDD Power Supply for LVDS or LVPECL Output.
13 LVDS/LVPECL OUT Complementary LVDS or LVPECL Output.
14 LVDS/LVPECL OUT LVDS or LVPECL Output.
15 GND Ground for LVDS or LVPECL Output.
16 SEL0 Output Frequency Select.
Table 12. Output Frequency Selection1
Mode XTAL SEL0 SEL1 LVDS/LVPECL Output LVCMOS Output
1 25 MHz GND X2100 MHz 33.33 MHz
2 25 MHz VS GND 156.25 MHz High-Z
3 25.78125 MHz VS GND 161.13 MHz High-Z
4 25 MHz No connect XX
2125 MHz 62.5 MHz
5 25 MHz 15 kΩ pull-up VS 159.375 MHz High-Z
6 25 MHz 15 kΩ pull-up GND 312.5 MHz High-Z
7 25 MHz VS V
S 106.25 MHz High-Z
8 19.44 MHz VS No connect 155.52 MHz High-Z
1 The AD9575 must be power-cycled if the select pin voltages are altered.
2 X = in Mode 1, Pin 10 is configured as an LVCMOS output (33.33 MHz) by forcing Pin 16 to GND. In Mode 4, Pin 10 is configured as an LVCMOS output (62.5 MHz) by
leaving Pin 16 unconnected.
AD9575
Rev. A | Page 9 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FRE QUENC Y (Hz)
PHASE NOISE (dBc/Hz )
08462-006
Figure 5. Phase Noise at LVPECL, 100 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FRE QUENC Y ( Hz )
PHASE NOISE (dBc/Hz)
08462-007
Figure 6. Phase Noise at LVPECL, 106.25 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
PHASE NO ISE ( dBc/ Hz )
08462-008
Figure 7. Phase Noise at LVPECL, 125 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FRE QUENC Y ( Hz )
PHASE NOISE (dBc/Hz)
08462-009
Figure 8. Phase Noise at LVPECL, 155.52 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
PHASE NO I SE ( d Bc/ Hz)
08462-010
Figure 9. Phase Noise at LVPECL, 156.25 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
PHASE NOISE (dBc/Hz)
08462-011
Figure 10. Phase Noise at LVPECL, 159.375 MHz Clock Output
AD9575
Rev. A | Page 10 of 16
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FRE QUENC Y ( Hz )
PHASE NOISE (dBc/Hz)
08462-027
Figure 11. Phase Noise at LVPECL, 161.13 MHz Clock Output
–160
–155
–150
–145
–140
–135
–130
–125
–120
–115
110
1k 10k 100k 1M 10M 100M
FRE QUENC Y ( Hz )
PHASE NOISE (dBc/ Hz )
08462-012
Figure 12. Phase Noise at LVPECL, 312.5 MHz Clock Output
08462-021
90
100
110
120
130
140
SUPPLY CURRENT (mA)
80 1234
MODE
5678
LVPECL
LVDS
Figure 13. Typical Supply Current vs. Mode (see Table 12)
M2
M2 50mV 2n s
M3 50mV 2n s
08462-022
Figure 14. 156.25 MHz LVDS Output
M2
M2 100mV 1 ns
M3 100mV 1 ns
0
8462-023
Figure 15. 312.5 MHz LVPECL Output
M2
M2 100mV 1 0ns
M3 100mV 1 0ns
08462-024
Figure 16. 62.5 MHz LVCMOS Output
AD9575
Rev. A | Page 11 of 16
TERMINOLOGY
Phase Jitter
An ideal sine wave can be thought of as having a continuous
and even progression of phase with time from 0° to 360° for
each cycle. Actual signals, however, display a certain amount of
variation from ideal phase progression over time. This phenom-
enon is called phase jitter. Although many causes can contribute
to phase jitter, one major cause is random noise, which is charac-
terized statistically as Gaussian (normal) in distribution.
This phase jitter leads to a spreading out of the energy of the
sine wave in the frequency domain, producing a continuous
power spectrum. This power spectrum is usually reported as
a series of values whose units are dBc/Hz at a given offset in
frequency from the sine wave (carrier). The value is a ratio
(expressed in decibels) of the power contained within a 1 Hz
bandwidth with respect to the power at the carrier frequency.
For each measurement, the offset from the carrier frequency
is also given.
Phase Noise
It is meaningful to integrate the total power contained within
some interval of offset frequencies (for example, 10 kHz to
10 MHz). This is called the integrated phase noise over that
frequency offset interval and can be readily related to the time
jitter due to the phase noise within that offset frequency interval.
Phase noise has a detrimental effect on error rate performance
by increasing eye closure at the transmitter output and reducing
the jitter tolerance/sensitivity of the receiver.
Time Jitter
Phase noise is a frequency domain phenomenon. In the time
domain, the same effect is exhibited as time jitter. When
observing a sine wave, the time of successive zero crossings is
seen to vary. In a square wave, the time jitter is seen as a
displacement of the edges from their ideal (regular) times of
occurrence. In both cases, the variations in timing from the
ideal are the time jitter. Because these variations are random in
nature, the time jitter is specified in units of seconds root mean
square (rms) or 1 sigma of the Gaussian distribution.
Additive Phase Noise
Additive phase noise is the amount of phase noise that is attrib-
utable to the device or subsystem being measured. The phase
noise of any external oscillators or clock sources is subtracted.
This makes it possible to predict the degree to which the device
affects the total system phase noise when used in conjunction
with the various oscillators and clock sources, each of which
contributes its own phase noise to the total. In many cases, the
phase noise of one element dominates the system phase noise.
Additive Time Jitter
Additive time jitter is the amount of time jitter that is attribut-
able to the device or subsystem being measured. The time jitter
of any external oscillators or clock sources is subtracted. This
makes it possible to predict the degree to which the device affects
the total system time jitter when used in conjunction with the
various oscillators and clock sources, each of which contributes
its own time jitter to the total. In many cases, the time jitter of
the external oscillators and clock sources dominates the system
time jitter.
AD9575
Rev. A | Page 12 of 16
THEORY OF OPERATION
XTAL
OSC
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
1/n 1/k
SEL
LVCMOS
CMOS OUT/SEL1
V
DDX GNDX
V
DD
A
GNDA
V
DD_CMOS GND_CMOS
SEL0
1/m
VLDO
2.488GHz TO
2.55GHz V CO LVDS
100MHz
AD9575
08462-015
LDO
LVDS/LVPECL OUT
LVDS/LVPECL OUT
Figure 17. Detailed Block Diagram
Figure 17 shows a block diagram of the AD9575. The chip features
a PLL core, which is configured to generate the specific clock
frequencies via pin programming. By appropriate connection of
the select pins, SEL0 and SEL1, the divide ratios of the feedback
divider (n), LVDS output divider (m), and LVCMOS output
divider (k) can be programmed (see Table 1 2). In Mode 1 and
Mode 4, Pin 10 is configured as an LVCMOS output by forcing
Pin 16 to GND (33.33 MHz output) or by leaving Pin 16 uncon-
nected (62.5 MHz output). In conjunction with a band-select
VCO that operates over the range of 2.488 GHz to 2.55 GHz,
a wide range of popular network reference frequencies can
be generated. This PLL is based on proven Analog Devices
synthesizer technology, noted for its exceptional phase noise
performance. The AD9575 is highly integrated and includes
the loop filter, a regulator for supply noise immunity, all the
necessary dividers, output buffers, and a crystal oscillator. A
user need only supply an external crystal to implement a
clocking solution that requires no processor intervention.
PHASE FREQUENCY DETECTOR (PFD) AND
CHARGE PUMP
The PFD takes inputs from the reference clock and feedback
divider to produce an output proportional to the phase and
frequency difference between them. Figure 18 shows a
simplified schematic.
08462-016
D1 Q1
CLR1
REFCLK
HIGH UP
D2 Q2
CLR2
HIGH DOWN
CP
CHARGE
PUMP
V
P
GND
FEEDBACK
DIVIDER
Figure 18. PFD Simplified Schematic
POWER SUPPLY
The AD9575 requires a 3.3 V ± 10% power supply for VS. The
Specifications section gives the performance expected from the
AD9575 with the power supply voltage within this range. The
absolute maximum range of −0.3 V to +3.6 V, with respect to
GND, must never be exceeded on the VDD, VDDA, VDDX,
and VDD_CMOS pins.
Good engineering practice should be followed in the layout
of power supply traces and the ground plane of the PCB. The
power supply should be bypassed on the PCB with adequate
capacitance (>10 μF). The AD9575 should be bypassed with
adequate capacitors (0.1 μF) at all power pins as close as possible
to the part. The layout of the AD9575 evaluation board is a
good example.
LVPECL CLOCK DISTRIBUTION
Because they are open emitter, the LVPECL outputs require
a dc termination to bias the output transistors. The simplified
equivalent circuit in Figure 19 shows the LVPECL output stage.
08462-026
LVPECL
V
TERM
LVPECL
5050
50
50
0.1µF
0.1µF
200200
Figure 19. LVPECL AC-Coupled Termination
In most applications, a standard LVPECL far-end termination is
recommended, as shown in Figure 20. The resistor network is
designed to match the transmission line impedance (50 Ω) and
the desired switching threshold (1.3 V).
AD9575
Rev. A | Page 13 of 16
3.3V 50
50
SINGLE-ENDED
(NO T CO UP L E D)
3.3V
3.3V
LVPECL
127127
8383
08462-025
V
T
= V
DD
– 1.3 V
LVPECL
Figure 20. LVPECL Far-End Termination
LVDS CLOCK DISTRIBUTION
The AD9575 is also available with low voltage differential
signaling (LVDS) outputs. LVDS uses a current mo de output
stage with a factory programmed current level. The normal
value (default) for this current is 3.5 mA, which yields a 350 mV
output swing across a 100 Ω resistor. The LVDS outputs meet or
exceed all ANSI/TIA/EIA-644 specifications.
A recommended termination circuit for the LVDS outputs is
shown in Figure 21.
50
50
LVDS LVDS
100
0
8462-017
Figure 21. LVDS Output Termination
See the AN-586 Application Note on the Analog Devices
website at www.analog.com for more information about LVDS.
LVCMOS CLOCK DISTRIBUTION
The AD9575 provides a 33.33 MHz or 62.5 MHz clock output,
which is a dedicated LVCMOS level. Whenever single-ended
LVCMOS clocking is used, some of the following general guide-
lines should be followed.
Point-to-point nets should be designed such that a driver has
only one receiver on the net, if possible. This allows for simple
termination schemes and minimizes ringing due to possible
mismatched impedances on the net. Series termination at the
source is generally required to provide transmission line
matching and/or to reduce current transients at the driver (see
Figure 22). The value of the resistor is dependent on the board
design and timing requirements (typically 10 Ω to 100 Ω is
used). LVCMOS outputs are limited in terms of the capacitive
load or trace length that they can drive. Typically, trace lengths
less than 6 inches are recommended to preserve signal rise/fall
times and preserve signal integrity.
10
MICROSTRIP
GND
5pF
60.4
1.0 INCH
CMOS
08462-018
Figure 22. Series Termination of LVCMOS Output
Termination at the far end of the PCB trace is a second option.
The LVCMOS output of the AD9575 does not supply enough
current to provide a full voltage swing with a low impedance
resistive, far-end termination, as shown in Figure 23. The far-end
termination network should match the PCB trace impedance
and provide the desired switching point.
The reduced signal swing may still meet receiver input
requirements in some applications. This can be useful when
driving long trace lengths on less critical nets.
50
10
V
PULLUP = 3.3
LVCMOS 3pF
100
100
0
8462-019
Figure 23. LVCMOS Output with Far-End Termination
TYPICAL APPLICATION CIRCUIT
1
2
3
4
5
6
7
8
VDDA
VDDX
XO1
GNDA
GNDX
XO2
GNDA
VDDA
16
15
14
13
12
11
10
9
GND
LVDS/LVPECL OUT
LVDS/LVPECL OUT
CMOS OUT/SEL1
GND_CMOS
VDD_CMOS
VDD
SEL0
AD9575
50R
T
=
100
50
1nF0.1µF
0.1µF 0.1µF
V
S
V
S
V
S
0.1µF
0.1µF
Cx1 = 22pF
Cx2 = 22pF V
S
V
S
08462-028
Figure 24. Typical Application Circuit (in LVDS Configuration)
AD9575
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
16 9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX 0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COM PLI ANT T O JEDEC S TANDARDS MO-153-AB
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1Temperature Range Package Description Package Option
AD9575ARUZLVD −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP), 96 pcs per Tube,
LVDS Output Format
RU-16
AD9575ARUZPEC −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP), 96 pcs per Tube,
LVPECL Output Format
RU-16
AD9575-EVALZ-LVD LVDS Outputs, Evaluation Board
AD9575-EVALZ-PEC LVPECL Outputs, Evaluation Board
1 Z = RoHS Compliant Part.
AD9575
Rev. A | Page 15 of 16
NOTES
AD9575
Rev. A | Page 16 of 16
NOTES
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08462-0-3/10(A)