BFN38 NPN Silicon High-Voltage Transistors * Suitable for video output stages in TV sets and 4 switching power supplies * High breakdown voltage * Low collector-emitter saturation voltage 3 * Complementary type: BFN39 (PNP) 2 1 Type Marking BFN38 BFN 38 Pin Configuration 1=B 2=C 3=E VPS05163 Package 4=C SOT223 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage VCEO 300 Collector-base voltage VCBO 300 Emitter-base voltage VEBO 5 DC collector current IC 200 Peak collector current ICM 500 Base current IB 100 Peak base current IBM 200 Total power dissipation, TS = 124 C Ptot 1.5 W Junction temperature Tj 150 C Storage temperature Tstg V mA -65 ... 150 Thermal Resistance Junction - soldering point1) RthJS 17 K/W 1For calculation of R thJA please refer to Application Note Thermal Resistance 1 Mar-04-2005 BFN38 Electrical Characteristics at TA = 25C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. V(BR)CEO 300 - - V(BR)CBO 300 - - V(BR)EBO 5 - - ICBO - - 100 nA ICBO - - 20 A IEBO - - 100 nA DC Characteristics Collector-emitter breakdown voltage V IC = 1 mA, IB = 0 Collector-base breakdown voltage IC = 100 A, IE = 0 Emitter-base breakdown voltage IE = 100 A, IC = 0 Collector cutoff current VCB = 250 V, IE = 0 Collector cutoff current VCB = 250 V, IE = 0 , T A = 150 C Emitter cutoff current VEB = 4 V, IC = 0 - hFE DC current gain 1) IC = 1 mA, VCE = 10 V 25 - - IC = 10 mA, VCE = 10 V IC = 30 mA, VCE = 10 V 40 - - 30 - - VCEsat - - 0.5 VBEsat - - 0.9 Collector-emitter saturation voltage1) V IC = 20 mA, IB = 2 mA Base-emitter saturation voltage 1) IC = 20 mA, IB = 2 mA 1) Pulse test: t < 300s; D < 2% 2 Mar-04-2005 BFN38 Electrical Characteristics at TA = 25C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. fT - 70 - MHz Ccb - 1.5 - pF AC Characteristics Transition frequency IC = 20 mA, VCE = 10 V, f = 20 MHz Collector-base capacitance VCB = 30 V, f = 1 MHz 3 Mar-04-2005 BFN38 Total power dissipation Ptot = f(TS) Collector current IC = f (VBE) VCE = 10V BFN 36/38 10 3 1.8 W EHP00636 mA C Ptot 1.4 10 2 5 1.2 1 10 1 0.8 5 0.6 10 0 0.4 5 0.2 0 0 15 30 45 60 75 90 105 120 10 -1 C 150 TS 0.5 0 V 1.0 V BE Permissible pulse load Collector cutoff current ICBO = f (TA) Ptotmax / PtotDC = f (tp) VCB = 30V 10 3 BFN 36/38 Ptot max 5 Ptot DC 10 4 nA EHP00245 D= tp T tp CB0 T 10 2 D= 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 5 10 1 BFN 36/38 EHP00638 max 10 3 5 10 2 5 typ 10 1 5 5 10 0 10 -6 1.5 10 0 5 10 -5 10 -4 10 -3 10 -2 s 10 -1 0 10 0 tp 50 C 150 100 TA 4 Mar-04-2005 BFN38 DC current gain hFE = f (I C) Transition frequency fT = f (IC ) VCE = 10V VCE = 10V, f = 100MHz 10 3 BFN 36/38 EHP00639 10 3 BFN 36/38 EHP00637 MHz 5 fT h FE 10 2 5 10 2 5 10 1 5 10 0 -1 10 5 10 0 5 10 1 2 5 10 C mA 10 10 1 10 0 3 5 10 1 5 10 2 mA 5 10 3 C 5 Mar-04-2005 Package SOT223 Package Outline 1.6 0.1 6.5 0.2 0.1 MAX. 2 B 0.5 MIN. 1 +0.2 acc. to DIN 6784 3.5 0.2 4 7 0.3 3 0.1 15 MAX. A 3 0.28 0.04 2.3 0.7 0.1 4.6 0.25 M A 0.25 M B Foot Print 1.4 4.8 1.4 3.5 1.2 1.1 Marking Layout Manufacturer Date code (Year/Calendarweek) 2003, July Type code BCP52-16 Pin 1 Example Packing Code E6327: Reel o180 mm = 1.000 Pieces/Reel Code E6433: Reel o330 mm = 4.000 Pieces/Reel 0.3 MAX. Pin 1 6.8 12 7.55 8 1.75 Impressum Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen (c) Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.Infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.