2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 1
BM78
Features
• Bluetooth C la ssic (BR/ED R) a nd Low Energ y (LE)
• Certified to FCC, IC, MIC, KCC, and NCC radio
regulations
• Europe an R&TTE Dire ctive Assess ed Radio mo d-
ule
• Bluetooth SIG 4.2 qualified
• T ra nsp arent UART mode f or seamle ss se rial da ta
over UART interface
• Easy to configure with User Interface (UI) tool, a
Windows
®
configuration utility or directly by
MCUs
• Firmwa re can be upg rade d in th e fiel d over UAR T
(Flash versi on)
• Integral chip antenna (BM78SPPS5MC2/NC2) or
external antenna (BM78SPP05MC2/NC2)
• Integrated crystal, internal voltage regulator, and
matchi ng cir cui try
• Configurable I/O pins for control and status
• Suppo rt s Ap pl e
®
iPod Accessory Pro toc ol (iAP2),
(only BM78SPPx5MC2)
• Supports Bluetooth 4.2 LE secure connections
• Bluetooth 4.2 LE data packet length extension
• Small and compact surface mount module
• Castellate d SMT pads for easy and reliable PCB
mounting
• Ideal for portable battery operated devices
• One LED driver with 16 steps brightness control
RF/Analog
• Frequency: 2.402 GHz to 2.480 GHz
• Receive Sensitivity: -90 dBm (BR/EDR), -92 dBm
(LE)
• Class 2 output power (+1.5 dBm ty pical)
Data Throughput
Data Throughput at 1 Mbps UART baud rate:
• BR/EDR: up to 32 Kbps
• LE: up to 7 Kbps
Data Throughput at 115200 bps UART baud rate
• BR/EDR: upto 10 Kbps
• LE: up to 6 Kbps
MAC/Baseband/Higher Layer
• Secure AES128 encryption
• Bluetooth 3.0: GAP, SPP, SDP, RFCOMM, and
L2CAP
• Bluetooth 4.2: GAP, GATT, ATT, SMP, and L2CAP
Operating Conditions
• Operating voltage range: 3.3V to 4.2V
• Operating temperature: -20ºC to +70ºC
Applications
• Internet of Things (IoT)
• Secure Payment
• Home and Securi ty
• Health and Fitness
• Industrial and Data Logger
• LED Lighti ng (16 c on fig urations)
Bluetooth
®
4.2 Dual-Mode Module
BM78
DS60001380A-Page 2
Advance Information
2016 Microchip Technology Inc.
General Descript ion
The BM78 modu le is a fully- certifi ed, Bluetooth ver sion
4.2 module for customers to easily add dual-mode
Bluetooth wireless capability to their products. The
BM78 is built around Microchip's IS1678 Bluetooth
dual-mode module, and it is available in ROM-based
(BM78SPPx5NC2) and Flash-based (BM78SPPx-
5MC2) versions. Refer to Section 9.0 “Ordering
Information” for additional information on the BM78
SKUs.
The BM78 bridges the customer products to smart
phones or tablets for conv enient data transfer, control,
and access to cloud applications delivering local con-
nectivity for IoT. The BM78 supports GAP, SDP, SPP,
and GATT profiles. Data transfer is achieved through
the Blueto oth link by se ndi ng or rec eiv in g data through
transparent UART mode, making it easy to integrate
with any microprocessor or Microcontroller (MCU) with
a UART interface. It also enables a easy configuration
by using a UI tool, a Windows configuration utility, or
directly through UART by MCUs.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 3
BM78
Table of Contents
1.0 Sy stem Overview ............................................................................................................................................................................ 5
2.0 Application Information ................................................................................................................................................................. 11
3.0 Operating Pattern .......................................................................................................................................................................... 23
4.0 Electrical Characteristics ............................................................................................................................................................... 31
5.0 Radio Characteristics .................................................................................................................................................................... 35
6.0 Physical Dimensions ..................................................................................................................................................................... 37
7.0 Reflow profile ................................................................................................................................................................................ 43
8.0 Module Placement ........................................................................................................................................................................ 45
9.0 Ordering Information ..................................................................................................................................................................... 49
Appendix A: Certification Notices ........................................................................................................................................................ 51
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will contin ue to improve our publications to bet ter suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or c omments regarding this publication, p lease c ontact the M arket ing Co mm unications Department via
E-mail at docerrors@microchip.com or fax the Read er Response Form in t he back of this data sheet to (480) 792-4150. We
welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literat ure number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer No tific atio n Syst em
Register on our web site at www.microchip.com to receive the most current information on all of our products.
BM78
DS60001380A-Page 4
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 5
BM78
1.0 SYSTEM OVERVIEW
The BM78
module
is a fully certified, embedded 2.4 GHz
Bluetooth version 4.2 (BR/EDR/LE) wireless module. It
includes an on board Blue tooth st ack, a power m anage-
ment subsystem, a 2.4 GHz transceiver, and an RF
power amplifier. Customers can embed Bluetooth func-
tionality into any application s us ing the BM 7 8.
The BM78 enables rapid product development and
faster time t o market, and it is designed to provide inte-
grators with the following f e atures:
• Simple integ ration and programmi ng
• Reduc ed dev el opm en t time
• Superior wireless module with low-cost syst em
• Interoperability with Bluetooth host
• Wide range of applications
The BM78 has four Stock Keeping Units (SKUs). For
additional information on SKUs, refer to Section 9.0
“Ordering Information”. The BM78SPPS5MC2/NC2
is a complete and fully regulatory certified module with
an integral ceramic chip antenna and RF shield. The
BM78SPP05MC2/NC2 is a low-cost alternative with
RF out PAD (for external antenna) and no RF shield.
The integrator is responsible for the antenna, antenna
matching, and regulatory certifications.
The BM78 is a small, compact, and surface mounted
module with castellat ed pads for ea sy and reliabl e host
PCB mounting. It is compatible with standard
pick-an d-place equi pment and
can indepe ndently main-
tain a low -power wireless connection . Low power usage
and flexible pow er manag ement maximize the lifetime of
the BM78 in battery-operated devices. A wide operating
temperature ra nge enable s its app lications in indo or and
outdoor environments. Figure 1-1 i llustrates the internal
block diagram o f the BM 7 8.
FIGURE 1-1: INTERNAL BLOCK DIAGRAM OF BM78
BM78
DS60001380A-Page 6
Advance Information
2016 Microchip Technology Inc.
Table 1-1 provides various pins of the
BM78SPPx5MC2/NC2
module.
TABLE 1-1: PIN DESCRIPTION
S5 Pin 05 Pin Symbol Type Description
1 — GND Power Ground reference
2 — GND Power Ground reference
3 1 GND Power Ground reference
4 2 BAT_IN Power Battery Input (3.3V to 4.2V)
Main positive su pply input
Connect to 10 uF (X5R /X7R) capacitor
5 3 SW_BTN DI Software Button H: Power On
L: Power Off
6 4 LDO33_O Power Internal 3.3V LDO output, can source no more than 50
mA
7 5 VDD_IO Power I/O positive supply input. Internal use only, do not con-
nect to other devices
8 6 LDO18_O Power Internal 1.8V LDO output. Internal use only, do not con-
nect to other devices
9 7 W AKEUP DI Wakeup from Sleep mode (active- low)
(internal pull-up)
10 8 PMULDO_O Power Power management unit output. Internal use only, do
not connect to other devices
11 9 P0_4 DO Status Indication pin along with P1_5, refer to Table 2-3
12 10 P1_5 DO Status Indication pin along with P0_4, refer to Table 2-3
13 11 P1_2/SCL DO I
2
C SCL
14 12 P1_3/SDA DIO I
2
C SDA
15 13 P1_7/CTS DIO Configurable Control or Indication pin or
UART CTS (input)
16 14 P0_5 DIO Configurable Control or Indication pin
17 15 P0_0/RTS DIO Configurable Control or Indication pin or
UART RTS (output)
18 16 P2_0 DI System configuration pin along with P2_4 and EAN
pins, used to set the BM78 in any one of the following
three modes: Application mode (for normal operation),
Test mode (to c hange EEPROM values), and Write
Flash m ode (to enter the new fi rmware into the m odule),
refer to Table 2-1
19 17 P2_4 DI System configuration pin along with P2_0 and EAN
pins, used to set the module in any one of the following
three modes: Application mode (for normal operation),
Test mode (to change EEPROM values), and Write
Flash mode (to enter new firmware into the module),
refer to Table 2-1
Legend: A = Analog D = Digital I = Input O = Output
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 7
BM78
20 18 EAN DI External address-bus negative System configuration pin
along w i th P2_ 0 an d P2 _4 p ins, u s ed to s et t he m od ule
in any of the three m odes : Applica tion m ode (fo r norm al
operation), Test mode (to change EEPROM values),
and Write Flash mode (to enter new firmware into the
module), refer to Table 2-1
ROM: Must be pulled high to VDD_IO
FLASH: Must be pulled down with 4.7Kohm to GND
21 19 RST_N DI Mod ule Reset (ac tiv e-lo w ) (intern al pul l up)
Apply a pulse of at least 63 ns
22 20 RXD DI UART data input
23 21 TXD DO UART data output
24 22 P3_1 DIO Configurable Control or Indication pin
(Internally pulled-up, if configured as an input)
25 23 P3_2 DIO Configurable Control or Indication pin
(Internally pulled-up, if configured as an input)
26 24 P3_3 DIO Configurable Control or Indication pin
(Internally pulled-up, if configured as an input)
27 25 P3_4 DIO Configurable Control or Indication pin
(Internally pulled-up, if configured as an input)
28 26 P3_6 DIO Do not connect
29 27 P3_7 DIO Configurable Control or Indication pin
(Internally pulled-up, if configured as an input)
30 28 LED1 DO Status LED, connec t to LDO33_0
31 29 GND Power Ground reference
— 30 BT_RF AIO External antenna connection(50 ohms)
32 — GND Power Ground reference
Legend: A = Analog D = Digital I = Input O = Output
TABLE 1-1: PIN DESCRIPTION (CONTINUED)
S5 Pin 05 Pin Symbol Type Description
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 9
BM78
FIGURE 1-3: BM78SPP05 MC2/NC2 PIN DIAGRAM
BM78
DS60001380A-Page 10
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 11
BM78
2.0 APPLICATION INFORMATION
2.1 System Configuration
The I/O pins, P2_0, P2_4 and EAN, place the BM78
into operat ing mode and each of thes e pins hav e inter-
nal pull up and allow configuration settings and firm-
ware to be updated from UART. Table 2-1 provides
system configuration details.
TABLE 2-1:
SYSTEM CONFIGURATION SETTINGS
2.2 Control and Indication I/ O Pins
The I/O pins, P0_0, P0_5, P1_7, P3_1, P3_2, P3_3,
P3_4, and P3_7, are configurable control and indica-
tion pins. The control signals are inputs to the BM78
and the indication signals are outputs from the BM78.
Table 2-2 prov ide s d efa ult I/O pi n c onfi gu rati on d etails.
TABLE 2-2: CONTROL AND INDICATION I/O PIN ASSIGNMENTS
Note 1: The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7.
2: The RTS and CTS pins can be configured as GPIOs if flow control is disabled.
Module P2_0 P2_4 EAN Operational Mode
BM78SPPx5NC2
(ROM Variant) Low High High Write EEPROM and test mode
High High High Normal operation/application mode
BM78SPPx5MC2
(Flash Variant)
Low Low High Write FLASH
Low High Low Write EEPROM and test mode
High High Low Normal operational/application mode
PINS
N/C
UART_RTS
(1,2)
UART_CTS
(1,2)
LOW_BATTERY_IND
RSSI_IND
GET WIFI INFO KEY
LINK_DROP_CONTROL
(DISCONNECT)
UART_RX_IND
PAIRING_KEY
INQUIRY CONTROL
PROFILE_IND
P0_0
■
P0_5
■
P1_7
■
P3_1
■
P3_2
■
P3_3
■
P3_4
■
P3_7
■
BM78
DS60001380A-Page 12
Advance Information
2016 Microchip Technology Inc.
2.3 Status Indication I/O Pins
The I/ O pin s, P1_5 an d P0_4 , are st atus indi cator p ins:
Status_IND_1 and status_IND_2. Together these pins
provide status indication to MCUs. Table 2-3 provides
status indication of the P1_5 and P0_4 pins.
TABLE 2-3: STATUS INDICATION
2.4 Power Tree
Figure 2-1 illustrates the power tree diagram of the
BM78.
FIGURE 2-1: POWER TREE DIAGRAM
P1_5/STATUS_IND_1 P0_4/STATUS_IND_2 Indication
H H Power-on (default setting) and deep-sleep state.
HH status should be stable for at least 500 ms.
HLAccess state
L H Link state
(UART data trans m itting)
L L Link state (no UART data transmitted)
Legend: L = Low H = High
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 13
BM78
2.5 Software Button (SW_BTN)
The Software Button (SW_BTN) input pin powers the
BM78
ON (high) or OFF (low) into the S4 mode. The S4
mode is the Deep-sleep mode and the S2 mode is the
Sleep mod e. The S4 mode can only be tr iggered by the
SW_BTN pin, and the power consumption is lower in
the S4 mode.
Figure 2-2 through Figure 2-4 display the waveforms
for the
BM78 in the high and low status, that is access
and link s t a tus.
FIGURE 2-2: SW _BTN TIME (H IGH) AT APP MODE
(1,2,3,4,5)
Note 1: MCU can send UART command, refer to Table 2-3.
2: Time duration (475 ms) is for reference purpose only, check the status pin.
3: Reset is ‘no connect’.
4: Time is configured as default setting.
5: Data corresponds to the BM78SPPx5NC2 (ROM variant) module.
BM78
DS60001380A-Page 14
Advance Information
2016 Microchip Technology Inc.
FIGURE 2-3: SW _BTN TIME (LOW ) AT ACCESS STATES
(1,2,3)
Note 1: Reset is ‘no connect’.
2: Time is configured as default setting.
3: Data corresponds to the BM78SPPx5NC2 (ROM variant) module.
FIGURE 2-4: SW_BTN TIME (LOW) AT LINK STATES
(1,2,3)
Note 1: 830 ms time duration is a typical value measured on iPhone 6 and this tim e duration can vary from one smart
phone to another.
2: Reset is ‘no connect’.
3: Time is configured as default setting.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 15
BM78
2.6 WAKE UP
The WAKE UP input pin wakes the BM78 from Sleep
mode (active-low) and wake up is always from Sleep
mode (S2) to Stan dby mo de. Figure 2-5 illustrates the
timing diagram of the BM78 in the Wake Up mode.
FIGURE 2-5: WAKEUP TI ME
(1,2)
Note 1: 85 ms is for reference time and the user should check the status pin.
2: Refer to Table 2-3 for the status of the P0_4/P1_5 pin.
BM78
DS60001380A-Page 16
Advance Information
2016 Microchip Technology Inc.
2.7 External Reset
The watchdog tim er (WDT) ca n Reset the BM7 8 whic h
has an integrated Power-on Reset (POR) circuit that
reset all ci rcuit s to a kn own Power-on state. This actio n
can als o be dr ive n by an ex ternal Reset s ignal that ca n
be used t o externall y control the device , forcing it into a
Power-on Reset state. The Reset signal input is
active -low and conne ction is not req uired in most o f the
applications.
Figure 2-6 illustrates the timing diagram of the BM78
when it is in the Reset (RST_N is set to active low)
state.
FIGURE 2-6: TIMING WAVEFORMS ON RESET (WHEN RST_N IS SET TO ACTIVE LOW)
(1,2,3,4)
Note 1: Auto Pattern can use external Rese t, refer to Section 3.0 “Operating Pattern”.
2: The RST_N state trigger must be greater than 63 ns.
3: Manual pattern can use external Reset and Reset command, refer to Section 3.0 “Operating Pattern”.
4: Time duration (350 ms) is for reference purpose only, check the status pin.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 17
BM78
2.8 LED Driver
The BM78 has a dedicated LED driver and the LED
(LED1) can be connected directly with the BM78 using
this driver, see Figure 2-7.
The maximum current sourcing for the LED is 5 mA and
it provides 16 options (steps) to trim the brightness.
The LED brightness can be configured using the User
Interface (UI) tool, a Windows
®
configuration utility.
The follow ing are stat us indication of the LED an d each
indication is a configurable flashing sequence:
• Standby
• Link Back
• Low Battery
• Inquiry
• Link
FIGURE 2-7: LED DRIV ER
BM78
DS60001380A-Page 18
Advance Information
2016 Microchip Technology Inc.
2.9 Host MCU Interface over UART
Figure 2-8 illustrates an example of UART interface
with host MCU and power scheme using 3.3V to the
V
DD
. Battery p ower is applied to the BAT_IN pin. From
the LDO33_O pin, voltage can be routed to the
VDD_IO pin and external circuitry including the MCU.
This power scheme ensures that the BM78 and MCU
I/O voltages are compatible.
FIGURE 2-8: POW ER AND MCU INTERFACE EXAMPLE FOR BM78
Note 1: Ensure that VDD_IO and MCU VDD voltages are compatible.
2: The control and indication ports are configurable
Note: The internal 3.3V LDO current source
should not exceed 50 mA (i.e maximum).
BM78
DS60001380A-Page 20 Advance Inform ation 2016 Microchip Technology Inc.
FIGURE 2-10: BM78SPP05MC2/NC2 REFERENCE CIRCUIT
2016 Microchip Technology Inc. Advance Inform ation DS60001380A-Page 21
BM78
FIGURE 2-11 : BM78SPPS5M C2/N C2 REFERENCE CIRCUIT
BM78
DS60001380A-Page 22 Advance Inform ation 2016 Microchip Technology Inc.
FIGURE 2-12: BM78SPPS5MC2/NC2 REFERENCE CIRCUIT
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 23
BM78
3.0 OPERATING PATTERN
The BM78 provides two operating patterns, Auto Pat-
tern and M anual Pattern, and the operati ng mo des ca n
be con figured thr ough th e UI tool or the hos t MCU. See
Figure 3-1.
If the Auto_Pattern_Setting parameter is enabled, the
BM78 triggers the Auto Pattern state machine other-
wise Manual Pattern is u sed. Configure mode is avail-
able only in Auto Pattern and it can be enabled or
disabled by the UI settings or host MCU.
FIGURE 3-1: OPE RATING PATTERN CONFIGURATION
BM78
DS60001380A-Page 24
Advance Information
2016 Microchip Technology Inc.
3.1 Auto Pattern
In Auto Pattern, the BM78 aut om atic al ly operat es after
power on withou t any in terfe ren ce from the MCU. Auto
Pattern is the basic ap plicatio n of the BM7 8. Figure 3-2
illustrates the characteristics of Auto Pattern.
FIGURE 3-2: AUTO PATTERN CHARACTERISTIC
Although the BM78 is set to operate in Auto Pattern
mode, it provides the flexibility for the MCU to perform
some spe cific setti ngs i n C onfig ure mo de by comm and
set. If the BM78 has enabled authenticated pairing, the
command set is required to accomplish the Bluetooth
link. The MCU doesn’t have to deal with the BM78
state, and the BM78 changes its state after power on.
However, the MCU can terminate the connection by
using GPIOs. The transparent pipe is used for
application data transmission and data is transmitted
between the remote host and MCU.
The MCU knows the state of the BM78 by GPIOs. The
configure mode is available only in Auto Pattern and it
can be enabled or disabled by UI tool settings. Basi-
cally, the MCU is communicating with the BM78 by
GPIOs, except for data transmission.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 25
BM78
Figure 3-3 illustrates how the BM78 changes its own
state. After power on, there are two options, one is to
enter Stand-by mode and the other is to enter
Link-Back mode, and it depends on if any device is
recorded in the BM78. Irrespective of the mode, the
BM78 waits for the remote side to establish a connec-
tion or tries to establish a connection with the remote
side. Once the connection is established, the state of
the BM78 changes to connected mode. If the connec-
tion is terminated, the BM78 goes into Deep-Sleep
mode.
FIGURE 3-3: BM7 8 INTERNAL STATE MACHINE
The BM78 stays in Access state and it is ready for a
remote host to access. It either waits for the remote
side to c reat e a c onn ec tion or tries to create a con ne c-
tion on its own .
Configure mode and pairing procedure are also define d
as Acce ss st ate. If the BM78 enters l ink st ate, it mean s
not only the Bluetooth link has been established suc-
cessfully, but also the data session is triggered. MCUs
can tran smit dat a t o a remote ho st or r eceiv e dat a fro m
a remote host in this state.
Note: Link-Back mode is available only for SPP
profile or mode.
TABLE 3-1: S TATE INDICATION
State Mode
Access State Configure Mode
Stand-by Mode
Link-Back mode
Pairing Procedure
Link State Connected Mode
Deep-sleep State Deep-Sleep Mode
BM78
DS60001380A-Page 26
Advance Information
2016 Microchip Technology Inc.
Figure 3-4 illustrates Auto Pattern transparent pipe. If
MCU wants to send data (12345) to the remote side,
the data should be in the.hex format to the BM78 and
the BM78 transmits the received data to the remote
side. Similarly, if the BM78 receives data from the
remote h ost, it s ends the data i n the.hex format to the
MCU.
FIGURE 3-4: AU TO PATTERN TRANSPARENT PIPE
3.2 Manual Pattern
In Manual Pattern, the MCU communicates with the
BM78 using command sets. The MCU must send cor-
rect commands to handle the state of the BM78. The
change in the BM78 state is based on the MCU com-
mands.
The data pipe for Manual Pattern is d i f fe rent from Auto
Pattern. Since the MCU is communicating with the
MCU by c ommand se ts, the da ta transm ission will fol -
low t he command set r ule. This is defin ed as pro tocol
pipe. In Manual Pattern, the MCU can get the det ail sta-
tus by the BM78_Status_Report event.
Figure 3-5 illustrates the c har acteris tics of M anual Pa t-
tern.
FIGURE 3-5: MANUAL PATTERN CHARACTERISTICS
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 27
BM78
Figure 3-6 illustrates the MCU state change in Manual
Pattern. For Manual Pattern, all MCU state change
requires a corresponding command. For example, the
MCU se nds th e Invisible_Setting c om ma nd wi th
the pa rameter Enter_Standby_Mode, then the BM78
goes into stand-by mode. The MCU sends the
SPP_Create_Link command, then BM78 goes into
Link-Bac k mo de.
In Auto Pattern, the BM78 g oes into De ep-Sl ee p m od e
once the connection is terminated, and in Manual Pat-
tern the BM78 stays in Idle mode even after the con-
nection is terminated. The MCU should decide on the
mode of the BM78 once the connection is terminated,
that is based on the overall system behavior.
FIGURE 3-6: STATE CHANGES BY MCU IN MANUAL PATTERN
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 29
BM78
3.3 Mode Definition
3.3.1 CONFIGURE MODE
The Configure mode configures the relative settings
before the BM 78 en ters in to Auto Pa ttern state. If Con-
figure mode is enabled, the BM78 will send Configure
mode status event to notify the MCU that the BM78 is
ready to receive commands. If the BM78 doesn’t
receive any v alid com mand wit hin th e specif ied Confi g-
ure mode time, it will exit from Configure mode auto-
matically. Once the MCU sends any valid command
within the Configure mode time, the BM78 will not exit
Configure mode until the MCU gives the leave Config-
ure mod e command . Once the BM78 exit s from C onfig-
ure mode, it goes to process Auto Pattern state
machine.
FIGURE 3-8: CONFIGURE MODE
BM78
DS60001380A-Page 30
Advance Information
2016 Microchip Technology Inc.
3.3.2 STANDBY MODE
• SPP (BR/EDR)
- Enable th e inquiry scan and pa ge scan in this
mode
- Configurable to be discoverable
- Ready to be paired
• Bluetooth Low Energy (BLE)
- Enable the undirected advertising in this
mode
- Ready to be paired
3.3.3 LINK- BA CK MODE
• SPP (BR/EDR)
- Enable page procedure to establish dedi-
cated or last connected Bluetooth SPP link
- Configurable to be invisible situation
•BLE
- No BLE link-bac k behavior because of iOS
limitation
- Configurable to be invisible situation
- Ready to be paired
3.3.4 CONNECTED MODE
• SPP (BR/EDR)
- Use SPP or iAP protocol to exchange the
application data
- Connection Est ablish statu s: SPP Conn ected
mode
•BLE
- Use GATT protocol to exchange the applica-
tion data
- Connection es tablish sta tus : BLE Connec ted
mode
3.3.5 DEEP- SLEEP MODE
• Auto Pattern
- Enter into Deep-Sleep mode automatically
- Wa ke -up trigg er: Wakeup pin
• Manual Pattern
- Enter into Deep-Sleep mode by MCU
comma nd as sig n
- Wa ke -up trigger: Wak eup pin or
UART_RX_Ind pin
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 31
BM78
4.0 ELECTRICAL CHARACTERIS T ICS
This section provides an overview of the electrical characteristics of the BM78 module. Additional information will
be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the BM78 devices are listed below. Exposure to these maximum rating conditions for
extende d periods may a ffect devi ce reliabilit y . Func tional operati on of the device at the se or any other con ditions, abov e
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
Ambient temperature under bias...............................................................................................................-20°C to +70°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
DD
with respect to V
SS
......................................................................................................... -0.3V to +3.6 V
Maximum output current sunk by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin.....................................................................................................12 mA
Note: Stre sse s ab ov e th os e l is t ed und er “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
BM78
DS60001380A-Page 32
Advance Information
2016 Microchip Technology Inc.
Table 4-1 through Table 4-7 provide the rec omme nde d
operat ing cond iti ons and the ele ctrica l spec ifica tions of
the BM78.
Note 1: HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V.
Note 1: With 10 uF capacitor at LDO33_O as the condition for IP verification.
2: Output voltage can be calibrated using the MP tool
Note 1: With 1uF capacitor at PMULDO_O as the condition for IP verification.
2: Output voltage can be calibrated by using the MP tool.
TABLE 4-1: RECOMMENDED OPERATING CONDITIONS
Rating Min. Typical Max.
Ambient Operating temperature range -20ºC +25ºC +70ºC
Relative Humidity (Operating) 10% — 90%
Relative Humidity (Storage) 10% — 90%
ESD
HBM — ±2KV —
MM — ±200V —
HTOL (Note 1) — 1000 hrs —
Supply vo ltage: BAT_IN 3.3V — 4.2V
Supply voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR 1.8V 1.9V 2.1V
SW_BTN 3.3V — 4.2V
LED1 ——3.6V
Reset V
TH,res
threshold voltage — 1.6V —
V
IL
input logic levels low -0.3V — 0.8V
V
IH
input logic lev el s high 2.0V — 3 .6V
V
OL
output logic levels low (I
Ol
= 12mA) — — 0.4V
V
OH
output logic levels high (I
Oh
= 12mA) 2.4V — —
RF continuous Tx mode — — 43 mA
RF continuous Rx mode — — 37 mA
TABLE 4-2:
3.3V LDO ELECTRICAL PARAMETERS
(1,2)
Parameter Min. Typical Max. Unit
Operating Temperatu r e -20 — +70 ºC
Output Current (V
IN
= 3.6V /load regulation with 100mV drop) — 100 — mA
Quiescent Current (V
IN
= 3.6V) — 15 0 — uA
TABLE 4-3:
PMU LDO
(1,2)
Parameter Min. Typical Max. Unit
Operating Temperature -20 — +70 ºC
Output Current (V
IN
= 3.6V/load regulation with 0.3mV drop) — 100 — uA
Quiescent Current (V
IN
= 3.6V) — 12 0 — uA
TABLE 4-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR
Parameter Min. Typical Max. Unit
Operati ng Temperatu re -20 — +70 ºC
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 33
BM78
Note 1: SAR_BAT is connected with BAT_IN internally for battery voltage detection.
TABLE 4-5: INTENSITY CONTROLLABLE LED DRIVER
Note 1: Classic BR/EDR and RX_IND functions are enabled.
2: The data corresponds to BM78SPPx5NC2 (ROM variant).
AVDD_SAR power su ppl y — 1.8 — V
SAR_BAT detection (Note 1) 3.3 — 4.2 V
Resolution — 10 — bit
Operati ng Cu rren t (incl udi ng ban dga p) — — 1 mA
Deep-sleep Current — — 1 uA
Parameter Min. Typical Max. Unit
Operating Temperature -20 — +70 ºC
Open-drain Voltage — — 3.6 V
Current Step — 0.3 — mA
Programmable Current Range 0 — 5 mA
Intensity control — 16 — step
Power down open-drain current — — 1 uA
Deep-sleep Current — — 1 uA
TABLE 4-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR
Parameter Min. Typical Max. Unit
TABLE 4-6: POWER CONSUMPTION-CLASSIC
(1,2)
Test Condition Current Consumption (avg.) (mA) Remarks
Standb y mo de 2.543 —
Deep-sleep mode 0.187 —
Connected+Sniff, Master (no data) 0.541 No data was transmitted
Sniff interval = 500 ms
Connected+Sniff, Slave (no data) 0.551 No data was transmitted
Sniff interval = 500 ms
Data, Master 10.67 Data transmitted at 115200 bps;
block size = 500
Data, Slave 14.87 Data transmitted at 115200 bps;
block size = 500
TABLE 4-7: POWER CONSUMPTION-LOW ENERGY
(1,2,3)
Test Condition Current Consumption (avg.) (mA) Remarks
Deep-sleep mode 0.13 —
LE fast advertising 1.21 LE fast advertising interval = 100 ms
0.88 LE fast advertising interval = 1 60 ms
0.48 LE fast advertising interval = 5 00 ms
1.72 LE fast advertising interval = 1 00 ms+
Beacon 100 ms
0.62 LE fast advertising interval = 5 00 ms+
Beacon 500 ms
BM78
DS60001380A-Page 34
Advance Information
2016 Microchip Technology Inc.
Note 1: Low energy, RX_IND function is enabled.
2: Data corresponds to the BM78SPPx5NC2 (ROM variant).
3: Only low energy
Reduced power advertising 0.39 LE Reduced Power advertising
interval = 961 ms
1.00 LE Re duced Power advertising
interval = 961 ms+Beacon 100 ms
0.51 LE Reduced Power advertising
interval = 961 ms+Beacon 500 ms
Connected (No data) 0.39 Connection interval = 1500 ms
0.43 Connection interval = 600 ms
Connec ted (iPho ne
®
6 to module) 0.45 Connection interval = 500 ms
0.60 Connection interval = 200 ms
Connected (module to iPhone 6) 6.6 Connection interval = 500 ms
7.0 Connection interval = 200 ms
TABLE 4-7: POWER CONSUMPTION-LOW ENERGY
(1,2,3)
(CONTINUED)
Test Condition Current Consumption (avg.) (mA) Remarks
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 35
BM78
5.0 R ADIO CHARACTERISTICS
Table 5-1 provides the transmitter performance
characteristics of the BM78 module .
TABLE 5-1: TRANSMITTER PERFORMANCE
(1,2)
Table 5-2 provides the receiver performance character-
istics of the BM78 module.
TABLE 5-2: RECEIVER PERFORMANCE
(1)
Min. Typical Max. Bluetooth
Specification Unit
BDR power — 1.5 — -6 ~ +4 dBm
EDR (2M/3M) power — -1 — -6 ~ +4
LE power — 0.5 — -20 ~ +10
Note 1: The RF Transmit power can be calibrated during production by using the MP Tool software and the
MT8852 Bluetooth Test equipment.
2: Test condition: V
CC
RF = 1.80V, temperature = 25ºC.
Min. Typical Max. Bluetooth
Specification Unit
BDR Sensitivity — -90 —
≤
-70 dBm
EDR 2M Sensitivity — -90 —
EDR 3M Sensitivity — -82 —
LE Sens itivity — -92 —
Note 1: Test condition: V
CC
RF
= 1.80V, temperature = 25ºC .
BM78
DS60001380A-Page 36
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 39
BM78
Figure 6-3 illustrates the recommendations for mount-
ing the BM78SPPS5MC2/NC2 on the host PCB, and it
also show s t he mi nim um grou nd plan e a rea to t he l eft
and right of the module for the best antenna perfor-
mance.
Avoid top copper layer near the test pin area. When
designing the host PCB, the areas under the antenna
should not contain any top, inner, or bottom copper
layer. A low-impedance ground plane will ensure best
radio performance (best range and lowest noise). The
ground plane can be extended beyond the minimum
recommended as needed for host PCB EMC noise
reduction. For best range performance, keep all exter-
nal metal at least 31 mm away from the ceramic chip
antenna.
FIGURE 6-3: BM 78SPPS5MC2/NC 2 HOST PCB MOU NTING SUGGESTION
BM78
DS60001380APage 42
Advance Information
2016 Microchip Technology Inc.
Figure 6-6 illustrates the recommended mounting
details for the BM78SPP05MC2/NC2 module and rec-
ommended layout o f the host PCB.
A low-impedance ground plane will ensure best radio
performance (best
range, lowest noise). Pin30
(BT_RF) is a 50 ohm co nnection to an external antenna
connector, PCB
trace antenna, or component (ceramic
chip) antenna through a host PCB with 50 ohm imped-
ance and mic ro-strip trac e. This
trace can be extended
to include passive parts for antenna attenuation pad-
ding, impedance matching,
or to provide test posts. It is
recommended that the micro-strip trace be as short as
possible for
minimum loss and better impedance
matchi ng . If the micr o -stri p trace is long er, it should b e
a 50 ohm
impedance.
FIGURE 6-6: BM78SPP05MC2/NC2 HOST PCB MOUNTING SUGGESTION
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 43
BM78
7.0 REFLOW PROFILE
The BM78 should be assembled using a standard
lead-free reflow profile, IPC/JEDEC J-STD-020. The
BM78 can be soldered to the host PCB by using the
standard leaded and lead-free solder reflow profile.
To avoid damage to the module, follow these recom-
mendations:
• Follow solder reflow recommendations provided
in Micr och ip Technology Applic ation N ote “AN233
Solder Reflow Recommendation (DS002 33)”.
• Refer to the solder paste data sheet for specific
reflow prof ile recomme nda tio ns .
• Do not exceed the peak temperature (T
P
) of
250ºC.
• Use no-clean flux solder paste.
• Do not wash as moisture can be trapped under
the shield.
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
• Standard: IPC/JEDEC J-STD-020.
- Condition: Preheat:150~200 ℃for 60~120
seconds.
- Average ramp-up rate (217 ℃ to peak): 3 ℃
sec max.
- Temperature maintained above 217: 60~150
seconds.
-Time within 5℃ of peak tempe rature: 30 ~ 40
seconds.
- Peak temperature: 260 +5/-0 ℃.
- Ramp-down rate (peak to 217): 6 ℃/sec.
max.
- Ti me 25℃ to peak temperature: 8 minutes
max.
- Cycle interval 5 minutes.
FIGURE 7-1: REFLOW PROFILE
BM78
DS60001380A-Page 44
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 45
BM78
8.0 MODULE PLACEMENT
For a Bluetooth wireless product, the antenna place-
ment af fect s the p erformanc e of the wh ole sys tem. The
antenna requires free space to radiate the RF signal
and it cannot be surrounded by the ground plane.
Microchip recommends that the areas underneath the
antenna on the ho st PCB sh ould n ot con t ain copp er on
top, inner, or bottom layer.
Figure 8-1 illustrates an example of good and poor
antenna placement on a host PCB with gro und plane.
The ground plane can be extended beyond the mini-
mum recommended as required for the main PCB EMC
noise re duc tio n. For th e b es t ran ge performance, keep
all ex terna l metal away from the c era mi c chi p antenna,
that is minimum 15 m m away.
FIGURE 8-1: MODULE PLACEMENT EXAMPLES
TABLE 8-1: RECOMMENDED ANTENNA
Descrip tion Manufactur e r Part Number Manu factu r er
ANT ANT3216A063R2400A PIFA 2.4GHZ L3.2W1.6 ANT3216A063R2400A YAGEO
BM78
DS60001380A-Page 46
Advance Information
2016 Microchip Technology Inc.
Figure 8-2 illustrates the BM78 module is mounted on
the BM78 Evaluation Board (EVB). It also shows the
recommended keep out area for the antenna.
FIGURE 8-2: KEEP OUT AREA RECOMMENDED FOR ANTENNA
Note: For additional information on free space
for ante nna pl acem ent de sign, refer to the
design rule document of the antenna
manufacturer.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 47
BM78
8.1 BM78SPPS5MC2/NC2 Ceramic Chip Antenna
The BM78SPPS5MC2/NC2 contains an integral
ceramic chip antenna. Figure 8-3 illustrates the
ante nna radia tion patt ern of th e ceramic ch ip anten na
on the BM78SPPS5MC2/NC2.
FIGURE 8-3: BM78SPPS5MC2/NC2 ANTENNA RADIATION PATTERN
TABLE 8-2: ANTENNA RADIATION
PATTERN DETAILS
Parameter Values
Frequency 2450 MHz
Peak Gain 1.63 dBi
Efficiency 71.55%
BM78
DS60001380A-Page 48
Advance Information
2016 Microchip Technology Inc.
NOTES:
BM78
DS60001380APage 49 Advance Inform ation 2016 Microchip Technology Inc.
9.0 ORDE RIN G INFORMA TION
Table 9-1 provides the various SKUs of the BM78 module.
TABLE 9-1: BM78 MODULE SKUS
Note: Contact Microchip Sales office for information on Bluetooth 4.2 ROM variants of the BM78.
Device Microchip IC Antenna Description Shield Regulatory Certification Ordering Number
BM78SPPS5MC 2 IS1678SM-151 On-board BT4.2 Dual Mode, Class 2, Flash V ari ant Yes FCC, IC, CE, MIC, KCC, NCC,
JRF BM78SPPS5MC2-0002AA
BM78SPP05MC2 IS1678SM-151 External BT4.2 Dual Mode, Class 2, Fl ash Variant No No BM78SPP05MC2-0002AA
BM78SPPS5NC2 IS1678S-152 On-board BT4.2 Dual Mode, Class 2, ROM Variant Yes Planned BM78SPPS5NC2-0002AA
BM78SPP05NC 2 IS1678S- 152 External BT4.2 Du al Mode, Class 2, ROM Variant No No BM78SPP05NC2-0002AA
BM78
DS60001380A-Page 50
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 51
BM78
APPENDIX A: C ERTIFICATION
NOTICES
The BM78 has receiv ed regula tory appro val for the fol-
lowing countries:
• BT SIG/QDID : 75929
• United States/FCC ID: A8TBM78ABCDEFGH
• Canada:
- IC ID: 12246A-BM78SPPS5M2
- HVIN: BM78SPPS5M2
• Europe/CE
• Japan/MIC: 202-SMD070
• Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2
• Taiwan/NCC No: CCAN15LP0510T4
A.1 REGULATORY APPROVAL
This se ction outlines the regulatory information for the
BM78 for the followi ng cou ntries :
• United States
• Canada
• Europe
• Japan
•Korea
•Taiwan
• Other Regu latory Jurisdictions
A.1.1 UNITED STATES
The BM78 module has received Federal Communica-
tions Comm ission (FCC) CFR47 Telecomm unications,
Part 15 Subpart C "Intentional Radiators" modular
approval in accordance with Part 15.212 Modular
Transmitter appro val . Mo du lar approval allows the en d
user to integrat e the BM78 module into a fin ished pro d-
uct without obtaining subsequent and separate FCC
approvals for intentional radiation, provided no
changes or modifications are made to the module cir-
cuitry. Changes or modifications could void the user's
authority to operate the equipmen t. The end user must
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.
The fini shed product is required to comply with all appli-
cable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with t he trans mitter m odule por tion. Fo r exampl e, com -
plian ce must be demonstr ated to re gulation s for othe r
transmitter components within the host product. The
requirements for unintentional radiators (Part 15 Sub-
part B "Unintentional Radiators"), such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g.,
transmi tter modules may also co ntain di gital lo gic func-
tions) as appropriate.
A.1.2 LABELING AND USER
INFORMATION REQUIREMENTS
The BM7 8 ha s been labeled with it s ow n FCC ID num-
ber, and if the FCC ID is n ot visi ble wh en the m odule i s
installed inside another device, then the outside of the
finishe d product into which the mod ule is installe d must
also display a label referring to the enclosed module.
This exterior label can use wording as follows:
A user's manual for the finis hed p rodu ct sh ould i nclude
the following statement:
Addition al informatio n on labeling and user info rmation
requirem ents for Part 15 dev ices c an b e fo un d in KDB
Publica tion 784748 av ailable at the FCC Offi ce of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KD B)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
Contains Transmitter Module FCC ID: A8TBM78AB-
CDEFGH
or
Contains FCC ID:A8TBM78ABCDEFGH
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
This e quipm ent h as been teste d and foun d t o co mply
with the limits for a Clas s B digit al device , pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipm ent off and on, th e user is enco uraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna.
• Increas e the sep ara tion bet ween the equi pment
and receiver.
• Connec t the equipmen t into an o utlet on a circu it
different from that to which the receiver is con-
nected.
• Consult the dealer or an experienced radio/TV
technician for help.
BM78
DS60001380A-Page 52
Advance Information
2016 Microchip Technology Inc.
A.1.3 RF EXPOSURE
All transm itters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power l isted is con ducted.
This gran t is valid only when the module i s sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certifi cation and must n ot be co-lo cated or opera ting i n
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-tra nsmi tter prod uc t procedure s.
A.1.4 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov.
FCC Of fic e of Eng ineering a nd Techn ology (O ET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.2 Canada
The BM78 module has been certifi ed for use in Ca nada
under I ndustry C anada (IC) Radio S t andards S pe cifica-
tion (RSS) RSS-247 and RSS-Gen. Modular approval
permits the installation of a module in a host device
without the need to recertify the device.
A.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the host device (from Sec-
tion 3.1, RSS-Gen, Issue 4, No vember 20 14): The hos t
device shall be properly labeled to identify the module
within the host device.
The Industry Canada certification label of a module
shall be cle arl y vis ib le at all times when ins t alled in the
host device, otherw ise th e host devic e must be lab eled
to display the Industry Canada certification number of
the modul e, preceded by the words "C ontains trans mit-
ter module", or the word "Contains", or similar wording
expressing the same meaning, as follows:
User Manual Notice for Li cense-Exempt Radio Appara-
tus (from Section 8.4 RSS-Gen, Issue 4, November
2014): User manuals for license-ex empt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
T ransmitter Antenn a (from Section 8.3 RSS-Gen, Issue
4, November 2014): User manuals for transmitters
shall dis play the followi ng notice in a cons picuous loca-
tion:
The above notice may be affixed to the device instead
of display ed in the us er manu al .
A.2.2 RF EXPOSURE
All transmitters regulated by IC must comply with RF
exposure requirements listed in RSS-102 - Radio Fre-
quency (RF) Exposure Compliance of Radioc ommuni-
cation Apparatus (All Frequency Bands).
A.2.3 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Contains transmitter module IC:
12246A-BM78SPPS5M2
This device complies with Industry Canada
license-exempt RSS standard(s). Operation is sub-
ject to the following two conditions: (1) this device
may not cause interference, and (2) this device must
accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Indus-
trie Canada applicables aux appareils radio exempts
de licen ce. L' explo ita tion es t autoris ée aux deux c on-
ditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même
si le brouillage est susceptible d'en compromettre le
fonctionnement.
Unde r Indu stry Can ada re gulat ions , thi s ra dio t rans-
mitter may only operate using an antenna of a type
and maxi mum (or lesser) ga in approved for the tran s-
mitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its
gain s hould be so ch os en tha t the equival ent is ot rop-
ically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Can-
ada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieu r) approuvé pou r l'émetteur par Indus trie Can-
ada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il
faut ch oisir le type d 'antenne et son gain de sorte que
la puissance isotrope rayonnée équivalente (p.i.r.e.)
ne dépasse pas l'intensité nécessaire à l'établisse-
ment d'une communication satisfaisante.
BM78
DS60001380A-Page 53
Advance Information
2016 Microchip Technology Inc.
A.3 Europe
The BM78 module is an R&TTE Directive assessed
radio module that is CE marked and has been manu-
factured and tested with the intention of being inte-
grated into a final product.
The BM78 mo dule has been tes ted to R&TTE Directiv e
1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility
(EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Section TABLE A-1: “EUROPEAN
COMPLIANCE TESTING”. A no tified body opinio n has
also been issued.
The R&TTE Compliance Association provides guid-
ance on modular device s in document Te chnical Guid-
ance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
A.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The labe l o n the f inal p roduct whic h con tai ns the BM78
module must follow CE marking requirements. The
R&TTE Compliance Association Technical Guidance
Note 01 provides guidance on final product CE mark-
ing.
A.3.2 ANTENNA REQUIREMENTS
From R&T TE Compl iance Ass ociatio n docume nt Tech-
nical Guidance Note 01:
Provided the integrator installing an assessed
radio module with an integral or specific antenna
and ins talled in conformance with the radio mo d-
ule manufacturer's installation instructions
requires no further evaluation under Article 3.2
of the R &TTE Directive a nd does not re quire fur-
ther invol vement of an R&T TE Directive Noti fied
Body for the final product. [Section 2.2.4]
The European Compliance Testing listed in
Section TABLE A-1: “EUROPEAN COMPLIANCE
TESTING” was performed using the integral ceramic
chip antenna.
Note: To maintain conformance to the testing
listed in Section TABLE A-1: “EURO-
PEAN COMPLIANCE TESTING”, the
module shall be installed in accordance
with the installation instructions in this
data sheet and shall not be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
produ ct with th e esse ntial req ui rement s of
the R&TTE Directive.
TABLE A-1: EUROPEAN COMPLIANCE TESTING
Certification Standards Article Laboratory Report Number
Safety EN 60950-1:2006+A11:2009
+A1:2010 +A12:2011+A2:2013 [3.1(a)]
TUV
Rheinland
10052799 001
Health ETSI EN 300 328 V1.9.1
EN 62479:2010 10052796 001
10052797 001
EMC EN 300 489-1 V1.9.2 [3.1(b)] 10052437 001
EN 301 489-17 V2.2.1
Radio ETSI EN 300 328 V1.9.1 (3.2) 10052796 001
10052797 001
Notifi ed Body
Opinion
0197
—TUV
Rheinland 10048937 001
BM78
DS60001380A-Page 54
Advance Information
2016 Microchip Technology Inc.
A.3.3 HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be down loade d from the Euro pe an Radi o Co mmu-
nications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equip-
ment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommu-
nications Administrations (CEPT ):
http://www.cept.org
• European Telecommunications Standards Insti-
tute (ETSI):
http://www.etsi.org
• Europe an R adi o Comm uni cations Offic e (ERO):
http://www.ero.dk
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
A.4 Japan
The BM78 module has received type certification and
is labeled with its own technical conformity mark and
certific ation numb er as requi red to conf orm to the tech-
nical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appli-
ance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their confor-
mance laboratory to determine if this testing is
required.
• There is an v ol untary Electroma gne tic Com p atibil-
ity (EMC) test for the host produ ct adm in is tere d
by VCCI: http://www.vcci.jp/vcci_e/index.html
A.4.1 LABELING AND USER
INFORMATION REQUIREMENTS
The labe l o n the f inal p roduct whic h con tai ns the BM78
modul e must follo w Japan m arkin g requ irements . The
integrator of the module should refer to the labeling
requirements for Japan available at the Ministry of
Internal Affairs and Communica tio ns (MIC ) webs ite .
The BM78 mod ule is labeled with its own technical co n-
formity mark and certi fication num ber . The final product
in which this module is being used must have a label
referring to the type certified module inside:
A.4.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.5 Korea
The BM78 module has received certification of confor-
mity in accordance with the Radio Waves Act. Integra-
tion of this mo dul e into a final pr odu ct doe s no t requi re
additional radio certification provided installation
instructions are followed and no modifications of the
module are allowed.
A.5.1 LABELING AND USER
INFORMATION REQUIREMENTS
The labe l o n the fi nal pr oduct whic h cont ai ns the BM78
module must follow KC marking requirements. The
integrator of the module should refer to the labeling
requirements for Korea available on the Korea Com-
munications Commission (KCC) website.
The BM78 module is la beled with it s own KC mark. Th e
final pro duct req uires the KC mark and c ertific ate num -
ber of the module:
A.5.2 HELPFUL WEB SITES
Korea Communications Comm ission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 55
BM78
A.6 Taiwan
The BM78 module has received compliance approval
in accordance with the Telecommunications Act. Cus-
tomers seeking to use the compliance approval in their
product should contact Microchip Technology sales or
distribution partners to obtain a Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
A.6.1 LABELING AND USER
INFORMATION REQUIREMENTS
The BM78 module is labeled with its own NCC mark
and certificate number as below:
The user's manual should contain below warning (for
RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.6.2 HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw
A.7 Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, please contact
Microchip for the required utilities and d ocumentation.
BM78
DS60001380A-Page 56
Advance Information
2016 Microchip Technology Inc.
APPENDIX B: REVISION HISTORY
Revision A (January 2016)
This is the initial released version of this document.
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 57
BM78
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microchip.com. This web si te i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online dis cu ss io n gr oups, Microchip con sul t an t
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing o f seminars and events, listin gs of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of interes t.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engi neer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical suppo rt is avail able throug h the we b site
at: http://microchip.com/support
BM78
DS60001380A-Page 58
Advance Information
2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc.
Advance Information
DS60001380A-Page 59
Information contained in this publication regarding device
appli ca tions and the like is p ro vided on ly f or your con ve nience
and may be su persed ed by updates . I t is your r esponsi bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
EE
L
OQ
, K
EE
L
OQ
logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoL yzer , PIC, PICSTART, PIC
32
logo, RightTouch, S pyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsP ICDEM. net, ECA N, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBenc h, MPAS M, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0133-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with t he customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are com mitted to continuously improving the c ode prot ecti on featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPIC
®
DSCs, K
EE
L
OQ
®
code hopping
devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949
==
DS60001380A-Page 60
Advance Information
2016 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca , IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhu ha i
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11 - 4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thail and - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha ge n
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921- 5800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15
