D14V0H1U2LP1610
Document number: DS40334 Rev. 1 - 2
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December 2017
© Diodes Incorporated
D14V0H1U2LP1610
1 CHANNEL HIGH SURGE TVS DIODE
Product Summary
VBR (Min)
IPP (Max)
CT (Typ)
15V
50A
320pF
Description
This new generation TVS is designed to protect sensitive electronics
from the damage due to ESD. The combination of small size and high
ESD surge capability makes it ideal for use in portable applications
such as cellular phones, digital cameras, and MP3 players.
Applications
Cellular Handsets
Portable Electronics
Computers and Peripheral
Ordering Information (Note 4)
Part Number
Compliance
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
D14V0H1U2LP1610-7
Standard
MR1
7
8
10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
Date Code Key
Year
2015
2016
2017
2018
2019
2020
Code
C
D
E
F
G
H
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Device Schematic
MR1 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
MR1
Pin 2 Pin 1
YM
e4
D14V0H1U2LP1610
Document number: DS40334 Rev. 1 - 2
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Conditions
Peak Pulse Current
IPP
50
A
8/20µs (Note 7)
Peak Pulse Power Dissipation
PPP
1120
W
8/20µs (Note 7)
ESD Protection Contact Discharge
VESD_CONTACT
±30
kV
Standard IEC 61000-4-2
ESD Protection Air Discharge
VESD_AIR
±30
kV
Standard IEC 61000-4-2
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 5)
PD
300
mW
Thermal Resistance, Junction to Ambient TA = +25°C
RθJA
417
C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Standoff Voltage
VRWM
14
V
Channel Leakage Current (Note 6)
IR
0.3
A
VR = 14.0V
Reverse Breakdown Voltage
VBR
15
V
IR = 1mA
Clamping Voltage, Positive Transients (Note 7)
VC
18
V
IPP = 1A, tp = 8/20μs
19
V
IPP = 10A, tp = 8/20μs
23.5
V
IPP = 50A, tp = 8/20μs
Channel Input Capacitance (Note 8)
CT
320
pF
VR = 0V, f = 1MHz,
Any I/O to GND
Dynamic Resistance
RDYN
0.05
TLP, 10A, tp = 100ns
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at
http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
7. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform.
8. Measured from any I/O to GND.
9. For information on the impact of Diodes Incorporated’s USB 2.0 compatible ESD protectors on signal integrity including eye diagram plots, please refer to
AN77 at the following URL: https://www.diodes.com/assets/App-Note-Files/AN77.pdf.
D14V0H1U2LP1610
Document number: DS40334 Rev. 1 - 2
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December 2017
© Diodes Incorporated
D14V0H1U2LP1610
0125 175
150
50
100
0
T , AMBIENT TEMPERATURE ( C)
Figure 1 Power Derating Curve
A°
P , POWER DISSIPATION (mW)
D
25 100
50 75 150
200
Note 5
250
300
350
400
0
50
25 50 75 100 125 150
PEAK PULSE DERATING % OF
PEAK POWER OR CURRENT
T , AMBIENT TEMPERATURE (
)
Figure 2 Pulse Derating Curve
A
0
100
25
75
175 200
0t, TIME ( s)
Figure 3 Pulse Waveform
20 40 60
100
50
0
Peak Value Ipp
Half Value I /2
pp
8x20 Waveform
as defined by R.E.A.
I , PEAK PULSE CURRENT (%I )
P ppP
80
120
160
200
240
280
320
360
400
0246810 12 14
CJ, JUNCTION CAPACITANCE (pF)
VR, REVERSE VOLTAGE (V)
Figure 4 Typical Junction Capacitance
C)
D14V0H1U2LP1610
Document number: DS40334 Rev. 1 - 2
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1
Y
X
X2
U-DFN1610-2 (Type B)
U-DFN1610-2
(Type B)
Dim
Min
Max
Typ
A
0.45
0.55
0.50
A1
0.00
0.05
0.015
A3
-
-
0.127
b
0.85
0.95
0.90
D
1.55
1.65
1.60
E
0.95
1.05
1.00
e
-
-
1.10
L
0.35
0.45
0.40
z
0.050 REF
z1
0.050 REF
All Dimensions in mm
U-DFN1610-2 (Type B)
Dimensions
Value
(in mm)
X
0.650
X1
0.600
X2
1.900
Y
1.300
D
E
(Pin #1 ID)
R0.100
z
L
b
z1
A1
A
Seating Plane
e
A3
D14V0H1U2LP1610
Document number: DS40334 Rev. 1 - 2
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December 2017
© Diodes Incorporated
D14V0H1U2LP1610
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
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