© Semiconductor Components Industries, LLC, 2011
August, 2011 Rev. 3
1Publication Order Number:
ASM5P2304A/D
ASM5P2304A
3.3 V Zero Delay Buffer
Description
ASM5P2304A is a versatile, 3.3 V zerodelay buffer designed to
distribute highspeed clocks in PC, workstation, datacom, telecom
and other highperformance applications. It is available in 8pin
package. The part has an onchip PLL which locks to an input clock
presented on the REF. The PLL feedback is required to be driven to
FBK pin, and can be obtained from one of the outputs. The
inputtooutput propagation delay is guaranteed to be less than
±250 pS, and the outputtooutput skew is guaranteed to be less than
200 pS.
ASM5P2304A has two banks of two outputs each. Multiple
ASM5P2304A devices can accept the same input clock and distribute
it. In this case the skew between the outputs of the two devices is
guaranteed to be less than 500 pS.
ASM5P2304A is available in two different configurations. Refer to
ASM5P2304A Configurations Table. The ASM5P2304A1 is the base
part, where the output frequencies equal the reference if there is no
counter in the feedback path. The ASM5P2304A1H is the highdrive
version of the 1 and the rise and fall times on this device are faster.
ASM5P2304A2 allows the user to obtain REF and 1/2x or 2x
frequencies on each output bank. The exact configuration and output
frequencies depend on which output drives the feedback pin.
Features
Zero InputOutput Propagation Delay, Adjustable by Capacitive
Load on FBK Input
Multiple Configurations
Refer to ASM5P2304A Configurations Table
Input Frequency Range: 10 MHz to 133 MHz
Multiple Lowskew Outputs
OutputOutput Skew less than 200 pS
DeviceDevice Skew less than 500 pS
Two Banks of Two Outputs Each
Less than 200 pS CycletoCycle Jitter
(1, 1H, 2, 2H)
8pin SOIC Package
3.3 V Operation
Commercial and Industrial Temperature Range
Advanced 0.35 m CMOS Technology
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
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SOIC8
S SUFFIX
CASE 751BD
PIN CONFIGURATION
(Top View)
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
FBK
VDD
CLKB2
CLKB1
CLKA1
CLKA2
REF
1
GND
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Figure 1. Block Diagram
PLL
/2 Extra Divider (2)
CLKA2
CLKA1
FBK
CLKB1
CLKB2
REF
Table 1. ASM5P2304A CONFIGURATIONS
Device Feedback From Bank A Frequency Bank B Frequency
ASM5P2304A (1, 1H) Bank A or Bank B Reference Reference
ASM5P2304A (2, 2H) Bank A Reference Reference /2
ASM5P2304A (2, 2H) Bank B 2 x Reference Reference
Zero Delay and Skew Control
For applications requiring zero inputoutput delay, all outputs must be equally loaded.
REFInput to CLKA / CLKB Delay (pS)
1500
1000
500
0
500
1000
1500
3025201510
5
510152025
30
Output Load Difference: FBK Load CLKA/CLKB Load (pF)
Figure 2. REF Input to CLKA/CLKB Delay vs. Difference in Loading
between FBK Pin and CLKA/CLKB Pins
0
To close the feedback loop of the ASM5P2304A, the FBK
pin can be driven from any of the four available clock
outputs. The output driving the FBK pin will be driving a
total load of 7 pF plus any additional load that it drives. The
relative loading of this output (with respect to the remaining
outputs) can adjust the inputoutput delay. This is shown in
the above graph.
For applications requiring zero inputoutput delay, all
outputs including the one providing feedback should be
equally loaded. If inputoutput delay adjustments are
required, use the above graph to calculate loading
differences between the feedback output and remaining
outputs. For zero outputoutput skew, be sure to load outputs
equally.
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Table 2. PIN DESCRIPTION
Pin # Pin Name Description
1REF (Note 1) Input reference clock frequency, 5 V tolerant input
2CLKA1 (Note 2) Buffered clock output, bank A
3CLKA2 (Note 2) Buffered clock output, bank A
4 GND Ground
5CLKB1 (Note 2) Buffered clock output, bank B
6CLKB2 (Note 2) Buffered clock output, bank B
7 VDD 3.3 V supply
8 FBK PLL feedback input
1. Weak pulldown.
2. Weak pulldown on all outputs.
Table 3. ABSOLUTE MAXIMUM RATINGS
Parameter Min Max Unit
Supply Voltage to Ground Potential 0.5 +4.6 V
DC Input Voltage (Except REF) 0.5 VDD + 0.5 V
DC Input Voltage (REF) 0.5 7 V
Storage Temperature 65 +150 °C
Max. Soldering Temperature (10 sec) 260 °C
Junction Temperature 150 °C
Static Discharge Voltage (As per JEDEC STD22 A114B) 2000 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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Table 4. OPERATING CONDITIONS
Parameter Description Min Max Unit
VDD Supply Voltage 3.0 3.6 V
TA Operating Temperature
(Ambient Temperature)
Commercial temperature 0 70 °C
Industrial temperature 40 85
CL Load Capacitance, below 100 MHz 30 pF
CL Load Capacitance, from 100 MHz to 133 MHz 15 pF
CIN Input Capacitance (Note 3) 7 pF
3. Applies to both Ref Clock and FBK.
Table 5. ELECTRICAL CHARACTERISTICS
Parameter Description Test Conditions Min Max Unit
VIL Input LOW Voltage 0.8 V
VIH Input HIGH Voltage 2.2 V
IIL Input LOW Current VIN = 0 V 50 mA
IIH Input HIGH Current VIN = VDD 100 mA
VOL Output LOW Voltage (Note 4) IOL = 8 mA (1, 2)
IOL = 12 mA (1H, 2H)
0.4 V
VOH Output HIGH Voltage (Note 4) IOH = 8 mA (1, 2)
IOH = 12 mA (1H, 2H)
2.4 V
IDD Supply Current Unloaded outputs @ 100 MHz Commercial temp. 35 mA
Industrial temp. 40
Unloaded outputs @ 66 MHz,
(1, 1H, 2, 2H)
Commercial temp. 25
Industrial temp. 30
Unloaded outputs @ 33 MHz,
(1, 1H, 2, 2H)
Commercial temp. 16
Industrial temp. 20
4. Parameter is guaranteed by design and characterization. Not 100% tested in production.
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Table 6. SWITCHING CHARACTERISTICS (Notes 5, 6)
Parameter Test Conditions Min Typ Max Unit
Output Frequency 30 pF load (1, 1H) devices 10 100 MHz
(2, 2H) devices 12 100
15 pF load (1, 1H) devices 10 133
(2, 2H) devices 12 133
Duty Cycle (Note 7)
(1, 2, 1H, 2H)
Measured at 1.4 V,
FOUT < 66.66 MHz, 30 pF load
40 50 60 %
Duty Cycle (Note 7)
(1, 2,1H, 2H)
Measured at 1.4 V,
FOUT 50 MHz, 15 pF load
45 50 55 %
Output Rise Time (Note 7)
(1, 2)
Measured between 0.8 V
and 2.0 V, 30 pF load
Commercial temp. 2.2 nS
Industrial temp. 2.5
Output Rise Time (Note 7)
(1H, 2H)
Measured between 0.8 V
and 2.0 V, 30 pF load
Commercial temp.,
Industrial temp.
1.5 2 nS
Output Rise Time (Note 7)
(1, 2)
Measured between 0.8 V
and 2.0 V, 15 pF load
1.5 nS
Output Fall Time (Note 7)
(1, 2)
Measured between 2.0 V
and 0.8 V, 30 pF load
Commercial temp. 2.2 nS
Industrial temp. 2.5
Output Fall Time (Note 7)
(1H, 2H)
Measured between 2.0 V
and 0.8 V, 30 pF load
Commercial temp.,
Industrial temp.
1.25 1.5 nS
Output Fall Time (Note 7)
(1, 2)
Measured between 2.0 V
and 0.8 V, 15 pF load
1.5 nS
Outputtooutput skew on same bank
(1, 1H, 2, 2H) (Note 7)
All outputs equally loaded 200 pS
Output bank A to output bank B
skew (1, 1H)
All outputs equally loaded 200
Output bank A to output Bank B
skew (2, 2H) (Note 7)
All outputs equally loaded 400
Delay, REF Rising Edge to FBK
Rising Edge (Note 7)
Measured at VDD /2 0±250 pS
DevicetoDevice Skew (Note 7) Measured at VDD/2 on the FBK pins of the device 0 500 pS
CycletoCycle Jitter
(Note 7)
(1, 1H) Measured at 66.67 MHz, loaded outputs, 15 pF load 180 pS
Measured at 66.67 MHz, loaded outputs, 30 pF load 200
Measured at 133 MHz, loaded outputs, 15 pF load 125
(2, 2H) Measured at 66.67 MHz, loaded outputs, 15 pF load 380
Measured at 66.67 MHz, loaded outputs, 30 pF load 400
PLL Lock Time (Note 7) Stable power supply, valid clock presented on
REF and FBK pins
1.0 mS
5. For all measurements use Test Circuit #1.
6. All parameters are specified at Commercial and Industrial temperature unless stated otherwise.
7. Parameter is guaranteed by design and characterization. Not 100% tested in production.
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Switching Waveforms
Figure 3. Duty Cycle Timing
Figure 4. All Outputs Rise/Fall Time
Figure 5. OutputOutput Skew
Figure 6. InputOutput Propagation Delay
Figure 7. DeviceDevice Skew
OUTPUT
1.4 V 1.4 V 1.4 V
OUTPUT 0 V
VDD
0.8 V
2 V
0.8 V
2 V
OUTPUT
OUTPUT
1.4 V
1.4 V
FBK
INPUT
FBK, Device1
FBK, Device2
t2
t1
t3t4
t5
VDD/2
VDD/2
t6
VDD/2
VDD/2
t7
Figure 8. Test Circuit
22 W
22 W
CLOAD
CLOAD
CLK A / CLK B
CLK A / CLK B
GND
FBK
VDD
ASM5P2304A
+3.3 V
0.1 mF
TEST CIRCUIT #1
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PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD01
ISSUE O
E1 E
A
A1
h
θ
L
c
eb
D
PIN # 1
IDENTIFICATION
TOP VIEW
SIDE VIEW END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
SYMBOL MIN NOM MAX
θ
A
A1
b
c
D
E
E1
e
h
0.10
0.33
0.19
0.25
4.80
5.80
3.80
1.27 BSC
1.75
0.25
0.51
0.25
0.50
5.00
6.20
4.00
L0.40 1.27
1.35
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Table 7. ORDERING INFORMATION
Part Number Marking Package Type Temperature
P5P2304AF108SR 5P2304AF1 8pin 150mil SOICTAPE & REEL, Pb free Commercial
ASM5P2304AF108ST 5P2304AF1 8pin 150mil SOICTUBE, Pb free Commercial
ASM5I2304AF108SR 5I2304AF1 8pin 150mil SOICTAPE & REEL, Pb free Industrial
ASM5I2304AF108ST 5I2304AF1 8pin 150mil SOICTUBE, Pb free Industrial
P5P2304AF1H08SR 5P2304AF1H 8pin 150mil SOICTAPE & REEL, Pb free Commercial
ASM5P2304AF1H08ST 5P2304AF1H 8pin 150mil SOICTUBE, Pb free Commercial
P5I2304AF1H08SR 5I2304AF1H 8pin 150mil SOICTAPE & REEL, Pb free Industrial
ASM5I2304AF1H08ST 5I2304AF1H 8pin 150mil SOICTUBE, Pb free Industrial
P5P2304AF208SR 5P2304AF2 8pin 150mil SOICTAPE & REEL, Pb free Commercial
P5P2304AF208ST 5P2304AF2 8pin 150mil SOICTUBE, Pb free, Pb free Commercial
ASM5I2304AF208SR 5I2304AF2 8pin 150mil SOICTAPE & REEL, Pb free Industrial
P5I2304AF208ST 5I2304AF2 8pin 150mil SOICTUBE, Pb free Industrial
ASM5P2304AF2H08SR 5P2304AF2H 8pin 150mil SOICTAPE & REEL, Pb free Commercial
ASM5P2304AF2H08ST 5P2304AF2H 8pin 150mil SOICTUBE, Pb free Commercial
ASM5I2304AF2H08SR 5I2304AF2H 8pin 150mil SOICTAPE & REEL, Pb free Industrial
ASM5I2304AF2H08ST 5I2304AF2H 8pin 150mil SOICTUBE, Pb free Industrial
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ASM5P2304A/D
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