• All specifications are subject to change without notice.
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001-03 / 20031219 / e9412_mmz0603.fm
EMC Components MMZ Series MMZ0603 Type
Chip Beads
SMD Size: JIS/IEC 0603, EIA 0201
FEATURES
• This is a multi-layered chip bead product with dimensions of
L0.6×W0.3×T0.3mm.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
• The products contain no lead and also support lead-free soldering.
APPLICATIONS
The removal of EMI components from signal lines in various mod-
ules, cellular phones and other sets that use very small compo-
nents.
ELECTRICAL CHARACTERISTICS
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
MMZ0603S800
MMZ0603S241C
MMZ0603S121
MMZ0603D330C
Part No.
Impedance
(Ω)±25%
[100MHz]
DC resistance
(Ω)max.
Rated current
(mA)max.
MMZ0603S800 80 0.5 200
MMZ0603S121 120 0.8 200
MMZ0603S241 240 1.0 100
MMZ0603D330 33 1.0 100
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 15000 pieces/reel
0.3
0.6
0.3
Dimensions in mm
0.30 0.250.25
0.30
0
50
100
150
200
100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
0
500
400
300
200
100
100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
0
50
100
150
200
250
300
100001000100101
Impedance(Ω)
Frequency(MHz)
Z
R
X
0
500
400
300
200
100
100001000100101
Impedance(Ω)
Frequency(MHz)
ZR
X
