(0,40 mm) .0158"
SS4, ST4 SERIES
SS4–20–3.00–L–D–K–TR
SS4–40–3.00–L–D–K–TR
ST4–40–1.00–L–D–P–TR
ST4–20–1.00–L–D–P–TR
WWW.SAMTEC.COM
F-213-1
SS4 Mates with:
ST4
ST4 Mates with:
SS4
Note: Some lengths,
styles and options are
non-standard, non-returnable.
SPECIFICATIONS
For complete specifi cations
and recommended PCB layouts
see www.samtec.com?SS4 or
www.samtec.com?ST4
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
1.3A per contact
@ 80°C ambient
RoHS Compliant:
Ye s
Processing:
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max
MATED HEIGHT
SS4
ST4
MATED
HEIGHT
ULTRA FINE PITCH HEADER & SOCKET
(0,40) .01575 (5,00)
.197
(4,35)
.171
A
(0,15) .006
No. of positions x
(0,40) .01575 + (3,54) .139
B
LEAD
STYLE AB
–3.00 (2,85)
.112
(3,50)
.138
–3.50 (3,35)
.132
(4,00)
.157
(4,00)
.157
No. of positions x
(0,40) .01575 + (1,58) .062
(3,70)
.146
A
B
(0,20) .008 (0,40) .01575
SS4 POSITIONS
PER ROW KTR
–10, –20,
–30, –40, –50
LEAD
STYLE
–3.00
= 3.00 mm
–3.50
= 3.50 mm
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
(Required
in callout)
–TR
= Tape &
Reel
(Required
in callout)
–K
= (3,51 mm)
.138" DIA
Polyimide
Film Pick &
Place Pad
PLATING
OPTION D
ST4 POSITIONS
PER ROW PTR
–10, –20,
–30, –40, –50
LEAD
STYLE
–1.00
= 1.00 mm
–1.50
= 1.50 mm
–2.50
= 2.50 mm
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
(Required
in callout)
–TR
= Tape &
Reel
(Required
in callout)
–P
= Pick &
Place Pad
PLATING
OPTION D
TM
SYSTEM
LP
f
i
n
a
l
i
n
c
h
.
c
o
m
®
LEAD
STYLE AB
–1.00 (1,00)
.039
(3,08)
.121
–1.50 (1,50)
.059
(3,58)
.141
–2.50 (2,50)
.098
(4,58)
.180
MATED HEIGHT*
ST4
LEAD
STYLE
SS4 LEAD STYLE
–3.00 –3.50
–1.00 (4,00)
.157
(4,50)
.177
–1.50 (4,50)
.177
(5,00)
.197
–2.50 (5,50)
.217
(6,00)
.236
*Processing conditions will
affect mated height.
SS4/ST4
4 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling 7.0 GHz / 14 Gbps 13.5 GHz / 27 Gbps
Differential Pair Signaling 4.5 GHz / 9 Gbps 15.5 GHz / 31 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?SS4, www.samtec.com?ST4 or
contact sig@samtec.com
