SN74AVC4T774 www.ti.com..................................................................................................................................................... SCES693B - FEBRUARY 2008 - REVISED MAY 2008 4-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS FEATURES 1 1 16 3 14 B1 A2 4 13 B2 A3 5 12 B3 15 VCCB A1 3 14 13 B1 B2 B3 B4 GND A2 4 5 6 A4 6 11 B4 A3 DIR3 7 10 GND A4 DIR4 8 9 OE 16 15 14 13 2 DIR2 DIR3 12 11 10 7 8 9 A1 1 12 B1 A2 2 11 B2 A3 3 10 B3 A4 4 9 B4 5 6 7 8 GND VCCB A1 VCCA VCCA 15 VCCB 16 2 DIR1 1 DIR2 RSV PACKAGE (TOP VIEW) OE DIR1 VCCA RGY PACKAGE (TOP VIEW) DIR1 PW PACKAGE (TOP VIEW) DIR4 * DIR2 * * * Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds the Following Levels (tested per JESD 22) - 8000-V Human-Body Model (A114-A) - 250-V Machine Model (A115-A) - 1500-V Charged-Device Model (C101) DIR3 * * OE * Each Channel Has an Independent DIR Control Input Control Inputs VIH/VIL Levels Are Referenced to VCCA Voltage Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range I/Os Are 4.6-V Tolerant Ioff Supports Partial Power-Down-Mode Operation Typical Data Rates - 380 Mbps (1.8-V to 3.3-V Translation) - 200 Mbps (<1.8-V to 3.3-V Translation) - 200 Mbps (Translate to 2.5 V or 1.8 V) - 150 Mbps (Translate to 1.5 V) - 100 Mbps (Translate to 1.2 V) DIR4 * DESCRIPTION/ORDERING INFORMATION This 4-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. The SN74AVC4T774 is optimized to operate with VCCA/VCCB set at 1.4 V to 3.6 V. It is operational with VCCA/VCCB as low as 1.2 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2008, Texas Instruments Incorporated SN74AVC4T774 SCES693B - FEBRUARY 2008 - REVISED MAY 2008..................................................................................................................................................... www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74AVC4T774 is designed for asynchronous communication between data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port outputs or place both output ports in the high-impedance mode. The device transmits data from the A bus to the B bus when the B outputs are activated, and from the B bus to the A bus when the A outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ. The SN74AVC4T774 is designed so that the control pins (DIR1, DIR2, DIR3, DIR4, and OE) are supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature ensures that if either VCC input is at GND, then both ports are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCCA through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Since this device has CMOS inputs, it is very important to not allow them to float. If the inputs are not driven to either a high VCC state, or a low GND state, an undesirable larger than expected ICC current may result. Since the input voltage settlement is governed by many factors (e.g. capacitance, board-layout, package inductance, surrounding conditions, etc.), ensuring that they these inputs are kept out of erroneous switching states and tying them to either a high or a low level minimizes the leakage-current. ORDERING INFORMATION PACKAGE (1) (2) TA -40C to 85C TOP-SIDE MARKING QFN - RGY Tape and reel SN74AVC4T774RGYR WT774 QFN - RSV Tape and reel SN74AVC4T774RSVR ZVK Tube SN74AVC4T774PW Tape and reel SN74AVC4T774PWR TSSOP - PW (1) (2) ORDERABLE PART NUMBER WT774 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE (Each Bit) CONTROL INPUTS OE OUTPUT CIRCUITS OPERATION DIR A PORT B PORT L L Enabled Hi-Z B data to A data L H Hi-Z Enabled A data to B data H X Hi-Z Hi-Z Isolation LOGIC DIAGRAM (POSITIVE LOGIC)(1) DIR1 OE A1 B1 (1) 2 Shown for a single channel Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 SN74AVC4T774 www.ti.com..................................................................................................................................................... SCES693B - FEBRUARY 2008 - REVISED MAY 2008 TYPICAL APPLICATION 3.0 V 1.8 V 0.1 F 0.1 F VCCB VCCA MOSI SPI Port MISO CLK Processor CS A1 B1 A2 B2 A3 B3 A4 B4 SPI Peripheral OE SN74AVC4T774 GND DIR1 = HIGH DIR2 = LOW DIR3 = HIGH DIR4 = HIGH Figure 1. Typical Application of the SN74AVC4T774 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX -0.5 4.6 I/O ports (A port) -0.5 4.6 I/O ports (B port) -0.5 4.6 Control inputs -0.5 4.6 A port -0.5 4.6 B port -0.5 4.6 A port -0.5 VCCA + 0.5 B port -0.5 VCCB + 0.5 VCCA Supply voltage range VCCB UNIT V VI Input voltage range (2) VO Voltage range applied to any output in the high-impedance or power-off state (2) VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current Continuous current through VCCA, VCCB, or GND Tstg (1) (2) (3) Storage temperature range. -65 V V V 50 mA 100 mA 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed. Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 3 SN74AVC4T774 SCES693B - FEBRUARY 2008 - REVISED MAY 2008..................................................................................................................................................... www.ti.com PACKAGE THERMAL IMPEDANCE UNIT PW package JA (1) (2) Package thermal impedance (1) 108 RGY package (2) 39 RSV package (1) 184 C/W The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. RECOMMENDED OPERATING CONDITIONS (1) (2) (3) VCCI VCCO MIN MAX UNIT VCCA Supply voltage 1.2 3.6 V VCCB Supply voltage 1.2 3.6 V High-level input voltage VIH Low-level input voltage VIL High-level input voltage VIH VIL Low-level input voltage VI Input voltage VO Output voltage IOH Data inputs (4) Data inputs DIR (referenced to VCCA) (5) (DIRx, OE) DIR (referenced to VCCA) (5) (DIRx, OE) 2 V 1.2 V to 1.95 V VCCI x 0.35 1.95 V to 2.7 V 0.7 2.7 V to 3.6 V 0.8 1.2 V to 1.95 V VCCA x 0.65 1.95 V to 2.7 V 1.6 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCA x 0.35 1.95 V to 2.7 V 0.7 2.7 V to 3.6 V 3-state 0 3.6 Operating free-air temperature V 0.8 3.6 Low-level output current V V VCCO TA 4 1.6 2.7 V to 3.6 V 0 Input transition rise or fall rate (4) (5) 1.95 V to 2.7 V Active state t/v (1) (2) (3) VCCI x 0.65 0 High-level output current IOL (4) 1.2 V to 1.95 V 1.1 V to 1.2 V -3 1.4 V to 1.6 V -6 1.65 V to 1.95 V -8 2.3 V to 2.7 V -9 3 V to 3.6 V -12 1.1 V to 1.2 V 3 1.4 V to 1.6 V 6 1.65 V to 1.95 V 8 2.3 V to 2.7 V 9 3 V to 3.6 V 12 -40 V V mA mA 5 ns/V 85 C VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. For VCCI values not specified in the data sheet, VIH min = VCCI x 0.7 V, VIL max = VCCI x 0.3 V For VCCA values not specified in the data sheet, VIH min = VCCA x 0.7 V, VIL max = VCCA x 0.3 V Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 SN74AVC4T774 www.ti.com..................................................................................................................................................... SCES693B - FEBRUARY 2008 - REVISED MAY 2008 ELECTRICAL CHARACTERISTICS (1) (2) (3) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 A VOH VCCB TA = 25C MIN TYP 1.2 V to 3.6 V 1.2 V to 3.6 V 1.2 V 1.4 V 1.4 V 1.05 1.65 V 1.65 V 1.2 IOH = -9 mA 2.3 V 2.3 V 1.75 IOH = -12 mA 3V 3V 2.3 VI = VIH 0.2 1.2 V 1.2 V IOL = 6 mA 1.4 V 1.4 V 0.35 1.65 V 1.65 V 0.45 IOL = 9 mA 2.3 V 2.3 V 0.55 IOL = 12 mA 3V 3V 0.7 II Ioff A or B port VI or VO = 0 to 3.6 V IOZ A or B port VI = VCCA or GND VO = VCCO or GND, VI = VCCI or GND, OE = VIH 1.2 V to 3.6 V 1.2 V to 3.6 V 0.25 0.025 0.25 1 0V 0 V to 3.6 V 0.1 1 5 0 V to 3.6 V 0V 0.1 1 5 3.6 V 3.6 V 0.5 2.5 5 1.2 V to 3.6 V 1.2 V to 3.6 V VI = VCCI or GND, IO = 0 VI = VCCI or GND, IO = 0 VI = VCCI or GND, IO = 0 Ci Control inputs Cio A or B port VO = 3.3 V or GND (2) (3) VI = 3.3 V or GND V A A A 8 0V 0 V to 3.6 V -2 0 V to 3.6 V 0V 8 1.2 V to 3.6 V 1.2 V to 3.6 V (1) V IOL = 3 mA VI = VIL UNIT 0.95 1.2 V to 3.6 V 1.2 V to 3.6 V Control inputs ICCA + ICCB MAX VCCO - 0.2 1.2 V IOL = 8 mA ICCB MIN IOH = -6 mA IOL = 100 A ICCA -40C to 85C MAX IOH = -3 mA IOH = -8 mA VOL VCCA A 8 0V 0 V to 3.6 V 8 0 V to 3.6 V 0V -2 1.2 V to 3.6 V 1.2 V to 3.6 V A 16 A 3.3 V 3.3 V 2.5 3 pF 3.3 V 3.3 V 5 6 pF All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. VCCO is the VCC associated with the output port. VCCI is the VCC associated with the input port. Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 5 SN74AVC4T774 SCES693B - FEBRUARY 2008 - REVISED MAY 2008..................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.2 V (unless otherwise noted) (see Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) A B B A OE A OE B OE A OE B tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ VCCB = 1.2 V VCCB = 1.5 V 0.1 V VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V TYP TYP TYP TYP TYP 3.5 2.8 2.7 2.7 3.1 3.5 2.8 2.7 2.7 3.1 3.8 3.4 3.2 3 2.9 3.8 3.4 3.2 3 2.9 6 4.8 4.4 5.3 9.3 6 4.8 4.4 5.3 9.3 6.7 6.7 6.6 6.7 6.6 6.7 6.7 6.6 6.7 6.6 4.3 3.6 3.7 3.3 4 4.3 3.6 3.7 3.3 4 4.4 4.4 4.4 4.4 4.4 4.4 4.4 4.4 4.4 4.4 UNIT ns ns ns ns ns ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.5 V 0.1 V (see Figure 2) PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ 6 FROM (INPUT) TO (OUTPUT) A B B A OE A OE B OE A OE B VCCB = 1.2 V VCCB = 1.5 V 0.1 V VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V TYP MIN MAX MIN MAX MIN MAX MIN MAX 3.1 0.3 4.4 0.2 3.9 0.1 3.6 0.1 3.9 3.1 0.3 4.4 0.2 3.9 0.1 3.6 0.1 3.9 2.9 0.6 5.1 0.4 4.9 0.2 4.6 0.1 4.5 2.9 0.6 5.1 0.4 4.9 0.2 4.6 0.1 4.5 5.3 1.1 7.1 0.9 6.2 0.7 5.5 0.1 6.4 5.3 1.1 7.1 0.9 6.2 0.7 5.5 0.1 6.4 4.4 1.1 8.2 1.1 8.2 1.1 8.2 1.1 8.2 4.4 1.1 8.2 1.1 8.2 1.1 8.2 1.1 8.2 3.6 1.2 4.8 0.8 5.4 0.4 5.1 1 5.4 3.6 1.2 4.8 0.8 5.4 0.4 5.1 1 5.4 3.1 0.3 5.6 0.2 5.7 0.3 5.6 0.3 56 3.1 0.3 5.6 0.2 5.7 0.3 5.6 0.3 5.6 Submit Documentation Feedback UNIT ns ns ns ns ns ns Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 SN74AVC4T774 www.ti.com..................................................................................................................................................... SCES693B - FEBRUARY 2008 - REVISED MAY 2008 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.8 V 0.15 V (see Figure 2) PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ FROM (INPUT) TO (OUTPUT) A B B A OE A OE B OE A OE B VCCB = 1.2 V VCCB = 1.5 V 0.1 V VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V TYP MIN MAX MIN MAX MIN MAX MIN MAX 2.8 0.1 4.1 0.1 3.6 0.1 3.1 0.1 3.3 2.8 0.1 4.1 0.1 3.6 0.1 3.1 0.1 3.3 2.6 0.4 4.3 0.1 4.1 0.1 3.8 0.1 3.7 2.6 0.4 4.3 0.1 4.1 0.1 3.8 0.1 3.7 5 0.8 6.7 0.6 5.8 0.4 4.8 0.3 4.6 5 0.8 6.7 0.6 5.8 0.4 4.8 0.3 4.6 3.3 0.2 6.7 0.2 6.6 0.2 6.7 0.2 6.7 3.3 0.2 6.7 0.2 6.6 0.2 6.7 0.2 6.7 3.4 0.7 4.7 0.3 5.1 0.1 4.5 0.8 5 3.4 0.7 4.7 0.3 5.1 0.1 4.5 0.8 5 2.9 0.1 5.7 0.1 5.8 0.1 5.8 0.1 5.8 2.9 0.1 5.7 0.1 5.8 0.1 5.8 0.1 5.8 UNIT ns ns ns ns ns ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 2.5 V 0.2 V (see Figure 2) PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ FROM (INPUT) TO (OUTPUT) A B B A OE A OE B OE A OE B VCCB = 1.2 V VCCB = 1.5 V 0.1 V VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V TYP MIN MAX MIN MAX MIN MAX MIN MAX 2.6 0.1 3.8 0.1 3.2 0.1 2.7 0.1 2.6 2.6 0.1 3.8 0.1 3.2 0.1 2.7 0.1 2.6 2.5 0.5 3.4 0.2 3.1 0.1 2.8 0.1 2.6 2.5 0.5 3.4 0.2 3.1 0.1 2.8 0.1 2.6 4.7 0.7 6.2 0.5 5.2 0.3 4.1 0.3 3.6 4.7 0.7 6.2 0.5 5.2 0.3 4.1 0.3 3.6 2.3 0.4 4.5 0.4 4.5 0.4 4.5 0.4 4.5 2.3 0.4 4.5 0.4 4.5 0.4 4.5 0.4 4.5 3 0.2 4.3 0.1 4.9 0.1 4 0.7 4.3 3 0.2 4.3 0.1 4.9 0.1 4 0.7 4.3 1.9 01 4.7 0.1 4.6 0.1 4.7 0.1 4.7 1.9 01 4.7 0.1 4.6 0.1 4.7 0.1 4.7 Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 UNIT ns ns ns ns ns ns 7 SN74AVC4T774 SCES693B - FEBRUARY 2008 - REVISED MAY 2008..................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 3.3 V 0.3 V (see Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) A B B A OE A OE B OE A OE B tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ VCCB = 1.2 V VCCB = 1.5 V 0.1 V VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V TYP MIN MAX MIN MAX MIN MAX MIN MAX 2.5 0.1 3.6 0.1 3 0.1 2.6 0.1 2.4 2.5 0.1 3.6 0.1 3 0.1 2.6 0.1 2.4 2.6 0.5 3.4 0.2 2.9 0.1 2.5 0.1 2.3 2.6 0.5 3.4 0.2 2.9 0.1 2.5 0.1 2.3 4.5 0.9 5.9 0.5 5 0.3 3.8 0.3 3.3 3.8 0.9 5.9 0.5 5 0.3 3.8 0.3 3.3 1.9 0.4 3.6 0.4 3.6 0.4 3.6 0.4 3.6 1.9 0.4 3.6 0.4 3.6 0.4 3.6 0.4 3.6 2.7 0.1 4.2 0.1 4.6 0.3 3.8 0.7 3.9 2.7 0.1 4.2 0.1 4.6 0.3 3.8 0.7 3.9 2.3 0.1 4.5 0.1 4.5 0.1 4.6 0.1 4.6 2.3 0.1 4.5 0.1 4.5 0.1 4.6 0.1 4.6 UNIT ns ns ns ns ns ns OPERATING CHARACTERISTICS TA = 25C VCCA = VCCB = 1.2 V VCCA = VCCB = 1.5 V VCCA = VCCB = 1.8 V VCCA = VCCB = 2.5 V VCCA = VCCB = 3.3 V TYP TYP TYP TYP TYP 3 3 3 3 4 1 1 1 2 2 12 13 14 15 17 Outputs disabled 2 2 2 2 2 Outputs enabled 12 13 14 16 17 2 2 2 2 2 3 3 3 3 4 1 1 1 2 2 PARAMETER A to B CpdA (1) B to A A to B CpdB (1) B to A (1) 8 TEST CONDITIONS Outputs enabled Outputs disabled Outputs enabled Outputs disabled Outputs enabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF CL = 0, f = 10 MHz, tr = tf = 1 ns pF Outputs disabled Power dissipation capacitance per transceiver Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 SN74AVC4T774 www.ti.com..................................................................................................................................................... SCES693B - FEBRUARY 2008 - REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION 2 x VCCO S1 RL From Output Under Test Open GND CL (see Note A) TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 2 x VCCO GND RL tw LOAD CIRCUIT VCCI VCCI/2 Input VCCO CL RL VTP 1.2 V 1.5 V 0.1 V 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 15 pF 15 pF 15 pF 15 pF 15 pF 2 k 2 k 2 k 2 k 2 k 0.1 V 0.1 V 0.15 V 0.15 V 0.3 V VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCA Output Control (low-level enabling) VCCA/2 VCCA/2 0V tPZL VCCI Input VCCI/2 VCCI/2 0V tPLH Output tPHL VOH VCCO/2 VOL VCCO/2 tPLZ VCCO Output Waveform 1 S1 at 2 x VCCO (see Note B) VCCO/2 VOL + VTP VOL tPZH tPHZ Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCCO/2 VOH - VTP VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. Figure 2. Load and Circuit and Voltage Waveforms Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): SN74AVC4T774 9 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) 74AVC4T774RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74AVC4T774RSVRG4 ACTIVE UQFN RSV 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AVC4T774RSVR ACTIVE UQFN RSV 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74AVC4T774PWR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.6 8.0 12.0 Q1 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 SN74AVC4T774RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 SN74AVC4T774RSVR UQFN RSV 16 3000 180.0 12.4 2.1 2.9 0.75 4.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AVC4T774PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74AVC4T774RGYR VQFN RGY 16 3000 367.0 367.0 35.0 SN74AVC4T774RSVR UQFN RSV 16 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated