REVISIONS LTR DESCRIPTION H Add device type 41. Make corrections to case outline N, dimension b. Add vendor CAGE 65786 as source of supply for device type 41. Update boilerplate. Editorial changes throughout. 97-03-26 Raymond Monnin J Add device types 42, 43, 44, 45, and 46. Editorial changes to pages 1, 3, 7-15. Update boilerplate. ksr 98-03-03 Raymond Monnin K Added provisions to accommodate radiation-hardened devices. Added device type 47 to drawing. glg 00-03-01 Raymond Monnin L Corrected case outline 8 Figure 1 to show correct numbering of terminals. Corrected Figure 2 Terminal connections. Corrected the case outline Y Figure 1 to show the proper distance of E and E1. Added note to Case outline Y Figure 1, to allow for bottom brazed package as an alternative style to the side brazed package . Update boilerplate. Editorial changes throughout. ksr 00-12-08 Raymond Monnin M Changed the minimum value for the Q dimension on package T from 0.026 to 0.020 and removed footnote 12. Editorial changes throughout.. ksr 02-12-19 Raymond Monnin N Added device type 48 to drawing. ksr 03-08-12 Raymond Monnin P Corrected typo on Figure 4 (Read Cycle). ksr 05-08-16 Raymond Monnin R Vendor requested change in capacitance in Table I for devices 39 and 40 from 5 pF to 8 pF. ksr 06-02-13 Raymond Monnin REV R R R R R R R R R R R R R R R R R R SHEET 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 REV R R R R R R R R R R R R R R R R R R R R SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV R R R R R R R R R R R R R R SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 REV STATUS OF SHEETS PMIC N/A STANDARD MICROCIRCUIT DRAWING DATE (YR-MO-DA) PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY Raymond Monnin THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Michael A. Frye AMSC N/A REVISION LEVEL DRAWING APPROVAL DATE 89-04-21 R http://www.dscc.dla.mil MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, MONOLITHIC SILICON SIZE A SHEET CAGE CODE 5962-89598 67268 1 OF DSCC FORM 2233 APR 97 APPROVED 52 5962-E261-06 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 89598 01 Device type (see 1.2.2) / M Device class designator (see 1.2.3) X Case outline (see 1.2.4) A Lead finish (see 1.2.5) \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Circuit function Access time 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 120 ns 100 ns 85 ns 70 ns 120 ns 100 ns 85 ns 70 ns 55 ns 45 ns 35 ns 25 ns 120 ns 100 ns 85 ns 70 ns 55 ns 45 ns 35 ns 25 ns 20 ns 120 ns 100 ns 85 ns 70 ns 55 ns 45 ns 35 ns 25 ns 120 ns 100 ns 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 2 Device type 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Generic number 1/ Circuit function 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM 128K x 8 low power CMOS SRAM 128K x 8 standard power CMOS SRAM dual CE 128K x 8 low power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM 128K x 8 standard power CMOS SRAM dual CE 128K x 8 standard power CMOS SRAM 128K x 8 very low power CMOS SRAM 128K x 8 low power CMOS SRAM Access time 85 ns 70 ns 55 ns 45 ns 35 ns 25 ns 20 ns 20 ns 20 ns 15 ns 70 ns 70 ns 15 ns 12 ns 12 ns 30 ns 15 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z U T N M 9 8 7 2/ Descriptive designator Terminals GDIP1-T32 or CDIP2-T32 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 CQCC1-N32 See figure 1 See figure 1 See figure 1 32 32 32 32 32 32 32 32 32 32 Package style dual-in-line SOJ package dual-in-line rectangular chip carrier flat pack rectangular chip carrier rectangular chip carrier J-leaded rectangular chip carrier zig-zag in-line SOJ package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 3/ 4/ Supply voltage range (VCC)......................................... DC input voltage range (VIN) ....................................... DC output voltage range (VOUT) ................................. Storage temperature range .......................................... Maximum power dissipation (PD)................................. Lead temperature (soldering, 10 seconds)................... -0.5 V dc to +7.0 V dc -0.5 V dc to VCC+0.5 V dc 5/ -0.5 V dc to VCC+0.5 V dc 5/ -65C to +150C 1.0 W +260C 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ A bottom brazed option for this package now exists (See figure 1, case outline Y NOTE:). Customers may specify in the purchase order to negate the option as acceptable for their use. 3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 4/ All voltages referenced to VSS (VSS = ground) unless otherwise specified. 5/ Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 3 1.3 Absolute maximum ratings - continued. 3/ 4/ Thermal resistance, junction-to-case (JC): Case M ...................................................................... Cases X, Y, Z, U, and 7 ............................................. Cases T, N, and 9 ...................................................... Case 8 ....................................................................... Output voltage applied in high Z state.......................... Maximum power dissipation, (PD)................................ Maximum junction temperature (TJ) ............................ See MIL-STD-1835 11C/W 6/ 10C/W 6/ 16C/W 6/ -0.5 V dc to VCC+0.5 V dc 1.0 W +150C 7/ 1.4 Recommended operating conditions. Supply voltage range (VCC) ........................................ Supply voltage range (VSS)......................................... High level input voltage range (VIH)............................. Low level input voltage range (VIL) .............................. Case operating temperature range (TC) ...................... 4.5 V dc minimum to 5.5 V dc maximum 0.0 V dc 2.2 V dc to VCC + 0.5 V dc -0.5 V dc to 0.8 V dc -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM Standard F1192-95 - Standard Guide for the Measurement of Single Event Phenomena from Heavy Ion Irradiation of Semiconductor Devices. (Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 4/ All voltages referenced to VSS (VSS = ground) unless otherwise specified. 6/ When the JC for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein. 7/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 4 ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA 22201; http://www.jedec.org.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix C to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request. 3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 5 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 41 (see MIL-PRF-38535, appendix A). 3.11 Substitution. Substitution data shall be as indicated in appendix B herein. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein. b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (1) c. Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein). Interim and final electrical parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 6 TABLE I. Electrical performance characteristics. Test Symbol High level input current IIH Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups VCC = 5.5 V, VIN = 5.5 V 1, 2, 3 M,D,P Low level input current IIL VCC = 5.5 V, VIN = 0.0 V IOZH Min All Max 10 A 2/ 1, 2, 3 All 1 1/ VCC = 5.5 V, VO = 5.5 V VIL = 0.0 V, VIH = 5.0 V Unit Limits 1 1/ M,D,P High impedance output leakage current Device types A -10 2/ 1, 2, 3 All 10 A VIH OE VCC M,D,P IOZL 1 1/ VCC = 5.5 V, VO = 0.0 V VIL = 0.0 V, VIH = 5.0 V 2/ 1, 2, 3 All -10 VIH OE VCC M,D,P Output high voltage VOH 1 1/ 2/ 1, 2, 3 IOH = -4.0 mA, VCC = 4.5 V VIH = 2.2 V, VIL = 0.8 V M,D,P 1 1/ 42- 46 M,D,P VOL 1 1/ M,D,P 01-41, 47,48 1 1/ M,D,P 2.4 0.4 V 2/ 42- 46 IOL = 2.1 mA, VCC = 4.5 V VIH = 2.2 V, VIL = 0.8 V V 2/ 1, 2, 3 IOL = 8.0 mA, VCC = 4.5 V VIH = 2.2 V, VIL = 0.8 V 2.4 2/ IOH = -1.0 mA, VCC = 4.5 V VIH = 2.2 V, VIL = 0.8 V Output low voltage 01-41, 47,48 1 1/ 0.4 2/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 7 TABLE I. Electrical performance characteristics Continued. Test Symbol Operating supply current ICC1 Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups VCC = 5.5 V, CE = VIL max 1, 2, 3 1 1/ Unit Limits Min OE , WE , and CE2 = VIH f = 1/tAVAV min M,D,P Device types Max 01-04, 11,19, 26,27, 34,35, 42 125 05, 06, 13, 14 100 07, 08, 15, 16, 22, 23, 30, 31 110 09, 10, 17, 18 115 24, 25, 32, 33, 43 120 12,20, 47 130 28, 36 135 21, 29, 37, 39, 40,48 140 38 150 41 180 44-46 250 All 2/ mA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 8 TABLE I. Electrical performance characteristics Continued. Test Symbol Standby supply current TTL ICC2 Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups VCC = 5.5 V, CE = VIH CE2 = VIL, f = 0 Hz 1, 2, 3 M,D,P Standby supply current CMOS ICC3 VCC= 5.5 V, CE VCC -0.2 V Inputs = VIH or VIL, f = 0 M,D,P Data retention current ICC4 VCC = 2.0 V, f = 0 Input capacitance (A0 - A16) Input capacitance 3/ 3/ CIN CCLK ( CE , WE , OE ) Output capacitance 3/ COUT 01-04, 42 10 05-40, 43,48 25 41 40 44-46 60 1 1/ All 2/ 1, 2, 3 47 0.3 42 1 01-04, 40,43,48 5 05-39, 41 10 44-46 15 1 1/ All 2/ 1, 2, 3 01-04 2 05-21 1 40,48 750 42 400 47 150 All 2/ 01-38, 41-47 12 39, 40 8 48 5 01-38, 41-47 20 39, 40 8 48 5 01-38, 41-47 14 39, 40 8 48 5 4 4 VOUT = 0 V, f = 1.0 MHz TC = +25C, see 4.4.1e Max 2 4 VOUT = 0 V, f = 1.0 MHz TC = +25C, see 4.4.1e Unit 47 1 1/ VIN = 0 V, f = 1.0 MHz TC = +25C, see 4.4.1e Limits Min CE VCC - 0.2 V, all other inputs = 0.2 V or VCC - 0.2 V M,D,P Device types mA mA mA A pF pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 9 TABLE I. Electrical performance characteristics Continued. Test Symbol Functional tests 4/ Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See 4.4.1c 7, 8A, 8B M,D,P Read cycle time tAVAV Device types 9, 10, 11 9 1/ Max 2/ 2/ 01,05, 13,22,30 120 02,06, 14,23,31 100 03,07,15, 24,32 M,D,P Min Unit All 7 1/ See figure 4, as applicable 5/ 6/ Limits ns ns 85 04,08,16, 25,33,42, 43 70 09,17, 26,34 55 10,18, 27,35 45 11,19, 28,36 35 47 30 12,20, 29,37 25 21,38-40 20 41,44,48 15 45,46 12 All 2/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 10 TABLE I. Electrical performance characteristics Continued. Test Symbol Address access time tAVQV Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 Device types Limits Min M,D,P 9 1/ Unit Max 01,05, 13,22, 30 120 02,06, 14,23, 31 100 03,07, 15,24, 32 85 04,08, 16,25, 33,42, 43 70 09,17, 26,34 55 10,18, 27,35 45 11,19, 28,36 35 47 30 12,20, 29,37 25 21, 38-40 20 41,44,48 15 45,46 12 All 2/ ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 11 TABLE I. Electrical performance characteristics Continued. Test Symbol Chip enable access time tELQV Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Device types Limits Min 9 1/ Unit Max 01,05, 13,22,30 120 02,06, 14,23,31 100 03,07, 15,24,32 85 04,08, 16,25, 33,42,43 70 09,17, 26,34 55 10,18, 27,35 45 11,19, 28,36 35 47 30 12,20, 29,37 25 21,38-40 20 41,44,48 15 45,46 12 All 2/ ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 12 TABLE I. Electrical performance characteristics Continued. Test Symbol Output enable to output valid tOLQV Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Device types Limits Min 9 1/ Unit Max 01,02, 05,06, 13,14, 22,23, 30,31 50 42, 43 35 03,07, 15,24,32 30 04,08, 16,25,33 25 09,10, 17,18, 26,27, 34,35 20 11,19, 28,36 15 47 12 12,20, 29,37 10 21,38, 41,44, 45,46 7 39,40,48 6 All 2/ ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 13 TABLE I. Electrical performance characteristics Continued. Test Symbol tAVQX Output hold after address change Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Chip enable to output in low Z 3/ 7/ tELQX 9, 10, 11 tOLQX M,D,P Unit Max 3 ns 2/ All 3 ns 2/ 01-08, 13-16, 22-25, 30-33, 42, 43 30 09,10, 17,18, 26,27, 34,35 20 11,19, 28,36, 47 15 12,20, 29,37 10 21,3840,48 8 41,44, 45,46 7 9 1/ All 2/ 9, 10, 11 All 9, 10, 11 M,D,P Output enable 3/ 7/ to output in low Z All 9 1/ tEHQZ Limits Min 9 1/ M,D,P Chip disable to output in high Z 3/ 7/ Device types 9 1/ 0 ns ns 2/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 14 TABLE I. Electrical performance characteristics Continued. Test Symbol Output disable to output in high Z tOHQZ Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 Device types Limits Min 3/ 7/ Unit Max 01-08, 13-16, 22-25, 30-33, 42,43 30 09,10, 17,18, 26,27, 34,35 20 11,19, 28,36 15 12,20, 29,37 10 21,38, 47 8 41,44, 45,46 7 ns 6 39,40, 48 M,D,P 9 1/ All 2/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 15 TABLE I. Electrical performance characteristics - Continued. Test Symbol Write cycle time tAVAV Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Address setup to beginning of write Data hold after end of write tAVWL tAVEL M,D,P Device types Min 01,05, 13,22, 30 120 02,06, 14,23, 31 100 03,07, 15,24, 32 85 04,08, 16,25, 33,42, 43 70 09,17, 26,34 55 10,18, 27,35 45 11,19, 28,36 35 47 30 12,20, 29,37 25 21, 38-40 20 41,44, 48 15 45,46 12 9 1/ All 2/ 9, 10, 11 All 0 9 1/ tWHDX tEHDX 9, 10, 11 M,D,P Limits 9 1/ Unit Max ns ns 2/ 01-04 5 05-48 0 All 2/ ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 16 TABLE I. Electrical performance characteristics - Continued. Test Symbol Write pulse width tWLWH Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Address setup to end of write tAVWH Chip select to end of write tELWH M,D,P Device types Limits Min 05,13,22,30 100 06,14,23,31 80 07,15, 24,32 70 42, 43 65 01 50 10,18, 27,35 02,03 40 04,08, 09,16, 17,25, 26,33, 34 35 11,19, 28,36 30 12,20, 29,37 20 47 22 21, 38-40,48 15 41,44 12 45,46 11 9 1/ All 2/ 9, 10, 11 01,05, 13,22, 30 100 02,06, 14,23, 31 85 03,07, 15,24, 32 75 42, 43 65 04,08, 16,25, 33 60 09,17, 26,34 45 10,18, 27,35 35 11,19, 28,36 25 47 22 12,20, 29,37 20 21,38 15 39-41,44,48 12 45, 46 11 All 2/ 9 1/ Unit Max ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 17 TABLE I. Electrical performance characteristics - Continued. Test Symbol Address hold after end of write tWHAX tEHAX Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Data setup to end of write tDVWH tDVEH M,D,P Write enable to output disable 3/ 7/ tWLQZ M,D,P Output active after end of write 3/ tWHQX Unit Max 01-10, 13-18, 22-27, 30-35, 44-46 5 11,12,19-21, 28,29,36-43, 47,48 0 9 1/ All 2/ 9, 10, 11 01,02,05, 06, 13,14, 22,23, 30,31 40 03,07, 15,24,32 35 04,08, 16,25, 33,42,43 30 09,17, 26,34 25 10,11,18, 19, 27,28, 35,36 20 47 18 12,20, 29,37 15 21,38-40,48 10 41,44, 45,46 8 ns ns 9 1/ All 9, 10, 11 01-08, 13-16, 22-25, 30-33, 42, 43 35 09,10, 17,18, 26,27, 34,35 20 11,19, 28,36 15 12,20, 29,37 10 21,38-40,48 9 47 8 41, 44-46 7 All 2/ 9, 10, 11 M,D,P Limits Min 9 1/ See figure 4, as applicable Device types 2/ All 5 9 1/ ns ns 2/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 18 TABLE I. Electrical performance characteristics - Continued. Test Symbol Retention time 3/ tCDR Conditions -55C TC +125C VSS = 0 V; 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 4, as applicable 9, 10, 11 M,D,P Operation recovery time 3/ Device types Min All 9, 10, 11 9 1/ Max ns 0 01,05, 13,22, 30 120 02,06, 14,23, 31 100 03,07, 15,24, 32 85 04,08, 16,25, 33,42, 43 70 09,17, 26,34 55 10,18, 27,35 45 11,19, 28,36 35 47 30 12,20, 29,37 25 21, 38- 40 20 41,44, 48 15 45,46 M,D,P Unit 2/ 9 1/ tR Limits All ns 12 2/ 1/ When performing postirradiation electrical measurements for any RHA level TA = +25C. Limits shown are guaranteed at TA = +25C 5C. The M, D, and P in the test condition column are the postirradiation limits for the device types specified in the device types column. 2/ Preirradiation values for RHA marked devices shall also be the postirradiation values unless otherwise specified. 3/ This parameter is tested initially and after any design or process change which could affect this parameter, and therefore shall be guaranteed to the limits specified in table I. 4/ Functional tests shall include the test table and other test patterns used for fault detection as approved by the qualifying activity. Outputs are measured at VOL < 1.5 V, VOH > 1.5 V. 5/ For timing waveforms see figure 4 and for output load circuits, see figure 5. 6/ AC measurements assume transition time 5 ns, input levels are from ground to 3.0 V, and output load CL 30 pF except as noted on figure 5. Timing reference levels are 1.5 V. 7/ Transition is measured 500 mV from steady state voltage. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 19 Case Y Inches Millimeters Symbol Min Max Min Max A .120 .165 3.05 4.19 A1 .088 .120 2.24 3.05 A2 .070 Ref. 1.78 --- B .010 Ref. 0.25 --- B1 .030R Typ. 0.76 --- B2 .020 Ref. 0.51 --- B3 .025 .045 0.64 1.14 D .816 .838 20.73 21.29 D1 .750 Ref. 19.05 --- E .419 .431 10.64 10.95 E1 .430 .445 10.42 11.30 E2 .360 .380 9.14 9.65 e .050 BSC e1 .038 e2 .005 j .005 S S1 Typ. 1.27 BSC 0.97 --- 0.13 --- Typ. 0.13 --- .030 .040 0.76 1.02 .020 Typ. 0.51 --- NOTE: A bottom brazed package may be shipped as an alternative package style, provided the vendor makes the receiving customer aware of the intent to ship the part as a bottom brazed package rather than the one shown on this figure. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 20 Case Z Symbol Inches Min Millimeters Max Min Max A --- .232 --- 5.89 b .014 .023 0.36 0.58 b1 .038 .065 0.97 1.65 c .008 .015 0.20 0.38 D --- E .350 E1 .390 e 1.700 --- 41.05 .405 9.78 10.29 .420 9.91 10.67 .100 BSC 2.54 BSC L .125 .200 3.18 5.08 L1 .150 --- 3.81 --- Q .015 .060 0.38 1.52 S --- .100 --- 2.54 S1 .005 --- 0.13 --- S2 .005 --- 0.13 --- --- --- 0 N 15 32 Note: Either configuration in detail A is allowed. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 21 Case U Symbol Inches Millimeters Min Nom Max Min Nom Max A .080 .090 .100 2.03 2.29 2.54 b .022 .025 .028 0.56 0.64 0.71 b1 .006 .014 .022 0.15 0.36 0.56 b2 .040 --- --- 1.02 --- --- D .800 .820 .840 20.32 20.83 21.34 E .392 .400 .408 9.96 10.16 10.36 e .050 BSC 1.27 BSC h .012 REF 0.30 REF Notes 4 7 L .070 .075 .080 1.78 1.90 2.03 L1 .090 .100 .110 2.29 2.54 2.79 5 L2 .003 .009 .015 0.08 0.23 0.38 4 N 32 --- 8 FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 22 Case U - Continued. NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. All dimensions and tolerances conform to ANSI Y14.5M-1982. 4. Metallized castellations shall be connected to plane 1 terminals. 5. Index area: A pin identification mark shall be located adjacent to pin one within the shaded area shown. Plane 1 terminal identification may be an extension of the length of the metallized terminal which shall not be wider than the b dimension. 6. The cover shall not extend beyond the edges of the body. 7. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option. 8. N indicates the number of terminals. 9. Unless otherwise specified, a minimum clearance of .015 inch (.381 mm) shall be maintained between all metallized features (e.g., lid, castellation, terminals, thermal pads, etc.). 10. Solder finish is optional with a maximum allowable thickness of .007 inch. Measurement of dimensions A, b1, and L2 may be made prior to solder application. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 23 Case T Symbol Inches Millimeters Notes Min Max Min Max A .097 .125 2.46 3.18 b .015 .019 0.38 0.48 5 c .003 .009 0.08 0.23 5 D --- .830 --- 21.08 3 E .400 .420 10.16 10.67 E1 --- .450 --- 11.43 E2 .180 --- 4.57 --- E3 .030 --- 0.76 --- 9 1.27 BSC 4,6 e .050 BSC L .250 .370 6.35 9.40 Q .020 .045 0.51 1.14 S --- .045 --- 1.14 S1 .000 --- 0.00 --- N 32 3 7 7,8 6 NOTES: 1. Index area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. Dimension Q shall be measured at the point of exit of the lead from the body. Dimension Q minimum shall be reduced by .0015 inch (0.038 mm) maximum when lead finish A is applied. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. The basic lead spacing is .050 (1.27 mm) between centerlines. Each lead centerline shall be located within .005 (0.13 mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead. 5. All leads - Increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A or B is applied. 6. Total number of spaces = (N-2). Symbol "N" is the maximum number of leads. 7. Measure all four corner leads. 8. Dimension S1 (see 5.2.2 of MIL-STD-1835) may be .000 (0.00 mm) if the corner leads, upon entering the body of the package, and within one lead's width, bend toward the die cavity. See 5.2.2 of MIL-STD-1835 for measurement of S1 on bottom-brazed flat packs. 9. Bottom brazed lead configuration. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 10. Dimensions are in inches. 11. Metric equivalents are given for general information only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 24 Case N Inches Symbol Millimeters Min Max Min Max A .070 .100 1.78 2.54 b .022 .028 0.56 0.71 b1 .009 R b2 .038 .042 .97 1.07 D .445 .460 11.30 11.68 D1 .295 .305 7.49 7.75 E .695 .715 17.65 18.16 E1 .395 .405 10.03 10.29 .23 R e .050 TYP 1.27 TYP h .020 REF .51 REF J .035 REF .89 REF L .045 .055 1.14 1.40 L1 .077 .093 1.96 2.36 FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 25 Case 9 FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 26 Case 9 - Continued. Inches Symbol Min Millimeters Max Min Max A .141 .177 3.58 4.50 A1 .073 .089 1.85 2.26 A2 .078 REF A3 .033 .065 1.98 REF .84 1.65 B .017 REF .43 REF B1 .028 REF .71 REF D .445 .458 11.30 11.63 D3 .290 .310 7.37 7.87 D4 .400 .440 10.16 11.18 E .695 .710 17.65 18.03 E3 .390 .410 9.91 10.41 E4 .650 .690 16.51 17.53 e .050 TYP 1.27 TYP e1 .007 REF .18 REF h .020 REF .51 REF L .075 .115 Q .040 MIN R1 .023 R REF TYP S1 .003 .035 1.91 2.92 1.02 MIN .58 R REF TYP .08 .89 FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 27 Case 8 Inches Symbol Millimeters Min Max Min Max A .460 .500 11.68 12.70 A1 .020 .040 0.51 1.02 A2 .440 .460 11.18 11.68 A3 .565 .645 14.35 16.38 B .016 .020 0.41 0.51 C .008 .012 0.20 0.30 D 1.630 1.670 41.40 42.42 E .090 .130 2.29 3.30 e1 .050 BSC eA .125 .155 M .055 .105 N 3 6 1.27 BSC .100 BSC L Notes 2.54 BSC 3.18 3.95 1.40 2.67 32 S .030 .070 1 0.76 1.78 NOTES: 1. N is the number of leads. 2. The chamfer on the body is optional. If is not present, a visual index feature must be located within the cross hatched area. 3. Lead configuration in this area is optional. 4. Controlling dimension: Inches. 5. Solder finish is optional. However, if leads are solder dipped or plated, increase maximum limit of all leads by 0.003" from center of flat. 6. The cover shall not extend beyond the edges of the ceramic body. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 28 Case 7 Symbol Millimeters Inches Min Max Min Max A 3.35 3.66 .132 .144 A2 0.66 0.91 .026 .036 b 0.38 0.48 .015 .019 B1 0.76 1.02 .030 .040 D 20.62 21.03 .812 .828 D1 18.80 19.30 .740 .760 E 10.29 10.54 .405 .415 E1 11.05 11.30 .435 .445 E2 9.14 9.85 .360 .380 e 1.27 BSC N .050 BSC 32 FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 29 01 through 12, 22 through 29,39, 40,42 through 46 Device types Case outlines 13 through 21, 30 through 38, 41,47 01 through 12, 22 through 29, 39 8 X, Y, Z, U, T, N, M, 9, and 7 Terminal number Terminal symbol 1 NC NC NC 2 A16 A16 VCC 3 A14 A14 A16 4 A12 A12 A15 5 A7 A7 A14 6 A6 A6 7 A5 A5 A12 8 A4 A4 WE 9 A3 A3 A7 10 A2 A2 A13 11 A1 A1 A6 12 A0 A0 A8 13 I/O0 I/O0 A5 14 I/O1 I/O1 A9 15 I/O2 I/O2 A4 16 VSS VSS A11 17 I/O3 I/O3 A3 18 I/O4 I/O4 19 I/O5 I/O5 A2 20 I/O6 I/O6 A10 21 I/O7 I/O7 A1 22 CE CE 1 23 A10 A10 A0 24 OE OE I/O7 25 A11 A11 I/O0 26 A9 A9 I/O6 27 A8 A8 I/O1 28 A13 A13 I/O5 29 WE NC OE CS I/O2 WE 30 NC CE2 I/O4 31 A15 A15 VSS 32 VCC VCC I/O3 NC = No connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 30 Mode CE *CE2 Standby H Standby I/O WE OE X X X High Z X L X X High Z Read L H H L DOUT Write L H L X DIN Read L H H H High Z H = logic "1" state, L = logic "0" state. X = logic "don't care" state, and Z = high impedance state. * = only applies to devices with dual CE . FIGURE 3. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 31 Read Cycle (see notes 1 and 2) NOTES: 1. 2. WE is held high during the read cycle. Timing measurement reference level is 1.5 V. FIGURE 4. Timing waveform diagrams. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 32 Write cycle 1 (see notes 1, 2, and 3) ( CE 1 or CE2 controlled) NOTES: 1. Either CE 1 or CE2 may be used to control the write cycle. If CE 1 is used, CE2 should be high when WE is low. If CE2 is used, CE 1 should be low when WE is low. 2. In a CE 1 or CE2 controlled write cycle, the outputs assume a high impedance state, whether OE is high or low, as long as WE is low. 3. Timing measurement reference is 1.5 V. FIGURE 4. Timing waveform diagrams - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 33 Write cycle 2 (see notes 1 and 2) ( WE controlled) NOTES: 1. In the WE controlled write cycle, while WE is low, it will force the outputs into a high impedance state, whether OE is high or low. 2. Timing measurement reference level is 1.5 V. FIGURE 4. Timing waveform diagrams - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 34 Data retention Waveform (see notes 1 and 2) NOTES: 1. Either CE 1 or CE2 may be used to begin data retention mode. 2. For tCDR and tR: CE 1 VCC -0.2 V or CE2 0.2 V, VIN VCC -2.0 V or VIN 0.2 V. FIGURE 4. Timing waveform diagrams - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 35 NOTES: 1. Use these output load circuits or equivalent for testing. 2. Including scope and jig. 3. Minimum of 5 pF for tEHQZ, tOHQZ, tELQX, tOLQX, and tWHQX. FIGURE 5. Output load circuits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 36 NOTE: Input protection resistors = 1 k. FIGURE 6. Bias conditions for irradiation testing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 37 TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/ Line no. Subgroups (in accordance with MIL-STD-883, TM 5005, table I) Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Device class V 1 Interim electrical parameters (see 4.2) 2 Static burn-in (method 1015) 3 Same as line 1 4 Dynamic burn-in (method 1015) 5 Same as line 1 6 Final electrical parameters (see 4.2) 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 7 Group A test requirements (see 4.4) 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 8 Group C end-point electrical parameters (see 4.4) 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B, 9, 10, 11 9 Group D end-point electrical parameters (see 4.4) 2, 3, 8A, 8B 2, 3, 8A, 8B 2, 3, 8A, 8B 10 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 Not required Not required Required 1*, 7* Required Required Required 1*, 7* 1/ 2/ 3/ 4/ 5/ 6/ Blank spaces indicate tests are not applicable. Any or all subgroups may be combined when using high-speed testers. Subgroups 7 and 8 functional tests shall verify the truth table. * indicates PDA applies to subgroup 1 and 7. ** see 4.4.1e. indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (see line 1). 7/ See 4.4.1d. TABLE IIB. Delta limits at +25C. Parameter 1/ Device types All ICC3 standby 10% of specified value in table I IIH, IIL 10% of specified value in table I IOHZ, IOLZ 10% of specified value in table I 1/ The above parameter shall be recorded before and after the required burn-in and life tests to determine the delta . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 38 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MILPRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MILPRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may affect the performance of the device. For device class M, procedures and circuits shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD 78 may be used for reference. e. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and output terminals tested. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MILPRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 39 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019 condition A, and as specified herein. 4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25C 5C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 4.4.4.2 Dose rate induced latchup testing. Dose rate induced latchup shall not occur under any recommended operating condition. 4.4.4.3 Dose rate upset testing. Dose rate upset testing shall be performed in accordance with test method 1021 of MILSTD-883 and herein. a. Transient dose rate upset testing for class M devices shall be performed at initial qualification and after any design or process changes which may effect the RHA performance of the devices. Test 10 devices with 0 defects unless otherwise specified. b. Transient dose rate upset testing for class Q and V devices shall be performed as specified by a TRB approved radiation hardness assurance plan and MIL-PRF-38535. Device parametric parameters that influence upset immunity shall be monitored at the wafer level in accordance with the wafer level hardness assurance plan and MIL-PRF-38535. c. The transient dose rate upset level shall be greater than or equal to 510 rads(Si)/s with a pulse width less than or equal to 1.0 s. 4.4.4.4 Single event phenomena (SEP). SEP testing shall be required on class V devices (see 1.4 herein). SEP testing shall be performed on a technology process on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as approved by the qualifying activity at inital qualification and after any design or process changes which may affect the upset or latchup characteristics. The recommended test conditions for SEP are as follows: a. The ion beam angle of incidence shall be between normal to the die surface and 60 to the normal, inclusive (i.e. 0 angle 60). No shadowing of the ion beam due to fixturing or package related effects is allowed. b. The fluence shall be 100 errors or 107 ions/cm2. c. The flux shall be between 102 and 105 ions/cm2/s. The cross-section shall be verified to be flux independent by measuring the cross-section at two flux rates which differ by at least an order of magnitude. d. The particle range shall be 20 microns in silicon. e. The test temperature shall be +25C and the maximum rated operating temperature 10C. f. Bias conditions shall be VCC = 4.5 V dc for the upset measurements and VCC = 5.5 V dc for the latchup measurements. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 40 4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1, 7, and 9. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HDBK-1331, and as follows: CIN, COUT ......................................... Input and bi-directional output, terminal-to-GND capacitance. GND ................................................... Ground zero voltage potential. ICC ..................................................... Supply current. IIL ....................................................... Input current low. IIH ....................................................... Input current high. TC....................................................... Case temperature. TA ....................................................... Ambient temperature. VCC .................................................... Positive supply voltage. VIC ..................................................... Positive input clamp voltage. O/V ..................................................... Latch-up over-voltage. 6.5.1 Timing parameter abbreviations. All timing abbreviations use lower case characters with upper case character subscripts. The initial character is always "t" and is followed by four descriptors. These characters specify two signal points arranged in a "from-to" sequence that define a timing interval. The two descriptors for each signal specify the signal name and the signal transitions. Thus the format is: t X X X X | | | | | | | Signal name from which interval is derived | | | | Transition direction for first signal | | | | | Signal name to which interval is defined | | | Transition direction for second signal | STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 41 6.5.1 Timing parameter abbreviations - Continued. a. Signal definitions: A = Address D = Data in Q = Data out W = Write enable E = Chip enable O = Output enable b. Transition definitions: H = Transition to high L = Transition to low V = Transition to valid X = Transition to invalid or don't care Z = Transition to off (high impedance) 6.5.2.1 Timing limits. The table of timing values shows either a minimum or a maximum limit for each parameter. Input requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since the system must supply at least that much time (even though most devices do not require it). On the other hand, responses from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the device never provides data later than that time. 6.5.3 Waveforms. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 42 APPENDIX A FORMS A PART OF SMD 5962-89598 FUNCTIONAL ALGORITHMS A10. SCOPE A10.1 Scope. Functional algorithms are test patterns which define the exact sequence of events used to verify proper operation of a random access memory (RAM). Each algorithm serves a specific purpose for the testing of the device. It is understood that all manufacturers do not have the same test equipment; therefore, it becomes the responsibility of each manufacturer to guarantee that the test patterns described herein are followed as closely as possible, or equivalent patterns be used that serve the same purpose. Each manufacturer should demonstrate that this condition will be met. Algorithms shall be applied to the device in a topologically pure fashion. This appendix is a mandatory part of the specification. The information contained herein is intended for compliance. A20. APPLICABLE DOCUMENTS. This section is not applicable to this appendix. A30. ALGORITHMS A30.1 Algorithm A (pattern 1). A30.1.1 Checkerboard, checkerboard-bar. Step 1. Step 2. Step 3. Step 4. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum. A30.2 Algorithm B (pattern 2). A30.2.1 March. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Step 7. Step 8. Step 9. Step 10. Step 11. Step 12. Step 13. Step 14. Step 15. Step 16. Step 17. Step 18. Load memory with background data, incrementing from minimum to maximum address locations (All "0's"). Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 2 through 4 incrementing X-fast sequentially, for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 6 through 8 decrementing X-fast sequentially for, each location in the array. Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 10 through 12 decrementing X-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array. Read background data from memory, decrementing X-fast from maximum to minimum address locations. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 43 APPENDIX A - Continued. A30.3 Algorithm C (pattern 3). A30.2.1 XY March. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Step 7. Step 8. Step 9. Step 10. Step 11. Step 12. Step 13. Step 14. Step 15. Step 16. Step 17. Step 18. Load memory with background data, incrementing from minimum to maximum address locations (All "0's"). Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 2 through 4 incrementing Y-fast sequentially, for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array. Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array. Read background data from memory, decrementing Y-fast from maximum to minimum address locations. A30.4 Algorithm D (pattern 4). A30.4.1 CEDES - CE deselect checkerboard, checkerboard-bar. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum. Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum. Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 44 APPENDIX B FORMS A PART OF SMD 5962-89598 SUBSTITUTION DATA B10. SCOPE B10.1 Scope. This appendix contains the PIN substitution information to support the one part-one part number system. For new designs, after the date of this document the NEW PIN shall be used in lieu of the OLD PIN. For existing designs prior to the date of this document the NEW PIN can be used in lieu of the OLD PIN. This appendix is a mandatory part of the specification. The information contained herein is intended for compliance. The PIN substitution data shall be as follows: B20. APPLICABLE DOCUMENTS This section is not applicable to this appendix. B30. SUBSTITUTION DATA NEW PIN OLD PIN 5962-8959801MXX 5962-8959802MXX 5962-8959803MXX 5962-8959804MXX STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 5962-8959801XX 5962-8959802XX 5962-8959803XX 5962-8959804XX SIZE 5962-89598 A REVISION LEVEL R SHEET 45 APPENDIX C FORMS A PART OF SMD 5962-89598 C10. SCOPE C10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. C10.2 PIN. The PIN is as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 10.2.1) 89598 01 Device type (see 10.2.2) V Device class designator (see 10.2.3) / 6 Die code (see 10.2.4) A Die Details (see 10.2.5) \/ Drawing number C10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. C10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 47 65608EV-30 128K X 8 very low power CMOS SRAM Access time 30ns C10.2.3 Device class designator. Device class Q or V Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 C10.2.4 Die code. The die code designator shall be a number 6 for all devices supplied as die only with no case outline. C10.2.5. Die Details. The die details designation shall be a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. C10.2.5.1 Die physical dimensions. Die type Figure number 01 A-1 C10.2.5.2. Die bonding pad locations and electrical functions. Die type Figure number 01 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 A-1 SIZE 5962-89598 A REVISION LEVEL R SHEET 46 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 C10.2.5.3. Interface materials. Die type Figure number 01 A-1 C10.2.5.4. Assembly related information. Die type Figure number 01 A-1 C10.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details. C10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details. C20. APPLICABLE DOCUMENTS. C20.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) C20.2. Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. C30. REQUIREMENTS C30.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit or function as described herein. C30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specified in MIL-PRF-38535 and the manufacturer's QM plan, for device classes Q and V and herein. C30.2.1 Die physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1. C30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in 10.2.4.2 and on figure A-1. C30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 47 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 C30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1. C30.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3. of the body of this document. C30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4. of the body of this document. C30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. C30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. C30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer's identification and the PIN listed in 10.2 herein. The certification mark shall be a "QML" or "Q" as required by MIL-PRF-38535. C30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. C30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. C40. VERIFICATION C40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The manufacturer's modifications in the QM plan shall not effect the form, fit or function as described herein. C40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer's QM plan. As a minimum it shall consist of: a) Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method 2010 or the alternate procedures allowed within MIL-STD-883 test method 5004. C40.3 Conformance inspection. C40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4, 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 and 4.4.4.4. C50. DIE CARRIER C50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer's QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 48 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 C60 NOTES C60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. C60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0547. C60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within MIL-PRF-38535 and MIL-STD-1331. C60.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 49 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 Rotation angle In degrees Manufacturer Pad reference Signal name Y 2,297 0 20 (A3) -7,706 2,117 0 21 (A2) A -7,706 1,937 0 22 (Al) A -7,706 1,757 0 23 (A0) 5 A -7,706 1,522 0 24 (1/O0) 6 A -7,706 1,242 0 25 I/O1 7 A -7,706 0,992 0 26 Gnd 8 A -7,706 0,742 0 27 I/O2 9 A -7,706 0,242 0 28 Gnd 10 B -7,706 0,042 0 29 Gnd 11 A -7,706 -0,158 0 30 Gnd 12 A -7,706 -0,408 0 31 I/O3 13 A -7,706 -0,688 0 32 I/O4 14 A -7,706 -0,913 0 33 Gnd 15 A -7,706 -1,138 0 34 I/O5 16 A -7,706 -1,418 0 35 (I/O6) 17 A -7,706 -1,698 0 36 (I/O7) 18 A -7,706 -1,938 0 37 (CS1/) 19 A -7,706 -2,118 0 38 (A1O) 20 A -7,706 -2,298 0 39 (OE/) 21 A -7,488 -2,504 0 40 I/O6 22 A -7,227 -2,504 0 41 Gnd 23 A -6,947 -2,504 0 42 I/O7 24 A -5,787 -2,504 0 43 CS1/ 25 A -4,787 -2,504 0 44 Al0 26 A -3,787 -2,504 0 45 OE/ 27 A -0,187 -2,504 0 46 Gnd 28 A 3,813 -2,504 0 47 All 29 A 4,813 -2,504 0 48 A9 Pad number Top left corner Pad reference Position relative to center of die (dimensions are in millimeters) 1 A X -7,706 2 A 3 4 Figure A-1, MMO-65608EV Bond Pad Locations and Functions STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 50 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 Rotation angle In degrees Manufacturer Pad reference Signal name Y -2,504 0 49 A8 6,613 -2,504 0 50 A13 A 7,213 -2,504 0 51 W/ 33 A 7,729 -2,333 0 52 (A11) 34 A 7,729 -2,158 0 53 (A9) 35 A 7,729 -1,983 0 54 (A8) 36 A 7,729 -1,808 0 55 (A13) 37 A 7,729 -1,633 0 56 (W) 38 A 7,729 -1,407 0 57 CS2 39 A 7,729 -1,183 0 58 Gnd 40 A 7,729 -0,983 0 59 A15 41 A 7,729 -0,188 0 60 Vcc 42 B 7,722 0,042 0 61 Vcc 43 A 7,729 0,272 0 62 Vcc 44 A 7,729 0,842 0 1 A16 45 A 7,729 1,067 0 2 Gnd 46 A 7,729 1,267 0 3 A14 47 A 7,729 1,436 0 4 (A12) 48 A 7,729 1,617 0 5 (A7) 49 A 7,729 1,792 0 6 (A6) 50 A 7,729 1,967 0 7 (A5) 51 A 7,729 2,142 0 8 (A4) 52 A 7,729 2,323 0 9 A12 53 A 7,638 2,504 0 10 A7 54 A 6,813 2,504 0 11 A6 55 A 6,613 2,504 0 12 A5 56 A 4,413 2,504 0 13 A4 57 A 0,013 2,504 0 14 Gnd 58 A -3,787 2,804 0 15 A3 59 A -4,787 2,504 0 16 A2 60 A -6,787 2,504 0 17 A1 61 A -6,387 2,504 0 18 A0 62 A -7,481 2,504 0 19 I/O0 Pad number Top left corner Pad reference Position relative to center of die (dimensions are in millimeters) 30 A X 5,813 31 A 32 Figure A-1, MMO-65608EV Bond Pad Locations and Functions - Continued STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 51 APPENDIX C - Continued. FORMS A PART OF SMD 5962-89598 Die physical dimensions. Die size: 15 860 X 5 410 microns Die thickness: 475 microns Interface materials. Top metallization: Aluminium + 1% Copper Backside metallization: bare silicon Glassivation. Type: Silicon Oxide + Nitride Thickness: 15 000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: not connected Special assembly instructions: None Figure A-1, MMO-65608EV Bond Pad Locations and Functions - Continued STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89598 A REVISION LEVEL R SHEET 52 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-02-13 Approved sources of supply for SMD 5962-89598 are listed below for immediate acquisition only and shall be added to MIL-HDBK-103 and QML-38535, as applicable, during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959801MXA 3/ 3/ 3/ S128K8L-120MC MSM8128SXLMC-12 EDI88128LPS120CB 5962-8959801MYA 3/ 3/ 3/ S128K8L-120MS EDI88128LPS120NB L7C108YMB25 5962-8959801MZA 3/ 3/ 3/ 3/ S128K8L-120ME MSM8128KXLMC-12 EDI88128LPS120TB L7C108CMB25 5962-8959801MUA 3/ 3/ S128K8L-120ML EDI88128LPS120LB 5962-8959801MTA 3/ 3/ 3/ 3/ S128K8L-120MF MSM8128GXLMC-12 EDI88128LPS120FB L7C108MMB25 5962-8959801MNA 3/ 3/ MSM8128WXLMC-12 L7C108KMB25 5962-8959801M9A 3/ MSM8128JXLMC-12 5962-8959801M8A 3/ EDI88128LPS120ZB 5962-8959802MXA 3/ 3/ 3/ S128K8L-100MC MSM8128SXLMC-10 EDI88128LPS100CB Vendor similar PIN 2/ See footnotes at end of table. 1 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Vendor Similar PIN 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959802MYA 3/ 3/ 3/ S128K8L-100MS EDI88128LPS100NB L7C108YMB25 5962-8959802MZA 3/ 3/ 3/ 3/ S128K8L-100ME MSM8128KXLMC-10 EDI88128LPS100TB L7C108CMB25 5962-8959802MUA 3/ 3/ S128K8L-100ML EDI88128LPS100LB 5962-8959802MTA 3/ 3/ 3/ 3/ S128K8L-100MF MSM8128GXLMC-10 EDI88128LPS100FB L7C108MMB25 5962-8959802MNA 3/ 3/ MSM8128WXLMC-10 L7C108KMB25 5962-8959802M9A 3/ MSM8128JXLMC-10 5962-8959802M8A 3/ EDI88128LPS100ZB 5962-8959803MXA 3/ 3/ 3/ S128K8L-85MC MSM8128SXLMC-85 EDI88128LPS85CB 5962-8959803MYA 3/ 3/ 3/ S128K8L-85MS EDI88128LPS85NB L7C108YMB25 5962-8959803MZA 3/ 3/ 3/ 3/ S128K8L-85ME MSM8128KXLMC-85 EDI88128LPS85TB L7C108CMB25 5962-8959803MUA 3/ 3/ S128K8L-85ML EDI88128LPS85LB See footnotes at end of table. 2 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Vendor Similar PIN 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959803MTA 3/ 3/ 3/ 3/ S128K8L-85MF MSM8128GXLMC-85 EDI88128LPS85FB L7C108MMB25 5962-8959803MNA 3/ 3/ MSM8128WXLMC-85 L7C108KMB25 5962-8959803M9A 3/ MSM8128JXLMC-85 5962-8959803M8A 3/ EDI88128LPS85ZB 5962-8959804MXA 3/ 3/ 3/ S128K8L-70MC MSM8128SXLMC-70 EDI88128LPS70CB 5962-8959804MYA 3/ 3/ 3/ S128K8L-70MS EDI88128LPS70NB L7C108YMB25 5962-8959804MZA 3/ 3/ 3/ 3/ S128K8L-70ME MSM8128KXLMC-70 EDI88128LPS70TB L7C108CMB25 5962-8959804MUA 3/ 3/ S128K8L-70ML EDI88128LPS70LB 5962-8959804MTA 3/ 3/ 3/ 3/ S128K8L-70MF MSM8128GXLMC-70 EDI88128LPS70FB L7C108MMB25 5962-8959804MNA 3/ 3/ MSM8128WXLMC-70 L7C108KMB25 5962-8959804M9A 3/ MSM8128JXLMC-70 5962-8959804M8A 3/ EDI88128LPS70ZB See footnotes at end of table. 3 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959805MXA 3/ 3/ 54230 0EU86 S128K8L-120MC MSM8128SXLMC-12 EDI88128LPS120CB MT5C1009CW-120L883C 5962-8959805MYA 3/ 54230 3/ 0EU86 S128K8L-120MS EDI88128LPS120NB L7C108YMB25 MT5C1009SOJ-120L883C 5962-8959805MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-120ME MSM8128KXLMC-12 EDI88128LPS120TB L7C108CMB25 MT5C1009C-120L883C 5962-8959805MUA 3/ 54230 0EU86 S128K8L-120ML EDI88128LPS120LB MT5C1009EC-120L883C 5962-8959805MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-120MF MSM8128GXLMC-12 EDI88128LPS120FB L7C108MMB25 MT5C1009F-120L883C 5962-8959805MNA 3/ 3/ 5962-8959805MMA 0EU86 5962-8959805M9A 3/ MSM8128WXLMC-12 L7C108KMB25 MT5C1009ECA-120L883C MSM8128JXLMC-12 5962-8959805M8A 54230 EDI88128LPS120ZB 5962-8959805M7A 0EU86 MT5C1009DCJ-120L883C 5962-8959806MXA 3/ 3/ 54230 0EU86 S128K8L-100MC MSM8128SXLMC-10 EDI88128LPS100CB MT5C1009CW-100L883C See footnotes at end of table. 4 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959806MYA 3/ 54230 3/ 0EU86 S128K8L-100MS EDI88128LPS100NB L7C108YMB25 MT5C1009SOJ-100L883C 5962-8959806MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-100ME MSM8128KXLMC-10 EDI88128LPS100TB L7C108CMB25 MT5C1009C-100L883C 5962-8959806MUA 3/ 54230 0EU86 S128K8L-100ML EDI88128LPS100LB MT5C1009EC-100L883C 5962-8959806MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-100MF MSM8128GXLMC-10 EDI88128LPS100FB L7C108MMB25 MT5C1009F-100L883C 5962-8959806MNA 3/ 3/ 5962-8959806MMA 0EU86 5962-8959806M9A 3/ MSM8128WXLMC-10 L7C108KMB25 MT5C1009ECA-100L883C MSM8128JXLMC-10 5962-8959806M8A 54230 EDI88128LPS100ZB 5962-8959806M7A 0EU86 MT5C1009DCJ-100L883C 5962-8959807MXA 3/ 3/ 54230 0EU86 S128K8L-85MC MSM8128SXLMC-85 EDI88128LPS85CB MT5C1009CW-85L883C 5962-8959807MYA 3/ 54230 3/ 0EU86 S128K8L-85MS EDI88128LPS85NB L7C108YMB25 MT5C1009SOJ-85L883C See footnotes at end of table. 5 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959807MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-85ME MSM8128KXLMC-85 EDI88128LPS85TB L7C108CMB25 MT5C1009C-85L883C 5962-8959807MUA 3/ 54230 0EU86 S128K8L-85ML EDI88128LPS85LB MT5C1009EC-85L883C 5962-8959807MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-85MF MSM8128GXLMC-85 EDI88128LPS85FB L7C108MMB25 MT5C1009F-85L883C 5962-8959807MNA 3/ 3/ MSM8128WXLMC-85 L7C108KMB25 5962-8959807MMA 0EU86 5962-8959807M9A 3/ MT5C1009ECA-85L883C MSM8128JXLMC-85 5962-8959807M8A 54230 EDI88128LPS85ZB 5962-8959807M7A 0EU86 MT5C1009DCJ-85L883C 5962-8959808MXA 3/ 3/ 54230 0EU86 S128K8L-70MC MSM8128SXLMC-70 EDI88128LPS70CB MT5C1009CW-70L883C 5962-8959808MYA 3/ 54230 3/ 0EU86 S128K8L-70MS EDI88128LPS70NB L7C108YMB25 MT5C1009SOJ-70L883C 5962-8959808MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-70ME MSM8128KXLMC-70 EDI88128LPS70TB L7C108CMB25 MT5C1009C-70L883C See footnotes at end of table. 6 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959808MUA 3/ 54230 0EU86 S128K8L-70ML EDI88128LPS70LB MT5C1009EC-70L883C 5962-8959808MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-70MF MSM8128GXLMC-70 EDI88128LPS70FB L7C108MMB25 MT5C1009F-70L883C 5962-8959808MNA 3/ 3/ MSM8128WXLMC-70 L7C108KMB25 5962-8959808MMA 0EU86 5962-8959808M9A 3/ MT5C1009ECA-70L883C MSM8128JXLMC-70 5962-8959808M8A 54230 EDI88128LPS70ZB 5962-8959808M7A 0EU86 MT5C1009DCJ-70L883C 5962-8959809MXA 3/ 3/ 3/ 54230 0EU86 S128K8L-55MC MSM8128SXLMC-55 PDM41024L55CE0B EDI88128LPS55CB MT5C1009CW-55L883C 5962-8959809MYA 3/ 54230 3/ 0EU86 S128K8L-55MS EDI88128LPS55NB L7C108YMB25 MT5C1009SOJ-55L883C 5962-8959809MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-55ME MSM8128KXLMC-55 EDI88128LPS55TB L7C108CMB25 MT5C1009C-55L883C 5962-8959809MUA 3/ 54230 0EU86 S128K8L-55ML EDI88128LPS55LB MT5C1009EC-55L883C 5962-8959809MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-55MF MSM8128GXLMC-55 EDI88128LPS55FB L7C108MMB25 MT5C1009F-55L883C See footnotes at end of table. 7 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959809MNA 3/ 3/ 5962-8959809MMA 0EU86 5962-8959809M9A 3/ Vendor Similar PIN 2/ MSM8128WXLMC-55 L7C108KMB25 MT5C1009ECA-55L883C MSM8128JXLMC-55 5962-8959809M8A 54230 EDI88128LPS55ZB 5962-8959809M7A 0EU86 MT5C1009DCJ-55L883C 5962-8959810MXA 3/ 3/ 3/ 54230 0EU86 S128K8L-45MC MSM8128SXLMC-45 PDM41024L45CE0B EDI88128LPS45CB MT5C1009CW-45L883C 5962-8959810MYA 3/ 54230 3/ 0EU86 S128K8L-45MS EDI88128LPS45NB L7C108YMB25 MT5C1009SOJ-45L883C 5962-8959810MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-45ME MSM8128KXLMC-45 EDI88128LPS45TB L7C108CMB25 MT5C1009C-45L883C 5962-8959810MUA 3/ 54230 0EU86 S128K8L-45ML EDI88128LPS45LB MT5C1009EC-45L883C 5962-8959810MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-45MF MSM8128GXLMC-45 EDI88128LPS45FB L7C108MMB25 MT5C1009F-45L883C 5962-8959810MNA 3/ 3/ MSM8128WXLMC-45 L7C108KMB25 5962-8959810MMA 0EU86 5962-8959810M9A 3/ 5962-8959810M8A 54230 MT5C1009ECA-45L883C MSM8128JXLMC-45 EDI88128LPS45ZB See footnotes at end of table. 8 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959810M7A 0EU86 MT5C1009DCJ-45L883C 5962-8959811MXA 3/ 3/ 3/ 54230 0EU86 S128K8L-35MC MSM8128SXLMC-35 PDM41024L35CE0B EDI88128LPS35CB MT5C1009CW-35L883C 5962-8959811MYA 3/ 54230 3/ 0EU86 S128K8L-35MS EDI88128LPS35NB L7C108YMB25 MT5C1009SOJ-35L883C 5962-8959811MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-35ME MSM8128KXLMC-35 EDI88128LPS35TB L7C108CMB25 MT5C1009C-35L883C 5962-8959811MUA 3/ 54230 0EU86 S128K8L-35ML EDI88128LPS35LB MT5C1009EC-35L883C 5962-8959811MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-35MF MSM8128GXLMC-35 EDI88128LPS35FB L7C108MMB25 MT5C1009F-35L883C 5962-8959811MNA 3/ 3/ MSM8128WXLMC-35 L7C108KMB25 5962-8959811MMA 0EU86 5962-8959811M9A 3/ MT5C1009ECA-35L883C MSM8128JXLMC-35 5962-8959811M8A 54230 EDI88128LPS35ZB 5962-8959811M7A 0EU86 MT5C1009DCJ-35L883C See footnotes at end of table. 9 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959812MXA 3/ 3/ 3/ 54230 0EU86 S128K8L-25MC MSM8128SXLMC-25 PDM41024L25CE0B EDI88128LPS25CB MT5C1009CW-25L883C 5962-8959812MYA 3/ 54230 3/ 0EU86 S128K8L-25MS EDI88128LPS25NB L7C108YMB25 MT5C1009SOJ-25L883C 5962-8959812MZA 3/ 3/ 54230 3/ 0EU86 S128K8L-25ME MSM8128KXLMC-25 EDI88128LPS25TB L7C108CMB25 MT5C1009C-25L883C 5962-8959812MUA 3/ 54230 0EU86 S128K8L-25ML EDI88128LPS25LB MT5C1009EC-25L883C 5962-8959812MTA 3/ 3/ 54230 3/ 0EU86 S128K8L-25MF MSM8128GXLMC-25 EDI88128LPS25FB L7C108MMB25 MT5C1009F-25L883C 5962-8959812MNA 3/ 3/ MSM8128WXLMC-25 L7C108KMB25 5962-8959812MMA 0EU86 5962-8959812M9A 3/ MT5C1009ECA-25L883C MSM8128JXLMC-25 5962-8959812M8A 54230 EDI88128LPS25ZB 5962-8959812M7A 0EU86 MT5C1009DCJ-25L883C See footnotes at end of table. 10 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959813MXA 3/ 3/ 0EU86 54230 3DDT2 S128K8TL-120MC MSM8128SLMC-12 MT5C1008CW-120L883C EDI88130LPS120CB P4C1024L-120C6MB 5962-8959813MYA 3/ 54230 3/ 0EU86 3DDT2 S128K8TL-120MS EDI88130LPS120NB L7C108YMB25 MT5C1008SOJ-120L883C P4C1024L-120CJMB 5962-8959813MZA 3/ 3/ 0EU86 54230 65786 3/ 3/ 3DDT2 S128K8TL-120ME MSM8128KLMC-12 MT5C1008C-120L883C EDI88130LPS120TB CY7C1009L-120DMB MMC965608V120/883 L7C108CMB25 P4C1024L-120C4MB 5962-8959813MUA 3/ 0EU86 54230 S128K8TL-120ML MT5C1008EC-120L883C EDI88130LPS120LB 5962-8959813MTA 3/ 3/ 0EU86 54230 3/ 3DDT2 S128K8TL-120MF MSM8128GLMC-12 MT5C1008F-120L883C EDI88130LPS120FB L7C108MMB25 P4C1024L-120FSMB 5962-8959813MTC 3/ MMDJ65608V120/883 5962-8959813MNA 3/ 3/ MSM8128WLMC-12 L7C108KMB25 5962-8959813MMA 0EU86 65786 54230 3DDT2 5962-8959813M9A 3/ 5962-8959813M7A 0EU86 MT5C1008ECA-120L883C CY7C1009L-120LMB EDI88130LPS120L32B P4C1024L-120LMB MSM8128JLMC-12 MT5C1008DCJ-120L883C See footnotes at end of table. 11 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959814MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-100MC MSM8128SLMC-10 MT5C1008CW-100L883C EDI88130LPS100CB P4C1024L-100C6MB 5962-8959814MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8TL-100MS EDI88130LPS100NB L7C108YMB25 MT5C1008SOJ-100L883C P4C1024L-100CJMB 5962-8959814MZA 3/ 3/ 0EU86 54230 65786 3/ 3/ 3DTT2 S128K8TL-100ME MSM8128KLMC-10 MT5C1008C-100L883C EDI88130LPS100TB CY7C1009L-100DMB MMC965608V100/883 L7C108CMB25 P4C1024L-100C4MB 5962-8959814MUA 3/ 0EU86 54230 S128K8TL-100ML MT5C1008EC-100L883C EDI88130LPS100LB 5962-8959814MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8TL-100MF MSM8128GLMC-10 MT5C1008F-100L883C EDI88130LPS100FB L7C108MMB25 P4C1024L-100FSMB 5962-8959814MTC 3/ MMDJ65608V100/883 5962-8959814MNA 3/ 3/ MSM8128WLMC-10 L7C108KMB25 5962-8959814MMA 0EU86 65786 54230 3DTT2 5962-8959814M9A 3/ 5962-8959814M7A 0EU86 MT5C1008ECA-100L883C CY7C1009L-100LMB EDI88130LPS100L32B P4C1024L-100LMB MSM8128JLMC-10 MT5C1008DCJ-100L883C See footnotes at end of table. 12 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959815MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-85MC MSM8128SLMC-85 MT5C1008CW-85L883C EDI88130LPS85CB P4C1024L-85C6MB 5962-8959815MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8TL-85MS EDI88130LPS85NB L7C108YMB25 MT5C1008SOJ-85L883C P4C1024L-85CJMB 5962-8959815MZA 3/ 3/ 0EU86 54230 65786 3/ 3/ 3DTT2 S128K8TL-85ME MSM8128KLMC-85 MT5C1008C-85L883C EDI88130LPS85TB CY7C1009L-85DMB MMC965608V85/883 L7C108CMB25 P4C1024L-85C4MB 5962-8959815MUA 3/ 0EU86 54230 S128K8TL-85ML MT5C1008EC-85L883C EDI88130LPS85LB 5962-8959815MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8TL-85MF MSM8128GLMC-85 MT5C1008F-85L883C EDI88130LPS85FB L7C108MMB25 P4C1024L-85FSMB 5962-8959815MTC 3/ MMDJ65608V85/883 5962-8959815MNA 3/ 3/ MSM8128WLMC-85 L7C108KMB25 5962-8959815MMA 0EU86 65786 54230 3DTT2 5962-8959815M9A 3/ 5962-8959815M7A 0EU86 MT5C1008ECA-85L883C CY7C1009L-85LMB EDI88130LPS85L32B P4C1024L-85LMB MSM8128JLMC-85 MT5C1008DCJ-85L883C See footnotes at end of table. 13 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959816MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-70MC MSM8128SLMC-70 MT5C1008CW-70L883C EDI88130LPS70CB P4C1024L-70C6MB 5962-8959816MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8TL-70MS EDI88130LPS70NB L7C108YMB25 MT5C1008SOJ-70L883C P4C1024L-70CJMB 5962-8959816MZA 3/ 3/ 0EU86 54230 65786 3/ 3/ 3DTT2 S128K8TL-70ME MSM8128KLMC-70 MT5C1008C-70L883C EDI88130LPS70TB CY7C1009L-70DMB MMC965608V70/883 L7C108CMB25 P4C1024L-70C4MB 5962-8959816MUA 3/ 0EU86 54230 S128K8TL-70ML MT5C1008EC-70L883C EDI88130LPS70LB 5962-8959816MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8TL-70MF MSM8128GLMC-70 MT5C1008F-70L883C EDI88130LPS70FB L7C108MMB25 P4C1024L-70FSMB 5962-8959816MTC 3/ MMDJ65608V70/883 5962-8959816MNA 3/ 3/ MSM8128WLMC-70 L7C108KMB25 5962-8959816MMA 0EU86 65786 54230 3DTT2 5962-8959816M9A 3/ 5962-8959816M7A 0EU86 MT5C1008ECA-70L883C CY7C1009L-70LMB EDI88130LPS70L32B P4C1024L-70LMB MSM8128JLMC-70 MT5C1008DCJ-70L883C See footnotes at end of table. 14 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959817MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-55MC MSM8128SLMC-55 PDM41024L55CB MT5C1008CW-55L883C EDI88130LPS55CB P4C1024L-55C6MB 5962-8959817MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8TL-55MS EDI88130LPS55NB L7C108YMB25 NS41024L55S/883 MT5C1008SOJ-55L883C P4C1024L-55CJMB 5962-8959817MZA 3/ 3/ 3/ 0EU86 54230 65786 3/ 3/ 3/ 3DTT2 0C7V7 S128K8TL-55ME MSM8128KLMC-55 PDM41024L55CB MT5C1008C-55L883C EDI88130LPS55TB CY7C1009L-55DMB MMC965608V55/883 L7C108CMB25 NS41024L55D/883 P4C1024L-55C4MB QP7C1009BL-55DMB 5962-8959817MUA 3/ 0EU86 54230 3/ S128K8TL-55ML MT5C1008EC-55L883C EDI88130LPS55LB NS41024L55Y/883 5962-8959817MTA 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8TL-55MF MSM8128GLMC-55 MT5C1008F-55L883C EDI88130LPS55FB L7C108MMB25 NS41024L55F/883 P4C1024L-55FSMB QP7C1009BL-55FMB 5962-8959817MTC 3/ MMDJ65608V55/883 5962-8959817MNA 3/ 3/ MSM8128WLMC-55 L7C108KMB25 5962-8959817MMA 3/ 3/ 0EU86 65786 54230 3DTT2 0C7V7 PDM41024L55L32B NS41024L55E/883 MT5C1008ECA-55L883C CY7C1009L-55LMB EDI88130LPS55L32B P4C1024L-55LMB QP7C1009BL-55LMB See footnotes at end of table. 15 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Vendor Similar PIN 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959817M9A 3/ 5962-8959817M7A 0EU86 MT5C1008DCJ-55L883C 5962-8959818MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-45MC MSM8128SLMC-45 PDM41024L45CB MT5C1008CW-45L883C EDI88130LPS45CB P4C1024L-45C6MB 5962-8959818MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8TL-45MS EDI88130LPS45NB L7C108YMB25 NS41024L45S/883 MT5C1008SOJ-45L883C P4C1024L-45CJMB 5962-8959818MZA 3/ 3/ 3/ 0EU86 54230 3/ 3/ 3/ 3DTT2 0C7V7 S128K8TL-45ME MSM8128KLMC-45 PDM41024L45CB MT5C1008C-45L883C EDI88130LPS45TB CY7C1009L-45DMB L7C108CMB25 NS41024L45D/883 P4C1024L-45C4MB QP7C1009BL-45DMB 5962-8959818MZC F7400 MMC965608V-45MQ 5962-8959818VZC F7400 SMC965608EV-45SV 5962-8959818MUA 3/ 0EU86 54230 3/ S128K8TL-45ML MT5C1008EC-45L883C EDI88130LPS45LB NS41024L45Y/883 5962-8959818MTA 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8TL-45MF MSM8128GLMC-45 MT5C1008F-45L883C EDI88130LPS45FB L7C108MMB25 NS41024L45F/883 P4C1024L-45FSMB QP7C1009BL-45FMB MSM8128JLMC-55 See footnotes at end of table. 16 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959818MTC F7400 MMDJ65608EV-45MQ 5962-8959818VTC F7400 SMDJ65608EV-45SV 5962-8959818MNA 3/ 3/ 5962-8959818MMA 3/ 3/ 0EU86 3/ 54230 3DTT2 0C7V7 5962-8959818M9A 3/ 5962-8959818M7A 0EU86 MT5C1008DCJ-45L883C 5962-8959819MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-35MC MSM8128SLMC-35 PDM41024L35CB MT5C1008CW-35L883C EDI88130LPS35CB P4C1024L-35C6MB 5962-8959819MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8TL-35MS EDI88130LPS35NB L7C108YMB25 NS41024L35S/883 MT5C1008SOJ-35L883C P4C1024L-35CJMB 5962-8959819MZA 3/ 3/ 3/ 0EU86 54230 3/ 3/ 3/ 3/ 3DTT2 0C7V7 S128K8TL-35ME MSM8128KLMC-35 PDM41024L35CB MT5C1008C-35L883C EDI88130LPS35TB CY7C1009L-35DMB MMC965608V-35/883 L7C108CMB25 NS41024L35D/883 P4C1024L-35C4MB QP7C1009BL-35DMB 3/ SMC965608EV-35SV 5962-8959819VZC MSM8128WLMC-45 L7C108KMB25 PDM41024L45L32B NS41024L45E/883 MT5C1008ECA-45L883C CY7C1009L-45LMB EDI88130LPS45L32B P4C1024L-45LMB QP7C1009BL-45LMB MSM8128JLMC-45 See footnotes at end of table. 17 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959819MUA 3/ 0EU86 54230 3/ S128K8TL-35ML MT5C1008EC-35L883C EDI88130LPS35LB NS41024L35Y/883 5962-8959819MTA 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8TL-35MF MSM8128GLMC-35 MT5C1008F-35L883C EDI88130LPS35FB L7C108MMB25 NS41024L35F/883 P4C1024L-35FSMB QP7C1009BL-35FMB 5962-8959819MTC 3/ MMDJ65608EV-35MQ 5962-8959819VTC 3/ SMDJ65608EV-35SV 5962-8959819MNA 3/ 3/ MSM8128WLMC-35 L7C108KMB25 5962-8959819MMA 3/ 3/ 0EU86 3/ 54230 3DTT2 0C7V7 5962-8959819M9A 3/ MSM8128JLMC-35 5962-8959819M7A 0EU86 MT5C1008DCJ-35L 5962-8959820MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-25MC MSM8128SLMC-25 PDM41024L25CB MT5C1008CW-25L883C EDI88130LPS25CB P4C1024L-25C6MB 5962-8959820MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8TL-25MS EDI88130LPS25NB L7C108YMB25 NS41024L25S/883 MT5C1008SOJ-25L883C P4C1024L-25CJMB PDM41024L35L32B NS41024L35E/883 MT5C1008ECA-35L883C CY7C1009L-35LMB EDI88130LPS35L32B P4C1024L-35LMB QP7C1009BL-35LMB See footnotes at end of table. 18 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959820MZA 3/ 3/ 3/ 0EU86 54230 3/ 3/ 3/ 3/ 3/ 3DTT2 0C7V7 S128K8TL-25ME MSM8128KLMC-25 PDM41024L25CB MT5C1008C-25L883C EDI88130LPS25TB CY7C1009L-25DMB MMC965608V25/883 L7C108CMB25 SMJ5C1008L-25JDCM NS41024L25D/883 P4C1024L-25C4MB QP7C1009BL-25DMB 5962-8959820MUA 3/ 0EU86 54230 3/ S128K8TL-25ML MT5C1008EC-25L883C EDI88130LPS25LB NS41024L25Y/883 5962-8959820MTA 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8TL-25MF MSM8128GLMC-25 MT5C1008F-25L883C EDI88130LPS25FB L7C108MMB25 NS41024L25F/883 P4C1024L-25FSMB QP7C1009BL-25FMB 5962-8959820MTC 3/ MMDJ65608EV25/883 5962-8959820MNA 3/ 3/ MSM8128WLMC-25 L7C108KMB25 5962-8959820MMA 3/ 3/ 0EU86 3/ 54230 3DTT2 0C7V7 5962-8959820M9A 3/ 5962-8959820M7A 0EU86 MT5C1008DCJ-25L883C 5962-8959821MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8TL-20MC MSM8128SLMC-20 PDM41024L20CB MT5C1008CW-20L883C EDI88130LPS20CB P4C1024L-20C6MB PDM41024L25L32B NS41024L25E/883 MT5C1008ECA-25L883C CY7C1009L-25LMB EDI88130LPS25L32B P4C1024L-25LMB QP7C1009BL-25LMB MSM8128JLMC-25 See footnotes at end of table. 19 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959821MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8TL-20MS EDI88130LPS20NB NS41024L20S/883 MT5C1008SOJ-20L883C P4C1024L-20CJMB 5962-8959821MZA 3/ 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8TL-20ME MSM8128KLMC-20 PDM41024L20CB MT5C1008C-20L883C EDI88130LPS20TB CY7C1009L-20DMB NS41024L20D/883 P4C1024L-20C4MB QP7C1009BL-20DMB 5962-8959821MUA 3/ 0EU86 54230 3/ S128K8TL-20ML MT5C1008EC-20L883C EDI88130LPS20LB NS41024L20Y/883 5962-8959821MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 0C7V7 5962-8959821MNA 3/ 5962-8959821MMA 5962-8959821M9A 5962-8959821M7A 3/ 3/ 0EU86 3/ 54230 3DTT2 0C7V7 3/ 0EU86 S128K8TL-20MF MSM8128GLMC-20 MT5C1008F-20L883C EDI88130LPS20FB NS41024L20F/883 P4C1024L-20FSMB QP7C1009BL-20FMB MSM8128WLMC-20 PDM41024L20L32B NS41024L20E/883 MT5C1008ECA-20L883C CY7C1009L-20LMB EDI88130LPS20L32B P4C1024L-20LMB QP7C1009BL-20LMB MSM8128JLMC-20 MT5C1008DCJ-20L883C 5962-8959822MXA 3/ 3/ 0EU86 54230 S128K8-120MC MSM8128SXMC-12 MT5C1009CW-120883C EDI88128CS120CB 5962-8959822MYA 3/ 54230 3/ 0EU86 S128K8-120MS EDI88128CS120NB L7C108YMB25 MT5C1009SOJ-120883C See footnotes at end of table. 20 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959822MZA 3/ 3/ 3/ 0EU86 54230 S128K8-120ME MSM8128KXMC-12 L7C108CMB25 MT5C1009C-120883C EDI88128CS120TB 5962-8959822MUA 3/ 0EU86 54230 S128K8-120ML MT5C1009EC-120883C EDI88128CS120LB 5962-8959822MTA 3/ 3/ 0EU86 54230 3/ S128K8-120MF MSM8128GXMC-12 MT5C1009F-120883C EDI88128CS120FB L7C108MMB25 5962-8959822MNA 3/ 3/ MSM8128WXMC-12 L7C108KMB25 5962-8959822MNC 3/ L7C108KMB25 5962-8959822MMA 0EU86 5962-8959822M9A 3/ MT5C1009ECA-120883C MSM8128JXMC-12 5962-8959822M8A 54230 EDI88128CS120ZB 5962-8959822M7A 0EU86 MT5C1009DCJ-120883C 5962-8959823MXA 3/ 3/ 0EU86 54230 S128K8-100MC MSM8128SXMC-10 MT5C1009CW-100883C EDI88128CS100CB 5962-8959823MYA 3/ 54230 3/ 0EU86 S128K8-100MS EDI88128CS100NB L7C108YMB25 MT5C1009SOJ-100883C 5962-8959823MZA 3/ 3/ 3/ 0EU86 54230 S128K8-100ME MSM8128KXMC-10 L7C108CMB25 MT5C1009C-100883C EDI88128CS100TB 5962-8959823MUA 3/ 0EU86 54230 S128K8-100ML MT5C1009EC-100883C EDI88128CS100LB See footnotes at end of table. 21 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959823MTA 3/ 3/ 0EU86 54230 3/ S128K8-100MF MSM8128GXMC-10 MT5C1009F-100883C EDI88128CS100FB L7C108MMB25 5962-8959823MNA 3/ 3/ MSM8128WXMC-10 L7C108KMB25 5962-8959823MNC 3/ L7C108KMB25 5962-8959823MMA 0EU86 5962-8959823M9A 3/ MT5C1009ECA-100L883C MSM8128JXMC-10 5962-8959823M8A 54230 EDI88128CS100ZB 5962-8959823M7A 0EU86 MT5C1009DCJ-100883C 5962-8959824MXA 3/ 3/ 0EU86 54230 S128K8-85MC MSM8128SXMC-85 MT5C1009CW-85883C EDI88128CS85CB 5962-8959824MYA 3/ 54230 3/ 0EU86 S128K8-85MS EDI88128CS85NB L7C108YMB25 MT5C1009SOJ-85883C 5962-8959824MZA 3/ 3/ 3/ 0EU86 54230 S128K8-85ME MSM8128KXMC-85 L7C108CMB25 MT5C1009C-85883C EDI88128CS85TB 5962-8959824MUA 3/ 0EU86 54230 S128K8-85ML MT5C1009EC-85883C EDI88128CS85LB 5962-8959824MTA 3/ 3/ 0EU86 54230 3/ S128K8-85MF MSM8128GXMC-85 MT5C1009F-85883C EDI88128CS85FB L7C108MMB25 5962-8959824MNA 3/ 3/ MSM8128WXMC-85 L7C108KMB25 5962-8959824MNC 3/ L7C108KMB25 5962-8959824MMA 0EU86 MT5C1009ECA-85883C See footnotes at end of table. 22 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959824M9A 3/ Vendor Similar PIN 2/ MSM8128JXMC-85 5962-8959824M8A 54230 EDI88128CS85ZB 5962-8959824M7A 0EU86 MT5C1009DCJ-85883C 5962-8959825MXA 3/ 3/ 0EU86 54230 S128K8-70MC MSM8128SXMC-70 MT5C1009CW-70883C EDI88128CS70CB 5962-8959825MYA 3/ 54230 3/ 0EU86 S128K8-70MS EDI88128CS70NB L7C108YMB25 MT5C1009SOJ-70883C 5962-8959825MZA 3/ 3/ 3/ 0EU86 54230 S128K8-70ME MSM8128KXMC-70 L7C108CMB25 MT5C1009C-70883C EDI88128CS70TB 5962-8959825MUA 3/ 0EU86 54230 S128K8-70ML MT5C1009EC-70883C EDI88128CS70LB 5962-8959825MTA 3/ 3/ 0EU86 54230 3/ S128K8-70MF MSM8128GXMC-70 MT5C1009F-70883C EDI88128CS70FB L7C108MMB25 5962-8959825MNA 3/ 3/ MSM8128WXMC-70 L7C108KMB25 5962-8959825MNC 3/ L7C108KMB25 5962-8959825MMA 0EU86 5962-8959825M9A 3/ MT5C1009ECA-70883C MSM8128JXMC-70 5962-8959825M8A 54230 EDI88128CS70ZB 5962-8959825M7A 0EU86 MT5C1009DCJ-70883C See footnotes at end of table. 23 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959826MXA 3/ 3/ 3/ 0EU86 54230 S128K8-55MC MSM8128SXMC-55 PDM41024S55CE0B MT5C1009CW-55883C EDI88128CS55CB 5962-8959826MYA 3/ 54230 3/ 0EU86 S128K8-55MS EDI88128CS55NB L7C108YMB25 MT5C1009SOJ-55883C 5962-8959826MZA 3/ 3/ 3/ 0EU86 54230 S128K8-55ME MSM8128KXMC-55 L7C108CMB25 MT5C1009C-55883C EDI88128CS55TB 5962-8959826MUA 3/ 0EU86 54230 S128K8-55ML MT5C1009EC-55883C EDI88128CS55LB 5962-8959826MTA 3/ 3/ 0EU86 54230 3/ S128K8-55MF MSM8128GXMC-55 MT5C1009F-55883C EDI88128CS55FB L7C108MMB25 5962-8959826MNA 3/ 3/ MSM8128WXMC-55 L7C108KMB25 5962-8959826MNC 3/ L7C108KMB25 5962-8959826MMA 0EU86 5962-8959826M9A 3/ MT5C1009ECA-55883C MSM8128JXMC-55 5962-8959826M8A 54230 EDI88128CS55ZB 5962-8959826M7A 0EU86 MT5C1009DCJ-55883C 5962-8959827MXA 3/ 3/ 3/ 0EU86 54230 S128K8-45MC MSM8128SXMC-45 PDM41024S45CE0B MT5C1009CW-45883C EDI88128CS45CB 5962-8959827MYA 3/ 54230 3/ 0EU86 S128K8-45MS EDI88128CS45NB L7C108YMB25 MT5C1009SOJ-45883C See footnotes at end of table. 24 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959827MZA 3/ 3/ 3/ 0EU86 54230 S128K8-45ME MSM8128KXMC-45 L7C108CMB25 MT5C1009C-45883C EDI88128CS45TB 5962-8959827MUA 3/ 0EU86 54230 S128K8-45ML MT5C1009EC-45883C EDI88128CS45LB 5962-8959827MTA 3/ 3/ 0EU86 54230 3/ S128K8-45MF MSM8128GXMC-45 MT5C1009F-45883C EDI88128CS45FB L7C108MMB25 5962-8959827MNA 3/ 3/ MSM8128WXMC-45 L7C108KMB25 5962-8959827MNC 3/ L7C108KMB25 5962-8959827MMA 0EU86 5962-8959827M9A 3/ MT5C1009ECA-45883C MSM8128JXMC-45 5962-8959827M8A 54230 EDI88128CS45ZB 5962-8959827M7A 0EU86 MT5C1009DCJ-45883C 5962-8959828MXA 3/ 3/ 3/ 0EU86 54230 S128K8-35MC MSM8128SXMC-35 PDM41024S35CE0B MT5C1009CW-35883C EDI88128CS35CB 5962-8959828MYA 3/ 54230 3/ 0EU86 S128K8-35MS EDI88128CS35NB L7C108YMB25 MT5C1009SOJ-35883C 5962-8959828MZA 3/ 3/ 3/ 0EU86 54230 S128K8-35ME MSM8128KXMC-35 L7C108CMB25 MT5C1009C-35883C EDI88128CS35TB 5962-8959828MUA 3/ 0EU86 54230 S128K8-35ML MT5C1009EC-35883C EDI88128CS35LB See footnotes at end of table. 25 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959828MTA 3/ 3/ 0EU86 54230 3/ S128K8-35MF MSM8128GXMC-35 MT5C1009F-35883C EDI88128CS35FB L7C108MMB25 5962-8959828MNA 3/ 3/ MSM8128WXMC-35 L7C108KMB25 5962-8959828MNC 3/ L7C108KMB25 5962-8959828MMA 0EU86 5962-8959828M9A 3/ MT5C1009ECA-35883C MSM8128JXMC-35 5962-8959828M8A 54230 EDI88128CS35ZB 5962-8959828M7A 0EU86 MT5C1009DCJ-35883C 5962-8959829MXA 3/ 3/ 3/ 0EU86 54230 S128K8-25MC MSM8128SXMC-25 PDM41024S25CE0B MT5C1009CW-25883C EDI88128CS25CB 5962-8959829MYA 3/ 54230 3/ 0EU86 S128K8-25MS EDI88128CS25NB L7C108YMB25 MT5C1009SOJ-25883C 5962-8959829MZA 3/ 3/ 3/ 0EU86 54230 S128K8-25ME MSM8128KXMC-25 L7C108CMB25 MT5C1009C-25883C EDI88128CS25TB 5962-8959829MUA 3/ 0EU86 54230 S128K8-25ML MT5C1009EC-25883C EDI88128CS25LB 5962-8959829MTA 3/ 3/ 0EU86 54230 3/ S128K8-25MF MSM8128GXMC-25 MT5C1009F-25883C EDI88128CS25FB L7C108MMB25 5962-8959829MNA 3/ 3/ MSM8128WXMC-25 L7C108KMB25 5962-8959829MNC 3/ L7C108KMB25 See footnotes at end of table. 26 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959829MMA 0EU86 MT5C1009ECA-25883C 5962-8959829M9A 3/ MSM8128JXMC-25 5962-8959829M8A 54230 EDI88128CS25ZB 5962-8959829M7A 0EU86 MT5C1009DCJ-25883C 5962-8959830MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8-120MC MSM8128SMC-12 MT5C1008CW-120883C EDI88130CS120CB P4C1024-120C6MB 5962-8959830MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8-120MS EDI88130CS120NB L7C109YMB25 MT5C1008SOJ-120883C P4C1024-120CJMB 5962-8959830MZA 3/ 3/ 3/ 0EU86 54230 65786 3/ 3DTT2 S128K8-120ME MSM8128KMC-12 L7C109CMB25 MT5C1008C-120883C EDI88130CS120TB CY7C1009-120DMB MMC965608L120/883 P4C1024-120C4MB 5962-8959830MUA 3/ 0EU86 54230 S128K8-120ML MT5C1008EC-120883C EDI88130CS120LB 5962-8959830MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-120MF MSM8128GMC-12 MT5C1008F-120883C EDI88130CS120FB L7C109MMB25 P4C1024-120FSMB 5962-8959830MTC 3/ MMDJ65608L120/883 5962-8959830MNA 3/ 3/ MSM8128WMC-12 L7C109KMB25 5962-8959830MNC 3/ L7C109KMB25 5962-8959830MMA 0EU86 65786 54230 3DTT2 5962-8959830M9A 3/ 5962-8959830M7A 0EU86 MT5C1008ECA-120883C CY7C1009-120LMB EDI88130CS120L32B P4C1024-120LMB MSM8128JMC-12 MT5C1008DCJ-120883C See footnotes at end of table. 27 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959831MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8-100MC MSM8128SMC-10 MT5C1008CW-100883C EDI88130CS100CB P4C1024-100C6MB 5962-8959831MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8-100MS EDI88130CS100NB L7C109YMB25 MT5C1008SOJ-100883C P4C1024-100CJMB 5962-8959831MZA 3/ 3/ 3/ 0EU86 54230 65786 3/ 3DTT2 S128K8-100ME MSM8128KMC-10 L7C109CMB25 MT5C1008C-100883C EDI88130CS100TB CY7C1009-100DMB MMC965608L100/883 P4C1024-100C4MB 5962-8959831MUA 3/ 0EU86 54230 S128K8-100ML MT5C1008EC-100883C EDI88130CS100LB 5962-8959831MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-100MF MSM8128GMC-10 MT5C1008F-100883C EDI88130CS100FB L7C109MMB25 P4C1024-100FSMB 5962-8959831MTC 3/ MMDJ65608L100/883 5962-8959831MNA 3/ 3/ MSM8128WMC-10 L7C109KMB25 5962-8959831MNC 3/ L7C109KMB25 5962-8959831MMA 0EU86 65786 54230 3DTT2 5962-8959831M9A 3/ 5962-8959831M7A 0EU86 MT5C1008ECA-100883C CY7C1009-100LMB EDI88130CS100L32B P4C1024-100LMB MSM8128JMC-10 MT5C1008DCJ-100883C See footnotes at end of table. 28 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959832MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8-85MC MSM8128SMC-85 MT5C1008CW-85883C EDI88130CS85CB P4C1024-85C6MB 5962-8959832MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8-85MS EDI88130CS85NB L7C109YMB25 MT5C1008SOJ-85883C P4C1024-85CJMB 5962-8959832MZA 3/ 3/ 3/ 0EU86 54230 65786 3/ 3DTT2 S128K8-85ME MSM8128KMC-85 L7C109CMB25 MT5C1008C-85883C EDI88130CS85TB CY7C1009-85DMB MMC965608L85/883 P4C1024-85C4MB 5962-8959832MUA 3/ 0EU86 54230 S128K8-85ML MT5C1008EC-85883C EDI88130CS85LB 5962-8959832MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-85MF MSM8128GMC-85 MT5C1008F-85883C EDI88130CS85FB L7C109MMB25 P4C1024-85FSMB 5962-8959832MTC 3/ MMDJ65608L85/883 5962-8959832MNA 3/ 3/ MSM8128WMC-85 L7C109KMB25 5962-8959832MNC 3/ L7C109KMB25 5962-8959832MMA 0EU86 65786 54230 3DTT2 5962-8959832M9A 3/ 5962-8959832M7A 0EU86 MT5C1008ECA-85883C CY7C1009-85LMB EDI88130CS85L32B P4C1024-85LMB MSM8128JMC-85 MT5C1008DCJ-85883C See footnotes at end of table. 29 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959833MXA 3/ 3/ 0EU86 54230 3DTT2 S128K8-70MC MSM8128SMC-70 MT5C1008CW-70883C EDI88130CS70CB P4C1024-70C6MB 5962-8959833MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8-70MS EDI88130CS70NB L7C109YMB25 MT5C1008SOJ-70883C P4C1024-70CJMB 5962-8959833MZA 3/ 3/ 3/ 0EU86 54230 65786 3/ 3DTT2 S128K8-70ME MSM8128KMC-70 L7C109CMB25 MT5C1008C-70883C EDI88130CS70TB CY7C1009-70DMB MMC965608L70/883 P4C1024-70C4MB 5962-8959833MUA 3/ 0EU86 54230 S128K8-70ML MT5C1008EC-70883C EDI88130CS70LB 5962-8959833MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-70MF MSM8128GMC-70 MT5C1008F-70883C EDI88130CS70FB L7C109MMB25 P4C1024-70FSMB 5962-8959833MTC 3/ MMDJ65608L70/883 5962-8959833MNA 3/ 3/ MSM8128WMC-70 L7C109KMB25 5962-8959833MNC 3/ L7C109KMB25 5962-8959833MMA 0EU86 65786 54230 3DTT2 5962-8959833M9A 3/ 5962-8959833M7A 0EU86 MT5C1008DCJ-70883C 5962-8959834MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8-55MC MSM8128SMC-55 PDM41024S55CB MT5C1008CW-55883C EDI88130CS55CB P4C1024-55C6MB MT5C1008ECA-70883C CY7C1009-70LMB EDI88130CS70L32B P4C1024-70LMB MSM8128JMC-70 See footnotes at end of table. 30 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959834MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8-55MS EDI88130CS55NB L7C109YMB25 NS41024S55S/883 MT5C1008SOJ-55883C P4C1024-55CJMB 5962-8959834MZA 3/ 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3/ 65786 3DTT2 0C7V7 S128K8-55ME MSM8128KMC-55 PDM41024S55TCB MT5C1008C-55883C CY7C109A-55DMB EDI88130CS55TB L7C109CMB25 MMC965608L55/883 NS41024S55D/883 CY7C1009-55DMB P4C1024-55C4MB QP7C1009B-55DMB 5962-8959834MUA 3/ 0EU86 3/ 54230 3/ S128K8-55ML MT5C1008EC-55883C CY7C109A-55LMB EDI88130CS55LB NS41024S55Y/883 5962-8959834MTA 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3DTT2 0C7V7 S128K8-55MF MSM8128GMC-55 MT5C1008F-55883C CY7C109A-55FMB EDI88130CS55FB L7C109MMB25 NS41024S55F/883 P4C1024-55FSMB QP7C1009B-55FMB 5962-8959834MTC 3/ MMDJ65608L55/883 5962-8959834MNA 3/ 3/ MSM8128WMC-55 L7C109KMB25 5962-8959834MNC 3/ L7C109KMB25 5962-8959834MMA 3/ 65786 3/ 0EU86 54230 3DTT2 0C7V7 5962-8959834M9A 3/ 5962-8959834M7A 0EU86 PDM41024S55L32B CY7C1009-55LMB NS41024S55E/883 MT5C1008ECA-55883C EDI88130CS55L32B P4C1024-55LMB QP7C1009B-55LMB MSM8128JMC-55 MT5C1008DCJ-55883C See footnotes at end of table. 31 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959835MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8-45MC MSM8128SMC-45 PDM41024S45CB MT5C1008CW-45883C EDI88130CS45CB P4C1024-45C6MB 5962-8959835MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8-45MS EDI88130CS45NB L7C109YMB25 NS41024S45S/883 MT5C1008SOJ-45883C P4C1024-45CJMB 5962-8959835MZA 3/ 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3/ 3/ 3DTT2 0C7V7 S128K8-45ME MSM8128KMC-45 PDM41024S45TCB MT5C1008C-45883C CY7C109A-45DMB EDI88130CS45TB L7C109CMB25 MMC965608EV45/883 NS41024S45D/883 CY7C1009-45DMB P4C1024-45C4MB QP7C1009B-45DMB 5962-8959835MZC 3/ MMC965608EV-45MQ 5962-8959835VZC 3/ SMC965608EV-45SV 5962-8959835MUA 3/ 0EU86 3/ 54230 3/ S128K8-45ML MT5C1008EC-45883C CY7C109A-45LMB EDI88130CS45LB NS41024S45Y/883 5962-8959835MTA 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3DTT2 0C7V7 S128K8-45MF MSM8128GMC-45 MT5C1008F-45883C CY7C109A-45FMB EDI88130CS45FB L7C109MMB25 NS41024S45F/883 P4C1024-45FSMB QP7C1009B-45FMB 5962-8959835MTC 3/ MMDJ65608EV-45MQ 5962-8959835VTC 3/ SMDJ65608EV-45SV 5962-8959835MNA 3/ 3/ MSM8128WMC-45 L7C109KMB25 See footnotes at end of table. 32 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Vendor Similar PIN 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8959835MNC 3/ 5962-8959835MMA 3/ 65786 3/ 0EU86 54230 3DTT2 0C7V7 5962-8959835M9A 3/ 5962-8959835M7A 0EU86 MT5C1008DCJ-45883C 5962-8959836MXA 3/ 3/ 3/ 0EU86 54230 3DTT2 S128K8-35MC MSM8128SMC-35 PDM41024S35CB MT5C1008CW-35883C EDI88130CS35CB P4C1024-35C6MB 5962-8959836MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8-35MS EDI88130CS35NB L7C109YMB25 NS41024S35S/883 MT5C1008SOJ-35883C P4C1024-35CJMB 5962-8959836MZA 3/ 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3/ 3/ 3DTT2 0C7V7 S128K8-35ME MSM8128KMC-35 PDM41024S35TCB MT5C1008C-35883C CY7C109A-35DMB EDI88130CS35TB L7C109CMB25 MMC965608EV35MQ NS41024S35D/883 CY7C1009-35DMB P4C1024-35C4MB QP7C1009B-35DMB 5962-8959836VZA 3/ SMC965608EV-35SV 5962-8959836MUA 3/ 0EU86 3/ 54230 3/ S128K8-35ML MT5C1008EC-35883C CY7C109A-35LMB EDI88130CS35LB NS41024S35Y/883 L7C109KMB25 PDM41024S45L32B CY7C1009-45LMB NS41024S45E/883 MT5C1008ECA-45883C EDI88130CS45L32B P4C1024-45LMB QP7C1009B-45LMB MSM8128JMC-45 See footnotes at end of table. 33 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959836MTA 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3DTT2 0C7V7 S128K8-35MF MSM8128GMC-35 MT5C1008F-35883C CY7C109A-35FMB EDI88130CS35FB L7C109MMB25 NS41024S35F/883 P4C1024-35FSMB QP7C1009B-35FMB 5962-8959836MTC 3/ MMDJ65608EV-35MQ 5962-8959836VTC 3/ SMDJ65608EV-35SV 5962-8959836MMA 3/ 3/ 3/ 0EU86 54230 3DTT2 0C7V7 PDM41024S35L32B CY7C1009-35LMB NS41024S35E/883 MT5C1008ECA-35883C EDI88130CS35L32B P4C1024-35LMB QP7C1009B-35LMB 5962-8959836M7A 0EU86 MT5C1008DCJ-35883C 5962-8959836MNA 3/ L7C109KMB25 5962-8959836MNC 3/ L7C109KMB25 5962-8959837MXA 3/ 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-25MC MSM8128SMC-25 PDM41024S25CB MT5C1008CW-25883C EDI88130CS25CB SMJ5C1008-25JDDM P4C1024-25C6MB 5962-8959837MYA 3/ 54230 3/ 3/ 0EU86 3DTT2 S128K8-25MS EDI88130CS25NB L7C109YMB25 NS41024S25S/883 MT5C1008SOJ-25883C P4C1024-25CJMB 5962-8959837MZA 3/ 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3/ 3/ 3DTT2 0C7V7 S128K8-25ME MSM8128KMC-25 SMJ5C1008-25JDCM MT5C1008C-25883C CY7C109A-25DMB EDI88130CS25TB L7C109CMB25 MMC965608EV25MQ NS41024S25D/883 CY7C1009-25DMB P4C1024-25C4MB QP7C1009B-25DMB See footnotes at end of table. 34 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959837MUA 3/ 0EU86 3/ 54230 3/ 3/ S128K8-25ML MT5C1008EC-25883C CY7C109A-25LMB EDI88130CS25LB NS41024S25Y/883 SMJ5C1008-25HMM 5962-8959837MTA 3/ 3/ 0EU86 3/ 54230 3/ 3/ 3DTT2 0C7V7 S128K8-25MF MSM8128GMC-25 MT5C1008F-25883C CY7C109A-25FMB EDI88130CS25FB L7C109MMB25 NS41024S25F/883 P4C1024-25FSMB QP7C1009B-25FMB 5962-8959837MTC 3/ MMDJ65608L-25MQ 5962-8959837MNA 3/ 3/ MSM8128WMC-25 L7C109KMB25 5962-8959837MNC 3/ L7C109KMB25 5962-8959837MMA 3/ 3/ 3/ 0EU86 54230 3DTT2 0C7V7 5962-8959837M9A 3/ PDM41024S25L32B CY7C1009-25LMB NS41024S25E/883 MT5C1008ECA-25883C EDI88130CS25L32B P4C1024-25LMB QP7C1009B-25LMB MSM8128JMC-25 5962-8959837M7A 0EU86 5962-8959838MXA 3/ 3/ 0EU86 54230 3/ 3DTT2 S128K8-20MC MSM8128SMC-20 MT5C1008CW-20883C EDI88130CS20CB SMJ5C1008-20JDDM P4C1024-20C6MB MT5C1008DCJ-25883C 5962-8959838MYA 3/ 54230 3/ 0EU86 3DTT2 S128K8-20MS EDI88130CS20NB NS41024S20S/883 MT5C1008SOJ-20883C P4C1024-20CJMB 5962-8959838MZA 3/ 3/ 3/ 0EU86 54230 3/ 3/ 3DTT2 0C7V7 S128K8-20ME MSM8128KMC-20 SMJ5C1008-20JDCM MT5C1008C-20883C EDI88130CS20TB NS41024S20D/883 CY7C1009-20DMB P4C1024-20C4MB QP7C1009B-20DMB See footnotes at end of table. 35 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959838MUA 3/ 0EU86 54230 3/ 3/ S128K8-20ML MT5C1008EC-20883C EDI88130CS20LB NS41024S20Y/883 SMJ5C1008-20HMM 5962-8959838MTA 3/ 3/ 0EU86 54230 3/ 3DTT2 0C7V7 S128K8-20MF MSM8128GMC-20 MT5C1008F-20883C EDI88130CS20FB NS41024S20F/883 P4C1024-20FSMB QP7C1009B-20FMB 5962-8959838MNA 3/ 5962-8959838MMA 3/ 3/ 3/ 0EU86 54230 3DTT2 0C7V7 5962-8959838M9A 3/ 5962-8959838M7A 0EU86 MT5C1008DCJ-20883C 5962-8959839MXA 0EU86 54230 MT5C1009CW-20883C EDI88128CS20CB 5962-8959839MYA 0EU86 54230 MT5C1009SOJ-20883C EDI88128CS20NB 5962-8959839MZA 0EU86 54230 MT5C1009C-20883C EDI88128CS20TB 5962-8959839MUA 0EU86 54230 MT5C1009EC-20883C EDI88128CS20LB 5962-8959839MTA 0EU86 54230 MT5C1009F-20883C EDI88128CS20FB 5962-8959839MMA 0EU86 MT5C1009ECA-20883C 5962-8959839M8A 54230 EDI88128CS20ZB 5962-8959839M7A 0EU86 MT5C1009DCJ-20883C 5962-8959840MXA 0EU86 54230 MT5C1009CW-20L883C EDI88128LPS20CB 5962-8959840MYA 0EU86 54230 MT5C1009SOJ-20L883C EDI88128LPS20NB MSM8128WMC-20 PDM41024S20L32B CY7C1009-20LMB NS41024S20E/883 MT5C1008ECA-20883C EDI88130CS20L32B P4C1024-20LMB QP7C1009B-20LMB MSM8128JMC-20 See footnotes at end of table. 36 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959840MZA 0EU86 54230 MT5C1009C-20L883C EDI88128LPS20TB 5962-8959840MUA 0EU86 54230 MT5C1009EC-20L883C EDI88128LPS20LB 5962-8959840MTA 0EU86 54230 MT5C1009F-20L883C EDI88128LPS20FB 5962-8959840MMA 0EU86 MT5C1009ECA-20L883C 5962-8959840M8A 54230 EDI88128LPS20ZB 5962-8959840M7A 0EU86 MT5C1009DCJ-20L883C 5962-8959841MXA 0EU86 MT5C1008CW-15 5962-8959841MYA 0EU86 MT5C1008SOJ-15 5962-8959841MZA 3/ 54230 0EU86 0C7V7 CY7C1009-15DMB EDI88130CS15TB MT5C1008C-15 QP7C1009B-15DMB 5962-8959841MMA 3/ 54230 0EU86 0C7V7 CY7C1009-15LMB EDI88130CS15L32B MT5C1008ECA-15 QP7C1009B-15LMB 5962-8959841MTA 0EU86 0C7V7 MT5C1008F-15 QP7C1009B-15FMB 5962-8959841MUA 0EU86 MT5C1008EC-15 5962-8959841M7A 0EU86 MT5C1008DCJ-15 5962-8959842MXA 54230 EDI88128LP70CB 5962-8959842MYA 54230 EDI88128LP70NB 5962-8959843MXA 54230 EDI88128C70CB 5962-8959843MYA 54230 EDI88128C70NB 5962-8959844MXA 0EU86 MT5C1009CW-15 5962-8959844MYA 0EU86 MT5C1009SOJ-15 5962-8959844MZA 54230 0EU86 EDI88128CS15TB MT5C1009C-15 5962-8959844MMA 0EU86 MT5C1009ECA-15 5962-8959844MTA 0EU86 MT5C1009F-15 See footnotes at end of table. 37 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. 1/ 2/ 3/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-8959844MUA 0EU86 MT5C1009EC-15 5962-8959844M7A 0EU86 MT5C1009DCJ-15 5962-8959845MZA 54230 EDI88130CS12TB 5962-8959845MMA 54230 EDI88130CS12L32B 5962-8959846MZA 54230 EDI88128CS12TB 5962-8959847QZC F7400 MMC965608EV-30MQ 5962-8959847VZC F7400 SMC965608EV-30SV 5962-8959847QTC F7400 MMDJ65608EV-30MQ 5962-8959847VTC F7400 SMDJ65608EV-30SV 5962-8959847Q9A F7400 MMD-65608EV-30MQ 5962-8959847V9A F7400 SMD-65608EV-30SV 5962-8959848MTA 54230 EDI88128LPS15FB The lead finish shown for each PIN, representing a hermetic package, is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Not available from an approved source of supply. Vendor CAGE Number Vendor name and address 0EU86 Austin Semiconductor 8701 Cross Park Drive Austin, TX 78754 65786 Cypress Semiconductor 3901 N. First Street San Jose, CA 95134-1599 54230 White Electronic Designs Corp. 3601 East University Drive Phoenix, AZ 85034 F7400 Atmel Nantes, part of Atmel Wireless and Microcontrollers La Chantrerie BP 70602 44306 NANTES CEDEX 3 France MORE VENDORS CONTINUED ON NEXT PAGE 38 of 39 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Vendor CAGE Number Vendor name and address 0C7V7 QP Semiconductor 2945 Oakmead Village Court Santa Clara, CA 95051 3DTT2 Pyramid Semiconductor Corporation 1340 Bordeaux Drive Sunnyvale, CA 94089 The following table lists the SMD part numbers for die. 1/ Standard microcircuit drawing PIN Vendor CAGE number Vendor Similar PIN 1/ 5962-8959847Q6A F7400 MM0-65608EV-30MQ 5962-8959847V6A F7400 SM0-65608EV-30SV Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. F7400 Atmel Nantes, part of Atmel Wireless and Microcontrollers La Chantrerie BP 70602 44306 NANTES CEDEX 3 France The information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in this information bulletin. 39 of 39