REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
H Add device type 41. Make corrections to case outline N, dimension b.
Add vendor CAGE 65786 as source of supply for device type 41.
Update boilerplate. Editorial changes throughout.
97-03-26 Raymond Monnin
J Add device types 42, 43, 44, 45, and 46. Editorial changes to pages
1, 3, 7-15. Update boilerplate. ksr 98-03-03 Raymond Monnin
K Added provisions to accommodate radiation-hardened devices.
Added device type 47 to drawing. glg 00-03-01 Raymond Monnin
L Corrected case outline 8 Figure 1 to show correct numbering of
terminals. Corrected Figure 2 Terminal connections. Corrected the
case outline Y Figure 1 to show the proper distance of E and E1.
Added note to Case outline Y Figure 1, to allow for bottom brazed
package as an alternative style to the side brazed package . Update
boilerplate. Editorial changes throughout. ksr
00-12-08 Raymond Monnin
M Changed the minimum value for the Q dimension on package T from
0.026 to 0.020 and removed footnote 12. Editorial changes
throughout.. ksr
02-12-19 Raymond Monnin
N Added device type 48 to drawing. ksr 03-08-12 Raymond Monnin
P Corrected typo on Figure 4 (Read Cycle). ksr 05-08-16 Raymond Monnin
R Vendor requested change in capacitance in Table I for devices 39 and
40 from 5 pF to 8 pF. ksr 06-02-13 Raymond Monnin
REV R R R R R R R R R R R R R R R R R R
SHEET 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
52
REV R R R R R R R R R R R R R R R R R R R R
SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
32 33
34
REV STATUS
REV R R R R R R R R R R R R R R
OF SHEETS
SHEET 1 2 3 4 5 6 7 8 9 10 11
12 13
14
PMIC N/A
PREPARED BY
Kenneth S. Rice
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Raymond Monnin
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
89-04-21
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 128K X 8 STATIC RANDOM
ACCESS MEMORY (SRAM) LOW POWER,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
R SIZE
A CAGE CODE
67268 5962-89598
SHEET
1 OF
52
DSCC FORM 2233
APR 97 5962-E261-06
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in
the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962 - 89598 01 M X A
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
Federal RHA Device Device Case Lead
stock class designator type class outline finish
designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5)
\ / (see 1.2.3)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix
A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time
01 128K x 8 low power CMOS SRAM 120 ns
02 128K x 8 low power CMOS SRAM 100 ns
03 128K x 8 low power CMOS SRAM 85 ns
04 128K x 8 low power CMOS SRAM 70 ns
05 128K x 8 low power CMOS SRAM 120 ns
06 128K x 8 low power CMOS SRAM 100 ns
07 128K x 8 low power CMOS SRAM 85 ns
08 128K x 8 low power CMOS SRAM 70 ns
09 128K x 8 low power CMOS SRAM 55 ns
10 128K x 8 low power CMOS SRAM 45 ns
11 128K x 8 low power CMOS SRAM 35 ns
12 128K x 8 low power CMOS SRAM 25 ns
13 128K x 8 low power CMOS SRAM dual CE 120 ns
14 128K x 8 low power CMOS SRAM dual CE 100 ns
15 128K x 8 low power CMOS SRAM dual CE 85 ns
16 128K x 8 low power CMOS SRAM dual CE 70 ns
17 128K x 8 low power CMOS SRAM dual CE 55 ns
18 128K x 8 low power CMOS SRAM dual CE 45 ns
19 128K x 8 low power CMOS SRAM dual CE 35 ns
20 128K x 8 low power CMOS SRAM dual CE 25 ns
21 128K x 8 low power CMOS SRAM dual CE 20 ns
22 128K x 8 standard power CMOS SRAM 120 ns
23 128K x 8 standard power CMOS SRAM 100 ns
24 128K x 8 standard power CMOS SRAM 85 ns
25 128K x 8 standard power CMOS SRAM 70 ns
26 128K x 8 standard power CMOS SRAM 55 ns
27 128K x 8 standard power CMOS SRAM 45 ns
28 128K x 8 standard power CMOS SRAM 35 ns
29 128K x 8 standard power CMOS SRAM 25 ns
30 128K x 8 standard power CMOS SRAM dual CE 120 ns
31 128K x 8 standard power CMOS SRAM dual CE 100 ns
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
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A
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DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
Device type Generic number 1/ Circuit function Access time
32 128K x 8 standard power CMOS SRAM dual CE 85 ns
33 128K x 8 standard power CMOS SRAM dual CE 70 ns
34 128K x 8 standard power CMOS SRAM dual CE 55 ns
35 128K x 8 standard power CMOS SRAM dual CE 45 ns
36 128K x 8 standard power CMOS SRAM dual CE 35 ns
37 128K x 8 standard power CMOS SRAM dual CE 25 ns
38 128K x 8 standard power CMOS SRAM dual CE 20 ns
39 128K x 8 standard power CMOS SRAM 20 ns
40 128K x 8 low power CMOS SRAM 20 ns
41 128K x 8 standard power CMOS SRAM dual CE 15 ns
42 128K x 8 low power CMOS SRAM 70 ns
43 128K x 8 standard power CMOS SRAM 70 ns
44 128K x 8 standard power CMOS SRAM 15 ns
45 128K x 8 standard power CMOS SRAM dual CE 12 ns
46 128K x 8 standard power CMOS SRAM 12 ns
47 128K x 8 very low power CMOS SRAM 30 ns
48 128K x 8 low power CMOS SRAM 15 ns
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows: Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X GDIP1-T32 or CDIP2-T32 32 dual-in-line
Y 2/ See figure 1 32 SOJ package
Z See figure 1 32 dual-in-line
U See figure 1 32 rectangular chip carrier
T See figure 1 32 flat pack
N See figure 1 32 rectangular chip carrier
M CQCC1-N32 32 rectangular chip carrier
9 See figure 1 32 J-leaded rectangular chip carrier
8 See figure 1 32 zig-zag in-line
7 See figure 1 32 SOJ package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 3/ 4/
Supply voltage range (VCC)......................................... -0.5 V dc to +7.0 V dc
DC input voltage range (VIN)....................................... -0.5 V dc to VCC+0.5 V dc 5/
DC output voltage range (VOUT)................................. -0.5 V dc to VCC+0.5 V dc 5/
Storage temperature range.......................................... -65°C to +150°C
Maximum power dissipation (PD)................................. 1.0 W
Lead temperature (soldering, 10 seconds)................... +260°C
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in MIL-HDBK-103.
2/ A bottom brazed option for this package now exists (See figure 1, case outline Y NOTE:). Customers may specify in the
purchase order to negate the option as acceptable for their use.
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ All voltages referenced to VSS (VSS = ground) unless otherwise specified.
5/ Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width.
STANDARD
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SIZE
A
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DEFENSE SUPPLY CENTER COLUMBUS
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R SHEET
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DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings - continued. 3/ 4/
Thermal resistance, junction-to-case (θJC):
Case M ...................................................................... See MIL-STD-1835
Cases X, Y, Z, U, and 7............................................. 11°C/W 6/
Cases T, N, and 9...................................................... 10°C/W 6/
Case 8 ....................................................................... 16°C/W 6/
Output voltage applied in high Z state.......................... -0.5 V dc to VCC+0.5 V dc
Maximum power dissipation, (PD)................................ 1.0 W
Maximum junction temperature (TJ) ............................ +150°C 7/
1.4 Recommended operating conditions.
Supply voltage range (VCC) ........................................ 4.5 V dc minimum to 5.5 V dc maximum
Supply voltage range (VSS)......................................... 0.0 V dc
High level input voltage range (VIH)............................. 2.2 V dc to VCC + 0.5 V dc
Low level input voltage range (VIL).............................. -0.5 V dc to 0.8 V dc
Case operating temperature range (TC)...................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
AMERICAN SOCIETY FOR TEST ING AND MATERIALS (ASTM)
ASTM Standard F1192-95 - Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ All voltages referenced to VSS (VSS = ground) unless otherwise specified.
6/ When the θJC for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein.
7/ Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
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DSCC FORM 2234
APR 97
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78 - IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,
VA 22201; http://www.jedec.org.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix C to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device
class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be
allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the
manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V
alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass
the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements
as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA
designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking
for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate
of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103
(see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for
this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-
38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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R SHEET
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DSCC FORM 2234
APR 97
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered
to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be
made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
3.11 Substitution. Substitution data shall be as indicated in appendix B herein.
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures
shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be
conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be
in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance
inspection.
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c. Interim and final electrical parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-
38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Limits
Test
Symbol
Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
High level input
current
IIH
VCC = 5.5 V, VIN = 5.5 V
1, 2, 3
All
10
µA
M,D,P
1 1/
2/
Low level input current
IIL
VCC = 5.5 V, VIN = 0.0 V
1, 2, 3
All
-10
µA
M,D,P
1 1/
2/
IOZH
VCC = 5.5 V, VO = 5.5 V
VIL = 0.0 V, VIH = 5.0 V
VIH ≤ OE ≤ VCC
1, 2, 3
All
10
M,D,P
1 1/
2/
High impedance output
leakage current
IOZL
VCC = 5.5 V, VO = 0.0 V
VIL = 0.0 V, VIH = 5.0 V
VIH ≤ OE ≤ VCC
1, 2, 3
All
-10
µA
M,D,P
1 1/
2/
IOH = -4.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
1, 2, 3
01-41,
47,48
2.4
M,D,P
1 1/
2/
Output high voltage
VOH
IOH = -1.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
42- 46
2.4
M,D,P
1 1/
2/
V
IOL = 8.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
1, 2, 3
01-41,
47,48
0.4
M,D,P
1 1/
2/
Output low voltage
VOL
IOL = 2.1 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
42- 46
0.4
M,D,P
1 1/
2/
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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R SHEET
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01-04,
11,19,
26,27,
34,35,
42
125
05, 06,
13, 14
100
07, 08,
15, 16,
22, 23,
30, 31
110
09, 10,
17, 18
115
24, 25,
32, 33,
43
120
12,20,
47
130
28, 36
135
21, 29,
37, 39,
40,48
140
38
150
41
180
Operating supply
current
ICC1
VCC = 5.5 V, CE = VIL max
OE , WE , and CE2 = VIH
f = 1/tAVAV min
1, 2, 3
44-46
250
M,D,P
1 1/
All
2/
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
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COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits Test Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups Device
types
Min
Max
Unit
47
2
01-04,
42
10
05-40,
43,48
25
41
40
Standby supply current
TTL
ICC2
VCC = 5.5 V, CE = VIH
CE2 = VIL, f = 0 Hz
1, 2, 3
44-46
60
M,D,P
1 1/
All
2/
mA
47
0.3
42
1
01-04,
40,43,48
5
05-39,
41
10
Standby supply current
CMOS
ICC3
VCC= 5.5 V, CE ≥ VCC -0.2 V
Inputs = VIH or VIL, f = 0
1, 2, 3
44-46
15
M,D,P
1 1/
All
2/
mA
01-04
2
05-21
1
mA
40,48
750
42
400
Data retention current
ICC4
VCC = 2.0 V, f = 0
CE ≥ VCC - 0.2 V, all other
inputs = 0.2 V or VCC - 0.2 V
1, 2, 3
47
150
M,D,P
1 1/
All
2/
µA
01-38,
41-47
12
39, 40
8
Input capacitance 3/
(A0 - A16)
CIN
VIN = 0 V, f = 1.0 MHz
TC = +25°C, see 4.4.1e
4
48
5
pF
01-38,
41-47
20
39, 40
8
Input capacitance 3/
(CE , WE , OE )
CCLK
VOUT = 0 V, f = 1.0 MHz
TC = +25°C, see 4.4.1e
4
48
5
pF
01-38,
41-47
14
39, 40
8
Output capacitance 3/
COUT
VOUT = 0 V, f = 1.0 MHz
TC = +25°C, see 4.4.1e
4
48
5
pF
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
Functional tests 4/
See 4.4.1c
7, 8A, 8B
M,D,P
7 1/
All
2/
2/
01,05,
13,22,30
120
Read cycle time
tAVAV
02,06,
14,23,31
100
ns
03,07,15,
24,32
85
04,08,16,
25,33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,38-40
20
41,44,48
15
See figure 4, as applicable 5/ 6/
9, 10, 11
45,46
12
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
11
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01,05,
13,22,
30
120
02,06,
14,23,
31
100
03,07,
15,24,
32
85
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,
38-40
20
41,44,48
15
Address access time
tAVQV
See figure 4, as applicable
9, 10, 11
45,46
12
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
12
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01,05,
13,22,30
120
02,06,
14,23,31
100
03,07,
15,24,32
85
04,08,
16,25,
33,42,43
70
09,17,
26,34
55
10,18,
27,35
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,38-40
20
41,44,48
15
See figure 4, as applicable
9, 10, 11
45,46
12
Chip enable access
time
tELQV
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
13
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01,02,
05,06,
13,14,
22,23,
30,31
50
42, 43
35
03,07,
15,24,32
30
04,08,
16,25,33
25
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36
15
47
12
12,20,
29,37
10
21,38,
41,44,
45,46
7
See figure 4, as applicable
9, 10, 11
39,40,48
6
Output enable to output
valid
tOLQV
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
14
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
See figure 4, as applicable
9, 10, 11
3
Output hold after
address change
tAVQX
M,D,P
9 1/
All
2/
ns
9, 10, 11
3
Chip enable to 3/ 7/
output in low Z
tELQX
M,D,P
9 1/
All
2/
ns
01-08,
13-16,
22-25,
30-33,
42, 43
30
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36,
47
15
12,20,
29,37
10
21,38-
40,48
8
9, 10, 11
41,44,
45,46
7
Chip disable to output
in high Z 3/ 7/
tEHQZ
M,D,P
9 1/
All
2/
ns
9, 10, 11
0
Output enable 3/ 7/
to output in low Z
tOLQX
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
15
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01-08,
13-16,
22-25,
30-33,
42,43
30
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36
15
12,20,
29,37
10
21,38,
47
8
41,44,
45,46
7
See figure 4, as applicable
9, 10, 11
39,40,
48
6
Output disable to
output in high Z
3/ 7/
tOHQZ
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
16
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01,05,
13,22,
30
120
02,06,
14,23,
31
100
03,07,
15,24,
32
85
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,
38-40
20
41,44,
48
15
See figure 4, as applicable
9, 10, 11
45,46
12
Write cycle time
tAVAV
M,D,P
9 1/
All
2/
ns
9, 10, 11
0
Address setup to
beginning of write
tAVWL
tAVEL
M,D,P
9 1/
All
2/
ns
01-04
5
9, 10, 11
05-48
0
Data hold after end of
write
tWHDX
tEHDX
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
17
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
05,13,22,30
100
06,14,23,31
80
07,15, 24,32
70
42, 43
65
01
50
10,18, 27,35
02,03
40
04,08, 09,16,
17,25, 26,33,
34
35
11,19, 28,36
30
12,20, 29,37
20
47
22
21, 38-40,48
15
41,44
12
See figure 4, as applicable
9, 10, 11
45,46
11
Write pulse width
tWLWH
M,D,P
9 1/
All
2/
ns
01,05, 13,22,
30
100
02,06, 14,23,
31
85
03,07, 15,24,
32
75
42, 43
65
04,08, 16,25,
33
60
09,17, 26,34
45
10,18, 27,35
35
11,19, 28,36
25
47
22
12,20, 29,37
20
21,38
15
39-41,44,48
12
9, 10, 11
45, 46
11
Address setup to
end of write
Chip select to end
of write
tAVWH
tELWH
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
18
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
01-10, 13-18,
22-27, 30-35,
44-46
5
See figure 4, as applicable
9, 10, 11
11,12,19-21,
28,29,36-43,
47,48
0
Address hold after
end of write
tWHAX
tEHAX
M,D,P
9 1/
All
2/
ns
01,02,05, 06,
13,14, 22,23,
30,31
40
03,07,
15,24,32
35
04,08, 16,25,
33,42,43
30
09,17, 26,34
25
10,11,18, 19,
27,28, 35,36
20
47
18
12,20, 29,37
15
21,38-40,48
10
9, 10, 11
41,44, 45,46
8
Data setup to end of
write
tDVWH
tDVEH
M,D,P
9 1/
All
2/
ns
01-08, 13-16,
22-25, 30-33,
42, 43
35
09,10, 17,18,
26,27, 34,35
20
11,19, 28,36
15
12,20, 29,37
10
21,38-40,48
9
47
8
9, 10, 11
41, 44-46
7
Write enable to output
disable 3/ 7/
tWLQZ
M,D,P
9 1/
All
2/
ns
See figure 4, as applicable
9, 10, 11
5
Output active after
end of write 3/
tWHQX
M,D,P
9 1/
All
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
19
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Limits
Test
Symbol Conditions
-55°C ≤ TC ≤ +125°C
VSS = 0 V; 4.5 V ≤ VCC ≤ 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Min
Max
Unit
See figure 4, as applicable
9, 10, 11
0
Retention time 3/
tCDR
M,D,P
9 1/
All
2/
ns
01,05,
13,22,
30
120
02,06,
14,23,
31
100
03,07,
15,24,
32
85
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,
38- 40
20
41,44,
48
15
9, 10, 11
45,46 12
Operation recovery time
3/
tR
M,D,P 9 1/ All 2/
ns
1/ When performing postirradiation electrical measurements for any RHA level TA = +25°C. Limits shown are guaranteed at
TA = +25°C ± 5°C. The M, D, and P in the test condition column are the postirradiation limits for the device types specified in
the device types column.
2/ Preirradiation values for RHA marked devices shall also be the postirradiation values unless otherwise specified.
3/ This parameter is tested initially and after any design or process change which could affect this parameter, and therefore
shall be guaranteed to the limits specified in table I.
4/ Functional tests shall include the test table and other test patterns used for fault detection as approved by the qualifying
activity. Outputs are measured at VOL < 1.5 V, VOH > 1.5 V.
5/ For timing waveforms see figure 4 and for output load circuits, see figure 5.
6/ AC measurements assume transition time ≤ 5 ns, input levels are from ground to 3.0 V, and output load CL ≥ 30 pF except
as noted on figure 5. Timing reference levels are 1.5 V.
7/ Transition is measured ±500 mV from steady state voltage.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
20
DSCC FORM 2234
APR 97
Case Y
NOTE: A bottom brazed package may be shipped as an alternative package style, provided the vendor makes the
receiving customer aware of the intent to ship the part as a bottom brazed package rather than the one shown on this
figure.
FIGURE 1. Case outlines.
Inches Millimeters
Symbol
Min
Max
Min
Max
A
.120
.165
3.05
4.19
A1
.088
.120
2.24
3.05
A2
.070
Ref.
1.78
---
B
.010
Ref.
0.25
---
B1
.030R
Typ.
0.76
---
B2
.020
Ref.
0.51
---
B3
.025
.045
0.64
1.14
D
.816
.838
20.73
21.29
D1
.750
Ref.
19.05
---
E
.419
.431
10.64
10.95
E1
.430
.445
10.42
11.30
E2
.360
.380
9.14
9.65
e
.050 BSC
1.27 BSC
e1
.038
Typ.
0.97
---
e2
.005
0.13
---
j
.005
Typ.
0.13
---
S
.030
.040
0.76
1.02
S1
.020
Typ.
0.51
---
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
21
DSCC FORM 2234
APR 97
Case Z
Note: Either configuration in detail A is allowed.
FIGURE 1. Case outlines - Continued.
Inches Millimeters
Symbol
Min
Max
Min
Max
A
---
.232
---
5.89
b
.014
.023
0.36
0.58
b1
.038
.065
0.97
1.65
c
.008
.015
0.20
0.38
D
---
1.700
---
41.05
E
.350
.405
9.78
10.29
E1
.390
.420
9.91
10.67
e
.100 BSC
2.54 BSC
L
.125
.200
3.18
5.08
L1
.150
---
3.81
---
Q
.015
.060
0.38
1.52
S
---
.100
---
2.54
S1
.005
---
0.13
---
S2
.005
---
0.13
---
α
0°
15°
---
---
N
32
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
22
DSCC FORM 2234
APR 97
Case U
FIGURE 1. Case outlines – Continued.
Inches
Millimeters
Symbol
Min
Nom
Max
Min
Nom
Max
Notes
A
.080
.090
.100
2.03
2.29
2.54
b
.022
.025
.028
0.56
0.64
0.71
b1
.006
.014
.022
0.15
0.36
0.56
4
b2
.040
---
---
1.02
---
---
D
.800
.820
.840
20.32
20.83
21.34
E
.392
.400
.408
9.96
10.16
10.36
e
.050 BSC
1.27 BSC
h
.012 REF
0.30 REF
7
L
.070
.075
.080
1.78
1.90
2.03
L1
.090
.100
.110
2.29
2.54
2.79
5
L2
.003
.009
.015
0.08
0.23
0.38
4
N
32
---
8
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
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R SHEET
23
DSCC FORM 2234
APR 97
Case U – Continued.
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. All dimensions and tolerances conform to ANSI Y14.5M-1982.
4. Metallized castellations shall be connected to plane 1 terminals.
5. Index area: A pin identification mark shall be located adjacent to pin one within the shaded area shown.
Plane 1 terminal identification may be an extension of the length of the metallized terminal which shall not be
wider than the b dimension.
6. The cover shall not extend beyond the edges of the body.
7. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option.
8. N indicates the number of terminals.
9. Unless otherwise specified, a minimum clearance of .015 inch (.381 mm) shall be maintained between all
metallized features (e.g., lid, castellation, terminals, thermal pads, etc.).
10. Solder finish is optional with a maximum allowable thickness of .007 inch. Measurement of dimensions A, b1,
and L2 may be made prior to solder application.
FIGURE 1. Case outlines – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
24
DSCC FORM 2234
APR 97
Case T
NOTES:
1. Index area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark.
2. Dimension Q shall be measured at the point of exit of the lead from the body. Dimension Q minimum shall be reduced
by .0015 inch (0.038 mm) maximum when lead finish A is applied.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. The basic lead spacing is .050 (1.27 mm) between centerlines. Each lead centerline shall be located within ±.005 (0.13
mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
5. All leads - Increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A or B is
applied.
6. Total number of spaces = (N-2). Symbol "N" is the maximum number of leads.
7. Measure all four corner leads.
8. Dimension S1 (see 5.2.2 of MIL-STD-1835) may be .000 (0.00 mm) if the corner leads, upon entering the body of the
package, and within one lead's width, bend toward the die cavity. See 5.2.2 of MIL-STD-1835 for measurement of S1 on
bottom-brazed flat packs.
9. Bottom brazed lead configuration. If this configuration is used, no organic or polymeric materials shall be molded to the
bottom of the package to cover the leads.
10. Dimensions are in inches.
11. Metric equivalents are given for general information only.
FIGURE 1. Case outlines – Continued.
Inches
Millimeters Symbol
Min
Max
Min
Max
Notes
A
.097
.125
2.46
3.18
b
.015
.019
0.38
0.48
5
c
.003
.009
0.08
0.23
5
D
---
.830
---
21.08
3
E
.400
.420
10.16
10.67
E1
---
.450
---
11.43
3
E2
.180
---
4.57
---
E3
.030
---
0.76
---
9
e
.050 BSC
1.27 BSC
4,6
L
.250
.370
6.35
9.40
Q
.020
.045
0.51
1.14
S
---
.045
---
1.14
7
S1
.000
---
0.00
---
7,8
N
32
6
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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DEFENSE SUPPLY CENTER COLUMBUS
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R SHEET
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DSCC FORM 2234
APR 97
Case N
Inches
Millimeters
Symbol
Min
Max
Min
Max
A
.070
.100
1.78
2.54
b
.022
.028
0.56
0.71
b1
.009 R
.23 R
b2
.038
.042
.97
1.07
D
.445
.460
11.30
11.68
D1
.295
.305
7.49
7.75
E
.695
.715
17.65
18.16
E1
.395
.405
10.03
10.29
e
.050 TYP
1.27 TYP
h
.020 REF
.51 REF
J
.035 REF
.89 REF
L
.045
.055
1.14
1.40
L1
.077
.093
1.96
2.36
FIGURE 1. Case outlines – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
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DSCC FORM 2234
APR 97
Case 9
FIGURE 1. Case outlines – Continued.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
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DSCC FORM 2234
APR 97
Case 9 – Continued.
Inches
Millimeters
Symbol
Min
Max
Min
Max
A
.141
.177
3.58
4.50
A1
.073
.089
1.85
2.26
A2
.078 REF
1.98 REF
A3
.033
.065
.84
1.65
B
.017 REF
.43 REF
B1
.028 REF
.71 REF
D
.445
.458
11.30
11.63
D3
.290
.310
7.37
7.87
D4
.400
.440
10.16
11.18
E
.695
.710
17.65
18.03
E3
.390
.410
9.91
10.41
E4
.650
.690
16.51
17.53
e
.050 TYP
1.27 TYP
e1
.007 REF
.18 REF
h
.020 REF
.51 REF
L
.075
.115
1.91
2.92
Q
.040 MIN
1.02 MIN
R1
.023 R REF TYP
.58 R REF TYP
S1
.003
.035
.08
.89
FIGURE 1. Case outlines - Continued.
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Case 8
Inches
Millimeters
Symbol
Min
Max
Min
Max
Notes
A
.460
.500
11.68
12.70
3
A1
.020
.040
0.51
1.02
A2
.440
.460
11.18
11.68
A3
.565
.645
14.35
16.38
B
.016
.020
0.41
0.51
C
.008
.012
0.20
0.30
D
1.630
1.670
41.40
42.42
6
E
.090
.130
2.29
3.30
e1
.050 BSC
1.27 BSC
eA
.100 BSC
2.54 BSC
L
.125
.155
3.18
3.95
M
.055
.105
1.40
2.67
N
32
1
S
.030
.070
0.76
1.78
NOTES:
1. N is the number of leads.
2. The chamfer on the body is optional. If is not present, a visual index feature must be located within the cross hatched
area.
3. Lead configuration in this area is optional.
4. Controlling dimension: Inches.
5. Solder finish is optional. However, if leads are solder dipped or plated, increase maximum limit of all leads by 0.003"
from center of flat.
6. The cover shall not extend beyond the edges of the ceramic body.
FIGURE 1. Case outlines - Continued.
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Case 7
Millimeters
Inches
Symbol
Min
Max
Min
Max
A
3.35
3.66
.132
.144
A2
0.66
0.91
.026
.036
b
0.38
0.48
.015
.019
B1
0.76
1.02
.030
.040
D
20.62
21.03
.812
.828
D1
18.80
19.30
.740
.760
E
10.29
10.54
.405
.415
E1
11.05
11.30
.435
.445
E2
9.14
9.85
.360
.380
e
1.27 BSC
.050 BSC
N
32
FIGURE 1. Case outlines - continued.
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Device types
01 through 12,
22 through 29,39,
40,42 through 46
13 through 21,
30 through 38,
41,47
01 through 12,
22 through 29,
39
Case outlines
X, Y, Z, U, T, N, M, 9, and 7 8
Terminal number
Terminal symbol
1
NC
NC NC
2
A16
A16 VCC
3
A14
A14
A16
4
A12
A12
A15
5
A7
A7
A14
6
A6
A6
NC
7
A5
A5
A12
8
A4
A4
WE
9
A3
A3
A7
10
A2
A2
A13
11
A1
A1
A6
12
A0
A0
A8
13
I/O0
I/O0
A5
14
I/O1
I/O1
A9
15
I/O2
I/O2
A4
16
VSS
VSS
A11
17
I/O3
I/O3
A3
18
I/O4
I/O4 OE
19
I/O5
I/O5
A2
20
I/O6
I/O6
A10
21
I/O7
I/O7
A1
22
CE
CE 1 CS
23
A10
A10
A0
24 OE OE
I/O7
25
A11
A11
I/O0
26
A9
A9
I/O6
27
A8
A8
I/O1
28
A13
A13
I/O5
29 WE WE
I/O2
30
NC
CE2
I/O4
31
A15
A15
VSS
32
VCC
VCC
I/O3
NC = No connection
FIGURE 2. Terminal connections.
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Mode
CE
*CE2
WE
OE
I/O
Standby
H
X
X
X
High Z
Standby
X
L
X
X
High Z
Read
L
H
H
L
DOUT
Write
L
H
L
X
DIN
Read
L
H
H
H
High Z
H = logic "1" state, L = logic "0" state.
X = logic "don't care" state, and Z = high impedance state.
* = only applies to devices with dual CE .
FIGURE 3. Truth table.
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Read Cycle (see notes 1 and 2)
NOTES:
1.
WE is held high during the read cycle.
2. Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams.
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Write cycle 1 (see notes 1, 2, and 3)
(CE 1 or CE2 controlled)
NOTES:
1. Either CE1 or CE2 may be used to control the write cycle. If CE 1 is used, CE2 should be high when WE is low. If
CE2 is used, CE 1 should be low when WE is low.
2. In a CE1 or CE2 controlled write cycle, the outputs assume a high impedance state, whether OE is high or low, as
long as WE is low.
3. Timing measurement reference is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
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Write cycle 2 (see notes 1 and 2)
(WE controlled)
NOTES:
1. In the
WE controlled write cycle, while WE is low, it will force the outputs into a high impedance state, whether OE is
high or low.
2. Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
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Data retention Waveform (see notes 1 and 2)
NOTES:
1. EitherCE1 or CE2 may be used to begin data retention mode.
2. For tCDR and tR: CE1 ≥ VCC -0.2 V or CE2 ≤ 0.2 V, VIN ≥ VCC -2.0 V or VIN ≤ 0.2 V.
FIGURE 4. Timing waveform diagrams - Continued.
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NOTES:
1. Use these output load circuits or equivalent for testing.
2. Including scope and jig.
3. Minimum of 5 pF for tEHQZ, tOHQZ, tELQX, tOLQX, and tWHQX.
FIGURE 5. Output load circuits.
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NOTE: Input protection resistors = 1 kΩ.
FIGURE 6. Bias conditions for irradiation testing.
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TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/
Subgroups
(in accordance with
MIL-STD-883,
TM 5005, table I)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Line
no.
Test requirements
Device
class M
Device
class Q
Device
class V
1
Interim electrical
parameters (see 4.2)
1, 7, 9
2
Static burn-in
(method 1015)
Not
required
Not
required
Required
3
Same as line 1 1*, 7* ∆
4
Dynamic burn-in
(method 1015)
Required Required Required
5
Same as line 1 1*, 7* ∆
6
Final electrical
parameters (see 4.2)
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
7
Group A test
requirements (see 4.4)
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
8
Group C end-point
electrical
parameters (see 4.4)
2, 3, 7,
8A, 8B
1, 2, 3, 7,
8A, 8B
1, 2, 3, 7, 8A,
8B, 9, 10, 11 ∆
9
Group D end-point
electrical
parameters (see 4.4)
2, 3, 8A, 8B 2, 3, 8A, 8B 2, 3, 8A, 8B
10
Group E end-point
electrical
parameters (see 4.4)
1, 7, 9 1, 7, 9 1, 7, 9
1/ Blank spaces indicate tests are not applicable.
2/ Any or all subgroups may be combined when using high-speed testers.
3/ Subgroups 7 and 8 functional tests shall verify the truth table.
4/ * indicates PDA applies to subgroup 1 and 7.
5/ ** see 4.4.1e.
6/ ∆ indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be
computed with reference to the previous interim electrical parameters (see line 1).
7/ See 4.4.1d.
TABLE IIB. Delta limits at +25°C.
Device types
Parameter 1/
All
ICC3 standby
±10% of specified
value in table I
IIH, IIL
±10% of specified
value in table I
IOHZ, IOLZ
±10% of specified
value in table I
1/ The above parameter shall be recorded before
and after the required burn- in and life tests to determine
the delta ∆.
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4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-
PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535
permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MIL-
PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in
method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted.
c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which
may affect the performance of the device. For device class M, procedures and circuits shall be maintained under
document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring
activity upon request. For device classes Q and V, the procedures and circuits shall be under the control of the
device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity
or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall
be considered destructive. Information contained in JEDEC Standard EIA/JESD 78 may be used for reference.
e. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or
design changes which may affect input or output capacitance. Capacitance shall be measured between the
designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and
output terminals tested.
4.4.2 Group C inspection. T he group C inspection end-point electrical parameters shall be as specified in table IIA
herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test
temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-
PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1005 of MIL-STD-883.
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4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C
±5°C, after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A, and as specified herein.
4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater
than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the
pre-irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any
design or process changes which may affect the RHA response of the device.
4.4.4.2 Dose rate induced latchup testing. Dose rate induced latchup shall not occur under any recommended operating
condition.
4.4.4.3 Dose rate upset testing. Dose rate upset testing shall be performed in accordance with test method 1021 of MIL-
STD-883 and herein.
a. Transient dose rate upset testing for class M devices shall be performed at initial qualification and after any design or
process changes which may effect the RHA performance of the devices. T est 10 devices with 0 defects unless
otherwise specified.
b. Transient dose rate upset testing for class Q and V devices shall be performed as specified by a TRB approved
radiation hardness assurance plan and MIL-PRF-38535. Device parametric parameters that influence upset
immunity shall be monitored at the wafer level in accordance with the wafer level hardness assurance plan and
MIL-PRF-38535.
c. The transient dose rate upset level shall be greater than or equal to 510 rads(Si)/s with a pulse width less than or equal
to 1.0 µs.
4.4.4.4 Single event phenomena (SEP). SEP testing shall be required on class V devices (see 1.4 herein). SEP testing
shall be performed on a technology process on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as
approved by the qualifying activity at inital qualification and after any design or process changes which may affect the upset or
latchup characteristics. The recommended test conditions for SEP are as follows:
a. The ion beam angle of incidence shall be between normal to the die surface and 60° to the normal, inclusive (i.e. 0° ≤
angle ≤ 60°). No shadowing of the ion beam due to fixturing or package related effects is allowed.
b. The fluence shall be ≥ 100 errors or ≥ 107 ions/cm2.
c. The flux shall be between 102 and 105 ions/cm2/s. The cross-section shall be verified to be flux independent by
measuring the cross-section at two flux rates which differ by at least an order of magnitude.
d. The particle range shall be ≥ 20 microns in silicon.
e. The test temperature shall be +25°C and the maximum rated operating temperature ±10°C.
f. Bias conditions shall be VCC = 4.5 V dc for the upset measurements and VCC = 5.5 V dc for the latchup
measurements.
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4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical
parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option,
either perform delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1, 7,
and 9.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record
for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a
system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a
record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings
covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-HDBK-1331, and as follows:
CIN, COUT......................................... Input and bi-directional output, terminal-to-GND capacitance.
GND ................................................... Ground zero voltage potential.
ICC..................................................... Supply current.
IIL ....................................................... Input current low.
IIH....................................................... Input current high.
TC....................................................... Case temperature.
TA....................................................... Ambient temperature.
VCC.................................................... Positive supply voltage.
VIC ..................................................... Positive input clamp voltage.
O/V..................................................... Latch-up over-voltage.
6.5.1 Timing parameter abbreviations. All timing abbreviations use lower case characters with upper case character
subscripts. The initial character is always "t" and is followed by four descriptors. These characters specify two signal points
arranged in a "from-to" sequence that define a timing interval. The two descriptors for each signal specify the signal name
and the signal transitions. Thus the format is: t X X X X
| | | |
Signal name from which interval is derived | | | |
| | |
Transition direction for first signal | | |
| |
Signal name to which interval is defined | |
|
Transition direction for second signal |
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6.5.1 Timing parameter abbreviations – Continued.
a. Signal definitions:
A = Address
D = Data in
Q = Data out
W = Write enable
E = Chip enable
O = Output enable
b. Transition definitions:
H = Transition to high
L = Transition to low
V = Transition to valid
X = Transition to invalid or don't care
Z = Transition to off (high impedance)
6.5.2.1 Timing limits. The table of timing values shows either a minimum or a maximum limit for each parameter. Input
requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since
the system must supply at least that much time (even though most devices do not require it). On the other hand, responses
from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the device
never provides data later than that time.
6.5.3 Waveforms.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-
103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has
been submitted to and accepted by DSCC-VA.
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APPENDIX A
FORMS A PART OF SMD 5962-89598
FUNCTIONAL ALGORITHMS
A10. SCOPE
A10.1 Scope. Functional algorithms are test patterns which define the exact sequence of events used to verify proper
operation of a random access memory (RAM). Each algorithm serves a specific purpose for the testing of the device. It is
understood that all manufacturers do not have the same test equipment; therefore, it becomes the responsibility of each
manufacturer to guarantee that the test patterns described herein are followed as closely as possible, or equivalent patterns
be used that serve the same purpose. Each manufacturer should demonstrate that this condition will be met. Algorithms
shall be applied to the device in a topologically pure fashion. This appendix is a mandatory part of the specification. The
information contained herein is intended for compliance.
A20. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
A30. ALGORITHMS
A30.1 Algorithm A (pattern 1).
A30.1.1 Checkerboard, checkerboard-bar.
Step 1. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Step 2. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Step 3. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Step 4. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum.
A30.2 Algorithm B (pattern 2).
A30.2.1 March.
Step 1. Load memory with background data, incrementing from minimum to maximum address locations (All "0's").
Step 2. Read data in location 0.
Step 3. Write complement data to location 0.
Step 4. Read complement data in location 0.
Step 5. Repeat steps 2 through 4 incrementing X-fast sequentially, for each location in the array.
Step 6. Read complement data in maximum address location.
Step 7. Write data to maximum address location.
Step 8. Read data in maximum address location.
Step 9. Repeat steps 6 through 8 decrementing X-fast sequentially for, each location in the array.
Step 10. Read data in location 0.
Step 11. Write complement data to location 0.
Step 12. Read complement data in location 0.
Step 13. Repeat steps 10 through 12 decrementing X-fast sequentially for each location in the array.
Step 14. Read complement data in maximum address location.
Step 15. Write data to maximum address location.
Step 16. Read data in maximum address location.
Step 17. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Step 18. Read background data from memory, decrementing X-fast from maximum to minimum address locations.
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APPENDIX A - Continued.
A30.3 Algorithm C (pattern 3).
A30.2.1 XY March.
Step 1. Load memory with background data, incrementing from minimum to maximum address locations (All "0's").
Step 2. Read data in location 0.
Step 3. Write complement data to location 0.
Step 4. Read complement data in location 0.
Step 5. Repeat steps 2 through 4 incrementing Y-fast sequentially, for each location in the array.
Step 6. Read complement data in maximum address location.
Step 7. Write data to maximum address location.
Step 8. Read data in maximum address location.
Step 9. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array.
Step 10. Read data in location 0.
Step 11. Write complement data to location 0.
Step 12. Read complement data in location 0.
Step 13. Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array.
Step 14. Read complement data in maximum address location.
Step 15. Write data to maximum address location.
Step 16. Read data in maximum address location.
Step 17. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Step 18. Read background data from memory, decrementing Y-fast from maximum to minimum address locations.
A30.4 Algorithm D (pattern 4).
A30.4.1 CEDES - CE deselect checkerboard, checkerboard-bar.
Step 1. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Step 2. Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from location
0 to maximum.
Step 3. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Step 4. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Step 5. Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0
to maximum.
Step 6. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
45
DSCC FORM 2234
APR 97
APPENDIX B
FORMS A PART OF SMD 5962-89598
SUBSTITUTION DATA
B10. SCOPE
B10.1 Scope. This appendix contains the PIN substitution information to support the one part-one part number system.
For new designs, after the date of this document the NEW PIN shall be used in lieu of the OLD PIN. For existing designs
prior to the date of this document the NEW PIN can be used in lieu of the OLD PIN. This appendix is a mandatory part of the
specification. The information contained herein is intended for compliance. The PIN substitution data shall be as follows:
B20. APPLICABLE DOCUMENTS
This section is not applicable to this appendix.
B30. SUBSTITUTION DATA
NEW PIN OLD PIN
5962-8959801MXX 5962-8959801XX
5962-8959802MXX 5962-8959802XX
5962-8959803MXX 5962-8959803XX
5962-8959804MXX 5962-8959804XX
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
46
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
C10. SCOPE
C10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices
using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes
consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or
Identification Number (PIN). When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
C10.2 PIN. The PIN is as shown in the following example:
5962 - 89598 01 V 6 A
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
⏐ ⏐ ⏐ ⏐ ⏐ ⏐
Federal RHA Device Device Die Die
stock class designator type class code Details
designator (see 10.2.1) (see 10.2.2) designator (see 10.2.4) (see 10.2.5)
\ / (see 10.2.3)
\/
Drawing number
C10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA
levels. A dash (-) indicates a non-RHA die.
C10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Access time
47 65608EV-30 128K X 8 very low power CMOS SRAM 30ns
C10.2.3 Device class designator.
Device class Device requirements documentation
Q or V Certification and qualification to the die requirements of MIL-PRF-38535
C10.2.4 Die code. The die code designator shall be a number 6 for all devices supplied as die only with no case outline.
C10.2.5. Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each
product and variant supplied to this appendix.
C10.2.5.1 Die physical dimensions.
Die type Figure number
01 A-1
C10.2.5.2. Die bonding pad locations and electrical functions.
Die type Figure number
01 A-1
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
47
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
C10.2.5.3. Interface materials.
Die type Figure number
01 A-1
C10.2.5.4. Assembly related information.
Die type Figure number
01 A-1
C10.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
C10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
C20. APPLICABLE DOCUMENTS.
C20.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
C20.2. Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence.
C30. REQUIREMENTS
C30.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit or function as described herein.
C30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
C30.2.1 Die physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.
C30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be
as specified in 10.2.4.2 and on figure A-1.
C30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
48
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
C30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.
C30.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3. of the body of this document.
C30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4. of the body
of this document.
C30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
C30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
C30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
C30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-
38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.
C30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
C40. VERIFICATION
C40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The
manufacturer's modifications in the QM plan shall not effect the form, fit or function as described herein.
C40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in
the manufacturer's QM plan. As a minimum it shall consist of:
a) Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007.
b) 100% wafer probe (see paragraph 30.4).
c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method
2010 or the alternate procedures allowed within MIL-STD-883 test method 5004.
C40.3 Conformance inspection.
C40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured
(see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing
of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs
4.4.4, 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 and 4.4.4.4.
C50. DIE CARRIER
C50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan
or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and
electrostatic protection.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
49
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
C60 NOTES
C60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance
with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications
and logistics purposes.
C60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43218-3990 or
telephone (614)-692-0547.
C60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within
MIL-PRF-38535 and MIL-STD-1331.
C60.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-
38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and
have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
50
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner Pad reference Position relative to center of die
(dimensions are in millimeters)
X Y
Rotation angle
In degrees Manufacturer
Pad reference Signal
name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,488
-7,227
-6,947
-5,787
-4,787
-3,787
-0,187
3,813
4,813
2,297
2,117
1,937
1,757
1,522
1,242
0,992
0,742
0,242
0,042
-0,158
-0,408
-0,688
-0,913
-1,138
-1,418
-1,698
-1,938
-2,118
-2,298
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
(A3)
(A2)
(Al)
(A0)
(1/O0)
I/O1
Gnd
I/O2
Gnd
Gnd
Gnd
I/O3
I/O4
Gnd
I/O5
(I/O6)
(I/O7)
(CS1/)
(A1O)
(OE/)
I/O6
Gnd
I/O7
CS1/
Al0
OE/
Gnd
All
A9
Figure A-1, MMO-65608EV Bond Pad Locations and Functions
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
51
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner Pad reference Position relative to center of die
(dimensions are in millimeters)
X Y
Rotation angle
In degrees Manufacturer
Pad reference Signal
name
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
A
A
A
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
5,813
6,613
7,213
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,722
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,638
6,813
6,613
4,413
0,013
-3,787
-4,787
-6,787
-6,387
-7,481
-2,504
-2,504
-2,504
-2,333
-2,158
-1,983
-1,808
-1,633
-1,407
-1,183
-0,983
-0,188
0,042
0,272
0,842
1,067
1,267
1,436
1,617
1,792
1,967
2,142
2,323
2,504
2,504
2,504
2,504
2,504
2,804
2,504
2,504
2,504
2,504
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
A8
A13
W/
(A11)
(A9)
(A8)
(A13)
(W)
CS2
Gnd
A15
Vcc
Vcc
Vcc
A16
Gnd
A14
(A12)
(A7)
(A6)
(A5)
(A4)
A12
A7
A6
A5
A4
Gnd
A3
A2
A1
A0
I/O0
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-89598
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
R SHEET
52
DSCC FORM 2234
APR 97
APPENDIX C – Continued.
FORMS A PART OF SMD 5962-89598
Die physical dimensions.
Die size: 15 860 X 5 410 microns
Die thickness: 475 microns
Interface materials.
Top metallization: Aluminium + 1% Copper
Backside metallization: bare silicon
Glassivation.
Type: Silicon Oxide + Nitride
Thickness: 15 000 Angstroms
Substrate: Single crystal silicon
Assembly related information.
Substrate potential: not connected
Special assembly instructions: None
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 06-02-13
Approved sources of supply for SMD 5962-89598 are listed below for immediate acquisition only and shall be added to
MIL-HDBK-103 and QML-38535, as applicable, during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated
revisions of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at
http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8959801MXA
3/
3/
3/
S128K8L-120MC
MSM8128SXLMC-12
EDI88128LPS120CB
5962-8959801MYA
3/
3/
3/
S128K8L-120MS
EDI88128LPS120NB
L7C108YMB25
5962-8959801MZA
3/
3/
3/
3/
S128K8L-120ME
MSM8128KXLMC-12
EDI88128LPS120TB
L7C108CMB25
5962-8959801MUA
3/
3/
S128K8L-120ML
EDI88128LPS120LB
5962-8959801MTA
3/
3/
3/
3/
S128K8L-120MF
MSM8128GXLMC-12
EDI88128LPS120FB
L7C108MMB25
5962-8959801MNA
3/
3/
MSM8128WXLMC-12
L7C108KMB25
5962-8959801M9A
3/
MSM8128JXLMC-12
5962-8959801M8A
3/
EDI88128LPS120ZB
5962-8959802MXA
3/
3/
3/
S128K8L-100MC
MSM8128SXLMC-10
EDI88128LPS100CB
See footnotes at end of table.
1 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959802MYA
3/
3/
3/
S128K8L-100MS
EDI88128LPS100NB
L7C108YMB25
5962-8959802MZA
3/
3/
3/
3/
S128K8L-100ME
MSM8128KXLMC-10
EDI88128LPS100TB
L7C108CMB25
5962-8959802MUA
3/
3/
S128K8L-100ML
EDI88128LPS100LB
5962-8959802MTA
3/
3/
3/
3/
S128K8L-100MF
MSM8128GXLMC-10
EDI88128LPS100FB
L7C108MMB25
5962-8959802MNA
3/
3/
MSM8128WXLMC-10
L7C108KMB25
5962-8959802M9A
3/
MSM8128JXLMC-10
5962-8959802M8A
3/
EDI88128LPS100ZB
5962-8959803MXA
3/
3/
3/
S128K8L-85MC
MSM8128SXLMC-85
EDI88128LPS85CB
5962-8959803MYA
3/
3/
3/
S128K8L-85MS
EDI88128LPS85NB
L7C108YMB25
5962-8959803MZA
3/
3/
3/
3/
S128K8L-85ME
MSM8128KXLMC-85
EDI88128LPS85TB
L7C108CMB25
5962-8959803MUA
3/
3/
S128K8L-85ML
EDI88128LPS85LB
See footnotes at end of table.
2 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959803MTA
3/
3/
3/
3/
S128K8L-85MF
MSM8128GXLMC-85
EDI88128LPS85FB
L7C108MMB25
5962-8959803MNA
3/
3/
MSM8128WXLMC-85
L7C108KMB25
5962-8959803M9A
3/
MSM8128JXLMC-85
5962-8959803M8A
3/
EDI88128LPS85ZB
5962-8959804MXA
3/
3/
3/
S128K8L-70MC
MSM8128SXLMC-70
EDI88128LPS70CB
5962-8959804MYA
3/
3/
3/
S128K8L-70MS
EDI88128LPS70NB
L7C108YMB25
5962-8959804MZA
3/
3/
3/
3/
S128K8L-70ME
MSM8128KXLMC-70
EDI88128LPS70TB
L7C108CMB25
5962-8959804MUA
3/
3/
S128K8L-70ML
EDI88128LPS70LB
5962-8959804MTA
3/
3/
3/
3/
S128K8L-70MF
MSM8128GXLMC-70
EDI88128LPS70FB
L7C108MMB25
5962-8959804MNA
3/
3/
MSM8128WXLMC-70
L7C108KMB25
5962-8959804M9A 3/
MSM8128JXLMC-70
5962-8959804M8A 3/
EDI88128LPS70ZB
See footnotes at end of table.
3 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959805MXA
3/
3/
54230
0EU86
S128K8L-120MC
MSM8128SXLMC-12
EDI88128LPS120CB
MT5C1009CW-120L883C
5962-8959805MYA
3/
54230
3/
0EU86
S128K8L-120MS
EDI88128LPS120NB
L7C108YMB25
MT5C1009SOJ-120L883C
5962-8959805MZA
3/
3/
54230
3/
0EU86
S128K8L-120ME
MSM8128KXLMC-12
EDI88128LPS120TB
L7C108CMB25
MT5C1009C-120L883C
5962-8959805MUA 3/
54230
0EU86
S128K8L-120ML
EDI88128LPS120LB
MT5C1009EC-120L883C
5962-8959805MTA
3/
3/
54230
3/
0EU86
S128K8L-120MF
MSM8128GXLMC-12
EDI88128LPS120FB
L7C108MMB25
MT5C1009F-120L883C
5962-8959805MNA
3/
3/
MSM8128WXLMC-12
L7C108KMB25
5962-8959805MMA
0EU86
MT5C1009ECA-120L883C
5962-8959805M9A 3/
MSM8128JXLMC-12
5962-8959805M8A
54230
EDI88128LPS120ZB
5962-8959805M7A 0EU86
MT5C1009DCJ-120L883C
5962-8959806MXA
3/
3/
54230
0EU86
S128K8L-100MC
MSM8128SXLMC-10
EDI88128LPS100CB
MT5C1009CW-100L883C
See footnotes at end of table.
4 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959806MYA
3/
54230
3/
0EU86
S128K8L-100MS
EDI88128LPS100NB
L7C108YMB25
MT5C1009SOJ-100L883C
5962-8959806MZA
3/
3/
54230
3/
0EU86
S128K8L-100ME
MSM8128KXLMC-10
EDI88128LPS100TB
L7C108CMB25
MT5C1009C-100L883C
5962-8959806MUA 3/
54230
0EU86
S128K8L-100ML
EDI88128LPS100LB
MT5C1009EC-100L883C
5962-8959806MTA
3/
3/
54230
3/
0EU86
S128K8L-100MF
MSM8128GXLMC-10
EDI88128LPS100FB
L7C108MMB25
MT5C1009F-100L883C
5962-8959806MNA
3/
3/
MSM8128WXLMC-10
L7C108KMB25
5962-8959806MMA
0EU86
MT5C1009ECA-100L883C
5962-8959806M9A 3/
MSM8128JXLMC-10
5962-8959806M8A
54230
EDI88128LPS100ZB
5962-8959806M7A 0EU86
MT5C1009DCJ-100L883C
5962-8959807MXA
3/
3/
54230
0EU86
S128K8L-85MC
MSM8128SXLMC-85
EDI88128LPS85CB
MT5C1009CW-85L883C
5962-8959807MYA
3/
54230
3/
0EU86
S128K8L-85MS
EDI88128LPS85NB
L7C108YMB25
MT5C1009SOJ-85L883C
See footnotes at end of table.
5 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959807MZA
3/
3/
54230
3/
0EU86
S128K8L-85ME
MSM8128KXLMC-85
EDI88128LPS85TB
L7C108CMB25
MT5C1009C-85L883C
5962-8959807MUA 3/
54230
0EU86
S128K8L-85ML
EDI88128LPS85LB
MT5C1009EC-85L883C
5962-8959807MTA
3/
3/
54230
3/
0EU86
S128K8L-85MF
MSM8128GXLMC-85
EDI88128LPS85FB
L7C108MMB25
MT5C1009F-85L883C
5962-8959807MNA
3/
3/
MSM8128WXLMC-85
L7C108KMB25
5962-8959807MMA
0EU86
MT5C1009ECA-85L883C
5962-8959807M9A 3/
MSM8128JXLMC-85
5962-8959807M8A
54230
EDI88128LPS85ZB
5962-8959807M7A 0EU86
MT5C1009DCJ-85L883C
5962-8959808MXA
3/
3/
54230
0EU86
S128K8L-70MC
MSM8128SXLMC-70
EDI88128LPS70CB
MT5C1009CW-70L883C
5962-8959808MYA
3/
54230
3/
0EU86
S128K8L-70MS
EDI88128LPS70NB
L7C108YMB25
MT5C1009SOJ-70L883C
5962-8959808MZA
3/
3/
54230
3/
0EU86
S128K8L-70ME
MSM8128KXLMC-70
EDI88128LPS70TB
L7C108CMB25
MT5C1009C-70L883C
See footnotes at end of table.
6 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959808MUA 3/
54230
0EU86
S128K8L-70ML
EDI88128LPS70LB
MT5C1009EC-70L883C
5962-8959808MTA
3/
3/
54230
3/
0EU86
S128K8L-70MF
MSM8128GXLMC-70
EDI88128LPS70FB
L7C108MMB25
MT5C1009F-70L883C
5962-8959808MNA
3/
3/
MSM8128WXLMC-70
L7C108KMB25
5962-8959808MMA
0EU86
MT5C1009ECA-70L883C
5962-8959808M9A 3/
MSM8128JXLMC-70
5962-8959808M8A
54230
EDI88128LPS70ZB
5962-8959808M7A 0EU86
MT5C1009DCJ-70L883C
5962-8959809MXA
3/
3/
3/
54230
0EU86
S128K8L-55MC
MSM8128SXLMC-55
PDM41024L55CE0B
EDI88128LPS55CB
MT5C1009CW-55L883C
5962-8959809MYA
3/
54230
3/
0EU86
S128K8L-55MS
EDI88128LPS55NB
L7C108YMB25
MT5C1009SOJ-55L883C
5962-8959809MZA
3/
3/
54230
3/
0EU86
S128K8L-55ME
MSM8128KXLMC-55
EDI88128LPS55TB
L7C108CMB25
MT5C1009C-55L883C
5962-8959809MUA 3/
54230
0EU86
S128K8L-55ML
EDI88128LPS55LB
MT5C1009EC-55L883C
5962-8959809MTA
3/
3/
54230
3/
0EU86
S128K8L-55MF
MSM8128GXLMC-55
EDI88128LPS55FB
L7C108MMB25
MT5C1009F-55L883C
See footnotes at end of table.
7 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959809MNA
3/
3/
MSM8128WXLMC-55
L7C108KMB25
5962-8959809MMA
0EU86
MT5C1009ECA-55L883C
5962-8959809M9A 3/
MSM8128JXLMC-55
5962-8959809M8A
54230
EDI88128LPS55ZB
5962-8959809M7A 0EU86
MT5C1009DCJ-55L883C
5962-8959810MXA
3/
3/
3/
54230
0EU86
S128K8L-45MC
MSM8128SXLMC-45
PDM41024L45CE0B
EDI88128LPS45CB
MT5C1009CW-45L883C
5962-8959810MYA
3/
54230
3/
0EU86
S128K8L-45MS
EDI88128LPS45NB
L7C108YMB25
MT5C1009SOJ-45L883C
5962-8959810MZA
3/
3/
54230
3/
0EU86
S128K8L-45ME
MSM8128KXLMC-45
EDI88128LPS45TB
L7C108CMB25
MT5C1009C-45L883C
5962-8959810MUA 3/
54230
0EU86
S128K8L-45ML
EDI88128LPS45LB
MT5C1009EC-45L883C
5962-8959810MTA
3/
3/
54230
3/
0EU86
S128K8L-45MF
MSM8128GXLMC-45
EDI88128LPS45FB
L7C108MMB25
MT5C1009F-45L883C
5962-8959810MNA
3/
3/
MSM8128WXLMC-45
L7C108KMB25
5962-8959810MMA
0EU86
MT5C1009ECA-45L883C
5962-8959810M9A 3/
MSM8128JXLMC-45
5962-8959810M8A
54230
EDI88128LPS45ZB
See footnotes at end of table.
8 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959810M7A 0EU86
MT5C1009DCJ-45L883C
5962-8959811MXA
3/
3/
3/
54230
0EU86
S128K8L-35MC
MSM8128SXLMC-35
PDM41024L35CE0B
EDI88128LPS35CB
MT5C1009CW-35L883C
5962-8959811MYA
3/
54230
3/
0EU86
S128K8L-35MS
EDI88128LPS35NB
L7C108YMB25
MT5C1009SOJ-35L883C
5962-8959811MZA
3/
3/
54230
3/
0EU86
S128K8L-35ME
MSM8128KXLMC-35
EDI88128LPS35TB
L7C108CMB25
MT5C1009C-35L883C
5962-8959811MUA 3/
54230
0EU86
S128K8L-35ML
EDI88128LPS35LB
MT5C1009EC-35L883C
5962-8959811MTA
3/
3/
54230
3/
0EU86
S128K8L-35MF
MSM8128GXLMC-35
EDI88128LPS35FB
L7C108MMB25
MT5C1009F-35L883C
5962-8959811MNA
3/
3/
MSM8128WXLMC-35
L7C108KMB25
5962-8959811MMA
0EU86
MT5C1009ECA-35L883C
5962-8959811M9A 3/
MSM8128JXLMC-35
5962-8959811M8A
54230
EDI88128LPS35ZB
5962-8959811M7A 0EU86
MT5C1009DCJ-35L883C
See footnotes at end of table.
9 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959812MXA
3/
3/
3/
54230
0EU86
S128K8L-25MC
MSM8128SXLMC-25
PDM41024L25CE0B
EDI88128LPS25CB
MT5C1009CW-25L883C
5962-8959812MYA
3/
54230
3/
0EU86
S128K8L-25MS
EDI88128LPS25NB
L7C108YMB25
MT5C1009SOJ-25L883C
5962-8959812MZA
3/
3/
54230
3/
0EU86
S128K8L-25ME
MSM8128KXLMC-25
EDI88128LPS25TB
L7C108CMB25
MT5C1009C-25L883C
5962-8959812MUA 3/
54230
0EU86
S128K8L-25ML
EDI88128LPS25LB
MT5C1009EC-25L883C
5962-8959812MTA
3/
3/
54230
3/
0EU86
S128K8L-25MF
MSM8128GXLMC-25
EDI88128LPS25FB
L7C108MMB25
MT5C1009F-25L883C
5962-8959812MNA
3/
3/
MSM8128WXLMC-25
L7C108KMB25
5962-8959812MMA
0EU86
MT5C1009ECA-25L883C
5962-8959812M9A 3/
MSM8128JXLMC-25
5962-8959812M8A
54230
EDI88128LPS25ZB
5962-8959812M7A 0EU86
MT5C1009DCJ-25L883C
See footnotes at end of table.
10 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959813MXA
3/
3/
0EU86
54230
3DDT2
S128K8TL-120MC
MSM8128SLMC-12
MT5C1008CW-120L883C
EDI88130LPS120CB
P4C1024L-120C6MB
5962-8959813MYA
3/
54230
3/
0EU86
3DDT2
S128K8TL-120MS
EDI88130LPS120NB
L7C108YMB25
MT5C1008SOJ-120L883C
P4C1024L-120CJMB
5962-8959813MZA
3/
3/
0EU86
54230
65786
3/
3/
3DDT2
S128K8TL-120ME
MSM8128KLMC-12
MT5C1008C-120L883C
EDI88130LPS120TB
CY7C1009L-120DMB
MMC965608V120/883
L7C108CMB25
P4C1024L-120C4MB
5962-8959813MUA 3/
0EU86
54230
S128K8TL-120ML
MT5C1008EC-120L883C
EDI88130LPS120LB
5962-8959813MTA
3/
3/
0EU86
54230
3/
3DDT2
S128K8TL-120MF
MSM8128GLMC-12
MT5C1008F-120L883C
EDI88130LPS120FB
L7C108MMB25
P4C1024L-120FSMB
5962-8959813MTC 3/
MMDJ65608V120/883
5962-8959813MNA
3/
3/
MSM8128WLMC-12
L7C108KMB25
5962-8959813MMA
0EU86
65786
54230
3DDT2
MT5C1008ECA-120L883C
CY7C1009L-120LMB
EDI88130LPS120L32B
P4C1024L-120LMB
5962-8959813M9A 3/
MSM8128JLMC-12
5962-8959813M7A 0EU86
MT5C1008DCJ-120L883C
See footnotes at end of table.
11 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959814MXA
3/
3/
0EU86
54230
3DTT2
S128K8TL-100MC
MSM8128SLMC-10
MT5C1008CW-100L883C
EDI88130LPS100CB
P4C1024L-100C6MB
5962-8959814MYA
3/
54230
3/
0EU86
3DTT2
S128K8TL-100MS
EDI88130LPS100NB
L7C108YMB25
MT5C1008SOJ-100L883C
P4C1024L-100CJMB
5962-8959814MZA
3/
3/
0EU86
54230
65786
3/
3/
3DTT2
S128K8TL-100ME
MSM8128KLMC-10
MT5C1008C-100L883C
EDI88130LPS100TB
CY7C1009L-100DMB
MMC965608V100/883
L7C108CMB25
P4C1024L-100C4MB
5962-8959814MUA 3/
0EU86
54230
S128K8TL-100ML
MT5C1008EC-100L883C
EDI88130LPS100LB
5962-8959814MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8TL-100MF
MSM8128GLMC-10
MT5C1008F-100L883C
EDI88130LPS100FB
L7C108MMB25
P4C1024L-100FSMB
5962-8959814MTC 3/
MMDJ65608V100/883
5962-8959814MNA
3/
3/
MSM8128WLMC-10
L7C108KMB25
5962-8959814MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-100L883C
CY7C1009L-100LMB
EDI88130LPS100L32B
P4C1024L-100LMB
5962-8959814M9A 3/
MSM8128JLMC-10
5962-8959814M7A 0EU86
MT5C1008DCJ-100L883C
See footnotes at end of table.
12 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959815MXA
3/
3/
0EU86
54230
3DTT2
S128K8TL-85MC
MSM8128SLMC-85
MT5C1008CW-85L883C
EDI88130LPS85CB
P4C1024L-85C6MB
5962-8959815MYA
3/
54230
3/
0EU86
3DTT2
S128K8TL-85MS
EDI88130LPS85NB
L7C108YMB25
MT5C1008SOJ-85L883C
P4C1024L-85CJMB
5962-8959815MZA
3/
3/
0EU86
54230
65786
3/
3/
3DTT2
S128K8TL-85ME
MSM8128KLMC-85
MT5C1008C-85L883C
EDI88130LPS85TB
CY7C1009L-85DMB
MMC965608V85/883
L7C108CMB25
P4C1024L-85C4MB
5962-8959815MUA 3/
0EU86
54230
S128K8TL-85ML
MT5C1008EC-85L883C
EDI88130LPS85LB
5962-8959815MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8TL-85MF
MSM8128GLMC-85
MT5C1008F-85L883C
EDI88130LPS85FB
L7C108MMB25
P4C1024L-85FSMB
5962-8959815MTC 3/
MMDJ65608V85/883
5962-8959815MNA
3/
3/
MSM8128WLMC-85
L7C108KMB25
5962-8959815MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-85L883C
CY7C1009L-85LMB
EDI88130LPS85L32B
P4C1024L-85LMB
5962-8959815M9A 3/
MSM8128JLMC-85
5962-8959815M7A 0EU86
MT5C1008DCJ-85L883C
See footnotes at end of table.
13 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959816MXA
3/
3/
0EU86
54230
3DTT2
S128K8TL-70MC
MSM8128SLMC-70
MT5C1008CW-70L883C
EDI88130LPS70CB
P4C1024L-70C6MB
5962-8959816MYA
3/
54230
3/
0EU86
3DTT2
S128K8TL-70MS
EDI88130LPS70NB
L7C108YMB25
MT5C1008SOJ-70L883C
P4C1024L-70CJMB
5962-8959816MZA
3/
3/
0EU86
54230
65786
3/
3/
3DTT2
S128K8TL-70ME
MSM8128KLMC-70
MT5C1008C-70L883C
EDI88130LPS70TB
CY7C1009L-70DMB
MMC965608V70/883
L7C108CMB25
P4C1024L-70C4MB
5962-8959816MUA 3/
0EU86
54230
S128K8TL-70ML
MT5C1008EC-70L883C
EDI88130LPS70LB
5962-8959816MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8TL-70MF
MSM8128GLMC-70
MT5C1008F-70L883C
EDI88130LPS70FB
L7C108MMB25
P4C1024L-70FSMB
5962-8959816MTC 3/
MMDJ65608V70/883
5962-8959816MNA
3/
3/
MSM8128WLMC-70
L7C108KMB25
5962-8959816MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-70L883C
CY7C1009L-70LMB
EDI88130LPS70L32B
P4C1024L-70LMB
5962-8959816M9A 3/
MSM8128JLMC-70
5962-8959816M7A 0EU86
MT5C1008DCJ-70L883C
See footnotes at end of table.
14 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959817MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8TL-55MC
MSM8128SLMC-55
PDM41024L55CB
MT5C1008CW-55L883C
EDI88130LPS55CB
P4C1024L-55C6MB
5962-8959817MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8TL-55MS
EDI88130LPS55NB
L7C108YMB25
NS41024L55S/883
MT5C1008SOJ-55L883C
P4C1024L-55CJMB
5962-8959817MZA
3/
3/
3/
0EU86
54230
65786
3/
3/
3/
3DTT2
0C7V7
S128K8TL-55ME
MSM8128KLMC-55
PDM41024L55CB
MT5C1008C-55L883C
EDI88130LPS55TB
CY7C1009L-55DMB
MMC965608V55/883
L7C108CMB25
NS41024L55D/883
P4C1024L-55C4MB
QP7C1009BL-55DMB
5962-8959817MUA 3/
0EU86
54230
3/
S128K8TL-55ML
MT5C1008EC-55L883C
EDI88130LPS55LB
NS41024L55Y/883
5962-8959817MTA
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8TL-55MF
MSM8128GLMC-55
MT5C1008F-55L883C
EDI88130LPS55FB
L7C108MMB25
NS41024L55F/883
P4C1024L-55FSMB
QP7C1009BL-55FMB
5962-8959817MTC 3/
MMDJ65608V55/883
5962-8959817MNA
3/
3/
MSM8128WLMC-55
L7C108KMB25
5962-8959817MMA 3/
3/
0EU86
65786
54230
3DTT2
0C7V7
PDM41024L55L32B
NS41024L55E/883
MT5C1008ECA-55L883C
CY7C1009L-55LMB
EDI88130LPS55L32B
P4C1024L-55LMB
QP7C1009BL-55LMB
See footnotes at end of table.
15 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959817M9A 3/
MSM8128JLMC-55
5962-8959817M7A 0EU86
MT5C1008DCJ-55L883C
5962-8959818MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8TL-45MC
MSM8128SLMC-45
PDM41024L45CB
MT5C1008CW-45L883C
EDI88130LPS45CB
P4C1024L-45C6MB
5962-8959818MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8TL-45MS
EDI88130LPS45NB
L7C108YMB25
NS41024L45S/883
MT5C1008SOJ-45L883C
P4C1024L-45CJMB
5962-8959818MZA
3/
3/
3/
0EU86
54230
3/
3/
3/
3DTT2
0C7V7
S128K8TL-45ME
MSM8128KLMC-45
PDM41024L45CB
MT5C1008C-45L883C
EDI88130LPS45TB
CY7C1009L-45DMB
L7C108CMB25
NS41024L45D/883
P4C1024L-45C4MB
QP7C1009BL-45DMB
5962-8959818MZC
F7400
MMC965608V-45MQ
5962-8959818VZC
F7400
SMC965608EV-45SV
5962-8959818MUA 3/
0EU86
54230
3/
S128K8TL-45ML
MT5C1008EC-45L883C
EDI88130LPS45LB
NS41024L45Y/883
5962-8959818MTA
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8TL-45MF
MSM8128GLMC-45
MT5C1008F-45L883C
EDI88130LPS45FB
L7C108MMB25
NS41024L45F/883
P4C1024L-45FSMB
QP7C1009BL-45FMB
See footnotes at end of table.
16 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959818MTC F7400
MMDJ65608EV-45MQ
5962-8959818VTC
F7400
SMDJ65608EV-45SV
5962-8959818MNA
3/
3/
MSM8128WLMC-45
L7C108KMB25
5962-8959818MMA 3/
3/
0EU86
3/
54230
3DTT2
0C7V7
PDM41024L45L32B
NS41024L45E/883
MT5C1008ECA-45L883C
CY7C1009L-45LMB
EDI88130LPS45L32B
P4C1024L-45LMB
QP7C1009BL-45LMB
5962-8959818M9A 3/
MSM8128JLMC-45
5962-8959818M7A
0EU86
MT5C1008DCJ-45L883C
5962-8959819MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8TL-35MC
MSM8128SLMC-35
PDM41024L35CB
MT5C1008CW-35L883C
EDI88130LPS35CB
P4C1024L-35C6MB
5962-8959819MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8TL-35MS
EDI88130LPS35NB
L7C108YMB25
NS41024L35S/883
MT5C1008SOJ-35L883C
P4C1024L-35CJMB
5962-8959819MZA
3/
3/
3/
0EU86
54230
3/
3/
3/
3/
3DTT2
0C7V7
S128K8TL-35ME
MSM8128KLMC-35
PDM41024L35CB
MT5C1008C-35L883C
EDI88130LPS35TB
CY7C1009L-35DMB
MMC965608V-35/883
L7C108CMB25
NS41024L35D/883
P4C1024L-35C4MB
QP7C1009BL-35DMB
5962-8959819VZC 3/
SMC965608EV-35SV
See footnotes at end of table.
17 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959819MUA 3/
0EU86
54230
3/
S128K8TL-35ML
MT5C1008EC-35L883C
EDI88130LPS35LB
NS41024L35Y/883
5962-8959819MTA
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8TL-35MF
MSM8128GLMC-35
MT5C1008F-35L883C
EDI88130LPS35FB
L7C108MMB25
NS41024L35F/883
P4C1024L-35FSMB
QP7C1009BL-35FMB
5962-8959819MTC 3/
MMDJ65608EV-35MQ
5962-8959819VTC 3/
SMDJ65608EV-35SV
5962-8959819MNA
3/
3/
MSM8128WLMC-35
L7C108KMB25
5962-8959819MMA 3/
3/
0EU86
3/
54230
3DTT2
0C7V7
PDM41024L35L32B
NS41024L35E/883
MT5C1008ECA-35L883C
CY7C1009L-35LMB
EDI88130LPS35L32B
P4C1024L-35LMB
QP7C1009BL-35LMB
5962-8959819M9A 3/
MSM8128JLMC-35
5962-8959819M7A
0EU86
MT5C1008DCJ-35L
5962-8959820MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8TL-25MC
MSM8128SLMC-25
PDM41024L25CB
MT5C1008CW-25L883C
EDI88130LPS25CB
P4C1024L-25C6MB
5962-8959820MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8TL-25MS
EDI88130LPS25NB
L7C108YMB25
NS41024L25S/883
MT5C1008SOJ-25L883C
P4C1024L-25CJMB
See footnotes at end of table.
18 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959820MZA
3/
3/
3/
0EU86
54230
3/
3/
3/
3/
3/
3DTT2
0C7V7
S128K8TL-25ME
MSM8128KLMC-25
PDM41024L25CB
MT5C1008C-25L883C
EDI88130LPS25TB
CY7C1009L-25DMB
MMC965608V25/883
L7C108CMB25
SMJ5C1008L-25JDCM
NS41024L25D/883
P4C1024L-25C4MB
QP7C1009BL-25DMB
5962-8959820MUA 3/
0EU86
54230
3/
S128K8TL-25ML
MT5C1008EC-25L883C
EDI88130LPS25LB
NS41024L25Y/883
5962-8959820MTA
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8TL-25MF
MSM8128GLMC-25
MT5C1008F-25L883C
EDI88130LPS25FB
L7C108MMB25
NS41024L25F/883
P4C1024L-25FSMB
QP7C1009BL-25FMB
5962-8959820MTC 3/
MMDJ65608EV25/883
5962-8959820MNA
3/
3/
MSM8128WLMC-25
L7C108KMB25
5962-8959820MMA 3/
3/
0EU86
3/
54230
3DTT2
0C7V7
PDM41024L25L32B
NS41024L25E/883
MT5C1008ECA-25L883C
CY7C1009L-25LMB
EDI88130LPS25L32B
P4C1024L-25LMB
QP7C1009BL-25LMB
5962-8959820M9A 3/
MSM8128JLMC-25
5962-8959820M7A
0EU86
MT5C1008DCJ-25L883C
5962-8959821MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8TL-20MC
MSM8128SLMC-20
PDM41024L20CB
MT5C1008CW-20L883C
EDI88130LPS20CB
P4C1024L-20C6MB
See footnotes at end of table.
19 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959821MYA
3/
54230
3/
0EU86
3DTT2
S128K8TL-20MS
EDI88130LPS20NB
NS41024L20S/883
MT5C1008SOJ-20L883C
P4C1024L-20CJMB
5962-8959821MZA
3/
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8TL-20ME
MSM8128KLMC-20
PDM41024L20CB
MT5C1008C-20L883C
EDI88130LPS20TB
CY7C1009L-20DMB
NS41024L20D/883
P4C1024L-20C4MB
QP7C1009BL-20DMB
5962-8959821MUA 3/
0EU86
54230
3/
S128K8TL-20ML
MT5C1008EC-20L883C
EDI88130LPS20LB
NS41024L20Y/883
5962-8959821MTA
3/
3/
0EU86
54230
3/
3DTT2
0C7V7
S128K8TL-20MF
MSM8128GLMC-20
MT5C1008F-20L883C
EDI88130LPS20FB
NS41024L20F/883
P4C1024L-20FSMB
QP7C1009BL-20FMB
5962-8959821MNA 3/
MSM8128WLMC-20
5962-8959821MMA 3/
3/
0EU86
3/
54230
3DTT2
0C7V7
PDM41024L20L32B
NS41024L20E/883
MT5C1008ECA-20L883C
CY7C1009L-20LMB
EDI88130LPS20L32B
P4C1024L-20LMB
QP7C1009BL-20LMB
5962-8959821M9A 3/
MSM8128JLMC-20
5962-8959821M7A
0EU86
MT5C1008DCJ-20L883C
5962-8959822MXA
3/
3/
0EU86
54230
S128K8-120MC
MSM8128SXMC-12
MT5C1009CW-120883C
EDI88128CS120CB
5962-8959822MYA 3/
54230
3/
0EU86
S128K8-120MS
EDI88128CS120NB
L7C108YMB25
MT5C1009SOJ-120883C
See footnotes at end of table.
20 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959822MZA
3/
3/
3/
0EU86
54230
S128K8-120ME
MSM8128KXMC-12
L7C108CMB25
MT5C1009C-120883C
EDI88128CS120TB
5962-8959822MUA 3/
0EU86
54230
S128K8-120ML
MT5C1009EC-120883C
EDI88128CS120LB
5962-8959822MTA
3/
3/
0EU86
54230
3/
S128K8-120MF
MSM8128GXMC-12
MT5C1009F-120883C
EDI88128CS120FB
L7C108MMB25
5962-8959822MNA 3/
3/
MSM8128WXMC-12
L7C108KMB25
5962-8959822MNC 3/
L7C108KMB25
5962-8959822MMA
0EU86
MT5C1009ECA-120883C
5962-8959822M9A 3/
MSM8128JXMC-12
5962-8959822M8A
54230
EDI88128CS120ZB
5962-8959822M7A
0EU86
MT5C1009DCJ-120883C
5962-8959823MXA
3/
3/
0EU86
54230
S128K8-100MC
MSM8128SXMC-10
MT5C1009CW-100883C
EDI88128CS100CB
5962-8959823MYA
3/
54230
3/
0EU86
S128K8-100MS
EDI88128CS100NB
L7C108YMB25
MT5C1009SOJ-100883C
5962-8959823MZA
3/
3/
3/
0EU86
54230
S128K8-100ME
MSM8128KXMC-10
L7C108CMB25
MT5C1009C-100883C
EDI88128CS100TB
5962-8959823MUA 3/
0EU86
54230
S128K8-100ML
MT5C1009EC-100883C
EDI88128CS100LB
See footnotes at end of table.
21 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959823MTA
3/
3/
0EU86
54230
3/
S128K8-100MF
MSM8128GXMC-10
MT5C1009F-100883C
EDI88128CS100FB
L7C108MMB25
5962-8959823MNA 3/
3/
MSM8128WXMC-10
L7C108KMB25
5962-8959823MNC 3/
L7C108KMB25
5962-8959823MMA
0EU86
MT5C1009ECA-100L883C
5962-8959823M9A 3/
MSM8128JXMC-10
5962-8959823M8A
54230
EDI88128CS100ZB
5962-8959823M7A
0EU86
MT5C1009DCJ-100883C
5962-8959824MXA
3/
3/
0EU86
54230
S128K8-85MC
MSM8128SXMC-85
MT5C1009CW-85883C
EDI88128CS85CB
5962-8959824MYA
3/
54230
3/
0EU86
S128K8-85MS
EDI88128CS85NB
L7C108YMB25
MT5C1009SOJ-85883C
5962-8959824MZA
3/
3/
3/
0EU86
54230
S128K8-85ME
MSM8128KXMC-85
L7C108CMB25
MT5C1009C-85883C
EDI88128CS85TB
5962-8959824MUA 3/
0EU86
54230
S128K8-85ML
MT5C1009EC-85883C
EDI88128CS85LB
5962-8959824MTA
3/
3/
0EU86
54230
3/
S128K8-85MF
MSM8128GXMC-85
MT5C1009F-85883C
EDI88128CS85FB
L7C108MMB25
5962-8959824MNA 3/
3/
MSM8128WXMC-85
L7C108KMB25
5962-8959824MNC 3/
L7C108KMB25
5962-8959824MMA
0EU86
MT5C1009ECA-85883C
See footnotes at end of table.
22 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959824M9A 3/
MSM8128JXMC-85
5962-8959824M8A
54230
EDI88128CS85ZB
5962-8959824M7A
0EU86
MT5C1009DCJ-85883C
5962-8959825MXA
3/
3/
0EU86
54230
S128K8-70MC
MSM8128SXMC-70
MT5C1009CW-70883C
EDI88128CS70CB
5962-8959825MYA
3/
54230
3/
0EU86
S128K8-70MS
EDI88128CS70NB
L7C108YMB25
MT5C1009SOJ-70883C
5962-8959825MZA
3/
3/
3/
0EU86
54230
S128K8-70ME
MSM8128KXMC-70
L7C108CMB25
MT5C1009C-70883C
EDI88128CS70TB
5962-8959825MUA 3/
0EU86
54230
S128K8-70ML
MT5C1009EC-70883C
EDI88128CS70LB
5962-8959825MTA
3/
3/
0EU86
54230
3/
S128K8-70MF
MSM8128GXMC-70
MT5C1009F-70883C
EDI88128CS70FB
L7C108MMB25
5962-8959825MNA 3/
3/
MSM8128WXMC-70
L7C108KMB25
5962-8959825MNC 3/
L7C108KMB25
5962-8959825MMA
0EU86
MT5C1009ECA-70883C
5962-8959825M9A 3/
MSM8128JXMC-70
5962-8959825M8A
54230
EDI88128CS70ZB
5962-8959825M7A
0EU86
MT5C1009DCJ-70883C
See footnotes at end of table.
23 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959826MXA
3/
3/
3/
0EU86
54230
S128K8-55MC
MSM8128SXMC-55
PDM41024S55CE0B
MT5C1009CW-55883C
EDI88128CS55CB
5962-8959826MYA
3/
54230
3/
0EU86
S128K8-55MS
EDI88128CS55NB
L7C108YMB25
MT5C1009SOJ-55883C
5962-8959826MZA
3/
3/
3/
0EU86
54230
S128K8-55ME
MSM8128KXMC-55
L7C108CMB25
MT5C1009C-55883C
EDI88128CS55TB
5962-8959826MUA 3/
0EU86
54230
S128K8-55ML
MT5C1009EC-55883C
EDI88128CS55LB
5962-8959826MTA
3/
3/
0EU86
54230
3/
S128K8-55MF
MSM8128GXMC-55
MT5C1009F-55883C
EDI88128CS55FB
L7C108MMB25
5962-8959826MNA 3/
3/
MSM8128WXMC-55
L7C108KMB25
5962-8959826MNC 3/
L7C108KMB25
5962-8959826MMA
0EU86
MT5C1009ECA-55883C
5962-8959826M9A 3/
MSM8128JXMC-55
5962-8959826M8A
54230
EDI88128CS55ZB
5962-8959826M7A
0EU86
MT5C1009DCJ-55883C
5962-8959827MXA
3/
3/
3/
0EU86
54230
S128K8-45MC
MSM8128SXMC-45
PDM41024S45CE0B
MT5C1009CW-45883C
EDI88128CS45CB
5962-8959827MYA
3/
54230
3/
0EU86
S128K8-45MS
EDI88128CS45NB
L7C108YMB25
MT5C1009SOJ-45883C
See footnotes at end of table.
24 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959827MZA
3/
3/
3/
0EU86
54230
S128K8-45ME
MSM8128KXMC-45
L7C108CMB25
MT5C1009C-45883C
EDI88128CS45TB
5962-8959827MUA 3/
0EU86
54230
S128K8-45ML
MT5C1009EC-45883C
EDI88128CS45LB
5962-8959827MTA
3/
3/
0EU86
54230
3/
S128K8-45MF
MSM8128GXMC-45
MT5C1009F-45883C
EDI88128CS45FB
L7C108MMB25
5962-8959827MNA 3/
3/
MSM8128WXMC-45
L7C108KMB25
5962-8959827MNC 3/
L7C108KMB25
5962-8959827MMA
0EU86
MT5C1009ECA-45883C
5962-8959827M9A 3/
MSM8128JXMC-45
5962-8959827M8A
54230
EDI88128CS45ZB
5962-8959827M7A
0EU86
MT5C1009DCJ-45883C
5962-8959828MXA
3/
3/
3/
0EU86
54230
S128K8-35MC
MSM8128SXMC-35
PDM41024S35CE0B
MT5C1009CW-35883C
EDI88128CS35CB
5962-8959828MYA
3/
54230
3/
0EU86
S128K8-35MS
EDI88128CS35NB
L7C108YMB25
MT5C1009SOJ-35883C
5962-8959828MZA
3/
3/
3/
0EU86
54230
S128K8-35ME
MSM8128KXMC-35
L7C108CMB25
MT5C1009C-35883C
EDI88128CS35TB
5962-8959828MUA 3/
0EU86
54230
S128K8-35ML
MT5C1009EC-35883C
EDI88128CS35LB
See footnotes at end of table.
25 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959828MTA
3/
3/
0EU86
54230
3/
S128K8-35MF
MSM8128GXMC-35
MT5C1009F-35883C
EDI88128CS35FB
L7C108MMB25
5962-8959828MNA 3/
3/
MSM8128WXMC-35
L7C108KMB25
5962-8959828MNC 3/
L7C108KMB25
5962-8959828MMA
0EU86
MT5C1009ECA-35883C
5962-8959828M9A 3/
MSM8128JXMC-35
5962-8959828M8A
54230
EDI88128CS35ZB
5962-8959828M7A
0EU86
MT5C1009DCJ-35883C
5962-8959829MXA
3/
3/
3/
0EU86
54230
S128K8-25MC
MSM8128SXMC-25
PDM41024S25CE0B
MT5C1009CW-25883C
EDI88128CS25CB
5962-8959829MYA
3/
54230
3/
0EU86
S128K8-25MS
EDI88128CS25NB
L7C108YMB25
MT5C1009SOJ-25883C
5962-8959829MZA
3/
3/
3/
0EU86
54230
S128K8-25ME
MSM8128KXMC-25
L7C108CMB25
MT5C1009C-25883C
EDI88128CS25TB
5962-8959829MUA 3/
0EU86
54230
S128K8-25ML
MT5C1009EC-25883C
EDI88128CS25LB
5962-8959829MTA
3/
3/
0EU86
54230
3/
S128K8-25MF
MSM8128GXMC-25
MT5C1009F-25883C
EDI88128CS25FB
L7C108MMB25
5962-8959829MNA 3/
3/
MSM8128WXMC-25
L7C108KMB25
5962-8959829MNC 3/
L7C108KMB25
See footnotes at end of table.
26 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959829MMA
0EU86
MT5C1009ECA-25883C
5962-8959829M9A 3/
MSM8128JXMC-25
5962-8959829M8A
54230
EDI88128CS25ZB
5962-8959829M7A
0EU86
MT5C1009DCJ-25883C
5962-8959830MXA
3/
3/
0EU86
54230
3DTT2
S128K8-120MC
MSM8128SMC-12
MT5C1008CW-120883C
EDI88130CS120CB
P4C1024-120C6MB
5962-8959830MYA
3/
54230
3/
0EU86
3DTT2
S128K8-120MS
EDI88130CS120NB
L7C109YMB25
MT5C1008SOJ-120883C
P4C1024-120CJMB
5962-8959830MZA
3/
3/
3/
0EU86
54230
65786
3/
3DTT2
S128K8-120ME
MSM8128KMC-12
L7C109CMB25
MT5C1008C-120883C
EDI88130CS120TB
CY7C1009-120DMB
MMC965608L120/883
P4C1024-120C4MB
5962-8959830MUA 3/
0EU86
54230
S128K8-120ML
MT5C1008EC-120883C
EDI88130CS120LB
5962-8959830MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8-120MF
MSM8128GMC-12
MT5C1008F-120883C
EDI88130CS120FB
L7C109MMB25
P4C1024-120FSMB
5962-8959830MTC 3/
MMDJ65608L120/883
5962-8959830MNA 3/
3/
MSM8128WMC-12
L7C109KMB25
5962-8959830MNC 3/
L7C109KMB25
5962-8959830MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-120883C
CY7C1009-120LMB
EDI88130CS120L32B
P4C1024-120LMB
5962-8959830M9A 3/
MSM8128JMC-12
5962-8959830M7A
0EU86
MT5C1008DCJ-120883C
See footnotes at end of table.
27 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959831MXA
3/
3/
0EU86
54230
3DTT2
S128K8-100MC
MSM8128SMC-10
MT5C1008CW-100883C
EDI88130CS100CB
P4C1024-100C6MB
5962-8959831MYA
3/
54230
3/
0EU86
3DTT2
S128K8-100MS
EDI88130CS100NB
L7C109YMB25
MT5C1008SOJ-100883C
P4C1024-100CJMB
5962-8959831MZA
3/
3/
3/
0EU86
54230
65786
3/
3DTT2
S128K8-100ME
MSM8128KMC-10
L7C109CMB25
MT5C1008C-100883C
EDI88130CS100TB
CY7C1009-100DMB
MMC965608L100/883
P4C1024-100C4MB
5962-8959831MUA 3/
0EU86
54230
S128K8-100ML
MT5C1008EC-100883C
EDI88130CS100LB
5962-8959831MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8-100MF
MSM8128GMC-10
MT5C1008F-100883C
EDI88130CS100FB
L7C109MMB25
P4C1024-100FSMB
5962-8959831MTC 3/
MMDJ65608L100/883
5962-8959831MNA 3/
3/
MSM8128WMC-10
L7C109KMB25
5962-8959831MNC 3/
L7C109KMB25
5962-8959831MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-100883C
CY7C1009-100LMB
EDI88130CS100L32B
P4C1024-100LMB
5962-8959831M9A 3/
MSM8128JMC-10
5962-8959831M7A
0EU86
MT5C1008DCJ-100883C
See footnotes at end of table.
28 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959832MXA
3/
3/
0EU86
54230
3DTT2
S128K8-85MC
MSM8128SMC-85
MT5C1008CW-85883C
EDI88130CS85CB
P4C1024-85C6MB
5962-8959832MYA
3/
54230
3/
0EU86
3DTT2
S128K8-85MS
EDI88130CS85NB
L7C109YMB25
MT5C1008SOJ-85883C
P4C1024-85CJMB
5962-8959832MZA
3/
3/
3/
0EU86
54230
65786
3/
3DTT2
S128K8-85ME
MSM8128KMC-85
L7C109CMB25
MT5C1008C-85883C
EDI88130CS85TB
CY7C1009-85DMB
MMC965608L85/883
P4C1024-85C4MB
5962-8959832MUA 3/
0EU86
54230
S128K8-85ML
MT5C1008EC-85883C
EDI88130CS85LB
5962-8959832MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8-85MF
MSM8128GMC-85
MT5C1008F-85883C
EDI88130CS85FB
L7C109MMB25
P4C1024-85FSMB
5962-8959832MTC 3/
MMDJ65608L85/883
5962-8959832MNA 3/
3/
MSM8128WMC-85
L7C109KMB25
5962-8959832MNC 3/
L7C109KMB25
5962-8959832MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-85883C
CY7C1009-85LMB
EDI88130CS85L32B
P4C1024-85LMB
5962-8959832M9A 3/
MSM8128JMC-85
5962-8959832M7A
0EU86
MT5C1008DCJ-85883C
See footnotes at end of table.
29 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959833MXA
3/
3/
0EU86
54230
3DTT2
S128K8-70MC
MSM8128SMC-70
MT5C1008CW-70883C
EDI88130CS70CB
P4C1024-70C6MB
5962-8959833MYA
3/
54230
3/
0EU86
3DTT2
S128K8-70MS
EDI88130CS70NB
L7C109YMB25
MT5C1008SOJ-70883C
P4C1024-70CJMB
5962-8959833MZA
3/
3/
3/
0EU86
54230
65786
3/
3DTT2
S128K8-70ME
MSM8128KMC-70
L7C109CMB25
MT5C1008C-70883C
EDI88130CS70TB
CY7C1009-70DMB
MMC965608L70/883
P4C1024-70C4MB
5962-8959833MUA 3/
0EU86
54230
S128K8-70ML
MT5C1008EC-70883C
EDI88130CS70LB
5962-8959833MTA
3/
3/
0EU86
54230
3/
3DTT2
S128K8-70MF
MSM8128GMC-70
MT5C1008F-70883C
EDI88130CS70FB
L7C109MMB25
P4C1024-70FSMB
5962-8959833MTC 3/
MMDJ65608L70/883
5962-8959833MNA 3/
3/
MSM8128WMC-70
L7C109KMB25
5962-8959833MNC 3/
L7C109KMB25
5962-8959833MMA
0EU86
65786
54230
3DTT2
MT5C1008ECA-70883C
CY7C1009-70LMB
EDI88130CS70L32B
P4C1024-70LMB
5962-8959833M9A 3/
MSM8128JMC-70
5962-8959833M7A
0EU86
MT5C1008DCJ-70883C
5962-8959834MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8-55MC
MSM8128SMC-55
PDM41024S55CB
MT5C1008CW-55883C
EDI88130CS55CB
P4C1024-55C6MB
See footnotes at end of table.
30 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959834MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8-55MS
EDI88130CS55NB
L7C109YMB25
NS41024S55S/883
MT5C1008SOJ-55883C
P4C1024-55CJMB
5962-8959834MZA
3/
3/
3/
0EU86
3/
54230
3/
3/
3/
65786
3DTT2
0C7V7
S128K8-55ME
MSM8128KMC-55
PDM41024S55TCB
MT5C1008C-55883C
CY7C109A-55DMB
EDI88130CS55TB
L7C109CMB25
MMC965608L55/883
NS41024S55D/883
CY7C1009-55DMB
P4C1024-55C4MB
QP7C1009B-55DMB
5962-8959834MUA 3/
0EU86
3/
54230
3/
S128K8-55ML
MT5C1008EC-55883C
CY7C109A-55LMB
EDI88130CS55LB
NS41024S55Y/883
5962-8959834MTA
3/
3/
0EU86
3/
54230
3/
3/
3DTT2
0C7V7
S128K8-55MF
MSM8128GMC-55
MT5C1008F-55883C
CY7C109A-55FMB
EDI88130CS55FB
L7C109MMB25
NS41024S55F/883
P4C1024-55FSMB
QP7C1009B-55FMB
5962-8959834MTC 3/
MMDJ65608L55/883
5962-8959834MNA 3/
3/
MSM8128WMC-55
L7C109KMB25
5962-8959834MNC 3/
L7C109KMB25
5962-8959834MMA 3/
65786
3/
0EU86
54230
3DTT2
0C7V7
PDM41024S55L32B
CY7C1009-55LMB
NS41024S55E/883
MT5C1008ECA-55883C
EDI88130CS55L32B
P4C1024-55LMB
QP7C1009B-55LMB
5962-8959834M9A 3/
MSM8128JMC-55
5962-8959834M7A
0EU86
MT5C1008DCJ-55883C
See footnotes at end of table.
31 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959835MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8-45MC
MSM8128SMC-45
PDM41024S45CB
MT5C1008CW-45883C
EDI88130CS45CB
P4C1024-45C6MB
5962-8959835MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8-45MS
EDI88130CS45NB
L7C109YMB25
NS41024S45S/883
MT5C1008SOJ-45883C
P4C1024-45CJMB
5962-8959835MZA
3/
3/
3/
0EU86
3/
54230
3/
3/
3/
3/
3DTT2
0C7V7
S128K8-45ME
MSM8128KMC-45
PDM41024S45TCB
MT5C1008C-45883C
CY7C109A-45DMB
EDI88130CS45TB
L7C109CMB25
MMC965608EV45/883
NS41024S45D/883
CY7C1009-45DMB
P4C1024-45C4MB
QP7C1009B-45DMB
5962-8959835MZC 3/
MMC965608EV-45MQ
5962-8959835VZC 3/
SMC965608EV-45SV
5962-8959835MUA 3/
0EU86
3/
54230
3/
S128K8-45ML
MT5C1008EC-45883C
CY7C109A-45LMB
EDI88130CS45LB
NS41024S45Y/883
5962-8959835MTA
3/
3/
0EU86
3/
54230
3/
3/
3DTT2
0C7V7
S128K8-45MF
MSM8128GMC-45
MT5C1008F-45883C
CY7C109A-45FMB
EDI88130CS45FB
L7C109MMB25
NS41024S45F/883
P4C1024-45FSMB
QP7C1009B-45FMB
5962-8959835MTC 3/
MMDJ65608EV-45MQ
5962-8959835VTC 3/
SMDJ65608EV-45SV
5962-8959835MNA 3/
3/
MSM8128WMC-45
L7C109KMB25
See footnotes at end of table.
32 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959835MNC 3/
L7C109KMB25
5962-8959835MMA 3/
65786
3/
0EU86
54230
3DTT2
0C7V7
PDM41024S45L32B
CY7C1009-45LMB
NS41024S45E/883
MT5C1008ECA-45883C
EDI88130CS45L32B
P4C1024-45LMB
QP7C1009B-45LMB
5962-8959835M9A 3/
MSM8128JMC-45
5962-8959835M7A
0EU86
MT5C1008DCJ-45883C
5962-8959836MXA
3/
3/
3/
0EU86
54230
3DTT2
S128K8-35MC
MSM8128SMC-35
PDM41024S35CB
MT5C1008CW-35883C
EDI88130CS35CB
P4C1024-35C6MB
5962-8959836MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8-35MS
EDI88130CS35NB
L7C109YMB25
NS41024S35S/883
MT5C1008SOJ-35883C
P4C1024-35CJMB
5962-8959836MZA
3/
3/
3/
0EU86
3/
54230
3/
3/
3/
3/
3DTT2
0C7V7
S128K8-35ME
MSM8128KMC-35
PDM41024S35TCB
MT5C1008C-35883C
CY7C109A-35DMB
EDI88130CS35TB
L7C109CMB25
MMC965608EV35MQ
NS41024S35D/883
CY7C1009-35DMB
P4C1024-35C4MB
QP7C1009B-35DMB
5962-8959836VZA 3/
SMC965608EV-35SV
5962-8959836MUA 3/
0EU86
3/
54230
3/
S128K8-35ML
MT5C1008EC-35883C
CY7C109A-35LMB
EDI88130CS35LB
NS41024S35Y/883
See footnotes at end of table.
33 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959836MTA
3/
3/
0EU86
3/
54230
3/
3/
3DTT2
0C7V7
S128K8-35MF
MSM8128GMC-35
MT5C1008F-35883C
CY7C109A-35FMB
EDI88130CS35FB
L7C109MMB25
NS41024S35F/883
P4C1024-35FSMB
QP7C1009B-35FMB
5962-8959836MTC 3/
MMDJ65608EV-35MQ
5962-8959836VTC 3/
SMDJ65608EV-35SV
5962-8959836MMA 3/
3/
3/
0EU86
54230
3DTT2
0C7V7
PDM41024S35L32B
CY7C1009-35LMB
NS41024S35E/883
MT5C1008ECA-35883C
EDI88130CS35L32B
P4C1024-35LMB
QP7C1009B-35LMB
5962-8959836M7A
0EU86
MT5C1008DCJ-35883C
5962-8959836MNA 3/
L7C109KMB25
5962-8959836MNC 3/
L7C109KMB25
5962-8959837MXA
3/
3/
3/
0EU86
54230
3/
3DTT2
S128K8-25MC
MSM8128SMC-25
PDM41024S25CB
MT5C1008CW-25883C
EDI88130CS25CB
SMJ5C1008-25JDDM
P4C1024-25C6MB
5962-8959837MYA
3/
54230
3/
3/
0EU86
3DTT2
S128K8-25MS
EDI88130CS25NB
L7C109YMB25
NS41024S25S/883
MT5C1008SOJ-25883C
P4C1024-25CJMB
5962-8959837MZA
3/
3/
3/
0EU86
3/
54230
3/
3/
3/
3/
3DTT2
0C7V7
S128K8-25ME
MSM8128KMC-25
SMJ5C1008-25JDCM
MT5C1008C-25883C
CY7C109A-25DMB
EDI88130CS25TB
L7C109CMB25
MMC965608EV25MQ
NS41024S25D/883
CY7C1009-25DMB
P4C1024-25C4MB
QP7C1009B-25DMB
See footnotes at end of table.
34 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959837MUA 3/
0EU86
3/
54230
3/
3/
S128K8-25ML
MT5C1008EC-25883C
CY7C109A-25LMB
EDI88130CS25LB
NS41024S25Y/883
SMJ5C1008-25HMM
5962-8959837MTA
3/
3/
0EU86
3/
54230
3/
3/
3DTT2
0C7V7
S128K8-25MF
MSM8128GMC-25
MT5C1008F-25883C
CY7C109A-25FMB
EDI88130CS25FB
L7C109MMB25
NS41024S25F/883
P4C1024-25FSMB
QP7C1009B-25FMB
5962-8959837MTC 3/
MMDJ65608L-25MQ
5962-8959837MNA 3/
3/
MSM8128WMC-25
L7C109KMB25
5962-8959837MNC 3/
L7C109KMB25
5962-8959837MMA 3/
3/
3/
0EU86
54230
3DTT2
0C7V7
PDM41024S25L32B
CY7C1009-25LMB
NS41024S25E/883
MT5C1008ECA-25883C
EDI88130CS25L32B
P4C1024-25LMB
QP7C1009B-25LMB
5962-8959837M9A 3/ MSM8128JMC-25
5962-8959837M7A 0EU86 MT5C1008DCJ-25883C
5962-8959838MXA
3/
3/
0EU86
54230
3/
3DTT2
S128K8-20MC
MSM8128SMC-20
MT5C1008CW-20883C
EDI88130CS20CB
SMJ5C1008-20JDDM
P4C1024-20C6MB
5962-8959838MYA
3/
54230
3/
0EU86
3DTT2
S128K8-20MS
EDI88130CS20NB
NS41024S20S/883
MT5C1008SOJ-20883C
P4C1024-20CJMB
5962-8959838MZA
3/
3/
3/
0EU86
54230
3/
3/
3DTT2
0C7V7
S128K8-20ME
MSM8128KMC-20
SMJ5C1008-20JDCM
MT5C1008C-20883C
EDI88130CS20TB
NS41024S20D/883
CY7C1009-20DMB
P4C1024-20C4MB
QP7C1009B-20DMB
See footnotes at end of table.
35 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959838MUA 3/
0EU86
54230
3/
3/
S128K8-20ML
MT5C1008EC-20883C
EDI88130CS20LB
NS41024S20Y/883
SMJ5C1008-20HMM
5962-8959838MTA
3/
3/
0EU86
54230
3/
3DTT2
0C7V7
S128K8-20MF
MSM8128GMC-20
MT5C1008F-20883C
EDI88130CS20FB
NS41024S20F/883
P4C1024-20FSMB
QP7C1009B-20FMB
5962-8959838MNA 3/
MSM8128WMC-20
5962-8959838MMA 3/
3/
3/
0EU86
54230
3DTT2
0C7V7
PDM41024S20L32B
CY7C1009-20LMB
NS41024S20E/883
MT5C1008ECA-20883C
EDI88130CS20L32B
P4C1024-20LMB
QP7C1009B-20LMB
5962-8959838M9A 3/
MSM8128JMC-20
5962-8959838M7A
0EU86
MT5C1008DCJ-20883C
5962-8959839MXA
0EU86
54230
MT5C1009CW-20883C
EDI88128CS20CB
5962-8959839MYA
0EU86
54230
MT5C1009SOJ-20883C
EDI88128CS20NB
5962-8959839MZA
0EU86
54230
MT5C1009C-20883C
EDI88128CS20TB
5962-8959839MUA
0EU86
54230
MT5C1009EC-20883C
EDI88128CS20LB
5962-8959839MTA 0EU86
54230
MT5C1009F-20883C
EDI88128CS20FB
5962-8959839MMA 0EU86 MT5C1009ECA-20883C
5962-8959839M8A 54230 EDI88128CS20ZB
5962-8959839M7A 0EU86 MT5C1009DCJ-20883C
5962-8959840MXA
0EU86
54230
MT5C1009CW-20L883C
EDI88128LPS20CB
5962-8959840MYA
0EU86
54230
MT5C1009SOJ-20L883C
EDI88128LPS20NB
See footnotes at end of table.
36 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959840MZA
0EU86
54230
MT5C1009C-20L883C
EDI88128LPS20TB
5962-8959840MUA
0EU86
54230
MT5C1009EC-20L883C
EDI88128LPS20LB
5962-8959840MTA
0EU86
54230
MT5C1009F-20L883C
EDI88128LPS20FB
5962-8959840MMA
0EU86
MT5C1009ECA-20L883C
5962-8959840M8A
54230
EDI88128LPS20ZB
5962-8959840M7A
0EU86
MT5C1009DCJ-20L883C
5962-8959841MXA
0EU86
MT5C1008CW-15
5962-8959841MYA
0EU86
MT5C1008SOJ-15
5962-8959841MZA
3/
54230
0EU86
0C7V7
CY7C1009-15DMB
EDI88130CS15TB
MT5C1008C-15
QP7C1009B-15DMB
5962-8959841MMA
3/
54230
0EU86
0C7V7
CY7C1009-15LMB
EDI88130CS15L32B
MT5C1008ECA-15
QP7C1009B-15LMB
5962-8959841MTA
0EU86
0C7V7
MT5C1008F-15
QP7C1009B-15FMB
5962-8959841MUA
0EU86
MT5C1008EC-15
5962-8959841M7A
0EU86
MT5C1008DCJ-15
5962-8959842MXA
54230
EDI88128LP70CB
5962-8959842MYA
54230
EDI88128LP70NB
5962-8959843MXA
54230
EDI88128C70CB
5962-8959843MYA
54230
EDI88128C70NB
5962-8959844MXA
0EU86
MT5C1009CW-15
5962-8959844MYA
0EU86
MT5C1009SOJ-15
5962-8959844MZA 54230
0EU86
EDI88128CS15TB
MT5C1009C-15
5962-8959844MMA 0EU86 MT5C1009ECA-15
5962-8959844MTA 0EU86 MT5C1009F-15
See footnotes at end of table.
37 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959844MUA 0EU86
MT5C1009EC-15
5962-8959844M7A 0EU86 MT5C1009DCJ-15
5962-8959845MZA
54230
EDI88130CS12TB
5962-8959845MMA
54230
EDI88130CS12L32B
5962-8959846MZA
54230
EDI88128CS12TB
5962-8959847QZC
F7400
MMC965608EV-30MQ
5962-8959847VZC
F7400
SMC965608EV-30SV
5962-8959847QTC
F7400
MMDJ65608EV-30MQ
5962-8959847VTC
F7400
SMDJ65608EV-30SV
5962-8959847Q9A
F7400
MMD-65608EV-30MQ
5962-8959847V9A
F7400
SMD-65608EV-30SV
5962-8959848MTA
54230
EDI88128LPS15FB
1/ The lead finish shown for each PIN, representing a hermetic package, is the
most readily available from the manufacturer listed for that part. If the desired
lead finish is not listed contact the Vendor to determine availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE Vendor name
Number and address
0EU86 Austin Semiconductor
8701 Cross Park Drive
Austin, TX 78754
65786 Cypress Semiconductor
3901 N. First Street
San Jose, CA 95134-1599
54230 White Electronic Designs Corp.
3601 East University Drive
Phoenix, AZ 85034
F7400 Atmel Nantes,
part of Atmel Wireless and Microcontrollers
La Chantrerie BP 70602
44306 NANTES CEDEX 3
France
MORE VENDORS CONTINUED ON NEXT PAGE
38 of 39
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Vendor CAGE Vendor name
Number and address
0C7V7 QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
3DTT2 Pyramid Semiconductor Corporation
1340 Bordeaux Drive
Sunnyvale, CA 94089
The following table lists the SMD part numbers for die.
Standard
microcircuit drawing
PIN
Vendor
CAGE
number
Vendor
Similar
PIN 1/
5962-8959847Q6A
F7400
MM0-65608EV-30MQ
5962-8959847V6A
F7400
SM0-65608EV-30SV
1/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
F7400 Atmel Nantes,
part of Atmel Wireless and Microcontrollers
La Chantrerie BP 70602
44306 NANTES CEDEX 3
France
The information contained herein is disseminated for convenience only and the
government assumes no liability whatsoev er for any inaccuracies in this
information bulletin.
39 of 39
