CPC2017N 60V Dual Normally-Open Single-Pole 8-Pin SOIC OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 120 16 1 Units VP mArms / mADC mA Features * Designed for use in Security Systems Complying with EN50130-4 * 1500Vrms Input/Output Isolation * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to Radiated EM Fields * Wave Solderable * Tape & Reel Version Available * Small 8-Pin SOIC Package Description The CPC2017N is a miniature device with two independent, normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. The CPC2017N uses IXYS Integrated Circuits Division's state of the art, double-molded, vertical construction packaging to produce one of the world's smallest relays. The CPC2017N offers substantial board space savings over the competitor's larger 8-pin SOIC relay. Approvals Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Approval Pending * EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part # CPC2017N CPC2017NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 8 1 + Control Load 7 2 - Control Load 6 3 + Control Load 4 5 - Control Load Switching Characteristics of Normally-Open (Form-A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2017N-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2017N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 600 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance, Input to Output Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IF=1mA t =10ms IL=120mA VL=60VP IL ILPK RON ILEAK - 7.1 - 120 350 16 1 mArms / mADC mAP IF=0mA, VL=50V, f=1MHz VIO=0V, f=1MHz ton toff COUT CIO - 1.25 0.45 5 1 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.40 0.35 1.2 - 1 1.4 10 IF=5mA, VL=10V A ms pF pF mA mA V A Load current derates linearly from 120mA @ 25oC to 60mA @80oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC2017N PERFORMANCE DATA @ 25C (Unless Otherwise Noted)* 25 20 15 10 5 1.17 15 10 5 1.0 25 Device Count (N) 20 15 10 1.1 1.2 1.3 1.4 1.5 0 5 0.26 0.28 0.30 0.32 0.34 0.36 0.38 Turn-Off Time (ms) Typical IF for Switch Dropout (N=50, IL=120mA) Typical On-Resistance Distribution (N=50, IF=1mA, IL=120mA) 35 30 10 0 10 Turn-On Time (ms) 15 5 15 1.6 20 5 20 0 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=120mA) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 20 15 10 5 0.30 0.35 0.40 0.45 0.50 0.55 0 0.30 0.60 0.35 LED Current (mA) 0.40 0.45 0.50 LED Current (mA) 0.55 0.60 6.8 6.9 7.0 7.1 7.2 7.3 7.4 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 80 82 84 86 88 90 92 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mA) IF=50mA IF=20mA IF=10mA 1.5 1.4 1.3 1.2 1.1 1.0 -40 IF=5mA IF=2mA IF=1mA -20 0 20 40 60 Temperature (C) 80 100 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) 0.7 0.6 Turn-Off Time (ms) 1.6 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2017N PERFORMANCE DATA @ 25C (Unless Otherwise Noted)* Typical IF for Switch Operation vs. Temperature (IL=60mA) 3.5 Turn-On Time (ms) LED Current (mA) 2.5 2.0 1.5 1.0 0.5 0 -40 14 -20 0 20 40 60 Temperature (C) 80 3.0 IF=2mA 2.5 2.0 IF=5mA 1.5 1.0 -40 100 Turn-Off Time (ms) 3.0 Typical Turn-On Time vs. Temperature (IL=50mA) -20 0 20 40 60 Temperature (C) 80 130 100 120 8 Instantaneous IF=5mA 6 50 0 -50 4 -100 2 -40 -150 -1.5 -20 0 20 40 60 Temperature (C) 80 100 91 0.016 89 0.014 87 Leakage (PA) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature 85 83 81 -1.0 -0.5 0 0.5 Load Voltage (V) 1.0 -20 0 20 40 60 Temperature (C) 80 0.008 0.006 0 -40 100 100 90 80 14 0.010 100 80 110 -40 Typical Leakage vs. Temperature (Measured Across Pins 5&6, 7&8) (VL=60V) 0.002 -40 20 40 60 Temperature (C) 60 1.5 0.012 77 0 70 0.004 79 -20 Maximum Load Current vs. Temperature (IF=2mA) Load Current (mA) Steady State IF=2mA 150 Output Capacitance (pF) 10 Load Current (mA) On-Resistance (:) IF=5mA IF=5mA -40 100 IF=2mA 12 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Typical Load Current vs. Load Voltage (IF=1mA) Typical On-Resistance vs. Temperature (IL=60mA) Typical Turn-Off Time vs. Temperature (IL=50mA) -20 0 20 40 60 Temperature (C) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 12 10 8 6 4 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 10 20 30 40 Load Voltage (V) 50 60 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC2017N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2017N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Reflow Cycles CPC2017N 260C for 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2017N MECHANICAL DIMENSIONS CPC2017N 1.016 0.025 (0.040 0.001) 9.347 0.203 (0.368 0.008) Pin 1 2.184 MAX (0.086 MAX) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 0.102 (0.240 0.004) 3.810 0.051 (0.150 0.002) 2.540 TYP (0.100 TYP) 0.203 0.025 (0.008 0.001) 0.432 0.127 (0.017 0.005) 2.54 (0.100) 0.55 (0.022) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 0.102 (0.033 0.004) Dimensions mm (inches) 0.381 0.051 (0.015 0.002) CPC2017NTR Tape & Reel 1.75 0.10 330.2 DIA. (13.00 DIA.) 4.00 0.10 8.00 0.10 2.00 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 0.10 O1.50 +0.1, -0 6.50 9.65 0.10 16.00 0.30 Embossed Carrier 3.50 6.55 0.10 O1.50 MIN Embossment 2.35 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance 0.20. 3. Carrier camber is within 1mm in 250mm. 2.85 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 0.05mm. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2017N-R04 (c)Copyright 2014, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/18/2014