BQ51010BEVM-764 - TEXAS INSTRUMENTS

User's Guide

SLUUAE3A–August 2013–Revised December 2013

bq51010BEVM-764 Evaluation Module (WCSP Package)

The bq51010BEVM-764 (EVM) wireless power receiver evaluation kit from TI is a high-performance, easy-

to-use development kit for the design of wireless power solutions. The EVM helps designers to evaluate

the operation and performance of the bq51010B, 7-V power supply for wireless power transfer. The

bq51010B devices provide AC/DC power conversion and regulation while integrating the digital control

required to comply with the Qi-communication protocol. The kit speeds up the development of end-use

applications.

Contents

1 Considerations with this EVM ............................................................................................. 2

2 Modifications ................................................................................................................. 2

3 Recommended Operation Condition ..................................................................................... 2

4 Equipment and EVM setup ................................................................................................ 3

4.1 Schematic ........................................................................................................... 3

4.2 Connector and Test Point Descriptions ......................................................................... 3

4.3 Jumpers and Switches ............................................................................................ 3

4.4 Test Point Descriptions ............................................................................................ 4

4.5 Pin Description of the IC .......................................................................................... 5

5 Test Procedure .............................................................................................................. 6

5.1 Definition ............................................................................................................ 6

5.2 Recommended Test Equipment ................................................................................. 6

5.3 Equipment Setup ................................................................................................... 7

5.4 Procedure ........................................................................................................... 8

6 Test Results ................................................................................................................ 10

6.1 Load Step .......................................................................................................... 10

6.2 Load Dump ........................................................................................................ 10

6.3 Start-Up ............................................................................................................ 11

6.4 Efficiency .......................................................................................................... 12

6.5 Thermal Performance ............................................................................................ 12

7 Layout and Bill of Material ................................................................................................ 14

7.1 Layout .............................................................................................................. 14

7.2 Bill of Materials (BOM) ........................................................................................... 17

List of Figures

1 HPA764 Schematic......................................................................................................... 3

2 Test Set Up.................................................................................................................. 7

3 Load Step, 0 mA to 600 mA ............................................................................................. 10

4 Load Dump, 500 mA to 0 mA ........................................................................................... 11

5 Start-Up .................................................................................................................... 12

6 Efficiency for the bq51010B versus IOUT ............................................................................... 12

7 Thermal Image............................................................................................................. 13

8 bq51010BEVM-764 Layout Example .................................................................................. 14

9 bq51010BEVM-764 Top Assembly ..................................................................................... 15

10 bq51010BEVM-764 Top Layer .......................................................................................... 15

11 bq51010BEVM-764 Bottom Copper Layer ............................................................................ 16

bqTESLA is a trademark of Texas Instruments, Inc..

SLUUAE3A–August 2013–Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)

Considerations with this EVM

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12 bq51010BEVM-764 Bottom Assembly ................................................................................. 16

List of Tables

1 bq51010BEVM-764 Electrical Performance Specifications ........................................................... 2

2 Pin Description .............................................................................................................. 5

3 bq51010BEVM-764 Bill of Materials ................................................................................... 17

1 Considerations with this EVM

The bq51010BEVM-764 evaluation module (HPA764-005) demonstrates the receiver portion of the

bqTESLA™ wireless power system. This receiver EVM is a complete receiver-side solution that produces

7-V output at up to a 720-mA load (5 W).

• The bqTESLA receiver is used in any number of low-power battery portable devices such as a power

supply to a direct battery charger. With contact-free charging capability, no connections to the device

are needed.

• Output voltage of 7 V up to 720-mA charge current

• External adapter switchover

• Low-profile, external pick-up coil

• Frame is configured to provide correct receiver to transmitter spacing

• Room above coil for testing with battery, key for tuning

• Option to adjust the max output current using variable resistor R16

2 Modifications

Refer to the datasheet when changing components (SLUSBB8). To aid in such customization of the EVM,

the board was designed with devices having 0603 or larger footprints. A real implementation likely

occupies less total board space.

Note that changing components can improve or degrade EVM performance.

3 Recommended Operation Condition

Table 1 provides a summary of the bq51010BEVM-764 performance specifications. All specifications are

given for an ambient temperature of 25°C.

Table 1. bq51010BEVM-764 Electrical Performance Specifications

Parameter Test Condition MIN TYP MAX UNIT

VIN Input voltage range Typical Vrect Voltage at TP12 4 10 V

Vadapter Adapter input voltage 4 7 20 V

OVP Input overvoltage protection Voltage at V-rectified 750 mA

IOUT Output current range Current limit programming range 750 mA

VOUT Output voltage ILOAD = 700 mA 7 V

Fs Switching frequency 110 205 kHz

Efficiency AC-AC efficiency 76 %

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Equipment and EVM setup

4 Equipment and EVM setup

4.1 Schematic

Figure 1. HPA764 Schematic

4.2 Connector and Test Point Descriptions

The connection points are described in the following paragraphs.

4.2.1 J1 – AD External Adapter Input, J2-GND

Power cannot be provided to simulate an external adapter applied to the receiver in this bq51010BEVM-

764 (HPA764-005).

4.2.2 J3 – Output Voltage, J4-GND

Output voltage is 7 V in wireless power mode up to 750 mA.

4.2.3 J5 – TS and Return Connector

External connection for temperature sense resistor, see the datasheet for additional information.

4.2.4 J6 – Programming Connector

This connector is populated and is only useful at the factory level for programming the IC.

4.3 Jumpers and Switches

The control jumpers are described in the following paragraphs.

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Equipment and EVM setup

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4.3.1 JP1 – EN1 Enable 1

Not populated in this EVM (HPA764-005).

4.3.2 JP2 – EN2 Enable 2

Enable signal input that allows the system to assert wireless charging. If EN2 is set to low, wireless

charging is enabled unless AD voltage > 3.6 V. If EN2 is set to High, AD mode disabled, wireless charging

always enabled. Used when OTG plus wireless charging is active.

4.3.3 JP3 – TS Enable or Disable

This jumper enables the TS adjustment feature using R3. The disable position sets voltage at the TS pin

to a safe value. The default shorting jumper setting is disabled.

4.3.4 JP4 – Pull-Up to Out or Vz

EN2 pull-up can be powered from OUT or RECT. Vz is derived from RECT through a resistor and Zener

diode D2.

4.3.5 JP5 – Termination

This jumper along with R14 and R13 are not installed in HPA764-001-003-005.

4.3.6 JP6 – ILIM Fix or ADJ

Max output current is set by ILIM pin. In the FIX position, the current is set to a fixed value. In the ADJ

position the current is set by R16.

4.4 Test Point Descriptions

The test points are described in the following paragraphs.

4.4.1 TP1 – AD-EN

This push-pull driver for the external PFET connects the adapter and the output from the bq51010B.

4.4.2 TP2 – AC Input 2

This is the test point for measuring AC voltage applied to the EVM from the receiver coil.

4.4.3 TP3 – COM2 Communication 2 Drive

Communication driver signal, open-drain output connected to communication capacitor.

4.4.4 TP4 – AC Input 1

This is the test point for measuring AC voltage applied to the EVM from the receiver coil.

4.4.5 TP5 – CLMP 1

Overvoltage clamp driver signal, open-drain output is connected to OVP capacitor.

4.4.6 TP6 – CLMP 2

Overvoltage clamp drive signal, open-drain output is connected to OVP capacitor.

4.4.7 TP7 – OUT Output Voltage

This test point is the output voltage.

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Equipment and EVM setup

4.4.8 TP8 – Boot-1 Boot Capacitor

This bootstrap capacitor 1 drive connects to the integrated circuit (IC).

4.4.9 TP9 – Boot-2 Boot Capacitor

This bootstrap capacitor 2 drive connects to the IC.

4.4.10 TP10 – CHG Charge

This output signal indicates that the output current is being delivered to OUT, the open-drain output.

4.4.11 TP11 – AC1 IC input

This is the AC input to the IC from series capacitors.

4.4.12 TP12 – Rectified Voltage

The input AC voltage is rectified into unregulated DC voltage; additional capacitance is used to filter the

voltage before the regulator.

4.4.13 TP13, TP14, TP15 – GND

These are the ground test points.

4.4.14 TP16 – TS Temp Sensor

This is the connection point for external thermistor; see the data sheet for additional information.

4.4.15 TP17 – FET Open Detection (FOD)

Input for rectified power measurement, pin F2 of the IC.

4.4.16 TP18– ILIM

Programming pin for over current limit, pin G1 of the IC.

4.5 Pin Description of the IC

Table 2. Pin Description

PIN Number (WCSP) bq51010B

A1, A2, A3, A4 PGND

B1, B2 AC2, AC2

B3, B4 AC1, AC1

C1 BOOT2

C2, C3 RECT

C4 BOOT1

D1, D2, D3, D4 OUT

E1 COM2

E2 CLMP2

E3 CLMP1

E4 COM1

F1 TS/CTRL

F2 FOD

F3 AD-EN

F4 CHG

SLUUAE3A–August 2013–Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)

Test Procedure

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Table 2. Pin Description (continued)

PIN Number (WCSP) bq51010B

G1 ILIM

G2 EN2

G3 EN1

G4 AD

5 Test Procedure

This procedure describes test configuration of the bq51010B evaluation board (HPA764-005) for bench

evaluation.

5.1 Definition

The following naming conventions are used:

VXXX : External voltage supply name (VADP, VBT, VSBT)

LOADW: External load name (LOADR, LOADI)

V(TPyy): Voltage at internal test point TPyy. For example, V(TP02) means the voltage at TP02.

V(Jxx): Voltage at header Jxx

V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test point which

is marked as ACDET.

V(XXX, YYY): Voltage across point XXX and YYY.

I(JXX(YYY)): Current going out from the YYY terminal of header XX.

Jxx(BBB): Terminal or pin BBB of header xx.

JPx ON: Internal jumper Jxx terminals are shorted.

JPx OFF : Internal jumper Jxx terminals are open.

JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted.

Assembly drawings have location for jumpers, test points, and individual components.

5.2 Recommended Test Equipment

The following equipment is needed to complete this test procedure.

5.2.1 Power Supplies

A power supply capable of supplying 19 V at 1 A is required for testing procedures.

5.2.2 Loads

A resistive load or electronic load set to 9.5 Ωat 750 mA, 14 Ωat 500 mA, and 5 kΩat 1 mA, power rating

should be 5 W.

5.2.3 Meters

Two DC voltmeters and two DC ammeters are required.

5.2.4 bqTesla Transmitter

The transmitter HPA689 or equivalent is used for final test.

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Wireless

Transmitter

PS bq51010BEVM-764 Load

VOUT

GND

VIN

GND

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Test Procedure

5.3 Equipment Setup

5.3.1 Test Set Up

The final assembly is tested using a bqTesla transmitter provided (HPA689). Input voltage to the

transmitter is set to 19 VDC, ±200 mV with current limit of 1 A and connected to J1 and J2. Set power

supply to OFF. Place UUT on the transmitter coil. The unit under test (UUT) is placed in the center of

HPA689 TX coil.

Other bqTesla transmitter base units are also acceptable for this test.

Figure 2. Test Set Up

5.3.2 Load

The load is connected between J3 OUT and J4 GND of the UUT. A DC ammeter is connected between

UUT and Load. Set the load for 10 Ω/700 mA.

5.3.3 Jumper Settings

JP1: EN1/TERM and Low shorted

JP2: EN2 and Low shorted

JP3: TS and DIS shorted

JP4: Pullup and Vz shorted

JP5: Open

JP6: ILIM and ADJ shorted

5.3.4 Meters

• Connect ammeter to measure 19-V input current to transmitter.

• Connect voltmeter to monitor input voltage at J1 and J2 of TX unit.

• On UUT, a voltmeter is used to measure output voltage at TP7 with ground at J4.

• Connect ammeter to measure load current.

5.3.5 R3 Set Up

Connect ohmmeter across J5. Connect shorting jumper JP3 from TS to EN. Adjust R3 for a 10 kΩ, ±200-

Ωreading on the ohmmeter

5.3.6 R16 Set Up

Connect ohm meter between JP6 ADJ and J2 (GND). Adjust R16 to 415 Ω, ±20-Ωreading on the

ohmmeter.

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Test Procedure

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5.4 Procedure

5.4.1 Turn ON Operation and Operation at 500-mA Load

• Turn ON transmitter power supply (19 V)

• Transmitter: Verify LED D2 is ON

• UUT: Adjust load current to 700 mA, ±50mA

• Put the receiver EVM on the Transmitter coil and align them correctly

• After 5 seconds, verify that:

1. Transmitter: Status LED D5 should be green flashing for approximately 1 second

2. The transmitter beeps

3. Transmitter: LED D2 still ON

4. Receiver: LED D1 is ON

• UUT: Verify that Vout is 6.9 V to 7.1 V (between TP7 and J4)

• UUT: Verify that the rectified voltage is 7.4 V to 7.05 V (between TP12 and TP13) (Note: a modulation

signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower

value or base line)

5.4.2 Efficiency Test (500-mA Load)

• Verify the input current to TX is less than 260 mA, with input voltage at 19 VDC

• Turn OFF Transmitter Power Supply (19)

5.4.3 Operation (1-mA Load)

• Turn ON transmitter power supply (19 V)

• Transmitter: Verify LED D2 is ON

• UUT: Adjust load current to 1mA, ±200 µA

• Put the receiver EVM on the transmitter coil and align them correctly

• After 5 seconds verify that:

1. Transmitter: Status LED D5 is flashing green for approximately 1 second

2. The transmitter beeps

3. Transmitter: LED D2 still ON

4. Receiver: LED D1 is ON

• UUT: Verify that Vout is 6.9 V to 7.1 V (between J3 or TP7 and J4)

• UUT: Verify that rectified voltage should be 10 V to 7.5 V (between TP12 and TP13) (Note: a

modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading,

use lower value or base line)

5.4.4 Efficiency Test (1-mA Load)

• Verify the input current to TX is less than 80 mA, with the input voltage at 19 VDC

• Turn OFF Transmitter Power Supply (19)

5.4.5 Operation (700-mA Load)

• UUT: Adjust load current to 700 mA, ±50 mA

• UUT: Verify that VOUT is 6.9 V to 7.1 V (between J3 or TP7 and J4)

• UUT: Verify that the rectified voltage should be 7.5 V to 7.05 V (between TP12 and TP13) (Note: a

modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading,

use lower value or base line)

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Test Procedure

5.4.6 Efficiency Test (700-mA Load)

• Verify that input current to TX is less than 350 mA with input voltage at 19 VDC

• Turn OFF Transmitter Power Supply (19)

5.4.7 Adapter Test (700-mA Load)

• Connect 6-V, ±200 mV power supply with current limit set to 1.0 A to J1 and return to J2 on the

HPA764-005 receiver.

• Adjust load current to 700 mA, ±50 mA

• Turn on power supply

• Verify that:

1. UUT: TP7 VOUT is 6.5 V to 7.1 V

2. Transmitter: Status LED D5 is off

SLUUAE3A–August 2013–Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)

Test Results

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6 Test Results

6.1 Load Step

The procedure for load step is as follows:

• Set up the test bench as described in Section 5.

• Power TX with 19 V.

• Provide a load step from no load (high impedance) to 11.5 Ωor 600 mA (if using current source load).

• Monitor load current, rectifier voltage, and output voltage as shown in Figure 3.

Figure 3. Load Step, 0 mA to 600 mA

6.2 Load Dump

The procedure for load dump is as follows:

• Set up the test bench as described in Section 5.

• Power TX with 19 V

• Provide a load dump from 14 Ωor 500 mA (if using a current source load) to no load (high

impedance).

• Monitor load current, rectifier voltage, and output voltage as shown in Figure 4.

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Test Results

Figure 4. Load Dump, 500 mA to 0 mA

6.3 Start-Up

These procedures demonstrates start-up:

• Set up the test bench as described in Section 5.

• Power TX with 19 V

• Trigger scope sweep on TP2 AC IN

SLUUAE3A–August 2013–Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)

100

0 100 200 300 400 500 600 700

Efficiency (%)

IOUT (mA)

C006

Test Results

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Figure 5. Start-Up

6.4 Efficiency

Figure 6 shows the efficiency data for the wireless power receiver, bq51010B. The efficiency data are

measured from 100- to 700-mA load.

Figure 6. Efficiency for the bq51010B versus IOUT

6.5 Thermal Performance

This section shows a thermal image of the bq51010BEVM-764. A 7.0-V output is used at a 720-mA load.

There is no air flow and the ambient temperature is 25°C. The peak temperature of the IC, 44.9°C, is well

below the maximum recommended operating condition listed in the data sheet.

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Test Results

Figure 7. Thermal Image

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Layout and Bill of Material

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7 Layout and Bill of Material

7.1 Layout

7.1.1 Printed-Circuit Board Layout Guideline

The primary concerns when laying out a custom receiver PCB are:

• AC1 and AC2 trace resistance

• OUT trace resistance

• RECT trace resistance

• GND connection

• Copper weight ≥2 oz

For a 720-mA load current application, the current rating for each net is as follows:

• AC1 = AC2 = 900 mA

• BOOT1 = BOOT2 = 10 mA

• RECT = 750 mA

• OUT = 750 mA

• COM1 = COM2 = 300 mA

• CLAMP1 = CLAMP2 = 500 mA

• ILIM = 10 mA

• AD = AD_EN = TS-CTRL = EN1 = EN2 = TERM = FOD = 1 mA

• CHG = 10 mA

It is also recommended to have the following capacitance on RECT and OUT:

• RECT ≥±10 μF

• OUT ≥1μF

It is always a good practice to place high-frequency bypass capacitors of 0.1 μF next to RECT and OUT.

Figure 8 illustrates an example of a WCSP layout:

Figure 8. bq51010BEVM-764 Layout Example

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Layout and Bill of Material

7.1.2 Layout

Figure 9. bq51010BEVM-764 Top Assembly

Figure 10. bq51010BEVM-764 Top Layer

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Layout and Bill of Material

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Figure 11. bq51010BEVM-764 Bottom Copper Layer

Figure 12. bq51010BEVM-764 Bottom Assembly

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Layout and Bill of Material

7.2 Bill of Materials (BOM)

Table 3. bq51010BEVM-764 Bill of Materials

COUNT

001 002 003 004 005 RefDes Value Description Size Part Number MFR

1 1 1 1 1 C1 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

1 1 1 1 0 C2 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

0 0 0 0 1 C2 12nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

1 1 1 1 1 C3 47nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

1 1 1 1 0 C4 1800pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

0 0 0 0 1 C4 1500pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

1 1 1 1 1 C5 100pF Capacitor, Ceramic, 50V, C0G, 5% 0603 Std Std

4 4 4 4 4 C6, C16, C18, C19 0.1uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

3 3 3 3 3 C7, C17, C20 1.0uF Capacitor, Ceramic, 50V, X5R, 10% 0805 Std Std

2 2 2 2 2 C8, C13 22nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

2 2 2 2 2 C9, C12 0.47uF Capacitor, Ceramic, 25V, X5R, 10% 0603 Std Std

2 2 2 2 2 C10, C11 0.01uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std

2 2 2 2 2 C14, C15 10uF Capacitor, Ceramic, 25V, X5R, 10% 1206 Std Std

1 1 1 1 1 D1 LTST-C190GKT Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 0603 LTST-C190GKT Lite On

1 1 1 1 1 D2 5.1V Diode, Zener, 5.1V, 300mW SOD-523 BZT52C5V1T-7 Diodes, Inc.

5 5 5 5 5 J1, J2, J3, J4, J5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins

1 1 1 1 1 J6 N2510-6002-RB Connector, Male Straight 2x5 pin, 100mil spacing, 4 Wall 0.338 x 0.788 inch N2510-6002-RB 3M

4 4 4 4 4 JP2, JP3, JP4, JP6 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins

1 0 1 0 1 JP1 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins

0 1 0 1 0 JP5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins

1 0 1 0 1 Q1 CSD75205W1015 MOSFET, Dual PChan, -20V, 1.2A, 190 milliOhm CSP 1x1.5mm CSD75205W1015 TI

0 0 0 0 0 R1 Open Resistor, Chip, 1/16W, 1% 0603 Std Std

1 0 0 0 0 R2 150 Resistor, Chip, 1/16W, 1% 0603 Std Std

0 0 1 0 0 R2 196 Resistor, Chip, 1/16W, 1% 0603 Std Std

0 1 0 1 1 R2 200 Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 1 1 1 R3 200k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-204LF Bourns

0 0 1 0 0 R4 75 Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 0 1 1 R4 110 Resistor, Chip, 1/16W, 1% 0603 Std Std

0 0 0 0 0 R5 Open Resistor, Chip, 1/16W, 1% 0603 Std Std

0 0 0 0 0 R6, R12 Open Resistor, Metal Film, 1/4 watt, ± 1% 1206 CRCW120624R0FKEA Vishay

1 1 1 1 1 R7 1.50K Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 1 1 1 R8, R9 200 Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 1 1 1 R10 499 Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 1 1 1 R11 10.0k Resistor, Chip, 1/16W, 1% 0603 Std Std

0 1 0 1 0 R14 1.0k Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 1 1 1 R15 1.0K Resistor, Chip, 1/16W, 1% 0603 Std Std

0 1 0 1 0 R13 20k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-203LF Bourns

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Layout and Bill of Material

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Table 3. bq51010BEVM-764 Bill of Materials (continued)

COUNT

001 002 003 004 005 RefDes Value Description Size Part Number MFR

1 1 1 1 1 R16 5k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-502LF Bourns

0 0 1 0 0 R17 20K Resistor, Chip, 1/16W, 1% 0603 Std Std

0 1 0 1 0 R17 42.2K Resistor, Chip, 1/16W, 1% 0603 Std Std

0 0 0 0 1 R17 36K Resistor, Chip, 1/16W, 1% 0603 Std Std

15 15 15 15 15 TP1, TP2, TP3, TP4, TP5, TP6, TP7, 5000 Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone

TP8, TP9, TP10, TP11, TP12, TP16,

TP17, TP18

3 3 3 3 3 TP13, TP14, TP15 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone

1 0 0 0 0 U1 bq51013AYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013AYFP TI

0 1 0 0 0 U1 bq51050BYFP IC, Wirless Secondary-Side Power Controller and Battery Charger DSBGA bq51050BYFP TI

0 0 1 0 0 U1 bq51013BYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013BYFP TI

0 0 0 1 0 U1 bq51051BYFP IC, Wirless Secondary-Side Power Controller and Battery Charger DSBGA bq51013BYFP TI

0 0 0 0 1 U1 bq51010BYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013BYFP TI

5 5 5 5 5 -- Shunt, 100-mil, Black — See note 6 929950-00 3M

1 1 1 1 1 -- PCB, 2.1" x 2.1" x 0.031" HPA764 Any

1 1 1 1 1 -- Case Modified Polycase LP-11B with 4 screws — See note 7 J-6838A Polycase

1 1 1 1 0 -- Coil, RX with Attractor IWAS-4832FF-50 Vishay

WR-483250-15M2-G TDK

760308103204 Wyurth

0 0 0 0 1 Coil, RX with Attractor — See note 8 IWAS4832ECEB160J50 Vishay

1 1 1 1 1 Tape segment, Low Static Polyimide Film — See note 9 1.5" x 2.3" 5419-1 1/2" 3M

1 1 1 1 1 Label Label Thermal Label — See note 10 THT-53-423-3 Brady

Notes: 1. These assemblies are ESD sensitive, observe ESD precautions.

2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.

3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.

4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.

5. Tape "Coil, RX" into bottom of case, centered, coil side down, lead wires passing through milled groove.

6. Install Shunts on:

JP1: (Only for HPA764-001, 003, & 005) between EN1/TERM and JP4: between Pull-up and Vz

LOW

JP2: between EN2 and LOW JP5: (Only for HPA764-002 and HPA764-004) between two ends

JP3: between TS and DIS

7. Install PCB in case using screws provided with case

8. WR483225-16M6-TI3 from TDK coil can also be used as second option.

9. Used to secure RX coil to case. Cut tape section from 36 yard roll identified in part number field.

10. Install label on back of PCB near J6 on the top edge of the PCB after final wash (box). Text shall be 8 pt font or lower. Text shall be per Table 1. The ref designators should not be hidden by the label.

Table 1

Assembly Number Text

HPA764-001 bq51013AEVM-764

HPA764-002 bq51050BEVM-764

HPA764-003 bq51013BEVM-764

18 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A–August 2013–Revised December 2013

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Layout and Bill of Material

Table 3. bq51010BEVM-764 Bill of Materials (continued)

COUNT

001 002 003 004 005 RefDes Value Description Size Part Number MFR

HPA764-004 bq51051BEVM-764

HPA764-005 bq51010BEVM-764

SLUUAE3A–August 2013–Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)

Revision History

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Revision History

Changes from Original (August 2013) to A Revision ..................................................................................................... Page

• Added Wyurth part 760308103204, in 'Coil, RX with Attractor' row of BOM. ................................................... 17

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

20 Revision History SLUUAE3A–August 2013–Revised December 2013

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• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

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greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

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Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel

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【【Important Notice for Users of EVMs for RF Products in Japan】】

This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

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2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this

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respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note

that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited

(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

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本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

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2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

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EVALUATION BOARD/KIT/MODULE (EVM)

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