ALPHA & OMEGA SEMICONDUCTOR 1. PACKAGE BODY SIDES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH SHOULD BE LESS THAN 6 MILS. 2. TOLERANCE 0.10 MILLIMETERS UNLESS OTHERWISE SPECIFIED. 3. DIMENSION L IS MEASURED IN GAUGE LINE. 4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 5. REFER TO JEDEC TO-263 AB. Document No. PO00005 Version L TO263(D2PAK) PACKAGE OUTLINE [A}K}= + A | ce ~ _ = : On | F 1 ~t~1 [Ptlonal des <r | 4 ~\ WY | / \ | S \ ! \ / cu . 4 L 4 |'|- 2 X b se SY - 3 X b2 |} [0.25mm@|BlA@| VIEW C a Et [0.25mm@|B/A@| & GAUGE PLANE | | 9 }- : SEATING lL i | L PLANE LL netat > Option 1 Option 2 x 4 VIEW _C DETAIL D VIEW C 2X e RECOMMENDED LAND PATTERN BOTTOM VIEW 8.50 MIN. SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES Zz = oO 3 n oO oS In S 160 MIN Hy | UL [254 ea 5.08 BSC UNIT: mm NOTE: