Si 5 7 0 / S i 5 71 10 MH Z TO 1.4 G H Z I 2C P ROGRAMMABLE XO/VCXO Features Any programmable output frequencies from 10 to 945 MHz and select frequencies to 1.4 GHz I2C serial interface 3rd generation DSPLL(R) with superior jitter performance 3x better frequency stability than SAW-based oscillators Internal fixed crystal frequency ensures high reliability and low aging Available LVPECL, CMOS, LVDS, and CML outputs Industry-standard 5x7 mm package Pb-free/RoHS-compliant 1.8, 2.5, or 3.3 V supply Applications Si5602 Ordering Information: SONET/SDH xDSL 10 GbE LAN/WAN ATE High performance instrumentation Low-jitter clock generation Optical modules Clock and data recovery See page 32. Pin Assignments: See page 31. Description The Si570 XO/Si571 VCXO utilizes Silicon Laboratories' advanced DSPLL(R) circuitry to provide a low-jitter clock at any frequency. The Si570/Si571 are userprogrammable to any output frequency from 10 to 945 MHz and select frequencies to 1400 MHz with <1 ppb resolution. The device is programmed via an I2C serial interface. Unlike traditional XO/VCXOs where a different crystal is required for each output frequency, the Si57x uses one fixed-frequency crystal and a DSPLL clock synthesis IC to provide any-frequency operation. This IC-based approach allows the crystal resonator to provide exceptional frequency stability and reliability. In addition, DSPLL clock synthesis provides superior supply noise rejection, simplifying the task of generating low-jitter clocks in noisy environments typically found in communication systems. (Top View) SDA 7 NC 1 6 VDD OE 2 5 CLK- GND 3 4 CLK+ 8 SCL Functional Block Diagram Si570 CLK- VDD CLK+ SDA 7 OE SDA 10-1400 MHz DSPLL Clock Synthesis Fixed Frequency XO SCL Si571 only ADC VC 1 6 VDD OE 2 5 CLK- GND 3 4 CLK+ 8 SCL GND VC Rev. 1.5 4/14 Copyright (c) 2014 by Silicon Laboratories Si571 Si570/Si571 Si570/Si571 2 Rev. 1.5 Si570/Si571 TABLE O F C ONTENTS Section Page 1. Detailed Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1. Programming a New Output Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2. Si570 Programming Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3. Si570 Troubleshooting FAQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.4. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4. Serial Port Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5. Si570 (XO) Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6. Si571 (VCXO) Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 8. Si57x Mark Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 9. Outline Diagram and Suggested Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 10. 8-Pin PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Rev. 1.5 3 Si570/Si571 1. Detailed Block Diagrams VDD GND fXTAL M + DCO fosc /HS_DIV CLKOUT+ /N1 CLKOUT- RFREQ Frequency Control OE SDA SCL Control Interface NVM RAM Figure 1. Si570 Detailed Block Diagram VDD GND fXTAL VC ADC VCADC M + DCO fosc /HS_DIV /N1 RFREQ Frequency Control OE SDA SCL Control Interface NVM RAM Figure 2. Si571 Detailed Block Diagram 4 Rev. 1.5 CLKOUT+ CLKOUT- Si570/Si571 2. Electrical Specifications Table 1. Recommended Operating Conditions Symbol Parameter Supply Voltage 1 VDD Supply Current IDD 2 Output Enable (OE) , Serial Data (SDA), Serial Clock (SCL) Operating Temperature Range Test Condition Min Typ Max 3.3 V option 2.97 3.3 3.63 2.5 V option 2.25 2.5 2.75 1.8 V option 1.71 1.8 1.89 Output enabled LVPECL CML LVDS CMOS -- -- -- -- 120 108 99 90 130 117 108 98 TriState mode -- 60 75 VIH 0.75 x VDD -- -- VIL -- -- 0.5 V -40 -- 85 C TA Unit V mA Notes: 1. Selectable parameter specified by part number. See Section "7. Ordering Information" on page 32 for further details. 2. OE pin includes a 17 k pullup resistor to VDD. See "7.Ordering Information". Table 2. VC Control Voltage Input (Si571) Symbol Parameter Test Condition Min Typ Max Unit VC 10 to 90% of VDD -- 33 45 90 135 180 356 -- ppm/V BSL -5 1 +5 Incremental -10 5 +10 Control Voltage Tuning Slope1,2,3 KV Control Voltage Linearity4 LVC Modulation Bandwidth BW 9.3 10.0 10.7 kHz ZVC 500 -- -- k -- VDD/2 -- V VDD V VC Input Impedance Nominal Control Voltage 5 Control Voltage Tuning Range VCNOM @ fO VC 0 % Notes: 1. Positive slope; selectable option by part number. See "7. Ordering Information" on page 32. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application's minimum APR requirements. See "AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)" for more information. 3. KV variation is 10% of typical values. 4. BSL determined from deviation from best straight line fit with VC ranging from 10 to 90% of VDD. Incremental slope is determined with VC ranging from 10 to 90% of VDD. 5. Nominal output frequency set by VCNOM = 1/2 x VDD. Rev. 1.5 5 Si570/Si571 Table 3. CLK Output Frequency Characteristics Parameter Programmable Frequency Range1,2 Symbol fO Temperature Stability1,3 Test Condition Min Typ Max LVPECL/LVDS/CML 10 -- 1417.5 CMOS 10 -- 160 TA = -40 to +85 C -7 -20 -50 -100 -- -- -- -- 7 +20 +50 +100 ppm -- 1.5 -- ppm Frequency drift over first year -- -- 3 ppm Frequency drift over 20-year life -- -- 10 ppm Temp stability = 7 ppm -- -- 20 ppm Temp stability = 20 ppm -- -- 31.5 ppm Temp stability = 50 ppm -- -- 61.5 ppm MHz Initial Accuracy Aging fa Total Stability Unit Absolute Pull Range1,3 APR 12 -- 375 ppm Power up Time4 tOSC -- -- 10 ms Notes: 1. See Section "7. Ordering Information" on page 32 for further details. 2. Specified at time of order by part number. Three speed grades available: Grade A covers 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417.5 MHz. Grade B covers 10 to 810 MHz. Grade C covers 10 to 280 MHz. 3. Selectable parameter specified by part number. 4. Time from power up or tristate mode to fO. 6 Rev. 1.5 Si570/Si571 Table 4. CLK Output Levels and Symmetry Parameter LVPECL Output Option LVDS Output Option 1 2 Symbol Test Condition Min Typ Max Unit VO mid-level VDD - 1.42 -- VDD - 1.25 V VOD swing (diff) 1.1 -- 1.9 VPP VSE swing (single-ended) 0.55 -- 0.95 VPP VO mid-level 1.125 1.20 1.275 V VOD swing (diff) 0.5 0.7 0.9 VPP 2.5/3.3 V option mid-level -- VDD - 1.30 -- V 1.8 V option mid-level -- VDD - 0.36 -- V 2.5/3.3 V option swing (diff) 1.10 1.50 1.90 VPP 1.8 V option swing (diff) 0.35 0.425 0.50 VPP VOH IOH = 32 mA 0.8 x VDD -- VDD V VOL IOL = 32 mA -- -- 0.4 V LVPECL/LVDS/CML -- -- 350 ps CMOS with CL = 15 pF -- 1 -- ns 45 -- 55 % VO CML Output Option2 VOD CMOS Output Option3 Rise/Fall time (20/80%) tR, tF Symmetry (duty cycle) SYM LVPECL: LVDS: CMOS: VDD - 1.3 V (diff) 1.25 V (diff) VDD/2 Notes: 1. Rterm = 50 to VDD - 2.0 V. 2. Rterm = 100 (differential). 3. CL = 15 pF Rev. 1.5 7 Si570/Si571 Table 5. CLK Output Phase Jitter (Si570) Parameter Symbol Test Condition Min Typ Max Unit Phase Jitter (RMS)1 for FOUT > 500 MHz J 12 kHz to 20 MHz (OC-48) -- 0.25 0.40 ps 50 kHz to 80 MHz (OC-192) -- 0.26 0.37 Phase Jitter (RMS)1 for FOUT of 125 to 500 MHz J 12 kHz to 20 MHz (OC-48) -- 0.36 0.50 50 kHz to 80 MHz (OC-192)2 -- 0.34 0.42 Phase Jitter (RMS) for FOUT of 10 to 160 MHz CMOS Output Only J 12 kHz to 20 MHz (OC-48)2 -- 0.62 -- -- 0.61 -- 50 kHz to 20 MHz Notes: 1. Refer to AN256 for further information. 2. Max offset frequencies: 80 MHz for FOUT > 250 MHz 20 MHz for 50 MHz < FOUT <250 MHz 2 MHz for 10 MHz < FOUT <50 MHz. 8 Rev. 1.5 2 ps ps Si570/Si571 Table 6. CLK Output Phase Jitter (Si571) Parameter 1,2,3 Phase Jitter (RMS) for FOUT > 500 MHz Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.26 0.26 -- -- Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.27 0.26 -- -- Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.32 0.26 -- -- Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.40 0.27 -- -- Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.49 0.28 -- -- Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.87 0.33 -- -- Unit ps Notes: 1. Differential Modes: LVPECL/LVDS/CML. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application's minimum APR requirements. See "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" for more information. 3. See "AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO" for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Single ended mode: CMOS. Refer to the following application notes for further information: "AN255: Replacing 622 MHz VCSO Devices with the Si55x VCXO" "AN256: Integrated Phase Noise" "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz 20 MHz for 50 MHz < FOUT <250 MHz 2 MHz for 10 MHz < FOUT <50 MHz. Rev. 1.5 9 Si570/Si571 Table 6. CLK Output Phase Jitter (Si571) (Continued) Parameter Phase Jitter (RMS)2,4,5 for FOUT 10 to 160 MHz CMOS Output Only Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 0.63 0.62 -- -- Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 0.63 0.62 -- -- Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 0.67 0.66 -- -- Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 0.74 0.72 -- -- Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 0.83 0.8 -- -- Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz -- -- 1.26 1.2 -- -- Unit ps Notes: 1. Differential Modes: LVPECL/LVDS/CML. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application's minimum APR requirements. See "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" for more information. 3. See "AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO" for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Single ended mode: CMOS. Refer to the following application notes for further information: "AN255: Replacing 622 MHz VCSO Devices with the Si55x VCXO" "AN256: Integrated Phase Noise" "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz 20 MHz for 50 MHz < FOUT <250 MHz 2 MHz for 10 MHz < FOUT <50 MHz. 10 Rev. 1.5 Si570/Si571 Table 6. CLK Output Phase Jitter (Si571) (Continued) Parameter Phase Jitter (RMS)1,2,3,5 for FOUT of 125 to 500 MHz Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.37 0.33 -- -- Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.37 0.33 -- -- Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.43 0.34 -- -- Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.50 0.34 -- -- Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 0.59 0.35 -- -- Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) -- -- 1.00 0.39 -- -- Unit ps Notes: 1. Differential Modes: LVPECL/LVDS/CML. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application's minimum APR requirements. See "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" for more information. 3. See "AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO" for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Single ended mode: CMOS. Refer to the following application notes for further information: "AN255: Replacing 622 MHz VCSO Devices with the Si55x VCXO" "AN256: Integrated Phase Noise" "AN266: VCXO Tuning Slope (kV), Stability, and Absolute Pull Range (APR)" 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz 20 MHz for 50 MHz < FOUT <250 MHz 2 MHz for 10 MHz < FOUT <50 MHz. Table 7. CLK Output Period Jitter Parameter Period Jitter* Symbol JPER Test Condition Min Typ Max RMS -- 2 -- Peak-to-Peak -- 14 -- Unit ps *Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to "AN279: Estimating Period Jitter from Phase Noise" for further information. Rev. 1.5 11 Si570/Si571 Table 8. Typical CLK Output Phase Noise (Si570) Offset Frequency (f) 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz 100 MHz 120.00 MHz 156.25 MHz 622.08 MHz Unit LVDS LVPECL LVPECL -112 -122 -132 -137 -144 -150 n/a -105 -122 -128 -135 -144 -147 n/a -97 -107 -116 -121 -134 -146 -148 dBc/Hz 74.25 MHz 491.52 MHz 622.08 MHz Unit 90 ppm/V 45 ppm/V 135 ppm/V LVPECL LVPECL LVPECL -87 -114 -132 -142 -148 -150 n/a -75 -100 -116 -124 -135 -146 -147 -65 -90 -109 -121 -134 -146 -147 Table 9. Typical CLK Output Phase Noise (Si571) Offset Frequency (f) 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz 100 MHz Table 10. Environmental Compliance (The Si570/571 meets the following qualification test requirements.) Parameter Conditions/Test Method Mechanical Shock MIL-STD-883, Method 2002 Mechanical Vibration MIL-STD-883, Method 2007 Solderability MIL-STD-883, Method 2003 Gross and Fine Leak MIL-STD-883, Method 1014 Resistance to Solder Heat MIL-STD-883, Method 2036 Moisture Sensitivity Level J-STD-020, MSL1 Contact Pads 12 Gold over Nickel Rev. 1.5 dBc/Hz Si570/Si571 Table 11. Programming Constraints and Timing (VDD = 3.3 V 10%, TA = -40 to 85 C) Parameter Symbol Output Frequency Range Test Condition Min Typ Max Unit HS_DIV x N1 > = 6 10 -- 945 MHz HS_DIV = 5 N1 = 1 970 -- 1134 MHz HS_DIV = 4 N1 = 1 1.2125 -- 1.4175 GHz fxtal = 114.285 MHz -- 0.09 -- ppb 4850 -- 5670 MHz Maximum variation is 2000 ppm -- 114.285 -- MHz From center frequency -3500 -- +3500 ppm -- -- 10 ms CKOF Frequency Reprogramming Resolution MRES Internal Oscillator Frequency fOSC Internal Crystal Frequency Accuracy fXTAL Delta Frequency for Continuous Output Unfreeze to NewFreq Timeout Settling Time for Small Frequency Change <3500 ppm from center frequency -- -- 100 s Settling Time for Large Frequency Change >3500 ppm from center frequency after setting NewFreq bit -- -- 10 ms Table 12. Thermal Characteristics (Typical values TA = 25 C, VDD = 3.3 V) Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction to Ambient JA Still Air -- 84.6 -- C/W Thermal Resistance Junction to Case JC Still Air -- 38.8 -- C/W Ambient Temperature TA -40 -- 85 C Junction Temperature TJ -- -- 125 C Rev. 1.5 13 Si570/Si571 Table 13. Absolute Maximum Ratings1,2 Parameter Symbol Rating Unit Supply Voltage, 1.8 V Option VDD -0.5 to +1.9 V Supply Voltage, 2.5/3.3 V Option VDD -0.5 to +3.8 V Input Voltage VI -0.5 to VDD + 0.3 V Storage Temperature TS -55 to +125 C ESD Sensitivity (HBM, per JESD22-A114) ESD >2000 V Soldering Temperature (Lead-free Profile) TPEAK 260 C tP 20-40 seconds Soldering Temperature Time @ TPEAK (Lead-free Profile) Notes: 1. Stresses beyond the absolute maximum ratings may cause permanent damage to the device. Functional operation or specification compliance is not implied at these conditions. 2. The device is compliant with JEDEC J-STD-020. Refer to packaging FAQ available for download at www.siliconlabs.com/VCXO for further information, including soldering profiles. 14 Rev. 1.5 Si570/Si571 3. Functional Description The Si570 XO and the Si571 VCXO are low-jitter oscillators ideally suited for applications requiring programmable frequencies. The Si57x can be programmed to generate virtually any output clock in the range of 10 MHz to 1.4 GHz. Output jitter performance complies with and exceeds the strict requirements of high-speed communication systems including OC-192/STM-64 and 10 Gigabit Ethernet (10 GbE). The Si57x consists of a digitally-controlled oscillator (DCO) based on Silicon Laboratories' third-generation DSPLL technology, which is driven by an internal fixedfrequency crystal reference. The device's default output frequency is set at the factory and can be reprogrammed through the two-wire I2C serial port. Once the device is powered down, it will return to its factory-set default output frequency. While the Si570 outputs a fixed frequency, the Si571 has a pullable output frequency using the voltage control input pin. This makes the Si571 an ideal choice for high-performance, low-jitter, phase-locked loops. 3.1. Programming a New Output Frequency The output frequency (fout) is determined by programming the DCO frequency (fDCO) and the device's output dividers (HS_DIV, N1). The output frequency is calculated using the following equation: f XTAL RFREQ f DCO f out = ----------------------------------------- = ------------------------------------------Output Dividers HSDIV N1 The DCO frequency is adjustable in the range of 4.85 to 5.67 GHz by setting the high-resolution 38-bit fractional multiplier (RFREQ). The DCO frequency is the product of the internal fixed-frequency crystal (fXTAL) and RFREQ. The 38-bit resolution of RFREQ allows the DCO frequency to have a programmable frequency resolution of 0.09 ppb. As shown in Figure 3, the device allows reprogramming of the DCO frequency up to 3500 ppm from the center frequency configuration without interruption to the output clock. Changes greater than the 3500 ppm window will cause the device to recalibrate its internal tuning circuitry, forcing the output clock to momentarily stop and start at any arbitrary point during a clock cycle. This re-calibration process establishes a new center frequency and can take up to 10 ms. Circuitry receiving a clock from the Si57x device that is sensitive to glitches or runt pulses may have to be reset once the recalibration process is complete. 3.1.1. Reconfiguring the Output Clock for a Small Change in Frequency For output changes less than 3500 ppm from the center frequency configuration, the DCO frequency is the only value that needs reprogramming. Since fDCO = fXTAL x RFREQ, and that fXTAL is fixed, changing the DCO frequency is as simple as reconfiguring the RFREQ value as outlined below: 1. Using the serial port, read the current RFREQ value (addresses 7-12 for all Si571 devices and Si570 devices with 20 ppm and 50 ppm temperature stability; or addresses 13-18 for Si570 devices with 7 ppm temperature stability). 2. Calculate the new value of RFREQ given the change in frequency. f out_new RFREQ new = RFREQcurrent ------------------------f out_current 3. Using the serial port, write the new RFREQ value (addresses 7-12 for all Si571 devices and Si570 devices with 20 ppm and 50 ppm temperature stability; or addresses 13-18 for Si570 devices with 7 ppm temperature stability). Example: An Si570 generating a 148.35 MHz clock must be reconfigured "on-the-fly" to generate a 148.5 MHz clock. This represents a change of +1011.122 ppm, which is well within the 3500 ppm window. Center Frequency Configuration 4.85 GHz -3500 ppm small frequency changes can be made "on-the-fly" without interruption to the output clock +3500 ppm 5.67 GHz Figure 3. DCO Frequency Range Rev. 1.5 15 Si570/Si571 A typical frequency configuration for this example: F out HSDIV N1 f XTAL = --------------------------------------------------RFREQ RFREQcurrent = 0x2EBB04CE0 Fout_current = 148.35 MHz Fout_new = 148.50 MHz Calculate RFREQnew to change the output frequency from 148.35 MHz to 148.5 MHz: 148.50 MHz RFREQ new = 0x2EBB04CE0 -------------------------------148.35 MHz = 0x2EC71D666 Note: Performing calculations with RFREQ requires a minimum of 38-bit arithmetic precision. Even relatively small changes in output frequency may require writing more than 1 RFREQ register. Such multiregister RFREQ writes can impact the output clock frequency on a register-by-register basis during updating. Interim changes to the output clock during RFREQ writes can be prevented by using the following procedure: 1. Freeze the "M" value (Set Register 135 bit 5 = 1). 2. Write the new frequency configuration (RFREQ). 3. Unfreeze the "M" value (Set Register 135 bit 5 = 0) 3.1.2. Reconfiguring the Output Clock for Large Changes in Output Frequency For output frequency changes outside of 3500 ppm from the center frequency, it is likely that both the DCO frequency and the output dividers need to be reprogrammed. Note that changing the DCO frequency outside of the 3500 ppm window will cause the output to momentarily stop and restart at any arbitrary point in a clock cycle. Devices sensitive to glitches or runt pulses may have to be reset once reconfiguration is complete. The process for reconfiguring the output frequency outside of a 3500 ppm window first requires reading the current RFREQ, HSDIV, and N1 values. Next, calculate fXTAL for the device. Note that, due to slight variations of the internal crystal frequency from one device to another, each device may have a different RFREQ value or possibly even different HSDIV or N1 values to maintain the same output frequency. It is necessary to calculate fXTAL for each device. Third, write the new values back to the device using the appropriate registers (addresses 7-12 for all Si571 devices and Si570 devices with 20 ppm and 50 ppm temperature stability; or addresses 13-18 for Si570 devices with 7 ppm temperature stability) sequencing as described in "3.1.2.1.Writing the New Frequency Configuration". 16 Once fXTAL has been determined, new values for RFREQ, HSDIV, and N1 are calculated to generate a new output frequency (fout_new). New values can be calculated manually or with the Si57x-EVB software, which provides a user-friendly application to help find the optimum values. The first step in manually calculating the frequency configuration is to determine new frequency divider values (HSDIV, N1). Given the desired output frequency (fout_new), find the frequency divider values that will keep the DCO oscillation frequency in the range of 4.85 to 5.67 GHz. f DCO_new = f out_new HSDIV new N1 new Valid values of HSDIV are 4, 5, 6, 7, 9 or 11. N1 can be selected as 1 or any even number up to 128 (i.e. 1, 2, 4, 6, 8, 10 ... 128). To help minimize the device's power consumption, the divider values should be selected to keep the DCO's oscillation frequency as low as possible. The lowest value of N1 with the highest value of HS_DIV also results in the best power savings. Once HS_DIV and N1 have been determined, the next step is to calculate the reference frequency multiplier (RFREQ). f DCO_new RFREQ new = ----------------------f XTAL RFREQ is programmable as a 38-bit binary fractional frequency multiplier with the first 10 most significant bits (MSBs) representing the integer portion of the multiplier, and the 28 least significant bits (LSBs) representing the fractional portion. Before entering a fractional number into the RFREQ register, it must be converted to a 38-bit integer using a bitwise left shift operation by 28 bits, which effectively multiplies RFREQ by 228. Example: RFREQ = 46.043042064d Multiply RFREQ by 228 = 12359584992.1 Discard the fractional portion = 12359584992 Convert to hexadecimal = 02E0B04CE0h In the example above, the multiplication operation requires 38-bit precision. If 38-bit arithmetic precision is not available, then the fractional portion can be separated from the integer and shifted to the left by 28bits. The result is concatenated with the integer portion Rev. 1.5 Si570/Si571 to form a full 38-bit word. An example of this operation is shown in Figure 4. 46.043042064 Multiply the fractional portion by 228 .043042064 x 228 = 11554016.077 Truncate the remaining fractional portion = 11554016 Convert integer portion to a 10-bit binary number 46 = 00 0010 1110b Convert to a 28-bit binary number (pad 0s on the left) 0000 1011 0000 0100 1100 1110 0000 Concatenate the two results 00 0010 1110 0000 1011 0000 0100 1100 1110 0000b Convert to Hex 02E0B04CE0h Figure 4. Example of RFREQ Decimal to Hexadecimal Conversion 3.1.2.1. Writing the New Frequency Configuration Once the new values for RFREQ, HSDIV, and N1 are determined, they can be written directly into the device from the serial port using the following procedure: 1. Freeze the DCO (bit 4 of Register 137) 2. Write the new frequency configuration (RFREQ, HSDIV, and N1) to addresses 7-12 for all Si571 devices and Si570 devices with 20 ppm and 50 ppm temperature stability; or addresses 13-18 for Si570 devices with 7 ppm temperature stability. 3. Unfreeze the DCO and assert the NewFreq bit (bit 6 of Register 135) within the maximum Unfreeze to NewFreq Timeout specified in Table 11, "Programming Constraints and Timing," on page 13. The process of freezing and unfreezing the DCO will cause the output clock to momentarily stop and start at any arbitrary point during a clock cycle. This process can take up to 10 ms. Circuitry that is sensitive to glitches or runt pulses may have to be reset after the new frequency configuration is written. Example: An Si570 generating 156.25 MHz must be re-configured to generate a 161.1328125 MHz clock (156.25 MHz x 66/ 64). This frequency change is greater than 3500 ppm. fout = 156.25 MHz Read the current values for RFREQ, HS_DIV, N1: RFREQcurrent = 0x2BC011EB8h = 11744124600d, 11744124600d x 228 = 43.7502734363d HS_DIV = 4 N1 = 8 Calculate fXTAL, fDCO_current f DCO_current = f out HSDV N1 = 5.000000000 GHz f DCO_current f XTAL = --------------------------------------- = 114.285 MHz RFREQ current Rev. 1.5 17 Si570/Si571 Given fout_new = 161.1328125 MHz, choose output dividers that will keep fDCO within the range of 4.85 to 5.67 GHz. In this case, keeping the same output dividers will still keep fDCO within its range limits: f DCO_new = f out_new HSDV new N1 new = 161.1328125 MHz 4 8 = 5.156250000 GHz Calculate the new value of RFREQ given the new DCO frequency: f DCO_new RFREQ new = ----------------------- = 45.11746948 f XTAL = 0x2D1E127AD 18 Rev. 1.5 Si570/Si571 3.2. Si570 Programming Procedure This following example was generated using Si514/70/71/98/99 Programmable Oscillator Software V4.0.1 found under the Tools tab at the following web page. http://www.siliconlabs.com/products/clocksoscillators/oscillators/Pages/i2c-oscillator.aspx On that same web page, the AN334 Si57x I2C XO/VCXO ANSI C Reference Design contains example C code for calculating register settings on the fly. 1. Read start-up frequency configuration (RFREQ, HS_DIV, and N1) from the device after power-up or register reset. Registers for the Current Configuration Register Data 7 0x01 8 0xC2 9 0xBC 10 0x01 11 0x1E 12 0xB8 RFREQ = = HS_DIV = N1 = 0x2BC011EB8 0x2BC011EB8 / (2^28) = 43.75027344 0x0 = 4 0x7 = 8 2. Calculate the actual nominal crystal frequency where f0 is the start-up output frequency. fxtal = ( f0 x HS_DIV x N1 ) / RFREQ = (156.250000000 MHz x 4 x 8) / 43.750273436 = 114.285000000 MHz 3. Choose the new output frequency (f1). Output Frequency (f1) = 161.132812000 MHz 4. Choose the output dividers for the new frequency configuration (HS_DIV and N1) by ensuring the DCO oscillation frequency (fdco) is between 4.85 GHz and 5.67 GHz where fdco = f1 x HS_DIV x N1. See the Divider Combinations tab for more options. HS_DIV N1 fdco = = = = 0x0 = 4 = 0x7 = 8 f1 x HS_DIV x N1 161.132812000 MHz x 4 x 8 5.156249984 GHz Rev. 1.5 19 Si570/Si571 5. Calculate the new crystal frequency multiplication ratio (RFREQ) as RFREQ = fdco / fxtal RFREQ = = = = fdco / fxtal 5.156249984 GHz / 114.285000000 MHz 45.11746934 45.11746934 x (2^28) = 0x2D1E12788 6. Freeze the DCO by setting Freeze DCO = 1 (bit 4 of register 137). 7. Write the new frequency configuration (RFREQ, HS_DIV, and N1) Registers for the New Configuration Register Data 7 0x01 8 0xC2 9 0xD1 10 0xE1 11 0x27 12 0x88 8. Unfreeze the DCO by setting Freeze DCO = 0 and assert the NewFreq bit (bit 6 of register 135) within 10 ms. 20 Rev. 1.5 Si570/Si571 3.3. Si570 Troubleshooting FAQ 1. Is the I2C bus working correctly and using the correct I2C address? Probing the device I2C pins with an oscilloscope can sometimes reveal signal integrity problems. Si570/Si571 I2C communication is normally very robust, so if other devices on the I2C bus are communicating successfully, then the Si570/Si571 should also work. You can confirm the specific I2C address expected by an Si570/Si571 device by using the part number lookup utility available on the Silicon Laboratories web site. http://www.silabs.com/custom-timing 2. Is the correct register bank being written based on device stability? Si570/Si571 devices use different configuration registers for 7 ppm temperature stability devices than they do for 20 ppm or 50 ppm temperature stability devices. The temperature stability of a Si570/Si571 device can be confirmed using the part number lookup utility available on the Silicon Laboratories web site or by referencing the 2nd ordering option code in the part number. http://www.silabs.com/custom-timing 2nd Ordering Option Code: A : 50 ppm temperature stability, 61.5 ppm total stability => Configuration Registers 7-12 B : 20 ppm temperature stability, 31.5 ppm total stability => Configuration Registers 7-12 C : 7 ppm temperature stability, 20 ppm total stability => Configuration Registers 13-18 3. Is the part-to-part variation in FXTAL included in calculations? It is required that one determine the internal crystal frequency for each individual part before calculating a new output frequency. The procedure for determining the internal crystal frequency from the register values of a device is described elsewhere in this data sheet. See Section 3.2. FXTAL = (FOUT x HSDIV x N1) / RFREQ <= note that RFREQ used here is the register value divided by 2^28 It is a common error to calculate the internal crystal frequency for one device and then use that same crystal frequency for all later devices. This will lead to offset errors in the output frequency accuracy from part-to-part. The internal crystal frequency must be calculated for each individual device. 4. Is the Unfreeze to NewFreq timeout spec being exceeded? The Si570/Si571 requires the DCO to be 'frozen' when changing register values and then 'unfrozen' and a calibration initiated by writing the 'NewFreq' bit to restart it properly. If the 'unfreeze' and 'NewFreq' writes are delayed by 10 ms or more, the internal state machine can timeout and cause the configuration to revert to default values. This 'unfreeze' and 'NewFreq' timing requirement is not usually a problem since the writes are done back-to-back, but if there is an interrupt or other system delay that may cause this 10 ms timing to be exceeded, it should be considered as a possible source of issues reprogramming the Si570/Si571. Rev. 1.5 21 Si570/Si571 3.4. I2C Interface The control interface to the Si570 is an I2C-compatible 2-wire bus for bidirectional communication. The bus consists of a bidirectional serial data line (SDA) and a serial clock input (SCL). Both lines must be connected to the positive supply via an external pullup. Fast mode operation is supported for transfer rates up to 400 kbps as specified in the I2C-Bus Specification standard. Figure 5 shows the command format for both read and write access. Data is always sent MSB. Data length is 1 byte. Read and write commands support 1 or more data bytes as illustrated. The master must send a Not Acknowledge and a Stop after the last read data byte to terminate the read command. The timing specifications and timing diagram for the I2C bus can be found in the I2C-Bus Specification standard (fast mode operation). The device I2C address is specified in the part number. S Slave Address 0 A Byte Address A Data A Data A P Write Command (Optional 2 nd data byte and acknowledge illustrated) S Slave Address 0 A Byte Address A S Slave Address 1 A Data A Data N Read Command (Optional data byte and acknowledge before the last data byte and not acknowledge illustrated) From master to slave From slave to master A - Acknowledge (SDA LOW) N - Not Acknowledge (SDA HIGH). Required after the last data byte to signal the end of the read comand to the slave. S - START condition P - STOP condition Figure 5. I2C Command Format 22 Rev. 1.5 P Si570/Si571 4. Serial Port Registers Note: Any register not listed here is reserved and must not be written. All bits are R/W unless otherwise noted. Register Name 7 High Speed/ N1 Dividers 8 Reference Frequency 9 Reference Frequency RFREQ[31:24] 10 Reference Frequency RFREQ[23:16] 11 Reference Frequency RFREQ[15:8] 12 Reference Frequency RFREQ[7:0] 13 High Speed/ N1 Dividers 14 Reference Frequency 15 Reference Frequency RFREQ_7PPM[31:24] 16 Reference Frequency RFREQ_7PPM[23:16] 17 Reference Frequency RFREQ_7PPM[15:8] 18 Reference Frequency RFREQ_7PPM[7:0] 135 137 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 HS_DIV[2:0] Bit 1 Bit 0 N1[6:2] N1[1:0] RFREQ[37:32] HS_DIV_7PPM[2:0] N1_7PPM[6:2] N1_7PPM[1:0] RFREQ_7PPM[37:32] Reset/Freeze/ RST_REG NewFreq Freeze M Freeze Memory Control VCADC Freeze DCO RECALL Freeze DCO Rev. 1.5 23 Si570/Si571 Register 7. High Speed/N1 Dividers Bit D7 D6 D5 D4 D3 D2 Name HS_DIV[2:0] N1[6:2] Type R/W R/W Bit Name 7:5 HS_DIV[2:0] 4:0 N1[6:2] D1 D0 Function DCO High Speed Divider. Sets value for high speed divider that takes the DCO output fOSC as its clock input. 000 = 4 001 = 5 010 = 6 011 = 7 100 = Not used. 101 = 9 110 = Not used. 111 = 11 CLKOUT Output Divider. Sets value for CLKOUT output divider. Allowed values are [1] and [2, 4, 6, ..., 27]. Illegal odd divider values will be rounded up to the nearest even value. The value for the N1 register can be calculated by taking the divider ratio minus one. For example, to divide by 10, write 0001001 (9 decimal) to the N1 registers. 0000000 = 1 1111111 = 27 Register 8. Reference Frequency Bit D7 D6 D5 D4 D3 D2 Name N1[1:0] RFREQ[37:32] Type R/W R/W D1 D0 Bit Name Function 7:6 N1[1:0] CLKOUT Output Divider. Sets value for CLKOUT output divider. Allowed values are [1, 2, 4, 6, ..., 27]. Illegal odd divider values will be rounded up to the nearest even value. The value for the N1 register can be calculated by taking the divider ratio minus one. For example, to divide by 10, write 0001001 (9 decimal) to the N1 registers. 0000000 = 1 1111111 = 27 5:0 RFREQ[37:32] 24 Reference Frequency. Frequency control input to DCO. Rev. 1.5 Si570/Si571 Register 9. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ[31:24] Type R/W Bit Name 7:0 RFREQ[31:24] D2 D1 D0 D2 D1 D0 D2 D1 D0 Function Reference Frequency. Frequency control input to DCO. Register 10. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ[23:16] Type R/W Bit Name 7:0 RFREQ[23:16] Function Reference Frequency. Frequency control input to DCO. Register 11. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ[15:8] Type R/W Bit Name 7:0 RFREQ[15:8] Function Reference Frequency. Frequency control input to DCO. Rev. 1.5 25 Si570/Si571 Register 12. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ[7:0] Type R/W Bit Name 7:0 RFREQ[7:0] D2 D1 D0 D2 D1 D0 Function Reference Frequency. Frequency control input to DCO. Register 13. High Speed/N1 Dividers Bit D7 D6 D5 D4 D3 Name HS_DIV_7PPM[2:0] N1_7PPM[6:2] Type R/W R/W Bit 7:5 4:0 Name Function HS_DIV_7PPM[2:0] DCO High Speed Divider. Sets value for high speed divider that takes the DCO output fOSC as its clock input. 000 = 4 001 = 5 010 = 6 011 = 7 100 = Not used. 101 = 9 110 = Not used. 111 = 11 N1_7PPM[6:2] CLKOUT Output Divider. Sets value for CLKOUT output divider. Allowed values are [1] and [2, 4, 6, ..., 27]. Illegal odd divider values will be rounded up to the nearest even value. The value for the N1 register can be calculated by taking the divider ratio minus one. For example, to divide by 10, write 0001001 (9 decimal) to the N1 registers. 0000000 = 1 1111111 = 27 Register 14. Reference Frequency Bit D7 D6 D5 D4 D3 D2 Name N1_7PPM[1:0] RFREQ_7PPM[37:32] Type R/W R/W 26 Rev. 1.5 D1 D0 Si570/Si571 Bit Name Function 7:6 N1_7PPM[1:0] CLKOUT Output Divider. Sets value for CLKOUT output divider. Allowed values are [1, 2, 4, 6, ..., 27]. Illegal odd divider values will be rounded up to the nearest even value. The value for the N1 register can be calculated by taking the divider ratio minus one. For example, to divide by 10, write 0001001 (9 decimal) to the N1 registers. 0000000 = 1 1111111 = 27 5:0 RFREQ_7PPM[37:32] Reference Frequency. Frequency control input to DCO. Register 15. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ_7PPM[31:24] Type R/W Bit 7:0 Name D2 D1 D0 D2 D1 D0 D2 D1 D0 Function RFREQ_7PPM[31:24] Reference Frequency. Frequency control input to DCO. Register 16. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ_7PPM[23:16] Type R/W Bit 7:0 Name Function RFREQ_7PPM[23:16] Reference Frequency. Frequency control input to DCO. Register 17. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ_7PPM[15:8] Type R/W Rev. 1.5 27 Si570/Si571 Bit 7:0 Name Function RFREQ_7PPM[15:8] Reference Frequency. Frequency control input to DCO. Register 18. Reference Frequency Bit D7 D6 D5 D4 D3 Name RFREQ_7PPM[7:0] Type R/W Bit 7:0 28 Name Function RFREQ_7PPM[7:0] Reference Frequency. Frequency control input to DCO. Rev. 1.5 D2 D1 D0 Si570/Si571 Register 135. Reset/Freeze/Memory Control Bit D7 D6 D5 D4 Name RST_REG NewFreq Freeze M Freeze VCADC D3 N/A D2 D1 RECALL D0 Type R/W R/W R/W R/W R/W R/W Reset settings = 00xx xx00 Bit Name 7 RST_REG Function Internal Reset. 0 = Normal operation. 1 = Reset of all internal logic. Output tristated during reset. Upon completion of internal logic reset, RST_REG is internally reset to zero. Note: Asserting RST_REG will interrupt the I2C state machine. It is not the recommended approach for starting from initial conditions. 6 NewFreq New Frequency Applied. Alerts the DSPLL that a new frequency configuration has been applied. This bit will clear itself when the new frequency is applied. 5 Freeze M Freezes the M Control Word. Prevents interim frequency changes when writing RFREQ registers. 4 Freeze VCADC 3:1 N/A 0 RECALL Freezes the VC ADC Output Word. May be used to hold the nominal output frequency of an Si571. Always Zero. Recall NVM into RAM. 0 = No operation. 1 = Write NVM bits into RAM. Bit is internally reset following completion of operation. Note: Asserting RECALL reloads the NVM contents in to the operating registers without interrupting the I2C state machine. It is the recommended approach for starting from initial conditions. Register 137. Freeze DCO Bit D7 D6 D5 D4 Name Freeze DCO Type R/W D3 D2 D1 D0 Reset settings = 00xx xx00 Bit Name 7:5 Reserved 4 Freeze DCO 3:0 Reserved Function Freeze DCO. Freezes the DSPLL so the frequency configuration can be modified. Rev. 1.5 29 Si570/Si571 5. Si570 (XO) Pin Descriptions (Top View) SDA 7 NC 1 6 VDD OE 2 5 CLK- GND 3 4 CLK+ 8 SCL Table 14. Si570 Pin Descriptions Pin Name Type Function 1 NC N/A No Connect. Make no external connection to this pin. 2 OE Input Output Enable: See "7. Ordering Information" on page 32. 3 GND Ground Electrical and Case Ground. 4 CLK+ Output Oscillator Output. 5 CLK- (NC for CMOS*) Output (N/A for CMOS*) Complementary Output. (NC for CMOS*). 6 VDD Power Power Supply Voltage. 7 SDA Bidirectional Open Drain I2C Serial Data. 8 SCL Input I2C Serial Clock. *Note: CMOS output option only: make no external connection to this pin. 30 Rev. 1.5 Si570/Si571 6. Si571 (VCXO) Pin Descriptions (Top View) SDA 7 VC 1 6 VDD OE 2 5 CLK- GND 3 4 CLK+ 8 SCL Table 15. Si571 Pin Descriptions Pin Name Type Function 1 VC Analog Input 2 OE Input 3 GND Ground Electrical and Case Ground 4 CLK+ Output Oscillator Output 5 CLK- (NC for CMOS*) Output (N/A for CMOS*) 6 VDD Power 7 SDA Bidirectional Open Drain I2C Serial Data 8 SCL Input I2C Serial Clock Control Voltage Output Enable: See "7. Ordering Information" on page 32. Complementary Output. (NC for CMOS*). Power Supply Voltage *Note: CMOS output option only: make no external connection to this pin. Rev. 1.5 31 Si570/Si571 7. Ordering Information The Si570/Si571 supports a wide variety of options including frequency range, start-up frequency, temperature stability, tuning slope, output format, and VDD. Specific device configurations are programmed into the Si570/Si571 at time of shipment. Configurations are specified using the Part Number Configuration chart shown below. Silicon Labs provides a web browser-based part number configuration utility to simplify this process. Refer to www.siliconlabs.com/VCXOPartNumber to access this tool and for further ordering instructions. The Si570/Si571 XO/VCXO series is supplied in an industry-standard, RoHS compliant, 8-pad, 5 x 7 mm package. Tape and reel packaging is an ordering option. 57x X X X XXX XXX D G R R = Tape & Reel Blank = Trays Operating Temp Range (C) G -40 to +85 C 570 Programmable XO Product Family Device Revision Letter 571 Programmable VCXO Product Family Six-Digit Start-up Frequency/I2C Address Designator The Si57x supports a user-defined start-up frequency within the following bands of frequencies: 10-945 MHz, 970-1134 MHz, and 1213-1417 MHz. The start-up frequency must be in the same frequency range as that specified by the Frequency Grade 3rd option code. The Si57x supports a user-defined I2C 7-bit address. Each unique start-up frequency/I2C address combination is assigned a six-digit numerical code. This code can be requested during the part number request process. Refer to www.silabs.com/VCXOPartNumber to request an Si57x part number. 1st Option Code A B C D E F G H J K M N P Q R S T U V W VDD 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 1.8 1.8 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 1.8 1.8 Output Format Output Enable Polarity LVPECL High LVDS High CMOS High CML High LVPECL High LVDS High CMOS High CML High CMOS High CML High LVPECL Low LVDS Low CMOS Low CML Low LVPECL Low LVDS Low CMOS Low CML Low CMOS Low CML Low 3rd Option Code Frequency Grade Code A B C Si570 Note: CMOS available to 160 MHz. Si571 Frequency Range Supported (MHz) 10-945, 970-1134, 1213-1417.5 10-810 10-280 (CMOS available to 160 MHz) 2nd Option Code Code Temperature Stability (ppm, max, ) Total Stablility (ppm, max, ) A 50 61.5 B 20 31.5 C 7 20 2nd Option Code Temperature Tuning Slope Minimum APR Stability Kv (ppm) for VDD @ ppm (max) ppm/V (typ) 3.3 V 2.5 V 1.8 V Code A 100 180 100 75 25 B 100 90 30 Note 6 Note 6 C 50 180 150 125 75 D 50 90 80 30 25 E 20 45 25 Note 6 Note 6 F 50 135 100 75 50 G 20 356 375 300 235 H 20 180 185 145 105 J 20 135 130 104 70 K 100 356 295 220 155 M 20 33 12 Note 6 Note 6 Notes: 1. For best jitter and phase noise performance, always choose the smallest Kv that meets the application's minimum APR requirements. Unlike SAW-based solutions which require higher higher Kv values to account for their higher temperature dependence, the Si55x series provides lower Kv options to minimize noise coupling and jitter in realworld PLL designs. See AN255 and AN266 for more information. 2. APR is the ability of a VCXO to track a signal over the product lifetime. A VCXO with an APR of 25 ppm is able to lock to a clock with a 25 ppm stability over 15 years over all operating conditions. 3. Nominal Pull range () = 0.5 x VDD x tuning slope. 4. Nominal Absolute Pull Range (APR) = Pull range - stability - lifetime aging = 0.5 x VDD x tuning slope - stability - 10 ppm 5. Minimum APR values noted above include worst case values for all parameters. 6. Combination not available. Figure 6. Part Number Convention 32 Rev. 1.5 Si570/Si571 8. Si57x Mark Specification Figure 7 illustrates the mark specification for the Si57x. Table 16 lists the line information. Figure 7. Mark Specification Table 16. Si57x Top Mark Description Line Position Description 1 1-10 "SiLabs"+ Part Family Number, 57x (First 3 characters in part number where x = 0 indicates a 570 device and x = 1 indicates a 571 device) 2 1-10 Si570, Si571: Option1 + Option2 + Option3 + ConfigNum(6) + Temp 3 Trace Code Position 1 Pin 1 orientation mark (dot) Position 2 Product Revision (D) Position 3-6 Tiny Trace Code (4 alphanumeric characters per assembly release instructions) Position 7 Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7) Position 8-9 Calendar Work Week number (1-53), to be assigned by assembly site Position 10 "+" to indicate Pb-Free and RoHS-compliant Rev. 1.5 33 Si570/Si571 9. Outline Diagram and Suggested Pad Layout Figure 8 illustrates the package details for the Si570/Si571. Table 17 lists the values for the dimensions shown in the illustration. Figure 8. Si570/Si571 Outline Diagram Table 17. Package Diagram Dimensions (mm) Dimension A b b1 c c1 D D1 e E E1 H L L1 p R aaa bbb ccc ddd eee Min 1.50 1.30 0.90 0.50 0.30 Nom 1.65 1.40 1.00 0.60 -- 5.00 BSC 4.40 2.54 BSC 7.00 BSC 6.20 0.65 1.27 1.17 -- 0.70 REF -- -- -- -- -- 4.30 6.10 0.55 1.17 1.07 1.80 -- -- -- -- -- Max 1.80 1.50 1.10 0.70 0.60 4.50 6.30 0.75 1.37 1.27 2.60 0.15 0.15 0.10 0.10 0.05 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 34 Rev. 1.5 Si570/Si571 10. 8-Pin PCB Land Pattern Figure 9 illustrates the 8-pin PCB land pattern for the Si570/Si571. Table 18 lists the values for the dimensions shown in the illustration. Figure 9. Si570/Si571 PCB Land Pattern Table 18. PCB Land Pattern Dimensions (mm) Dimension Min Max D2 5.08 REF D3 5.705 REF e 2.54 BSC E2 4.20 REF GD 0.84 GE 2.00 -- -- VD 8.20 REF VE 7.30 REF X1 1.70 TYP X2 1.545 TYP Y1 2.15 REF Y2 1.3 REF ZD -- 6.78 ZE -- 6.30 Note: 1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification. 2. Land pattern design follows IPC-7351 guidelines. 3. All dimensions shown are at maximum material condition (MMC). 4. Controlling dimension is in millimeters (mm). Rev. 1.5 35 Si570/Si571 DOCUMENT CHANGE LIST Revision 1.0 to Revision 1.1 Restored programming constraint information on page 15 and in Table 12, page 12. Clarified NC (No Connect) pin designations in Tables 13-14 on pages 22-23. Revision 1.1 to Revision 1.2 Revision 1.3 to Revision 1.4 36 Added Table 12, "Thermal Characteristics," on page 13. Revision 1.4 to Revision 1.5 Replaced "Unfreeze to Newfreq Delay" with the clearer terminology "Unfreeze to Newfreq Timeout" on page 15 and in Table 11 on page 13. Added Freeze M procedure on page 14 for preventing output clock changes during small frequency change multi-register RFREQ writes. Added Freeze M, Freeze VCADC, and RST_REG versus RECALL information to Register 135 references in "4. Serial Port Registers" on pages 17 and 20. Added Si570 20 ppm Total Stability Ordering Option to Figure 6 on page 32. Updated Figure 8 and Table 17 on page 34 to include production test sidepads. This change is for reference only as the sidepads are raised above the seating plane and do not impact PCB layout. Corrected errors in Table 10 on page 12. Revision 1.2 to Revision 1.3 Added text to "3. Functional Description" on page 15, paragraph 1, to state that the total output jitter complies to and exceeds strict requirements of various high-speed communication systems. Updated Table 3 on page 6 to include 7 ppm temperature stability and 20 ppm to stability parameters. Also changed aging test condition (frequency drift over life) from 15 years to 20 years. Updated 2.5 V/3.3 V and 1.8 V CML output level specification for Table 4 on page 7. Added footnotes clarifying max offset frequency test conditions in Table 5 on page 8. Updated ESD HBM sensitivity rating and the JEDEC standard in Note 2 in Table 13 on page 14. Updated Table 10 on page 12 to include "Moisture Sensitivity Level" and "Contact Pads" rows. Added Si570 7 ppm Total Stability Ordering Option to Figure 6 on page 32. Updated Figure 7 and Table 16 on page 33 to reflect specific marking information. Previously, Figure 7 was generic. Clarified "3.1.2. Reconfiguring the Output Clock for Large Changes in Output Frequency" on page 16 and added new registers 13-18 in "4. Serial Port Registers" on page 23 for the Si570 7 ppm temperature stability / 20 ppm total stability ordering option. Rev. 1.5 Added Section 3.2 and 3.3. ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. 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