DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC2709T 5 V, MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC2709T is a silicon monolithic integrated circuit designed as 1st IF amplifier for DBS tuners. This IC is packaged in minimold package. This IC is manufactured using NEC's 20 GHz fT NESATTMIII silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES * Supply voltage : VCC = 4.5 to 5.5 V * Wideband response : fu = 2.3 GHz TYP. @3 dB bandwidth * Medium output power : PO (sat) = +11.5 dBm@f = 1 GHz with external inductor * Power gain : GP = 23 dB TYP. @f = 1 GHz * Port impedance : input/output 50 APPLICATIONS * 1st IF amplifiers in DBS converters * RF stage buffer in DBS tuners, etc. ORDERING INFORMATION Part Number PC2709T-E3 Remark Package 6-pin minimold Marking C1E Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC2709T) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12426EJ3V1DS00 (3rd edition) Date Published May 2000 N CP(K) Printed in Japan (c) 1994, 2000 PC2709T PIN CONNECTIONS 3 2 1 Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC (Bottom View) C1E (Top View) 4 3 4 5 5 2 6 6 1 PRODUCT LINE-UP OF PC2709 (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Part No. PC2709T PC2709TB fu (GHz) PO (sat) (dBm) GP (dB) NF (dB) ICC (mA) 2.3 +11.5 23 5 25 Package 6-pin minimold C1E 6-pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold. 2 Marking Data Sheet P12426EJ3V1DS00 PC2709T SYSTEM APPLICATION EXAMPLE EXAMPLE OF DBS CONVERTERS BS Antenna (DBS ODU) PC2711T/TB IF Amp. Mixer PC2712T/TB RF Amp. Parabola Antenna To IDU PC2709T/TB Oscillator EXAMPLE OF 900 MHz BAND, 1.5 GHz BAND DIGITAL CELLULAR TELEPHONE RX DEMO PLL I Q PLL SW I Driver TX 0 PA PC2709T/TB 90 Q To know the associated products, please refer to each latest data sheet. Data Sheet P12426EJ3V1DS00 3 PC2709T PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage Note (V) 1 INPUT - 1.05 4 6 2 3 5 OUTPUT VCC GND Voltage as same as VCC through external inductor - 4.5 to 5.5 - 0 Function and Applications Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 6 VCC 4 OUT Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. IN 1 - Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Note Pin voltage is measured at VCC = 5.0 V 4 Internal Equivalent Circuit Data Sheet P12426EJ3V1DS00 3 GND 2 5 GND PC2709T ABSOLUTE MAXIMUM RATINGS Parameter Symbol Ratings Unit Conditions Supply Voltage VCC 6 V Total Circuit Current ICC 60 mA TA = +25C Power Dissipation PD 280 mW Mounted on double copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Input Power Pin +10 dBm TA = +25C, Pin 4 and 6 TA = +25C RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA -40 +25 +85 C Notice The same voltage should be applied to pin 4 and 6. ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signal 19 25 32 mA Power Gain GP f = 1 GHz 21.0 23.0 26.5 dB f = 1 GHz, Pin = 0 dBm +9.0 +11.5 - dBm - 5.0 6.5 dB 3 dB down below flat gain at f = 0.1 GHz 2.0 2.3 - GHz Maximum Output Level Noise Figure Upper Limit Operating Frequency PO (sat) NF fu f = 1 GHz Isolation ISL f = 1 GHz 26 31 - dB Input Return Loss RLin f = 1 GHz 7 10 - dB Output Return Loss RLout f = 1 GHz 7 10 - dB Gain Flatness GP f = 0.1 to 1.8 GHz - 1.0 - dB Data Sheet P12426EJ3V1DS00 5 PC2709T TEST CIRCUIT VCC 1 000 pF C3 L 6 50 C1 IN 1 000 pF 50 OUT C2 4 1 1 000 pF 2, 3, 5 COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C3 Capacitor 1 000 pF L Bias Tee 1 000 nH C1 to C2 Bias Tee 1 000 pF EXAMPLE OF ACTURAL APPLICATION COMPONENTS Type Value Operating Frequency C1 to C3 Chip Capacitor 1 000 pF 100 MHz or higher L Chip Inductor 300 nH 10 MHz or higher 100 nH 100 MHz or higher 10 nH 1.0 GHz or higher INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 6 Data Sheet P12426EJ3V1DS00 PC2709T ILLUSTRATION OF APPLICATION CIRCUIT ASSEMBLED ON EVALUATION BOARD 3 Top View 1 2 IN OUT C C 6 L 5 4 C 1E Mounting Direction VCC C COMPONENT LIST Value C 1 000 pF L 300 nH Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E). Data Sheet P12426EJ3V1DS00 7 PC2709T TYPICAL CHARACTERISTICS (TA = +25C unless otherwise specified) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 40 40 35 35 ICC - Circuit Current - mA ICC - Circuit Current - mA CIRCUIT CURRENT vs. SUPPLY VOLTAGE 30 25 20 15 10 VCC = 5.0 V 30 25 20 15 10 5 5 0 0 -60 -40 -20 1 2 3 4 5 6 NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 4 25 30 GP - Insertion Power Gain - dB 5 GP - Insertion Power Gain - dB 6 VCC = 5.0 V VCC = 5.5 V GP 20 VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V NF 15 VCC = 4.5 V 10 0.1 0.3 1.0 TA = +85C 20 15 0.3 1.0 3.0 ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLin - Input Return Loss - dB RLout - Output Return Loss - dB VCC = 5.0 V -20 -30 -40 0.3 1.0 3.0 VCC = 5.0 V -10 RLin RLout -20 -30 -40 -50 0.1 0.3 1.0 f - Frequency - GHz f - Frequency - GHz 8 TA = +25C f - Frequency - GHz -10 -50 0.1 TA = -40C 25 10 0.1 3.0 VCC = 5.0 V f - Frequency - GHz 0 ISL - Isolation - dB NF - Noise Figure - dB 7 +20 +40 +60 +80 +100 INSERTION POWER GAIN vs. FREQUENCY 30 8 0 TA - Operating Ambient Temperature - C VCC - Supply Voltage - V Data Sheet P12426EJ3V1DS00 3.0 PC2709T OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +15 +15 +10 PO - Output Power - dBm PO - Output Power - dBm f = 1.0 GHz VCC = 5.5 V VCC = 5.0 V +5 VCC = 4.5 V 0 -5 -10 -15 +10 TA = +25C +5 TA = +85C 0 -5 -10 0 -20 -35 -30 -25 -20 -15 -10 -5 +5 +10 Pin - Input Power - dBm 0 +5 +10 Pin - Input Power - dBm OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +15 +15 f = 2.0 GHz VCC = 5.0 V VCC = 5.5 V +10 PO - Output Power - dBm PO - Output Power - dBm TA = -40C -15 -20 -35 -30 -25 -20 -15 -10 -5 +5 VCC = 5.0 V VCC = 4.5 V 0 -5 -10 -15 +10 +5 0 f = 2.0 GHz -5 -10 -20 -35 -30 -25 -20 -15 -10 -5 +5 +10 Pin = 0 dB +16 VCC = 5.5 V +14 VCC = 5.0 V +8 VCC = 4.5 V +6 +4 +2 0 0.1 0.3 1 3 IM3 - 3rd Order Intermodulation Distortion - dBc +20 +18 0 +5 +10 Pin - Input Power - dBm SATURATED OUTPUT POWER vs. FREQUENCY +10 f = 1.0 GHz 0 Pin - Input Power - dBm +12 f = 0.5 GHz -15 -20 -35 -30 -25 -20 -15 -10 -5 PO(sat) - Saturated Output Power - dBm VCC = 5.0 V f = 1.0 GHz THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE -60 f1 = 1 .000 GHz f2 = 1 .002 GHz -50 VCC = 5.0 V -40 VCC = 5.5 V -30 -20 VCC = 4.5 V -10 -10 -8 -6 -4 -2 f - Frequency - GHz 0 +2 +4 +6 +8 +10 PO(each) - Output Power of Each Tone - dBm Data Sheet P12426EJ3V1DS00 9 PC2709T S-PARAMETER (VCC = Vout = 5.0 V) S11-FREQUENCY 9 0.0 1 0.4 600 1.6 T EN ON 0. 18 32 0. 1.8 0.2 0.1 0.3 7 3 50 2.0 0. 0. 06 44 0.1 6 0.3 4 0.4 0 0 .2 0 0 .3 0 1 0.2 9 0.2 30 3. 0.6 ) 0.0 0 .4 5 5 70 40 0.8 2 0.2 8 0.2 20 4.0 ( 6 15 0 0.15 0.35 19 0. 31 0. POS 14 ITIV 0 ER EA CT A --+JX NCE ZO-- CO M P 0.14 0.36 80 90 07 43 0. 0 13 0. WAVELE NGTH S TO WAR D 0.0 GENE 3 RA N O I C T O C E E F L F F 0.4 C E IENT I R 0.0TOR 7 N DE LE OF G 4 N GRE A 0.4 ES 0.13 0.37 0.12 0.38 1.4 8 0.0 2 0.4 20 1 0.11 0.39 100 0.10 0.40 110 0 1. 6.0 10 20 1.0 G REACTANCE COMPONENT R ---- 0.2 ZO 50 0.1 G ( 0.4 0.1 0.6 3.0 G .8 0 1. E IV OM EC NC TA AC RE 0.3 0 T NEN PO 0.2 4 0. 0.8 0.7 0.6 0. 5 NE GA T S22-FREQUENCY 0.15 0.35 70 1.6 0 12 0. 0.1 0.3 7 3 0.4 0. 18 32 0. 2.0 T EN ON 50 0 3. ) 0.6 0.8 ( 6.0 2 0.2 8 0.2 20 4.0 0 1. 10 20 50 REACTANCE COMPONENT R ---- 0.2 ZO 3.0 G 0.1 0.1 G ( 0.4 0.6 1.0 G 8 4 0 1. 0.8 0.7 0.6 0. 5 0. E IV 0.3 0. O EC NC TA AC RE ENT ON MP 2.0 G NE GA T 0.2 10 600 1.8 0.2 0.1 6 0.3 4 1 0.2 9 0.2 30 POS 14 ITIV 0 ER EA CT A --+JX NCE ZO-- CO M P 0.0 0.4 5 5 0.14 0.36 80 90 0 0.2 0 0.3 6 15 0 0.13 0.37 0.12 0.38 40 WAVELE NGTH S TO WAR D 0.0 GENE 3 RA 0.4 EFLECTION COEFFCIENT R 0.0TOR F O IN DE 7 LE 4 GRE ANG 0.4 ES 43 0 13 0.11 0.39 100 19 0. 31 0. 0. 0. 06 44 0. 0.10 0.40 110 1.4 07 8 0.0 2 0.4 9 0.0 1 0.4 Data Sheet P12426EJ3V1DS00 PC2709T TYPICAL S-PARAMETER VALUES (TA = +25C) PC2709T VCC = Vout = 5.0 V, ICC = 30 mA Frequency MHz MAG S11 ANG MAG S21 ANG MAG S12 ANG MAG ANG 100.0000 200.0000 400.0000 600.0000 800.0000 1000.0000 1200.0000 1400.0000 1600.0000 1800.0000 2000.0000 2200.0000 2400.0000 2500.0000 .258 .261 .271 .275 .278 .279 .276 .263 .246 .237 .222 .194 .176 .173 -4.1 -2.9 -4.6 -8.1 -12.7 -15.2 -20.7 -25.6 -28.6 -31.7 -33.6 -33.1 -26.8 -23.2 12.706 12.793 13.023 13.305 13.595 13.816 13.992 13.750 13.195 12.254 10.976 9.664 8.392 7.771 -3.7 -12.2 -27.0 -41.3 -57.4 -72.3 -90.3 -109.3 -128.3 -147.5 -166.1 177.5 162.0 154.8 .022 .024 .025 .026 .026 .027 .027 .027 .028 .030 .031 .033 .034 .035 7.5 3.1 6.5 10.5 11.0 15.6 17.7 19.2 20.6 27.9 33.2 35.8 38.5 39.2 .234 .240 .260 .288 .312 .324 .332 .326 .302 .254 .198 .143 .089 .065 -4.6 -6.9 -13.5 -22.1 -33.5 -43.4 -59.0 -75.1 -90.6 -106.8 -120.8 -132.5 -144.4 -150.6 Data Sheet P12426EJ3V1DS00 S22 K 1.66 1.52 1.32 1.29 1.27 1.20 1.19 1.22 1.27 1.33 1.47 1.61 1.81 1.90 11 PC2709T PACKAGE DIMENSIONS 6 pin minimold (Unit: mm) 0.3 +0.1 -0.05 2 3 +0.2 1.5 -0.1 +0.2 2.8 -0.3 1 0.130.1 0 to 0.1 6 5 4 0.95 0.95 1.9 2.90.2 12 Data Sheet P12426EJ3V1DS00 0.8 +0.2 1.1 -0.1 PC2709T NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit : None IR35-00-3 VPS Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit : None VP15-00-3 Wave Soldering Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit : None WS60-00-1 Partial Heating Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit : None Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P12426EJ3V1DS00 13 PC2709T [MEMO] 14 Data Sheet P12426EJ3V1DS00 PC2709T [MEMO] Data Sheet P12426EJ3V1DS00 15 PC2709T ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. * The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8