ASDL-4860
High Power Infrared Emitter (850nm) in Surface Mount Package
Data Sheet
Description
ASDL-4860 Infrared emitter is encapsulated in a compact
SMT package that is specially catered for High Power ap-
plication. This device represents best performance for
light output, fast switching and low thermal resistance
for heat dissipation. It utilizes AlGaAs LED technology
and is optimized with high eciency at emissive wave-
length of 850nm.
Applications
• High Speed Machine Automated System
• Non-Contact Position Sensing
• Optical Sensing
• Infrared Data Transmission
• Security Applications
Ordering Information
Features
• Top Emitting Surface Mount Infrared LED
• Ultra-Low Height Prole:
H = 1.5mm, W=6.0mm, L=6.0mm
• High Power
• High Speed
• Low Thermal Resistance
• 850nm Wavelength
• Design for High Power Application
• Design to Drive High Current
• Wide Viewing Angle
• Lead-Free and RoHS Compliant
• Tape & Reel for automation placement
Part Number Packaging Shipping Option
ASDL-4860-C22 Tape & Reel 2000pcs
2
Package Outline
Tape and Reel Dimensions
All Dimensions are in Millimeters
3
Absolute Maximum Ratings at 25°C
Parameter Symbol Min. Max Unit Reference
Peak Forward Current IFPK 1 A Tp<10us
Duty Cycle=10%
Continuous Forward Current IFDC 500 mA
Power Dissipation PDISS 1.2 W
Reverse Voltage Vr5 V
Operating Temperature TO-40 100 °C
Storage Temperature TS-40 100 °C
LED Junction Temperature TJ125 °C
Lead Soldering Temperature 260 for 5 sec °C
Electrical Characteristics at 25°C
Parameter Symbol Min. Typ. Max. Unit Condition
Forward Voltage VF1.4 2.2 V IF =500mA
Reverse Voltage Vr5 V IR=100uA
Diode Capacitance CO350 pF Vr=0V, f=1MHz
Thermal Resistance,
Junction/Base
Rqjs 20 °C/W
Optical Characteristics at 25°C
Parameter Symbol Min. Typ. Max. Unit Condition
Average On-Axis Intensity (1) IE40 45 mW/Sr IF =500mA
Viewing Angle 2θ1/2 120 deg
Peak wavelength λPK 850 nm IF = 500mA
Spectral Width Δλ 40 nm IF = 20mA
Optical Rise Time tr15 ns IF = 20mA
Optical Fall Time tf10 ns IF = 20mA
Note (1): IE is measured with accuracy of + 11%
4
Typical Electrical / Optical Characteristics Curve (TA = 25°C Unless Otherwise Stated)
Figure 5. Maximum Forward Current Vs Solder Point Temperature
Figure 4. Angular Displacement Vs Relative Radiant Intensity
Figure 2. Forward Current Vs Radiant Intensity
Figure 1. Peak Wavelength Vs Relative Radiant Power
Figure 3. Forward Current Vs Forward Voltage
0
10
20
30
40
50
60
70
80
0 200 400 600 800 1000
IF (mA)
IE (mW/Sr)
0
0.5
1
1.5
2
2.5
3
0 200 400 600 800 1000
IF (mA)
VF (v)
0
100
200
300
400
500
600
010 20 30 40 50 60 70 80 90 100
Solder Point Temperature (Ts)
Max IF (mA)
0.0E+00
2.0E-07
4.0E-07
6.0E-07
8.0E-07
1.0E-06
1.2E-06
0200 400 600 800 1000 1200
Peak Wavelength (nm)
Relative Radiant Power
0
0.2
0.4
0.6
0.8
1
-0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8
Ie - Relative Radiant Intensity
5
50 100 150 200 250 300
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (°C)
R1
R2
R3 R4
R5
217
MAX 260C
60 sec to 90 sec
Above 217 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
Process Zone Symbol DT
Maximum DT/Dtime
or Duration
Heat Up P1, R1 25°C to 150°C 3°C/s
Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s
Solder Reow P3, R3
P3, R4
200°C to 260°C
260°C to 200°C
3°C/s
-6°C/s
Cool Down P4, R5 200°C to 25°C -6°C/s
Time maintained above liquidus point , 217°C > 217°C 60s to 90s
Peak Temperature 260°C -
Time within 5°C of actual Peak Temperature - 20s to 40s
Time 25°C to Peak Temperature 25°C to 260°C 8mins
The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder
process. The temperature prole is divided into four process zones, each with dierent DT/Dtime temperature change
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at
the component to printed circuit board connections.
In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and component pins.
Process zone P2 should be of sucient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reow zone. In zone P3, the temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60
and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze
solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting minimal stresses on the component.
It is recommended to perform reow soldering no more than twice.
Recommended Reow Prole
Recommended Land Pattern
Note:
The additional solder resist is to improve heat dissipation.
The bigger the surface area, the better is the thermal dis-
sipation. The surface area depends on the substrate and
total power used. If MC (Metal Core) PCB is used, the ad-
ditional area will not be needed as the whole MC PCB
conducts heat.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0273EN - April 27, 2007
