○ Product structure：silicon monolithic integrated circuit ○It is not the radiation-proof design for this product.
1/20 TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
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TSZ22111・14・001
36VHigh-performance,
High-reliability Withstand Voltage
Stepping Motor Driver
BD68710EFV
●General Description
BD68710EFV is a bipolar low-
consumption driver that
driven by PWM current. Rated power supply voltage of
the device is 36 V, and rated output current is 1.0
A.
PARA-
IN driving mode is adopted for input interface,
and excitation mode is corresponding to FULL STEP
mode, HALF STEP mode (2 types) and QUARTER
STEP mode via a built-
in DAC. In terms of current
decay, the FAST DECAY/SLOW DECAY ratio may b
e
set without any limitation, and all available modes may
be controlled in the most appropriate way. In addition,
the power supply may be driven by one single system,
which simplifies the desig n.
● Features
■ Rated output current（DC）1.0A
■ Low ON resistance DMOS output
■ PARA-IN drive mode
■ PWM constant c urrent (other os c i llation)
■ Built-in spike noi s e cancel function (external noise
filter is unnec essary)
■ Full-, half (two kinds)-, quarter-step functionality
■ Freely timing excitation mode switch
■ Current deca y mode switch
（linearly variable FAST/SLOW DECAY ratio）
■ Normal rotati on & reverse rotation switchi ng
function
■ Power save func tion
■ Built-in logic input pull-down resistor
■ Power-on reset function
■ Thermal shutdown circuit (TSD)
■ Over-current protection circuit（OCP）
■ Under voltage lock out circuit (UVLO)
■ Over voltage lock out circuit (OVLO)
■ Ghost Supply Prevention (protects against
malfunction when power supply is disconnected)
■ Adjacent pins short protection
■ Microminiature, ultra-thin and high heat-radiation
(exposed metal type) package
● Applications
■ PPC, multi-function printer, laser beam printer, and
ink-jet printer
■ Monitoring camera and WEB camera
■ Sewing machine
■ Photo printer, FAX, scanner and mini pri nter
■ Toy and robot
● Key Specifications
■ Range of powe r supply voltage
■ Rated output current (continuous)
■ Rated output current (peak v alue)
■ Range of operat ing temperatur e
■ Output ON resistance (total of
upper and lower resistors)
19～28 [V]
1.0 [A]
1.5 [A]
-25～+85 [℃]
1.2 [Ω] (Typ.)
●Package W(Typ.) x D(Typ.)x H(Max.)
HTSSOP-B28 9.70mm x 6.40mm x 1.00mm
● Typical Application circuit
Figure.1 Application circuit
10
CR
12 MTH
7 VCC1
2 OUT1B
5 OUT1A
3 RNF1
22 VCC2
24 OUT2A
1 GND
27 OUT2B
26 RNF2
RNF1S
4
RNF2S
25
15
PHASE1
16
I01
18
I11
17
PHASE2
19
I02
VREF
13
9 GND
14 PS
20
I12
Datashee
t
2/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
OUT2B
RNF1S
OUT1A
VCC1
NC
MTH
VREF
PS
NC
RNF2S
GND
OUT1B
RNF1
RNF2
OUT2A
NC
VCC2
I02
I11
PHASE2
PHASE1
I01
I12
NC
GND
CR
NC
NC
● Pin Configuration [TOP VIEW] ● Block Diagram
● Pin Description
Pin No. Pin name Function Pin No. Pin nam e Function
1 GND Ground terminal 15 PHASE1 Phase selection terminal
2 OUT1B H bridge output terminal 16 I01 VREF division ratio setting terminal
3 RNF1
Connection terminal of resistor for
output current detection 17 PHASE2 Phase selection terminal
4 RNF1S Input terminal of current limit
comparator 18 I11 VREF division ratio setting terminal
5 OUT1A H bridge output terminal 19 I02 VREF division ratio setting terminal
6 NC Non connection 20 I12 VREF division ratio setting terminal
7 VCC1 Power supply terminal 21 NC Non connection
8 NC Non connection 22 VCC2 Power supply terminal
9 GND Ground terminal 23 NC Non connection
10 CR Connection terminal of CR for setting
chopping frequency 24 OUT2A H bridge output terminal
11 NC Non connection 25 RNF2S Input terminal of current limit comparator
12 MTH Current decay mode setting terminal 26 RNF2 Connection terminal of resis tor for output
current detection
13 VREF Output current value setting terminal 27 OUT2B H bridge output terminal
14 PS Power save terminal 28 NC Non connection
7
8
6
5
3
4
2
1
Figure.2 Pin configuration
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Figure.3 Bl ock Diagram
I01
I11
I02
Predriver
7 VCC1
Blank time
PWM control
2bit DAC
TSD
UVLO
Regulator
RESET
9 GND
10
CR
12 MTH
14
PS
15
PHASE1
16
18
17
19
VREF
13
2 OUT1B
5 OUT1A
3 RNF1
22 VCC2
24 OUT2A
1 GND
27 OUT2B
26 RNF2
Control logic
Mix decay
control
＋
－
＋
－
＋
－
OCP
OSC
RNF1S
4
RNF2S
25
OVLO
RNF1S
RNF2S
PHASE2
I12
20
Translator
3/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
● Absol ute Maximum Rat ings (Ta=25℃)
Item Symbol Rated Value Unit
Supply voltage VCC1,2 -0.2～+36.0 V
Input voltage for control pin VIN -0.2～+5.5 V
RNF maximum voltage VRNF 0.7 V
Maximum output current (DC) IOUT 1.0 A/Phase
Maximum output current
(PEAK)(Note 1) IOUTPEAK 1.5 A/Phase
Operating tem perature range Topr -25～+85 ℃
Storage temperature range Tstg -55～+150 ℃
(Note 1)Pulse width tw≦1ms, duty 20%.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between
pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute
maximum ratings.
●Recommended operating range (Ta= -25～+85℃)
Item Symbol Rated Value Unit
Supply voltage VCC1,2 19～28 V
Maximum Output current (DC) IOUT 0.7 A/ Phase
4/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
Thermal Resi stance(Note 2)
Parameter Symbol Thermal Resistance (Typ) Unit
1s(Note 4) 2s2p
(
Note 5)
HTSSOP-B28
Junction to Ambient θJA 107.0 25.1 °C/W
Junction to Top Character ization Parameter(Note 3) ΨJT 6 3 °C/W
(Note 2)Based on JESD51-2A(Still-Air)
(Note 3)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Boar d
Material Board Size
Single FR-4 114.3mm x 76.2m m x 1. 57mmt
Top
Copper Pattern Thickness
Footprints and Traces 70μm
(Note 5)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Boar d
Material Board Size
4 Layers FR-4 114.3mm x 76.2m m x 1. 6m mt
Top 2 Internal Laye rs Bottom
Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness
Footprints and T races 70μm 74.2mm x 74.2m m 35μm 74.2mm x 74. 2mm 70μm
5/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●Electrical Characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)
Item Symbol Specification Unit Condition
Minimum Standard Maximum
[Whole]
Circuit current at standby ICCST - 0.8 2.0 mA PS=L
Circuit current ICC - 2.0 5.0 mA PS=H, VREF=3V
[Control input] (PHASE1, PHASE2)
H-level input voltage VIN1H 2.8 - - V
L-level input voltage VIN1L - - 0.6 V
Input hysteresis voltage VIN1HYS - 0.85 - V
H-level input current IIN1H 35 50 100 µA VIN1=5V
L-level input current IIN1L -10 0 - µA VIN1=0V
[Control input] ( P S, I01, I11, I02, I12)
H-level input voltage VIN2H 2.0 - - V
L-level input voltage VIN2L - - 0.8 V
H-level input cur rent IIN2H 35 50 100 µA VIN2=5V
L-level input cu rrent IIN2L -10 0 - µA VIN2=0V
[Output (OUT1A, OUT1B, OUT2A, OUT2B)]
Output ON resi s tance RON - 1.2 1.5 Ω IOUT =±1.0A (total of upper and
lower resistors)
Output leak current ILEAK - - 10 µA
[Current control]
RNFXS input c urrent IRNFS -2.0 -0.1 - µA RNFxS=0V
RNFX input cur rent IRNF -80 -40 - µA RNFx=0V
VREF input current IVREF -2.0 -0.1 - µA VREF=0V
VREF input vol tage range VVREF 0 - 3.0 V
MTH input cur r ent IMTH -2.0 -0.1 - µA MTH=0V
MTH input voltage range VMTH 0 - 3.5 V
Minimum ON time
(Blank time)
tONMIN 0.3 0.7 1.5 µs C=1000pF, R= 39kΩ
Comparator threshold VCTH 0.57 0.60 0.63 V VREF=3V
6/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●Function explanation
○PS/Power saving pin
PS can make circuit standby state and make motor output OPEN. When PS=L⇒H, please be careful because there is a
delay of 40μs (max.) befor e it is returned from standby state to normal state and the motor output b ec omes ACTIVE.
PS State
L Standby state(RESET)
H ACTIVE
○PHASE1, PHASE2/Phase selection terminal
This is the pin to decide output logic.
PHASE1 PHASE2 OUT1A OUT1B OUT2A OUT2B
L L L H L H
H L H L L H
L H L H H L
H H H L H L
○I01,I02,I11,I12 / VREF divisi on r atio setting pin
These terminals determine internal 2bit-DAC output voltage for current limit.
(I0X, I1X)=(H, H) : motor outputs are ope n.
○VCC1,VCC2／Power supply terminal
Motor’s drive current is flowing in it, so please wire in such a way that the wir e i s thick & short and h as low impedance.
Voltage VCC m ay have great fluctuation, so please arrange the bypass capacitor of about 100μ～470μF as c l os e to the
terminal as possible and adjust in such a way t hat the voltage VCC is stable. Please increase the c apacity if needed
especially when a l arge current is used or th ose motors that have great back electromotive f orce are used. In addition, for
the purpose of reducing of power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered
ceramic capac itor of 0.01μ～0.1μF et c is recommended. E xtreme care must be us ed to make sure that t he voltage VCC
does not exce ed the rating even for a mom ent. VCC1 & VCC2 are shor ted inside IC, so ple ase be sure to short e xternally
VCC1 & VCC2 when using. If used without shorting, malfunction or destruction may occur because of concentration of
current routes etc., so please make sure t hat the y are shorted when in use. Still mor e, in the power suppl y terminal , there is
built-in clamp component for preventing of electrostatic destruction. If steep pulse or voltage of surge more that maximum
absolute rating is applied, this clam p component operates, as a result ther e is the danger of destr uction, so please be sure
that the maximum absolute rating must not be exceeded. It is effective to mount a Zener diode of about the maximum
absolute ratin g. Moreover, the diode for pre venting of electrostatic destruction is inser ted between VCC terminal and GND
terminal, as a result there is the danger of IC destruction if reverse voltage is applied between VCC terminal and GND
terminal, so p lease be careful.
○GND／Ground terminal
In order to reduc e the noise caused by switching current and to stabilize the int er nal reference v oltage of IC, please wire in
such a way that the wiring impedance from this t erminal is made as l ow as possible t o ac hieve the lowest electrical potential
no matter what operating state it may be.
○OUT1A,OUT1B,OUT2A,OUT2B／H Bridge output t erminal
Motor’s drive current is flowing in it, so please wire in such a way that the wir e i s thick & short and h as low impedance. It is
also effective to add a Schottky diode if output has positiv e or negative great fluctuation when large curre nt is used etc, for
example, if c ounter electromotive voltage etc. is great. Moreover, in the output termina l, there is built-in clamp component
for preventi ng of electrostatic destruction. If steep pulse or voltag e of surge more than maximum abs olute rating is applied,
this clamp com ponent operates, as a result ther e i s the danger of even des truction, s o please be sure that the maximum
absolute rating must not be exceeded.
I0x I1x Output current level (%)
L L 100
H L 67
L H 33
H H 0
7/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
○RNF1,RNF2／Connec tion termina l of resistor for detecting of output current
Please connect the resist or of 0.1Ω～0.3Ω for current detection between this ter m i nal and GND. In view of the power
consumption of the current-detecting res istor, please determine the r esistor in such a way that W= IOUT2･R[W] does not
exceed the power di s sipation of the resistor. In addition, please wire in such a way that it has a low impedance and does
not have a impedance in common with other GND patterns because m otor’s drive current flows in t he pattern through RNF
terminal～current-detecting resistor～GND. Please do not exceed the rating because there is the poss ibility of circ uits’
malfunction etc. if RNF voltage has exceeded the maximum r ating (0.7V). M oreover, please be careful bec ause if RNF
terminal is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that
OCP or TSD will operate. If RNF terminal is open, then there is t he possibility of such malfunc tion as output current does
not flow either, so please do not let it open.
○RNF1S,RNF2S／Input terminal of c ur rent limit c omparator
In this series, R NFS terminal, which is the input t er minal of curr ent limit comparator, is indepen dently arranged in order to
decrease the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF terminal.
Therefore, please be sure to connect RNF terminal and R NFS terminal together when using in the case of PWM constant
current control. In addition, because the wires from RNFS terminal is connected near the current-detecting resistor in the
case of interconnection, the lowering of current-detecting accuracy, which is caused by the impedance of board pattern
between RNF ter minal and the cur rent-detec ting resistor , can be decreas ed. Moreover, please design t he pattern in s uch a
way that ther e is no noise plunging. I n addition, please be caref ul because if terminals of RNF1S & RNF2S are short ed to
GND, large current flows without normal PW M constant current cont rol and, then there is the danger that OCP or TSD will
operate.
○VREF／Output current value setting terminal
This is the terminal to set the output current v alue. The output cur rent value can be s et by VREF voltage and
current-detecting resistor (RNF resistor).
Output current IOUT [A] = {VREF [V] / 5(division ratio inside IC)} / RNF [Ω]
Please avoid using it with VR EF terminal open because if VREF terminal is open, the input is uns ettled, and the VR E F
voltage increases, and the n there is the possibility of such malfunctions as the setting current increases and a large current
flows etc. Pl ease keep to the input voltage range because if the v oltage of over 3V is applied on VREF terminal, the n there
is also the danger that a large cur rent flows in the output and so O CP or TSD will operate. Besides , please take i nto
consideration the outflow current (max.2μA) if inputted by resistance division when selecting the resistance value. The
minimum current, which can b e controlled by V REF voltage, is determined b y motor coil’s L & R val ues and minimum ON
time because there is a minimum ON time in PWM drive.
○CR／Connection t erminal of CR for setting chopping frequency
This is the terminal to set the c hopping frequenc y of output. P lease connect the external C(470p～1 500pF) and R(10 k～
200kΩ) between this terminal and GND. Please r efer to P9.
Please interconnect from e xternal components to GND in such a way that the interc onnection does not have imped ance in
common with other GND patterns. In additio n, please carr y out the pattern des i gn in such ways as k eeps such steep pulses
as square wave etc . away and that there is no noise plun ging. Please mount t he two components of C and R if being used
by PWM constant current cont rol becaus e normal PW M constant cur rent cont rol becom es impossib le if CR terminal is open
or it is biased externally.
○MTH／Current decay mode-s etting terminal
This is the terminal to set the c urrent decay mode. C ur rent decay mode can be optionally set according to input volt age.
MTH terminal input v ol tage[V] Current deca y mode
0~0.3
SLOW DECAY
0.4~1.0 MIX DECAY
1.5~3.5
FAST DECAY
Please connect to GND if us i ng at SLOW DECAY mode.
Please avoid using with MTH terminal open because if MTH term i nal i s open, the input is unsettled, and then ther e is the
danger that P WM operation becomes unstable. B esides, please take into consideration the outflow current (max.2μA) if
inputted by res istance divis i on when select i ng the resistance value.
○NC terminal
This termi nal i s unconnected electrically with IC internal circuit.
8/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
○Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175℃(Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ.), it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
○Over Current Protection (OCP)
This IC has a built in over current protection circ ui t as a provision a gainst destruction when the mot or outputs are
shorted each o ther or VCC-motor output or motor output-GND is shorted. This circuit latches t he motor output t o OPEN
condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset of the
PS terminal. T he over current protection circuit’s only aim i s to prevent the destructio n of the IC from irregular situations
such as motor output shorts, and is not meant to be used as protect ion or securit y f or the set. Ther efore, sets should
not be designed to take into ac c ount this circui t’s functions . After OCP oper ating, if irregular situatio ns continues and
the return by power reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly
and the IC may generate heat or ot herwise deterior ate. When the L value of the wiring is great due to the wiring being
long, after the over current has flowed and the output terminal voltage jumps up and the abs olute maximum v al ues
may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output
current rating a nd under the OCP det ection c urrent f lo ws, the IC can heat up to over T jmax=150℃ and c an deteri orate,
so current which exceeds the output rating should not be applied.
○Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out f unction to prevent false operat ion such as IC output during p ower supply
under voltage. When the applied voltage to the V CC terminal goes under 15V (Typ.), the motor output is set to OPEN.
This switching voltage has a 1V (Typ.) hysteresis to prevent fal s e operation by noise etc. Please be aware that this
circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates
during PARA-IN drive mode.
○Over Voltage Lock Out (OVLO )
This IC has a built-in over voltage lock out function to protect the IC output and the motor durin g power supply over
voltage. When the applied voltage to the VCC t er minal goes over 32V (Typ.), the m otor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc.
Although this over voltage locked out circui t is built-in, there is a possibility of destruction if the absolute maxi m um
value for power supply voltage is exceeded, therefore the absolute ma ximum value should not be excee ded. Please be
aware that thi s circuit does not operate durin g power save mode.
○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (logic input, MTH, VREF) is input when there is no power supplied to this IC, there is a function which
prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input
terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even
when voltage is supplied to these input term inals while th ere is no power supply.
9/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
○PWM Constant c urrent control
1) Current control operation
When the output transistor i s turned on, the output current in c reases, raising the voltage o ver the current s ense resistor.
When the voltage on the RNF pin reac hes the voltage v al ue set by the internal 2-bi t DAC and the VREF input voltage, the
current limit c omparator engages and enters c urrent decay mode. The output is then held off for a per i od of time
determined by the RC time constant connect ed to the CR pin. The pr oc ess repeats its el f constantly for PW M operation.
2) Noise-masking function
In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, t he IC
employs an automatic current detection-masking period (tONMIN), during which c ur rent detection is disabled imm ediately
after the output transistor i s turned on. Thi s allows for constant-current dri ve without the need for an ext ernal filter. This
noise-masking perio d defines the mi nimum ON-time for the motor output transistor.
3) CR Timer
The CR filter connected to the CR pin is r epeatedl y char ged and discharged bet ween the VCRH and VCRL levels. The
output of the in ternal comparator is masked while charging f r om VCRL to VCRH in order to cancel noise. (As mentioned
above, this period defines the minimum ON-t ime of the motor output transis tor.) The CR term i nal begins disc har ging once
the voltage reaches VCRH. When t he output current reaches t he current limit dur i ng this period (i.e. RNF volt age r eaches
the decay trigger voltage), then the IC enters decay mode. The CR continues to discharge dur ing this period until it reaches
VCRL, at which point the IC output is switched back O N . The current output and CR pin begin charging simultaneously.
The CR charge time (tONMIN) and discharge time (tdischarge) are set by external component s , according to t he following
formulas. The total of tONMIN and tdischarge yield the chopping period, tchop.
tONMIN[s]≒C･R'･R / (R'+R)･ln[(VCR-0.4)/(VCR-1.0)]
VCR=V･R/(R'+R)
V: internal re gulator voltage 5V(Typ.)
R': CR terminal inter nal impedance 5kΩ(Typ.)
tdischarge[s]≒C･R･ln[(1+α)/0.4]
α:See the right graph.
tCHOP[s]≒tONMIN + tdischarge
Figure 4 Timing chart of CR voltage, RNF voltage and out put current
Attach a resistor of at least 10 kΩ to the CR terminal (10 kΩ~200 kΩ recommended) as lower values may keep the RC from
reaching the V CR H voltage level. A capacitor i n the range of 470 pF – 1500 pF is also recommended. As the capacitance
value is incre ased, however, the noise-masking period (tonmin) also increases, and there is a risk t hat the output current may
exceed the current limit threshold due to the internal L and R components of the output motor c oi l. Also, ensure that the
chopping peri od (tchop) is not set longer than necessary, as doing so will increase the output ripple, thereby decreasing the
average output current and yielding lower output rotati on efficiency. The optimal val ue should reduce the motor drive noise
while keepin g distortion of the output current waveform to a m i nimum.
CR Voltage
RNF Voltage
Output current
Spike noise
Current limit Value
GND
Minimum ON T ime
tONMIN
VCRH(1.0V typ.)
VCRL(0.4V t yp. )
GND
0mA
Current limit Value
Chopping Period
tCHOP
Discharge time
tdischarge
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0500 1000 1500 2000
C [pF]
α[V]
10/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
○Current deca y mode
The IC allows for a mixed decay mode in which the r atio of fast and slow decay can be optionally set .
The following diagrams show the operating state of each tr ansistor and t he regenerative current path during attenuation for
each decay mode:
Figure 5 Route of Regenerate d C ur rent during Curr ent Decay
The merits of each decay mode are as follows:
○SLOW DECAY
During current attenuation, the voltage between motor co il s is small and th e regeneration current decreases slowly,
decreasing t he output current ripple. This is favorable for k eeping motor torque high. However, due to fall-off of current
control charac teristics i n the low-current region, or due to r everse EMF of the output motor s exhibited when using
high-pulse-rate hal f-step or quart er-step modes, the output current increases, distorting the output current waveform an d
increasing m otor vibration. Thus, this decay mode is most suited to full-s tep modes, or lo w-pulse-rate half-step or
quarter-ste p m odes.
○FAST DECAY
Fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of t he
output current waveform. Ho wever, fast dec ay yields a muc h larger output c urrent ripple, which decreases the overall
average current running t hr ough the motor. T his causes two problems: first, the motor torque dec reases (incr easing the
current limit v alue can help eliminate this problem, but the rated output current must be t ak en i nto considerat i on); and
second, the power loss withi n the motor increases and there by radiates mo r e heat. If neith er of these problems i s of
concern, then fast decay can be used for high-puls e rate half- or quarter-step drive.
Additionally, this IC allows for a mixed decay mode that can hel p improve upon problems that arise from using fast or slow
decay alone. In this mode, the IC switches automatically between slow and fast decay, improving the current control
characteristics without i ncreasing the out put current ripple. The ratio of fast to slow decay is set externally via the voltage
input to the MTH pin; therefore, the optimal mix of slow and fast decay can be achieved for each application. Mixed decay
mode operates by splitting the decay period into two sections, the first X%(t1-t2) of which operates the IC in sl ow decay
mode, and the remain der (t2-t3) of which o perates in fast decay mode. However, if the output current (i.e., the voltage on
the RNF pin) does not reach the set c urrent limit duri ng the first X% (t1-t2) decay per i od, the IC oper ates in fast decay
mode only.
MTH voltage [V] Current decay mode
0~0.3 SLOW DECAY
0.4~1.0 MIX DECAY
1.5~3.5
FAST DECAY
Figure 6 Relation between CR term i nal voltage, MTH voltage, and output current during mixed decay
ON→OFF
OFF→ON
M
ON→OFF
OFF
FAST DECAY
SLOW DECAY
ON→OFF
OFF→ON
M
ON→ON
OFF→OFF
Output ON Time
Current Decay Time
CR Voltage
Current limit value
Output Current
0A
GND
1.0V
0.4V
SLOW
DECAY
FAST
DECAY
Chopping Period
tchop
MTH Voltage
t1
t2
t3
11/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●PARALLEL-IN drive mode
It is possible to drive stepping motor with FULL STEP, HALF STEP, and QUARTER STEP by inputting the following motor
control signals using PARALL EL-IN drive mode.
Examples of c ontrol sequence and torque vector
Controlled by 2 logic signals of PHASE1 & PHASE2
Controlled by 4 logic signa ls of PHASE1, P H A SE2, I01(I11), and I02(I12)
HALF STEP A
2
8
6
4
100%
67%
33%
1
5
7
3
OUT1A
OUT2B
OUT2A
OUT1B
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
I01
I02
I11
④
③
PHASE1
PHASE2
①
②
I12
IOUT(CH1)
IOUT(CH2)
I11
I01
I02
⑧
PHASE1
PHASE2
⑤
⑥
⑦
①
②
③
④
I12
IOUT(CH2)
IOUT(CH1)
FULL STEP
4
3
2
100%
67%
33%
OUT2B
OUT1B
OUT2A
OUT1A
1
12/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
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TSZ22111・15・001
Controlled by 6 logic signa ls of PHASE1, P H A SE2, I01,I11,I02, and I12
Controlled by 6 logic signa ls of PHASE1, P H A SE2, I01,I11,I02, and I12
HALF STEP B
QUARTER STEP
2
8
6
4
100%
67%
33%
1
5
7
3
OUT1A
OUT2B
OUT2A
OUT1B
OUT1A
3
15
11
7
100%
67%
33%
2
9
13
5
16
14
12
6
8
1
4
2
10
OUT1B
OUT2A
OUT2B
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
IOUT(CH2)
IOUT(CH1)
③
④
I02
I12
I01
I11
⑧
PHASE1
PHASE2
⑤
⑥
⑦
①
②
⑦
⑧
I01
I11
PHASE1
PHASE2
③
④
⑤
⑥
IOUT(CH2)
IOUT(CH1)
①
②
I02
I12
⑨
⑩
⑪
⑫
⑬
⑭
⑮
⑯
13/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●Power dissipation
Please confirm that the IC’s chip temperature Tj is not ov er 150℃, while consi dering the IC’s power cons umption (W) and
ambient temperature (Ta) . When Tj=150℃ is exce eded the functi ons as a semiconductor do not operate and problems such
as parasitism and leaks occur. Constant use under these circumstances l eads to deterioration and ev entually destructi on of
the IC. Tjmax=150℃ must be strictly obeyed under all circumstances.
○Thermal Calcul ation
The IC’s cons um ed power can be estimated roughly with the power supply voltage (VCC), circuit current (ICC), output ON
resistance ( R ONH､RONL) and motor out put current value (IOUT).
The calculation method duri ng FULL STEP drive, SLOW DECAY m ode i s shown here:
Consumed po wer of the Vcc [W ] = VCC [V]･ICC [A] ･･･････①
Consumed po wer of the output DMOS [W] = (RONH[Ω] + R ONL[Ω])･IOUT [A]2･2[ch]･on_duty
During output ON
+ (2･RONL[Ω])･IOUT [A]2･2[ch]･(1 - on_duty) ･･･････②
During current decay
However, on d uty: PWM on duty = ton / (tchop)
ton varies dependin g on the L and R values of the motor coil and the curren t set value. Ple as e confirm by act ual
measurement, or make an appro ximate calculati on.
tchop is the chopping period, which depends on the external CR. See P.8 for details.
IC number Upper P chDMOS O N Resistance
RONH[Ω] (Typ.) Lower NchDMOS ON Res istance
RONL[Ω] (Typ.)
BD68710EFV 0.70 0.50
Consumed po wer of total IC W_total [W] = ① + ②
Junction temperature Tj = Ta[℃] + θja[℃/W]･W_total [ W]
However, the thermal resist ance valueθja [℃/W] differs greatly dependin g on circuit boar d conditions. Refer to the
derating curve on P.17.Also, we are taking m easurements of thermal resistance valueθja of boards actually in use.
Please feel fr ee to contact our salesman. T he c al c ulated values above are only t heoretical. For actual thermal design,
please perform sufficient thermal evaluat ion for the application boar d us ed, and create the thermal design with enough
margin to not exceed Tjmax=150℃. Although unnec es sary with normal use, if the IC is to be used under especially
strict heat c onditions, pleas e consider exter nally attach ing a Schottk y diode between the m otor output ter minal and
GND to abate heat from the IC.
○Temperature Monit ori ng
In respect of BD68710EFV, there is a way to appro ximate ly measure t he c hip tem perat ure b y using the electros tatic d isc harge
protection diode of the logic terminal (I0x or I1x) can be used when at L state. Temperature monitoring using this method is
only for evaluation and experimenting purposes, and must not be used in actual usage conditions.
(1)Measure the terminal voltage when a current of IDIODE=50µA passes from the I0x or I1x terminal to the GND
without supplying VCC to the IC. This measurement is the Vf voltage of the internal diode.
(2)Measure the temperature characteristics of this terminal voltage. Vf has a linear negative temperature factor
against temperature. With these results of temperature characteristics, chip temperature may be calibrated from the
I0x or I1x terminal voltage.
(3)Supply VCC, monitor the I0x or I1x terminal voltage while running the motor, and the chip temperature can be
approximate d from the results of (2).
Figure.7 Model diagram for meas uring chip temper ature
-Vf[mV]
25 150 Chip temperature Tj[℃]
I0x or I1x
Vf
Internal circuit
Idiode
14/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●Example for applied circuit
Figure.8 Bloc k diagram and appl ied circuit diagram
0.2Ω
0.2Ω
Resistor for current detection
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detai l.
39kΩ 1000pF
Set the chopping
frequency.
Setting range is
C:470pF～1500pF
R:10kΩ～200kΩ
Refer to P.7, 9 for detail.
Bypass capacitor.
Setting range is
100uF～470uF(electrolytic)
0.01uF～0.1uF(multilayer ceramic
etc.)
Refer to P.6 for detai l.
Be sure to short VCC1 & VCC2.
Resistor for current detection
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detai l.
Predriver
7 VCC1
Blank time
PWM control
Translator
2bit DAC
TSD
UVLO
Regulator
RESET
9 GND
10
CR
12 MTH
14 PS
15
PHASE1
18
I11
19
I02
16
I01
20
I12
VREF
13
2 OUT1B
5 OUT1A
3 RNF1
22 VCC2
24 OUT2A
1 GND
27 OUT2B
26 RNF2
Control logic
Mix decay
control
＋
－
＋
－
＋
－
OCP
OSC
RNF1S
4
RNF2S
25
OVLO
RNF1S
RNF2S
0.1µF
100µF
Set the output current.
Input by resistor division.
Refer to P.6 for detai l.
Set the current decay mode.
①SLOW DECAY
⇒Connect to GND.
②MIX DECAY
⇒Input by resistor division.
Refer to P.7, 10 for detail .
Logic input terminal
See P6 for detail.
Power save terminal
Refer to P.6 for detai l.
17
PHASE2
15/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
●Input output equi v alent circuit diagram
Figure.9 Input output equivalent circuit di agram
10kΩ
100kΩ
PS
I01
I11
I02
I12
VREF
MTH
5kΩ
VCC
circuitry
RNF1, RNF2
OUT1B
OUT2B
OUT1A
OUT2A
RNF1S
RNF2S 5kΩ CR
5k
Ω
5k
Ω
5k
Ω
VREG (internal regulator)
215kΩ
100kΩ
PHASE1
PHASE2 10kΩ
16/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting t he power supply in rever se polarity can d amage the IC. Take pr ecautions against reverse polarit y when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent nois e in the grou nd and supply li nes of the digital bloc k from affecting t he analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using el ec trolytic capacit ors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during tr ansient condit ion.
4. Ground Wiring Pattern
When using both s mall-sign al and large-c urre nt ground t races , the t wo ground traces s hould be routed s eparately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ens ure that the grou nd traces of exter nal components do not cause var iations
on the ground voltage. The ground lines must be as short and thick as possible to reduc e line impedance.
5. Thermal Consideration
Should by any chanc e the maximum junction temperature r ating be excee ded the rise in temperatur e of the chi p may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to pr event exceeding t he maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of conne ct ions.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electrom agnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the I C during ass embly an d use similar prec a utions dur ing
transport and s torage.
10. Inter-pin Short and Mounting Err or s
Ensure that the direction an d positio n are cor rect when mountin g the IC on the P CB. Incorr ect mounti ng ma y resu lt in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposite d i n between pins during assembly to name a few.
17/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
Operational Notes – continued
11. Unus ed Input Pins
Input pins of a n IC are often conn ected to t he gate of a MO S transistor. The gate has extremel y high imped ance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpec ted operation of the IC. So unless other wise specified, unus ed input pins should be con nected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer t o figure below):
When GND > Pin A and GND > Pi n B , the P-N junction op erates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasit ic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference a mong circuits, operati onal faults, or physical damage. Therefore, con ditions that caus e these diodes to
operate, such as applying a voltage lo wer than the GND voltage to an input pin (and thu s to the P substrate) shou ld
be avoided.
Figure 10. Exam ple of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat dam age to the IC. Normal operat ion should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature ( Tj) will rise which will acti vate the TSD circuit that will turn OFF all output pins . When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operat ion.
Note that the TS D circuit operates in a sit uation that exceed s the absolute maximum ratings and ther efore, under n o
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection ci rcuit is effective in pr eventing damage due to sudden and unexpected inci dents. However, the IC shou ld
not be used in applications characterized by continuous o peration or transitioning of the protection circuit.
15. Operation Under Strong Electromagnetic Field (BD68710EFV)
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no
malfunction is found when using the IC in a strong electrom agnetic field.
16. Metal on the backsi de ( Define the side where product markings are printed as front) (BD68710EFV)
The metal on the backside is short ed wit h the back side of I C chip ther efor e it shoul d be conn ected to G ND. Be a ware
that here is a possibility of malfunction or destruction if i t is shorted with any potential other than GND.
18/20
BD68710EFV
TSZ02201-0P2P0B701230-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
10.Jun.2016 Rev.001
www.rohm.com
TSZ22111・15・001
● Selecting a model name when or der i ng
B
D 6 8 7 1 0 E F V - E 2
ROHM Model Package type
EFV :HTSSOP-B28 Packing, Forming specification
E2: Reel-wound embossed taping
● Marking Diagr am
HTSSOP-B28 (TOP VIEW)
BD68710EFV
Part Number M ar king
LOT Number
1PIN MARK
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
