Advanced Power P-CHANNEL ENHANCEMENT MODE
Electronics Corp. POWER MOSFET
▼ Simple Drive Requirement BVDSS -30V
▼ Low On-resistance RDS(ON) 20mΩ
▼ Fast Switching Characteristic ID-9A
▼ RoHS Compliant
Description
Absolute Maximum Ratings
Symbol Units
VDS V
VGS V
ID@TA=25℃A
ID@TA=70℃A
IDM A
PD@TA=25℃W
W/℃
TSTG ℃
TJ℃
Symbol Value Unit
Rthj-a Maximum Thermal Resistance, Junction-ambient350 ℃/W
Data and specifications subject to change without notice
Halogen-Free Product
Thermal Data
Parameter
Total Power Dissipation 2.5
-55 to 150
Operating Junction Temperature Range -55 to 150
Storage Temperature Range
Continuous Drain Current3-7.3
Pulsed Drain Current1-50
0.02Linear Derating Factor
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current3
1
200811216
AP4435GM-HF
Rating
- 30
+ 20
-9
A
dvanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
The SO-8 package is widely preferred for all commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters.
SSSG
DDDD
SO-8
G
D
S
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=-250uA -30 - - V
RDS(ON) Static Drain-Source On-Resistance2VGS=-10V, ID=-7A - - 20 mΩ
VGS=-4.5V, ID=-5A - - 32 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V
gfs Forward Transconductance VDS=-10V, ID=-7A - 16 - S
IDSS Drain-Source Leakage Current VDS=-30V, VGS=0V - - -1 uA
Drain-Source Leakage Current (Tj=70oC) VDS=-24V, VGS=0V - - -25 uA
IGSS Gate-Source Leakage VGS=+20V - - +100 nA
QgTotal Gate Charge2ID=-7A - 18 29 nC
Qgs Gate-Source Charge VDS=-24V - 3 - nC
Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 10 - nC
td(on) Turn-on Delay Time2VDS=-15V - 8 - ns
trRise Time ID=-1A - 6.6 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=-10V - 44 - ns
tfFall Time RD=15Ω-34-ns
Ciss Input Capacitance VGS=0V - 1175 1690 pF
Coss Output Capacitance VDS=-25V - 195 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 190 - pF
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2IS=-2.1A, VGS=0V - - -1.2 V
trr Reverse Recovery Time2IS=-7A, VGS=0V, - 28 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 18 - nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 125 ℃/W when mounted on Min. copper pad.
2
AP4435GM-HF
A
P4435GM-HF
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fi
g
5. Forward Characteristic o
f
Fig 6. Gate Threshold Voltage v.s.
Reverse Diode Junction Temperature
3
0
10
20
30
40
50
01234
-VDS , Drain-to-Source Voltage (V)
-ID , Drain Current (A)
TA=25oC -10V
-7.0V
-5.0V
-4.5V
VG= -3.0V
0
10
20
30
40
50
0246
-VDS , Drain-to-Source Voltage (V)
-ID , Drain Current (A)
TA=150oC
VG= -3.0V
-10V
-7.0V
-5.0V
-4.5V
0.6
0.8
1.0
1.2
1.4
1.6
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized RDS(ON)
ID= -7A
VG= -10V
0
2
4
6
8
10
0.1 0.3 0.5 0.7 0.9 1.1 1.3
-VSD , Source-to-Drain Voltage (V)
-IS(A)
Tj=25oC
Tj=150oC
0.8
1
1.2
1.4
1.6
1.8
2
-50 0 50 100 150
Tj , Junction Temperature ( oC)
-VGS(th) (V)
12
16
20
24
28
32
246810
-VGS , Gate-to-Source Voltage (V)
RDS(ON) (m
Ω
)
ID= -5A
TA=25oC
AP4435GM-HF
Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance
Fig 11. Transfer Characteristics Fig 12. Gate Charge Circuit
4
0.01
0.10
1.00
10.00
100.00
0.01 0.1 1 10 100
-VDS , Drain-to-Source Voltage (V)
-ID (A)
TA=25 oC
Single Pulse
100us
1ms
10ms
100ms
1s
DC
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10 100 1000
t , Pulse Width (s)
Normalized Th e rmal Re spon se (Rthja)
PDM
Duty factor = t/T
Peak Tj = PDM x Rthja + Ta
Rthja = 125℃/W
t
T
0.02
0.01
0.05
0.1
0.2
Duty factor=0.5
Single Pulse
0
2
4
6
8
10
12
0 10203040
QG , Total Gate Charge (nC)
-VGS , Gate to Source Voltage (V)
ID= -7A
VDS = -24V
100
1000
10000
1 5 9 13 17 21 25 29
-VDS , Drain-to-Source Voltage (V)
C (pF)
f
=1.0MH
z
Ciss
Coss
Crss
Q
VG
-4.5V
QGS QGD
QG
Charge
0
10
20
30
40
0123456
-VGS , Gate-to-Source Voltage (V)
-ID , Drain Current (A)
Tj=150oCTj=25oC
VDS = -5V
Millimeters
SYMBOLS MIN NOM MAX
A 1.35 1.55 1.75
A1 0.10 0.18 0.25
B 0.33 0.41 0.51
c 0.19 0.22 0.25
D 4.80 4.90 5.00
E 5.80 6.15 6.50
E1 3.80 3.90 4.00
e
G
L 0.38 －0.90
α0.00 4.00 8.00
1.All Dimension Are In Millimeters.
2.Dimension Does Not Include Mold Protrusions.
Part Marking Information & Packing : SO-8
1.27 TYP
0.254 TYP
Package Outline : SO-8
ADVANCED POWER ELECTRONICS CORP.
e
B
134
5678
2
D
E1
A1
A
G
Part Number
4435G
M
YWWSSS
Package Code
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
If last "S" is numerical letter : Rohs product
If last "S" is English letter : HF & Rohs product
E
5
meet Rohs requirement
