12-21-98
SB98107 Rev. A
Microtron®Printed Circuit Board Fuses MCR
.122∑ ≈ .297∑ (3.10mm ≈ 7.54mm)
Bussmann®
Form No. MCR
Page 2 of 2
BIF Doc #2003
The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin
is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Typical Voltage Drop (At 25° C Ambient Temperature)
Body High temperature thermoplastic,
flammability rating UL 94 VO.
Electrical Characteristics Carry 100% rated current for 4 hours
minimum. Open at 250% of rated
current in 5 seconds maximum.
Element Solid Matrix, gold or silver element
encapsulated in ceramic.
Leads Tin-plated copper, .64mm (.025∑)
diameter.
Lead Bend Test With a two pound weight attached, 90°
one direction, back to original position,
then 90° opposite direction; fuse will
withstand two cycles.
Life Test 2000 hours at 80% rated current,
55°C.
Moisture Resistance MIL-STD-202, Method 106, 90%
relative humidity at 65°C.
Operating Temperature -55°C to 125°C with proper fuse
derating.
Packaging EIA-STD-296-E.
Resistance to MIL-STD-202, Method 210, Test
Soldering Heat Condition C (260°C).
Salt Spray MIL-STD-202, Method 101, Test
Condition B.
Shock MIL-STD-202, Method 213, Test
Condition I, 100G’s for 6 milliseconds.
Solderability MIL-STD-202, Method 208.
Terminal Strength MIL-STD-202, Method 211, Test
Condition A, will withstand 7 lb. axial pull
test.
Thermal Shock MIL-STD-202, Method 107, Test
Condition B, -65°C to 125°C.
Thermal Cycle EIA-STD-RS-186-C, Test Condition A,
-55°C to 85°C.
Vibration MIL-STD-202, Method 204, Test
Condition C, (55 to 2000 HZ, 10G’s
peak).
Wave Soldering Maximum reservoir temperature 260°C,
10 second maximum exposure, .125"
from body.
Microtron fuses are designed to meet the following specifications: