ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 ADCS7476 ADCS7477 ADCS7478 1MSPS, 12-/10-/8-Bit A/D Converters in SOT-23 & WSON Check for Samples: ADCS7476, ADCS7477, ADCS7478 FEATURES 1 * * * * * 2 Variable Power Management Packaged in 6-Lead, SOT-23 and WSON Power Supply used as Reference Single +2.7V to +5.25V Supply Operation SPITM/QSPITM/MICROWIRETM/DSP Compatible APPLICATIONS * * * * * * Automotive Navigation FA/ATM Equipment Portable Systems Medical Instruments Mobile Communications Instrumentation and Control Systems KEY SPECIFICATIONS * * * * * Resolution with no Missing Codes 12/10/8 bits Conversion Rate 1 MSPS DNL +0.5, -0.3 LSB (typ) INL 0.4 LSB (typ) Power Consumption - 3V Supply 2 mW (typ) - 5V Supply 10 mW (typ) DESCRIPTION The ADCS7476, ADCS7477, and ADCS7478 are low power, monolithic CMOS 12-, 10- and 8-bit analog-todigital converters that operate at 1 MSPS. The ADCS7476/77/78 are drop-in replacements for Analog Devices' AD7476/77/78. Each device is based on a successive approximation register architecture with internal track-and-hold. The serial interface is compatible with several standards, such as SPITM, QSPITM, MICROWIRETM, and many common DSP serial interfaces. The ADCS7476/77/78 uses the supply voltage as a reference, enabling the devices to operate with a fullscale input range of 0 to VDD. The conversion rate is determined from the serial clock (SCLK) speed. These converters offer a shutdown mode, which can be used to trade throughput for power consumption. The ADCS7476/77/78 is operated with a single supply that can range from +2.7V to +5.25V. Normal power consumption during continuous conversion, using a +3V or +5V supply, is 2 mW or 10 mW respectively. The power down feature, which is enabled by a chip select (CS) pin, reduces the power consumption to under 5 W using a +5V supply. All three converters are available in a 6-lead, SOT-23 package and in a 6-lead WSON, both of which provide an extremely small footprint for applications where space is a critical consideration. These products are designed for operation over the automotive/extended industrial temperature range of -40C to +125C. Connection Diagram Figure 1. 6-Lead SOT-23 or WSON See DBV or NGF Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2013, Texas Instruments Incorporated ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com PIN DESCRIPTIONS Pin No. Symbol Description ANALOG I/O 3 VIN Analog input. This signal can range from 0V to VDD. DIGITAL I/O Digital clock input. The range of frequencies for this input is 10 kHz to 20 MHz, with ensured performance at 20 MHz. This clock directly controls the conversion and readout processes. 4 SCLK 5 SDATA 6 CS Chip select. A conversion process begins on the falling edge of CS. 1 VDD Positive supply pin. These pins should be connected to a quiet +2.7V to +5.25V source and bypassed to GND with 0.1 F and 1 F monolithic capacitors located within 1 cm of the power pin. The ADCS7476/77/78 uses this power supply as a reference, so it should be thoroughly bypassed. 2 GND The ground return for the supply. Digital data output. The output words are clocked out of this pin by the SCLK pin. POWER SUPPLY Block Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. (1) (2) Absolute Maximum Ratings -0.3V to +6.5V Supply Voltage VDD -0.3V to VDD +0.3V Voltage on Any Analog Pin to GND Voltage on Any Digital Pin to GND Input Current at Any Pin -0.3V to 6.5V (3) 10 mA ESD Susceptibility Human Body Model Machine Model 3500V 200V Soldering Temperature, Infrared, 10 seconds 215C Junction Temperature +150C Storage Temperature -65C to +150C (1) (2) (3) 2 Absolute maximum ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not implied. Exposure to maximum ratings for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Except power supply pins. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Operating Ratings TMIN = -40C TA TMAX = +125C Operating Temperature Range VDD Supply Voltage +2.7V to +5.25V Digital Input Pins Voltage Range (1) (1) +2.7V to +5.25V Independent of supply voltage. Package Thermal Resistance Package JA 6-Lead SOT-23 265C / W 6-Lead WSON 78C / W ADCS7476/ADCS7477/ADCS7478 Specifications (1) ADCS7476 Converter Electrical Characteristics The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions Typical Limits Units 12 Bits 1 LSB (max) +1 -1.1 LSB (max) LSB (min) +1 -0.9 LSB (max) LSB (min) 1 LSB (max) STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes INL VDD = 2.7V to 3.6V, -40C TA 85C Integral Non-Linearity DNL VDD = 2.7V to 3.6V, -40C TA 125C 0.4 VDD = 2.7V to 3.6V, TA = 125C VDD = 2.7V to 3.6V, -40C TA 85C Differential Non-Linearity +0.5 -0.3 VDD = 2.7V to 3.6V, TA = 125C VOFF Offset Error VDD = 2.7V to 3.6V, -40C TA 125C 0.1 1.2 LSB (max) GE Gain Error VDD = 2.7V to 3.6V, -40C TA 125C 0.2 1.2 LSB (max) DYNAMIC CONVERTER CHARACTERISTICS SINAD Signal-to-Noise Plus Distortion Ratio fIN = 100 kHz, -40C TA 125C 72 70 dB (min) fIN = 100 kHz, -40C TA 85C 72.5 70.8 dB (min) 70.6 dB (min) SNR Signal-to-Noise Ratio THD Total Harmonic Distortion fIN = 100 kHz -80 dB SFDR Spurious-Free Dynamic Range fIN = 100 kHz 82 dB Intermodulation Distortion, Second Order Terms fa = 103.5 kHz, fb = 113.5 kHz -78 dB Intermodulation Distortion, Third Order Terms fa = 103.5 kHz, fb = 113.5 kHz -78 dB +5V Supply 11 MHz +3V Supply 8 MHz IMD FPBW fIN = 100 kHz, TA = 125C -3 dB Full Power Bandwidth POWER SUPPLY CHARACTERISTICS VDD (1) -40C TA 125C Supply Voltage 2.7 V (min) 5.25 V (max) Data sheet min/max specification limits are ensured by design, test, or statistical analysis. Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 3 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7476 Converter Electrical Characteristics (continued) The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions Normal Mode (Static) IDD Normal Mode (Operational) Shutdown Mode Power Consumption, Normal Mode (Operational) PD Power Consumption, Shutdown Mode Typical Limits Units VDD = +4.75V to +5.25V, SCLK On or Off 2 mA VDD = +2.7V to +3.6V, SCLK On or Off 1 mA VDD = +4.75V to +5.25V, fSAMPLE = 1 MSPS 2.0 3.5 mA (max) VDD = +2.7V to +3.6V, fSAMPLE = 1 MSPS 0.6 1.6 mA (max) VDD = +5V, SCLK Off 0.5 VDD = +5V, SCLK On 60 VDD = +5V, fSAMPLE = 1 MSPS 10 17.5 mW (max) 2 4.8 mW (max) VDD = +3V, fSAMPLE = 1 MSPS A A VDD = +5V, SCLK Off 2.5 W VDD = +3V, SCLK Off 1.5 W 0 to VDD V ANALOG INPUT CHARACTERISTICS VIN Input Range IDCL DC Leakage Current CINA Analog Input Capacitance 1 30 A (max) pF DIGITAL INPUT CHARACTERISTICS VIH Input High Voltage VIL Input Low Voltage IIN Input Current CIND Digital Input Capacitance VDD = +5V VDD = +3V VIN = 0V or VDD 2.4 V (min) 0.8 V (max) 0.4 V (max) 10 nA 1 A (max) 2 4 pF (max) VDD -0.2 V (min) DIGITAL OUTPUT CHARACTERISTICS VOH Output High Voltage ISOURCE = 200 A, VDD = +2.7V to +5.25V VOL Output Low Voltage ISINK = 200 A IOL TRI-STATE Leakage Current COUT TRI-STATE Output Capacitance 2 Output Coding 0.4 V (max) 10 A (max) 4 pF (max) Straight (Natural) Binary AC ELECTRICAL CHARACTERISTICS fSCLK Clock Frequency DC -40C TA 125C 20 MHz (max) SCLK Duty Cycle 40 60 % (min) % (max) tTH Track/Hold Acquisition Time 400 ns (max) fRATE Throughput Rate 1 MSPS (max) tAD Aperture Delay 3 ns tAJ Aperture Jitter 30 ps See USING THE ADCS7476/77/78 ADCS7476/ADCS7477/ADCS7478 Specifications (1) ADCS7477 Converter Electrical Characteristics The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions Typical Limits Units STATIC CONVERTER CHARACTERISTICS (1) 4 Data sheet min/max specification limits are ensured by design, test, or statistical analysis. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7477 Converter Electrical Characteristics (continued) The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions Typical Resolution with No Missing Codes Limits Units 10 Bits INL Integral Non-Linearity 0.2 0.7 LSB (max) DNL Differential Non-Linearity +0.3 -0.2 0.7 LSB (max) LSB (min) VOFF Offset Error 0.1 0.7 LSB (max) GE Gain Error 0.2 1 LSB (max) 61 dBFS (min) DYNAMIC CONVERTER CHARACTERISTICS SINAD Signal-to-Noise Plus Distortion Ratio fIN = 100 kHz 61.7 SNR Signal-to-Noise Ratio fIN = 100 kHz 62 THD Total Harmonic Distortion fIN = 100 kHz -77 -73 dB (max) SFDR Spurious-Free Dynamic Range fIN = 100 kHz 78 74 dB (min) Intermodulation Distortion, Second Order Terms fa = 103.5 kHz, fb = 113.5 kHz -78 dB Intermodulation Distortion, Third Order Terms fa = 103.5 kHz, fb = 113.5 kHz -78 dB +5V Supply 11 MHz +3V Supply 8 MHz IMD FPBW -3 dB Full Power Bandwidth dB POWER SUPPLY CHARACTERISTICS VDD 2.7 5.25 Supply Voltage Normal Mode (Static) IDD Normal Mode (Operational) Shutdown Mode Power Consumption, Normal Mode (Operational) PD Power Consumption, Shutdown Mode V (min) V (max) VDD = +4.75V to +5.25V, SCLK On or Off 2 mA VDD = +2.7V to +3.6V, SCLK On or Off 1 mA VDD = +4.75V to +5.25V, fSAMPLE = 1 MSPS 2.0 3.5 mA (max) VDD = +2.7V to +3.6V, fSAMPLE = 1 MSPS 0.6 1.6 mA (max) VDD = +5V, SCLK Off 0.5 A (max) VDD = +5V, SCLK On 60 A (max) VDD = +5V, fSAMPLE = 1 MSPS 10 17.5 mW (max) VDD = +3V, fSAMPLE = 1 MSPS 2 4.8 mW (max) VDD = +5V, SCLK Off 2.5 W (max) VDD = +3V, SCLK Off 1.5 W (max) ANALOG INPUT CHARACTERISTICS VIN Input Range IDCL DC Leakage Current CINA Analog Input Capacitance 0 to VDD V 1 30 A (max) pF DIGITAL INPUT CHARACTERISTICS VIH Input High Voltage VIL Input Low Voltage IIN Input Current CIND Digital Input Capacitance 2.4 V (min) VDD = +5V 0.8 V (max) VDD = +3V 0.4 V (max) 10 nA 1 A (max) 2 4 pF (max) VDD -0.2 V (min) VIN = 0V or VDD DIGITAL OUTPUT CHARACTERISTICS VOH ISOURCE = 200 A, VDD = +2.7V to +5.25V Output High Voltage Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 5 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7477 Converter Electrical Characteristics (continued) The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions VOL Output Low Voltage IOL TRI-STATE Leakage Current COUT TRI-STATE Output Capacitance Typical ISINK = 200 A 2 Output Coding Limits Units 0.4 V (max) 10 A (max) 4 pF (max) Straight (Natural) Binary AC ELECTRICAL CHARACTERISTICS fSCLK Clock Frequency 20 MHz (max) DC SCLK Duty Cycle 40 60 % (min) % (max) tTH Track/Hold Acquisition Time 400 ns (max) fRATE Throughput Rate 1 MSPS (max) tAD Aperture Delay 3 ns tAJ Aperture Jitter 30 ps 6 See USING THE ADCS7476/77/78 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 ADCS7476/ADCS7477/ADCS7478 Specifications (1) ADCS7478 Converter Electrical Characteristics The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions Typical Limits Units 8 Bits STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes INL Integral Non-Linearity 0.05 0.3 LSB (max) DNL Differential Non-Linearity 0.07 0.3 LSB (max) VOFF Offset Error 0.03 0.3 LSB (max) GE Gain Error 0.08 0.4 LSB (max) Total Unadjusted Error 0.07 0.3 LSB (max) 49 dB (min) DYNAMIC CONVERTER CHARACTERISTICS SINAD Signal-to-Noise Plus Distortion Ratio fIN = 100 kHz 49.7 SNR Signal-to-Noise Ratio fIN = 100 kHz 49.7 THD Total Harmonic Distortion fIN = 100 kHz -77 -65 dB (max) SFDR Spurious-Free Dynamic Range fIN = 100 kHz 69 65 dB (min) Intermodulation Distortion, Second Order Terms fa = 103.5 kHz, fb = 113.5 kHz -68 dB Intermodulation Distortion, Third Order Terms fa = 103.5 kHz, fb = 113.5 kHz -68 dB +5V Supply 11 MHz +3V Supply 8 MHz IMD FPBW -3 dB Full Power Bandwidth dB POWER SUPPLY CHARACTERISTICS VDD 2.7 5.25 Supply Voltage Normal Mode (Static) IDD Normal Mode (Operational) Shutdown Mode Power Consumption, Normal Mode (Operational) PD Power Consumption= Shutdown Mode V (min) V (max) VDD = +4.75V to +5.25V, SCLK On or Off 2 mA VDD = +2.7V to +3.6V, SCLK On or Off 1 mA VDD = +4.75V to +5.25V, fSAMPLE = 1 MSPS 2.0 3.5 mA (max) VDD = +2.7V to +3.6V, fSAMPLE = 1 MSPS 0.6 1.6 mA (max) VDD = +5V, SCLK Off 0.5 VDD = +5V, SCLK On 60 VDD = +5V, fSAMPLE = 1 MSPS 10 17.5 mW (max) VDD = +3V, fSAMPLE = 1 MSPS 2 4.8 mW (max) A (max) A (max) VDD = +5V, SCLK Off 2.5 W (max) VDD = +3V, SCLK Off 1.5 W (max) 0 to VDD V ANALOG INPUT CHARACTERISTICS VIN Input Range IDCL DC Leakage Current CINA Analog Input Capacitance 1 30 A (max) pF DIGITAL INPUT CHARACTERISTICS VIH Input High Voltage VIL Input Low Voltage IIN Digital Input Current CIND Input Capacitance 2.4 V (min) VDD = +5V 0.8 V (max) VDD = +3V 0.4 V (max) 10 nA 1 A (max) 2 4 pF(max) VIN = 0V or VDD DIGITAL OUTPUT CHARACTERISTICS (1) Data sheet min/max specification limits are ensured by design, test, or statistical analysis. Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 7 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7478 Converter Electrical Characteristics (continued) The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted. Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. Symbol Parameter Conditions VOH Output High Voltage ISOURCE = 200 A, VDD = +2.7V to +5.25V VOL Output Low Voltage ISINK = 200 A IOL TRI-STATE Leakage Current COUT TRI-STATE Output Capacitance Typical Limits Units VDD -0.2 V (min) 2 Output Coding 0.4 V (max) 10 A (max) 4 pF (max) Straight (Natural) Binary AC ELECTRICAL CHARACTERISTICS fSCLK Clock Frequency 20 MHz (max) DC SCLK Duty Cycle 40 60 % (min) % (max) tTH Track/Hold Acquisition Time fRATE Throughput Rate tAD Aperture Delay 3 ns tAJ Aperture Jitter 30 ps See Applications Information 400 ns (max) 1 MSPS (min) Figure 2. Timing Test Circuit Timing Test Circuit ADCS7476/ADCS7477/ADCS7478 Timing Specifications The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. (1) Symbol Parameter Conditions Typical tCONVERT tQUIET (1) (2) (3) (4) 8 Limits Units 16 x tSCLK (2) 50 ns (min) t1 Minimum CS Pulse Width 10 ns (min) t2 CS to SCLK Setup Time 10 ns (min) t3 Delay from CS Until SDATA TRI-STATE Disabled (3) 20 ns (max) t4 Data Access Time after SCLK Falling Edge (4) VDD = +2.7 to +3.6 40 ns (max) VDD = +4.75 to +5.25 20 ns (max) t5 SCLK Low Pulse Width 0.4 x tSCLK ns (min) t6 SCLK High Pulse Width 0.4 x tSCLK ns (min) t7 SCLK to Data Valid Hold Time VDD = +2.7 to +3.6 7 ns (min) VDD = +4.75 to +5.25 5 ns (min) All input signals are specified as tr = tf = 5 ns (10% to 90% VDD) and timed from 1.6V. Minimum Quiet Time Required Between Bus Relinquish and Start of Next Conversion Measured with the load circuit shown above, and defined as the time taken by the output to cross 1.0V. Measured with the load circuit shown above, and defined as the time taken by the output to cross 1.0V or 2.0V. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Timing Test Circuit ADCS7476/ADCS7477/ADCS7478 Timing Specifications (continued) The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, Boldface limits apply for TA = -40C to +85C: all other limits TA = 25C, unless otherwise noted. (1) Symbol Parameter Conditions Typical VDD = +2.7 to +3.6 t8 SCLK Falling Edge to SDATA High Impedance (5) VDD = +4.75 to +5.25 tPOWER- Power-Up Time from Full Power-Down 1 Limits Units 25 ns (max) 6 ns (min) 25 ns (max) 5 ns (min) s UP (5) t8 is derived from the time taken by the outputs to change by 0.5V with the loading circuit shown above. The measured number is then adjusted to remove the effects of charging or discharging the 25pF capacitor. This means t8 is the true bus relinquish time, independent of the bus loading. Specification Definitions APERTURE DELAY is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as noise in the output. APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as noise in the output. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the SCLK. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5 LSB for ADCS7476 and ADCS7477, VREF - 1 LSB for ADCS7478), after adjusting for offset error. INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (1/2 LSB below the first code transition) through positive full scale (1/2 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in the either the two second order or all four third order intermodulation products to the sum of the power in both of the original frequencies. IMD is usually expressed in dBFS. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADCS7476/77/78 is ensured not to have any missing codes. OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB for the ADCS7476 and ADCS7477, and GND + 1 LSB for the ADCS7478). SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or DC. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding DC. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal, where a spurious signal is any signal present in the output Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 9 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com spectrum that is not present at the input. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic levels at the output to the level of the fundamental at the output. THD is calculated as where * * f1 is the RMS power of the fundamental (output) frequency f2 through f6 are the RMS power in the first 5 harmonic frequencies (1) TOTAL UNADJUSTED ERROR is the worst deviation found from the ideal transfer function. As such, it is a comprehensive specification which includes full scale error, linearity error, and offset error. Timing Diagrams Figure 3. ADCS7476 Serial Interface Timing Diagram Figure 4. ADCS7477 Serial Interface Timing Diagram 10 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Figure 5. ADCS7478 Serial Interface Timing Diagram Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 11 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics TA = +25C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated. ADCS7476 12 ADCS7476 DNL ADCS7476 INL Figure 6. Figure 7. ADCS7476 Spectral Response @ 100kHz Input ADCS7476 THD vs. Source Impedance Figure 8. Figure 9. ADCS7476 THD vs. Input Frequency, 600 kSPS ADCS7476 THD vs. Input Frequency, 1 MSPS Figure 10. Figure 11. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Typical Performance Characteristics (continued) TA = +25C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated. ADCS7476 ADCS7476 SINAD vs. Input Frequency, 600 kSPS ADCS7476 SINAD vs. Input Frequency, 1 MSPS Figure 12. Figure 13. ADCS7476 SNR vs. fSCLK ADCS7476 SINAD vs. fSCLK Figure 14. Figure 15. ADCS7477 DNL ADCS7477 INL Figure 16. Figure 17. Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 13 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) TA = +25C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated. ADCS7476 14 ADCS7477 Spectral Response @ 100kHz Input ADCS7477 SNR vs. fSCLK Figure 18. Figure 19. ADCS7477 SINAD vs. fSCLK ADCS7478 DNL Figure 20. Figure 21. ADCS7478 INL ADCS7478 Spectral Response @ 100kHz Input Figure 22. Figure 23. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Typical Performance Characteristics (continued) TA = +25C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated. ADCS7476 ADCS7478 SNR vs. fSCLK ADCS7478 SINAD vs. fSCLK Figure 24. Figure 25. Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 15 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com APPLICATIONS INFORMATION ADCS7476/77/78 OPERATION The ADCS7476/77/78 are successive-approximation analog-to-digital converters designed around a chargeredistribution digital-to-analog converter. Simplified schematics of the ADCS7476/77/78 in both track and hold operation are shown in Figure 26 and Figure 27, respectively. In Figure 26 the device is in track mode: switch SW1 connects the sampling capacitor to the input, and SW2 balances the comparator inputs. The device is in this state until CS is brought low, at which point the device moves to hold mode. Figure 27 shows the device in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the chargeredistribution DAC to add or subtract fixed amounts of charge from the sampling capacitor until the comparator is balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of the analog input voltage. The device moves from hold mode to track mode on the 13th rising edge of SCLK. CHARGE REDISTRIBUTION DAC VIN SAMPLING CAPACITOR SW1 + SW2 - CONTROL LOGIC GND VDD/2 Figure 26. ADCS7476/77/78 in Track Mode CHARGE REDISTRIBUTION DAC VIN SAMPLING CAPACITOR SW1 + - CONTROL LOGIC SW2 GND VDD/2 Figure 27. ADCS7476/77/78 in Hold Mode USING THE ADCS7476/77/78 Serial interface timing diagrams for the ADCS7476/77/78 are shown in Figure 3, Figure 4, and Figure 5. CS is chip select, which initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. SDATA is the serial data out pin, where a conversion result is found. Basic operation of the ADCS7476/77/78 begins with CS going low, which initiates a conversion process and data transfer. Subsequent rising and falling edges of SCLK will be labeled with reference to the falling edge of CS; for example, "the third falling edge of SCLK" shall refer to the third falling edge of SCLK after CS goes low. At the fall of CS, the SDATA pin comes out of TRI-STATE, and the converter moves from track mode to hold mode. The input signal is sampled and held for conversion at the falling edge of CS. The converter moves from hold mode to track mode on the 13th rising edge of SCLK (see Figure 3, Figure 4, or Figure 5). The SDATA pin will be placed back into TRI-STATE after the 16th falling edge of SCLK, or at the rising edge of CS, whichever occurs first. After a conversion is completed, the quiet time tQUIET must be satisfied before bringing CS low again to begin another conversion. 16 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Sixteen SCLK cycles are required to read a complete sample from the ADCS7476/77/78. The sample bits (including any leading or trailing zeroes) are clocked out on falling edges of SCLK, and are intended to be clocked in by a receiver on subsequent falling edges of SCLK. The ADCS7476/77/78 will produce four leading zeroes on SDATA, followed by twelve, ten, or eight data bits, most significant first. After the data bits, the ADCS7477 will clock out two trailing zeros, and the ADCS7478 will clock out four trailing zeros. The ADCS7476 will not clock out any trailing zeros; the least significant data bit will be valid on the 16th falling edge of SCLK. Depending upon the application, the first edge on SCLK after CS goes low may be either a falling edge or a rising edge. If the first SCLK edge after CS goes low is a rising edge, all four leading zeroes will be valid on the first four falling edges of SCLK. If instead the first SCLK edge after CS goes low is a falling edge, the first leading zero may not be set up in time for a microprocessor or DSP to read it correctly. The remaining data bits are still clocked out on the falling edges of SCLK. ADCS7476/77/78 TRANSFER FUNCTION The output format of the ADCS7476/77/78 is straight binary. Code transitions occur midway between successive integer LSB values. The LSB widths for the ADCS7476 is VDD / 4096; for the ADCS7477 the LSB width is VDD / 1024; for the ADCS7478, the LSB width is VDD / 256. The ideal transfer characteristic for the ADCS7476 and ADCS7477 is shown in Figure 28, while the ideal transfer characteristic for the ADCS7478 is shown in Figure 29. Figure 28. ADCS7476/77 Ideal Transfer Characteristic Figure 29. ADCS7478 Ideal Transfer Characteristic Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 17 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com TYPICAL APPLICATION CIRCUIT A typical application of the ADCS7476/77/78 is shown in Figure 30. The combined analog and digital supplies are provided in this example by the TI LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output voltages. The supply is bypassed with a capacitor network located close to the device. The three-wire interface is also shown connected to a microprocessor or DSP. Figure 30. Typical Application Circuit ANALOG INPUTS An equivalent circuit for the ADCS7476/77/78 input channel is shown in Figure 31. The diodes D1 and D2 provide ESD protection for the analog inputs. At no time should an analog input exceed VDD + 300 mV or GND 300 mV, as these ESD diodes will begin conducting current into the substrate or supply line and affect ADC operation. The capacitor C1 in Figure 31 typically has a value of 4 pF, and is mainly due to pin capacitance. The resistor R1 represents the on resistance of the multiplexer and track / hold switch, and is typically 100 ohms. The capacitor C2 is the ADCS7476/77/78 sampling capacitor, and is typically 26 pF. The sampling nature of the analog input causes input current pulses that result in voltage spikes at the input. The ADCS7476/77/78 will deliver best performance when driven by a low-impedance source to eliminate distortion caused by the charging of the sampling capacitance. In applications where dynamic performance is critical, the input might need to be driven with a low output-impedance amplifier. In addition, when using the ADCS7476/77/78 to sample AC signals, a band-pass or low-pass filter will reduce harmonics and noise and thus improve THD and SNR. Figure 31. Equivalent Input Circuit DIGITAL INPUTS AND OUTPUTS The ADCS7476/77/78 digital inputs (SCLK and CS) are not limited by the same absolute maximum ratings as the analog inputs. The digital input pins are instead limited to +6.5V with respect to GND, regardless of VDD, the supply voltage. This allows the ADCS7476/77/78 to be interfaced with a wide range of logic levels, independent of the supply voltage. 18 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 Note that, even though the digital inputs are tolerant of up to +6.5V above GND, the digital outputs are only capable of driving VDD out. In addition, the digital input pins are not prone to latch-up; SCLK and CS may be asserted before VDD without any risk. MODES OF OPERATION The ADCS7476/77/78 has two possible modes of operation: NORMAL MODE, and SHUTDOWN MODE. The ADCS7476/77/78 enters normal mode (and a conversion process is begun) when CS is pulled low. The device will enter shutdown mode if CS is pulled high before the tenth falling edge of SCLK after CS is pulled low, or will stay in normal mode if CS remains low. Once in shutdown mode, the device will stay there until CS is brought low again. By varying the ratio of time spent in the normal and shutdown modes, a system may trade-off throughput for power consumption. NORMAL MODE The best possible throughput is obtained by leaving the ADCS7476/77/78 in normal mode at all times, so there are no power-up delays. To keep the device in normal mode continuously, CS must be kept low until after the 10th falling edge of SCLK after the start of a conversion (remember that a conversion is initiated by bringing CS low). If CS is brought high after the 10th falling edge, but before the 16th falling edge, the device will remain in normal mode, but the current conversion will be aborted, and SDATA will return to TRI-STATE (truncating the output word). Sixteen SCLK cycles are required to read all of a conversion word from the device. After sixteen SCLK cycles have elapsed, CS may be idled either high or low until the next conversion. If CS is idled low, it must be brought high again before the start of the next conversion, which begins when CS is again brought low. After sixteen SCLK cycles, SDATA returns to TRI-STATE. Another conversion may be started, after tQUIET has elapsed, by bringing CS low again. SHUTDOWN MODE Shutdown mode is appropriate for applications that either do not sample continuously, or are willing to trade throughput for power consumption. When the ADCS7476/77/78 is in shutdown mode, all of the analog circuitry is turned off. To enter shutdown mode, a conversion must be interrupted by bringing CS back high anytime between the second and tenth falling edges of SCLK, as shown in Figure 32. Once CS has been brought high in this manner, the device will enter shutdown mode; the current conversion will be aborted and SDATA will enter TRI-STATE. If CS is brought high before the second falling edge of SCLK, the device will not change mode; this is to avoid accidentally changing mode as a result of noise on the CS line. Figure 32. Entering Shutdown Mode Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 19 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com Figure 33. Entering Normal Mode EXITING SHUTDOWN MODE To exit shutdown mode, bring CS back low. Upon bringing CS low, the ADCS7476/77/78 will begin powering up. Power up typically takes 1 s. This microsecond of power-up delay results in the first conversion result being unusable. The second conversion performed after power-up, however, is valid, as shown in Figure 33. If CS is brought back high before the 10th falling edge of SCLK, the device will return to shutdown mode. This is done to avoid accidentally entering normal mode as a result of noise on the CS line. To exit shutdown mode and remain in normal mode, CS must be kept low until after the 10th falling edge of SCLK. The ADCS7476/77/78 will be fully powered-up after 16 SCLK cycles. POWER-UP TIMING The ADCS7476/77/78 typically requires 1 s to power up, either after first applying VDD, or after returning to normal mode from shutdown mode. This corresponds to one "dummy" conversion for any SCLK frequency within the specifications in this document. After this first dummy conversion, the ADCS7476/77/78 will perform conversions properly. Note that the tQUIET time must still be included between the first dummy conversion and the second valid conversion. STARTUP MODE When the VDD supply is first applied, the ADCS7476/77/78 may power up in either of the two modes: normal or shutdown. As such, one dummy conversion should be performed after start-up, exactly as described in POWERUP TIMING. The part may then be placed into either normal mode or the shutdown mode, as described in NORMAL MODE and SHUTDOWN MODE. POWER CONSIDERATIONS There are three concerns relating to the power supply of these products: the effects of Power Supply Noise upon the conversion process, the Digital Output Effect Upon Noise upon the conversion process and Power Management of the product. Power Supply Noise Since the reference voltage of the ADCS7476/77/78 is the reference voltage, any noise greater than 1/2 LSB in amplitude will have some effect upon the converter noise performance. This effect is proportional to the input voltage level. The power supply should receive all the considerations of a reference voltage as far as stability and noise is concerned. Using the same supply voltage for these devices as is used for digital components will lead to degraded noise performance. Digital Output Effect Upon Noise The charging of any output load capacitance requires current from the digital supply, VDD. The current pulses required from the supply to charge the output capacitance will cause voltage variations at the ADC supply line. If these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Similarly, discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current into the die substrate, causing "ground bounce" noise in the substrate that will degrade noise performance if that current is large enough. The larger the output capacitance, the more current flows through the device power supply line and die substrate and the greater is the noise coupled into the analog path. 20 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 The first solution to keeping digital noise out of the power supply is to decouple the supply from any other components or use a separate supply for the ADC. To keep noise out of the supply, keep the output load capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100 series resistor at the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge current of the output capacitance and improve noise performance. Since the series resistor and the load capacitance form a low frequency pole, verify signal integrity once the series resistor has been added. Power Management When the ADCS7476/77/78 is operated continuously in normal mode, throughput up to 1 MSPS can be achieved. The user may trade throughput for power consumption by simply performing fewer conversions per unit time, and putting the ADCS7476/77/78 into shutdown mode between conversions. This method is not advantageous beyond 350 kSPS throughput. A plot of maximum power consumption versus throughput is shown in Figure 34. To calculate the power consumption for a given throughput, remember that each time the part exits shutdown mode and enters normal mode, one dummy conversion is required. Generally, the user will put the part into normal mode, execute one dummy conversion followed by one valid conversion, and then put the part back into shutdown mode. When this is done, the fraction of time spent in normal mode may be calculated by multiplying the throughput (in samples per second) by 2 s, the time taken to perform one dummy and one valid conversion. The power consumption can then be found by multiplying the fraction of time spent in normal mode by the normal mode power consumption figure. The power dissipated while the part is in shutdown mode is negligible. For example, to calculate the power consumption at 300 kSPS with VDD = 5V, begin by calculating the fraction of time spent in normal mode: 300,000 samples/second x 2 s = 0.6, or 60%. The power consumption at 300 kSPS is then 60% of 17.5 mW (the maximum power consumption at VDD = 5V) or 10.5 mW. Figure 34. Maximum Power Consumption vs. Throughput LAYOUT AND GROUNDING Capacitive coupling between noisy digital circuitry and sensitive analog circuitry can lead to poor performance. The solution is to keep the analog and digital circuitry separated from each other and the clock line as short as possible. Digital circuits create substantial supply and ground current transients. This digital noise could have significant impact upon system noise performance. To avoid performance degradation of the ADCS7476/77/78 due to supply noise, do not use the same supply for the ADCS7476/77/78 that is used for digital logic. Generally, analog and digital lines should cross each other at 90 to avoid crosstalk. However, to maximize accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the clock line should also be treated as a transmission line and be properly terminated. Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 21 ADCS7476, ADCS7477, ADCS7478 SNAS192F - APRIL 2003 - REVISED MARCH 2013 www.ti.com The analog input should be isolated from noisy signal lines to avoid coupling of spurious signals into the input. Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to the reference input pin and ground should be connected to a very clean point in the ground plane. We recommend the use of a single, uniform ground plane and the use of split power planes. The power planes should be located within the same board layer. All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed over the analog power plane. All digital circuitry and I/O lines should be placed over the digital power plane. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the analog ground plane at a single, quiet point. 22 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: ADCS7476 ADCS7477 ADCS7478 ADCS7476, ADCS7477, ADCS7478 www.ti.com SNAS192F - APRIL 2003 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision E (March 2013) to Revision F * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 22 Copyright (c) 2003-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADCS7476 ADCS7477 ADCS7478 23 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) ADCS7476AIMF NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 125 X01A ADCS7476AIMF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 X01A ADCS7476AIMFE/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 X01A ADCS7476AIMFX NRND SOT-23 DBV 6 3000 TBD Call TI Call TI -40 to 125 X01A ADCS7476AIMFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 X01A ADCS7477AIMF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X02A ADCS7477AIMFE/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X02A ADCS7477AIMFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X02A ADCS7478AIMF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X03A ADCS7478AIMFE/NOPB ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X03A ADCS7478AIMFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 X03A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ ADCS7476AIMF SOT-23 DBV 6 1000 178.0 8.4 ADCS7476AIMF/NOPB SOT-23 DBV 6 1000 178.0 ADCS7476AIMFE/NOPB SOT-23 DBV 6 250 178.0 SOT-23 DBV 6 3000 ADCS7476AIMFX/NOPB SOT-23 DBV 6 ADCS7476AIMFX ADCS7477AIMF/NOPB Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 ADCS7477AIMFE/NOPB SOT-23 DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 ADCS7477AIMFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 ADCS7478AIMFE/NOPB SOT-23 ADCS7478AIMF/NOPB DBV 6 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 ADCS7478AIMFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADCS7476AIMF SOT-23 DBV 6 1000 210.0 185.0 35.0 ADCS7476AIMF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 ADCS7476AIMFE/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 ADCS7476AIMFX SOT-23 DBV 6 3000 210.0 185.0 35.0 ADCS7476AIMFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 ADCS7477AIMF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 ADCS7477AIMFE/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 ADCS7477AIMFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 ADCS7478AIMF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 ADCS7478AIMFE/NOPB SOT-23 DBV 6 250 210.0 185.0 35.0 ADCS7478AIMFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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