INTEGRATED CIRCUITS DIVISION
DS-IXD_614-R08 www.ixysic.com 1
Features
•14A Peak Source/ Sink Drive Current
•Wide Operating Voltage Range: 4.5V to 35V
•-40°C to +125°C Extended Operating Temperature
Range
•Logic Input Withstands Negative Swing of up to 5V
•Low Propaga tion Delay Time
•Low, 10A Supply Current
•Low Output Impedance
Applications
•Efficient Power MOSFET and IGBT Switching
•Switch Mode Power Supplies
•Motor Controls
•DC to DC Converters
•Class-D Switching Amplifiers
•Pulse Transf ormer Driver
Description
The IXDD614 / IXDI614 / IXDN614 high-speed gate
drivers are especially w ell suit ed for driving the latest
IXYS MOSFETs and IGBTs. Ea ch out put can source
and sink 14A of peak current while producing voltage
rise and fall times of less than 30ns. Internal circuitry
eliminates cross-conduction and current
"shoot-through," making the driver virtually immune to
latch up. Lo w propagat ion delay with fast rise and f all
times make the IXD_614 family ideal for
high-frequency and high-pow er applications.
The IXDD614 is configured as a non-inverting driv er
with an enab le. The IXDN614 is configured as a
non-inverting driver, and the IXDI614 is configured as
an inverting driver.
The IXD_614 family is av ailable in an 8-pin DIP (PI),
an 8-pin P ower SOIC with an e xposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package .
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD614PI 8-Pin DIP Tube 50
IXDD614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD614CI 5-Pin TO-220 Tube 50
IXDD614YI 5-Pin TO-263 Tube 50
IXDI614PI 8-Pin DIP Tube 50
IXDI614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI614CI 5-Pin TO-220 Tube 50
IXDI614YI 5-Pin TO-263 Tube 50
IXDN614PI 8-Pin DIP Tube 50
IXDN614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN614CI 5-Pin TO-220 Tube 50
IXDN614YI 5-Pin TO-263 Tube 50
IN
EN
OUT
INOUT
INOUT
IXD_614
14-Ampere Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
IXD_614
2www.ixysic.com R08
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.5.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.5.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
Note: IXYS Integrated Circuits Division recommends
that the exposed metal pad on the bac k of the “SI”
package be connected to GND. The pad is not
suitab l e for carrying current.
1.3 Absolut e Max imum Rating s
Unless stated otherwise , a bsolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress r a tings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
1
4
3
2
8
5
6
7
VCC
IN
EN
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
EN
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
IXDD614 PI / SI
IXDI614 PI / SI
IXDN614 PI / SI
IXDD614 CI / YI
IXDI614 CI / YI
IXDN614 CI / YI
Pin Name Description
IN Logic Input
EN Output Enable - Drive pin low to disable output,
and force output to a high impedance state
OUT Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC Not connected
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VIN , VEN -5 VCC+0.3 V
Output Current IOUT -±14A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Range Units
Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range T
A-40 to +125 °C
INTEGRATED CIRCUITS DIVISION
IXD_614
4www.ixysic.com R08
1.5 Electrical Ch ara ct e ri st ic s: TA = 25°C
Test Conditions: 4.5V < VCC < 35V (unless otherwise noted).
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
EN Input Voltage, High IXDD614 only VENH 2/3VCC --
V
EN Input Voltage, Low IXDD614 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -0.40.8
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -0.30.6
Output Current, Continuous Limited by package power
dissipation IDC --±4A
Rise Time CLOAD=15nF, VCC=18V tR-2535
ns
Fall Time CLOAD=15nF, VCC=18V tF-1825
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY -5070
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY -5070
Enable to Output-High Delay Time IXDD614 only tENOH -3160
Disable to High Impedance State Delay Time IXDD614 only tDOLD -4470
Enable Pull-Up Resistor IXDD614 only REN -200-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-12mA
VCC=18V, VIN=0V -<110
A
VCC=18V, VIN=VCC -<110
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 5
1.6 Electrical Ch ara ct e ri st ic s: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 35V.
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN -±10A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -1.5
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -1.2
Output Current, Continuous Limited by package power
dissipation IDC -±1A
Rise Time CLOAD=15nF, VCC=18V tR-50
ns
Fall Time CLOAD=15nF, VCC=18V tF-40
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY -90
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY -90
Enable to Output-High Delay Time IXDD614 only tENOH -75
Disable to High Impedance State Delay Time IXDD614 only tDOLD -85
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-3mA
VCC=18V, VIN=0V -150
A
VCC=18V, VIN=VCC -150
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IXD_614
6www.ixysic.com R08
1.7 Thermal Characteristics
2 Performance
2.1 Timing Diagrams
2.2 Characterist ic s Te s t Diagram
Package Parameter Symbol Rating Units
CI (5-Pin TO-220)
Thermal Impedance, Junction-to-Ambient JA
36
°C/W
PI (8-Pin DIP) 125
SI (8-Pin Power SOIC) 85
YI (5-Pin TO-263) 46
CI (5-Pin TO-220)
Thermal Impedance, Junction-to-Case JC
3°C/W
SI (8-Pin Power SOIC) 10
YI (5-Pin TO-263) 2
10%
90%
t
ONDELAY
t
OFFDELAY
t
R
t
F
V
IH
V
IL
IN
OUT
10%
90%
t
ONDELAY
t
OFFDELAY
t
F
t
R
V
IH
V
IL
IN
OUT
EN
INOUT
GND
V
CC
V
CC
+
-
V
IN
0.1μF10μF
Tektronix
Current Probe
6302
C
LOAD
V
CC
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 7
3 Block Diagrams & Truth Tables
3.1 IXDD614
3.2 IXDI614
3.3 IXDN614
IN EN OUT
0 1 or open 0
1 1 or open 1
x0
Z
IN OUT
01
10
GND
IN
EN
VCC
OUT
IN
V
CC
GND
OUT
IN OUT
00
11
IN
V
CC
GND
OUT
INTEGRATED CIRCUITS DIVISION
IXD_614
8www.ixysic.com R08
4 Typical Performance Characteristics
Load Capacitance (nF)
246810 12 14 16
Fall Time (ns)
5
10
15
20
25
30
35
40
45
50 Fall Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Load Capacitance (nF)
246810 12 14 16
Rise Time (ns)
Rise Time vs. Load Capacitance
5
10
15
20
25
30
35
40
45
50 VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Time (ns)
5
6
7
8
9
10
11
12
13
14
15
Rise & Fall Time vs. Temperature
(VIN=0-5V, f=10kHz, CL=3.6nF , VCC=18V)
tF
tR
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
10
20
30
40
50
60
Fall Time vs. Supply Voltage
(VIN=0V-5V, f=10kHz, TA=25ºC)
CL=15nF
CL=7.5nF
CL=3.6nF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
10
20
30
40
50
60
70
80
Rise Time vs. Supply V oltage
(VIN=0-5V, f=10kHz, TA=25ºC)
CL=15nF
CL=7.5nF
CL=3.6nF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Propagation Delay (ns)
0
50
100
150
200
250
Propagation Delay vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=15nF)
tOFFDLY
tONDLY
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Input Threshold (V)
1.5
2.0
2.5
3.0
3.5
Input Threshold
vs. Supply Voltage
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Input Threshold (V)
1.5
2.0
2.5
3.0
3.5
Input Threshold
vs. Temperature
(CL=3.6nF , VCC=18V)
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
40
45
50
55
60
65
70
Propogation Delay
vs. Junction Temperature
(VIN=0-5V, f=1kHz, CL=15nF , VCC=18V)
tOFFDLY
tONDLY
Input V oltage (V)
246810 12 14
Propagation Delay (ns)
40
60
80
100
120
140
160
Propagation Delay vs. Input Voltage
(VIN=0-5V, f=1kHz, CL=15nF , VCC=12V)
tOFFDLY
tONDLY
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Enable Threshold (V)
0
5
10
15
20
25
Enable Threshold
vs. Supply Voltage
Min VENH
Max VENL
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 9
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=18V)
CL=15nF
CL=7.5nF
CL=3.6nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=35V)
CL=15nF
CL=7.5nF
CL=3.6nF
Load Capacitance (nF)
246810 12 14 16 18
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (nF)
246810 12 14 16 18
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=18V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Source Current (A)
0
-5
-10
-15
-20
-25
-30
-35
Output Source Current
vs. Supply Voltage
(CL=330nF)
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=8V)
CL=15nF
CL=7.5nF
CL=3.6nF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
-0.5
0.0
0.5
1.0
1.5
2.0
Quiescent Supply Current
vs. Temperature
3.5V
5V
10V
0V & 18V
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Sink Current (A)
0
5
10
15
20
25
30
35
40
45
Output Sink Current
vs. Supply Voltage
(CL=330nF)
INTEGRATED CIRCUITS DIVISION
IXD_614
10 www.ixysic.com R08
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
High-State Output Resistance @ -10mA
vs. Supply Voltage
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Sink Current (A)
16
17
18
19
20
21
22
23
24
Output Sink Current
vs. Temperature
(CL=330nF , VCC=18V)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Source Current (A)
-10
-12
-14
-16
-18
-20
-22
Output Source Current
vs. Temperature
(CL=330nF , VCC=18V)
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Low-State Output Resistance @ +10mA
vs. Supply Voltage
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 11
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptib le to moistur e ing ression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices f or moistu re se nsitivity according to the lat est
v ersion o f the joint indust ry standard, IPC/JEDEC J-STD-020, in force at the time of product e valuation.
We test all of our products to t he maximum conditions set forth in the stan dard, and guarantee proper
operation of our devices when handled according to the limit ations and information in that st andard as w ell as to an y
limitations set forth in the information or standards referenced below.
Failure to adhere to the wa rnings or limitations as established b y t he listed specificati ons could result in reduced
product performance, reduction of oper able life , and/or reduct ion of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivi ty
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temper ature sets the Maximum Body
Temperature allow ed for this device during lead-free re f low processes. For through-hole de vices, and any other
processes, the guidelines of J-STD- 020 must be observed.
5.4 Board Was h
IXYS Integr ated Circu it s Division recommends t he use of no-clean f lux formulations. Board washing to reduce or
remove flux residue f ollowing the solder reflow process is acceptable provided proper precautio ns ar e taken to
pre vent damage to the device. These precautions include but are not limited to: using a lo w pressure wash and
providing a follow up bake cycle sufficient to remove any moisture trapped within t he device due to the washing
process. Due to the v ariability of the w ash parameters used to clean the board, determination of the bake temper ature
and duration necessary to remo ve the moisture trapped within the package is the responsibility of t he user
(assembler) . Cleaning or drying methods that employ ultrasonic energy ma y damage the device and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
IXD_614SI / IXD_614PI /IXD_614CI MSL 1
IXD_614YI MSL 3
Device Classification Temperature (TC)Dwell Time (tp)Max Reflow Cycles
IXD_614CI 245°C 30 seconds 1
IXD_614YI 245°C 30 seconds 3
IXD_614PI 250°C 30 seconds 3
IXD_614SI 260°C 30 seconds 3
INTEGRATED CIRCUITS DIVISION
IXD_614
12 www.ixysic.com R08
5.5 Mechanical D ime ns io n s
5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back)
5.5.2 SI Package Tape & Reel Information
Dimensions
MIN / MAX
1.70 MAX
(0.067 MAX)
1.25 MIN
(0.049 MIN)
0 / 0.15
(0 / 0.006)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
BOTTOM VIEW
2.05 / 2.41
(0.081 / 0.095)
3.31 / 3.81
(0.130 / 0.150)
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
A
6x
1.27
0.05
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current.
7. Lead thickness includes plating.
1.55
(0.061)
0.60
(0.024)
3.85
(0.152) 2.23
(0.088)
3.56
(0.140)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256) P1=8.00
(0.315)
INTEGRATED CIRCUITS DIVISION
IXD_614
R08 www.ixysic.com 13
5.5.3 YI (5-Pin TO-263)
5.5.4 CI (5-Pin TO-220)
H
b1
c1
b
c
SECTION: C-C
PLATING
(Note 3)
BASE METAL
E
(Note 2)
D1
D
(Note 2)
L1
e ~4x
CC
E3
D2
*
b ~5x
E1
NOTES:
1. Reference JEDEC TO-263 Type “BA”.
2. Dimension does not include mold flash; mold flash
shall not exceed 0.127mm (0.005 inch) per side.
3. Minimum plating: 1000 microinches.
4. Controlling dimension: millimeters.
MINMINMAX MAX
MM INCH
SYMBOL
1.702 BSC 0.067 BSC
0.254 BSC 0.010 BSC
0.460 TYP 0.018 TYP
0.506 TYP 0.02 TYP
4.8264.064 0.160 0.190
0.2540.000 0.000 0.010
0.9910.5080.020 0.039
0.8890.5080.020 0.035
0.7370.381 0.015 0.029
0.5840.381 0.015 0.023
1.6511.143 0.045 0.065
9.6528.382 0.330 0.380
7.7006.8580.270 0.303
10.6689.652 0.380 0.420
8.0006.223 0.245 0.315
15.87514.605 0.575 0.625
2.7941.7780.070 0.110
1.6761.000 0.039 0.066
8º--8º
A
θ
A1
b
b1
c
c1
c2
D
D1
E
E1
e
H
L
L1
L3
R
R1
6.8695.092 0.200 0.270E3
1.5621.3580.053 0.062D2
A1
L
L3
θ
RR
A
c2
A1
L
L3
θ
R1 R1
JEDEC TO-263
Optional Tip Lead Form
Recommended PCB Pattern
10.75
(0.423)
2.20
(0.087)
8.40
(0.331)
8.05
(0.317) 10.50
(0.413)
1.05
(0.041)
3.80
(0.150)
1.702
(0.067)
Dimensions
mm
(inches)
Pin 1
Indicator
Circular feature will be
present on devices
with the
Optional Tip Lead Form.
*
9.652 - 10.668
(0.380 - 0.420)
14.224 - 16.510
(0.560 - 0.650)
12.700 - 14.732
(0.500 - 0.580)
CC
8.382 - 9.017
(0.330 - 0.355)
2.540 - 3.048
(0.100 - 0.120)
1.702 4x BSC
(0.067 4x BSC)
0.381 - 1.016 5x
(0.015 - 0.040 5x) SECTION C-C
0.381 - 1.016
(0.015 - 0.040)
0.356 - 0.610
(0.014 - 0.024)
0.381 - 0.965
(0.015 - 0.038)
0.356 - 0.559
(0.014 - 0.022)
PLATINGBASE METAL
3.556 - 4.826
(0.140 - 0.190)
0.508 - 1.397
(0.020 - 0.055)
5.842 - 6.858
(0.230 - 0.270)
2.032 - 2.921
(0.080 - 0.115)
0.356 - 0.610
(0.014 - 0.024)
6.858 - 8.890
(0.270 - 0.350)
12.192 - 12.878
(0.480 - 0.507)
9.652 - 10.668
(0.380 - 0.420)
7.550 - 8.100
(0.297 - 0.319)
THERMAL PAD
LEAD TIP
0.355 M B A M
AB
0.381 M B A M
3.810 - 3.860
(0.150 - 0.152)
0.127 BSC
(0.005 BSC)
4.826 - 5.334
(0.190 - 0.210)
6.300 - 6.700
(0.248 - 0.264)
5.842 - 6.858
(0.230 - 0.270)
Dimensions
mm
(inches)
INTEGRATED CIRCUITS DIVISION
IXD_614
14 www.ixysic.com R08
5.5.5 PI (8-Pin DIP)
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005) 9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warra nties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended fo r surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_614-R08
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017
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