Ultralow Noise,
Dual-Axis MEMS Gyroscope
Data Sheet
ADXRS290
FEATURES
MEMS pitch and roll rate gyroscope
Ultralow noise: 0.004°/s/√Hz
High vibration rejection over a wide frequency range
Power saving standby mode
80 µA current consumption in standby mode
Fast startup time from standby mode: <100 ms
Low delay of <0.5 ms for a 30 Hz input at the widest
bandwidth setting
Serial peripheral interface (SPI) digital output
Programmable high-pass and low-pass filters
2000 g powered acceleration survivability
2.7 V to 5.0 V operation
−25°C to +85°C operation
4.5 mm × 5.8 mm × 1.2 mm cavity laminate package
APPLICATIONS
Optical image stabilization
Platform stabilization
Wearable products
GENERAL DESCRIPTION
The ADXRS290 is a high performance MEMS pitch and roll
(dual-axis in-plane) angular rate sensor (gyroscope) designed
for use in stabilization applications.
The ADXRS290 provides an output full-scale range of ±100°/s with
a sensitivity of 200 LSB/°/s. Its resonating disk sensor structure
enables angular rate measurement about the axes normal to the
sides of the package around an in-plane axis. Angular rate data
is formatted as 16-bit twos complement and is accessible through
a SPI digital interface. The ADXRS290 exhibits a low noise floor
of 0.004°/s/√Hz and features programmable high-pass and low-
pass filters.
The ADXRS290 is available in a 4.5 mm × 5.8 mm × 1.2 mm,
18-terminal cavity laminate package.
FUNCTIONAL BLOCK DIAGRAM
CS
PDMYSYNC/ASEL PDMX
ADC
PITCH DEMOD
ADC
ROLL DEMOD FILTERS CONTROL LOGIC
SERIAL
INPUT/OUTPUT
POWER
MANAGEMENT GND
MOSI
MISO
SCLK
DIGITAL
AST V
DD I/O
CP V
REG
V
S
PITCH
ROLL
VELOCITY
PLL
MECHANICAL
SENSOR
DRIVE
ADXRS290
12636-001
Figure 1.
Rev. A Document Feedback
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Technical Support www.analog.com
ADXRS290 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Rate Sensitive Axes ....................................................................... 4
Package Information .................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 10
Applications Information .............................................................. 11
Application Circuit ..................................................................... 11
Power Supply Decoupling ......................................................... 11
Power Sequencing ...................................................................... 11
Setting Bandwidth ...................................................................... 11
Analog Evaluation Mode ........................................................... 12
Mechanical Considerations for Mounting .............................. 13
Serial Communications ................................................................. 14
Register Map ................................................................................... 16
Register Descriptions ..................................................................... 17
Analog Devices Identifier .......................................................... 17
MEMS Identifier ......................................................................... 17
Device Identifier ......................................................................... 17
Silicon Revision Number .......................................................... 17
Serial Number (SNx) ................................................................. 17
Rate Output Data ....................................................................... 17
Temperature Data ....................................................................... 17
Power Control ............................................................................. 17
Band-Pass Filter .......................................................................... 17
Data Ready .................................................................................. 17
Recommended Soldering Profile ................................................. 18
PCB Footprint Pattern ............................................................... 18
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
REVISION HISTORY
12/14—Rev.0 to Rev. A
Changes to Title ................................................................................ 1
Changes to Features Section and General Description Section ....... 1
10/14—Revision 0: Initial Versi on
Rev. A | Page 2 of 19
Data Sheet ADXRS290
SPECIFICATIONS
Specified conditions at TA = 25°C. VS = VDD I/O = 3 V, angular rate = 0°/sec, bandwidth = dc to 480 Hz, CS = CREG = CI/O = CCP = 1 µF, digital
mode, temperature sensor = off, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications
are not tested or guaranteed.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
MEASUREMENT RANGE Each axis
Output Full-Scale Range ±100 °/s
Resolution 16 Bits
Gyroscope Data Update Rate 4250 Hz
LINEARITY
Nonlinearity ±0.5 % FS
Cross Axis Sensitivity ±2.0 %
SENSITIVITY
Sensitivity 200 LSB/°/s
Initial Sensitivity Tolerance1 TA = 25°C −12 ±3 +12 %
Change Due to Temperature TA = −20°C to +60°C ±1 %
OFFSET
Offset Error TA = −20°C to +60°C ±9 °/s
NOISE PERFORMANCE
Rate Noise Density TA = 25°C at 10 Hz 0.004 °/s/√Hz
FREQUENCY RESPONSE Programmable (see the Setting Bandwidth section)
−3 dB Frequency2
Low-Pass Filter 20 480 Hz
High-Pass Filter DC output setting available 0.011 11.3 Hz
Delay
30 Hz input, low-pass filter (LPF) = 480 Hz
<0.5
ms
POWER SUPPLY
Operating Voltage Range (VS, VDD I/O) 2.7 5.0 V
Supply Current Measurement mode 7.8 mA
Standby mode 80 µA
Start-Up Time (Standby) Power off to standby mode <5 ms
Start-Up Time (Measurement Mode) Standby to measurement mode (to within ±1°/s of final value) <100 ms
TEMPERATURE SENSOR
Resolution 12 Bits
Sensitivity 0.1 °C/LSB
OPERATING TEMPERATURE RANGE
Operating Temperature Range –25 +85 °C
1 Initial sensitivity tolerance minimum and maximum specifications are guaranteed by characterization and are not tested in production.
2 Guaranteed by design and are not tested in production.
Rev. A | Page 3 of 19
ADXRS290 Data Sheet
Rev. A | Page 4 of 19
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Acceleration (Any Axis, Unpowered, 0.5 ms) 2000 g
Acceleration (Any Axis, Powered, 0.5 ms) 2000 g
VS, VDD I/O 2.7 V to 5.25 V
All Other Pins 2.7 V to 5.25 V
Output Short-Circuit Duration (Any Pin to
Common)
Indefinite
Operating Temperature Range –40°C to +105°C
Storage Temperature Range –40°C to +105°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
RATE SENSITIVE AXES
The ADXRS290 is an x-axis and y-axis rate sensing device that
is also called a roll and pitch rate sensing device. It produces a
positive output voltage for clockwise rotation about the x-axis
and y-axis, as shown in Figure 2.
Ω
Y
Ω
X
12636-002
Figure 2. Axes of Sensitivity
PACKAGE INFORMATION
The information in Figure 2 and Table 3 provide details about
the package branding for the ADXRS290. For a complete listing
of product availability, see the Ordering Guide section.
Table 3. Package Branding Information
Branding Key Field Description
XR290 Part identifier for ADXRS290
#yyyy Date code
●XXXXXX Pin 1 and factory lot code identifiers
ESD CAUTION
Data Sheet ADXRS290
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PDMY
CS
MISO
MOSI
PDMX
SENS
AST
V
DD I/O
V
REG
SCLK
SYNC/ASEL
CP
GND
V
S
V
S
V
REG
GND
GND
12345
13121110
9
6
7
8
15
16
17
18
14
TOP VIEW
(TE RM INAL S IDE DO WN)
Not to Scale
ADXRS290
12636-003
Figure 3. Pin Configuration (Top View)
Table 4. Pin Function Descriptions
Description
Pin No. Mnemonic Digital Mode Analog Evaluation Mode
1 VREG Regulator Output. Connect a 1 µF capacitor to this pin. Regulator Output. Connect a 1 µF capacitor to this pin.
2 VDD I/O Digital Interface Supply Voltage. Digital Interface Supply Voltage.
3 AST This pin is internally pulled to ground. Self Test.
4 SENS This pin is internally pulled to ground. Sensitivity Select.
5 PDMX This pin is internally pulled to ground. Pulse-Density Modulation (PDM) XOUT.
6 PDMY This pin is internally pulled to ground. PDM YOUT.
7 CS Chip Select. Active low. Chip Select. Active low.
8 MISO (SDO) Serial Data Out. Serial Data Out.
9 MOSI (SDI) Serial Data In. Serial Data In.
10 SCLK Serial Communications Clock. Serial Communications Clock.
11 SYNC/ASEL Data Ready Out (SYNC). Connect this pin to ground if
it is not used.
Analog Enable (ASEL).
12 CP Charge Pump Output. Connect a 1 µF capacitor (rated
for 50 V) to this pin.
Charge Pump Output. Connect a 1 µF capacitor (rated
for 50 V) to this pin.
13, 15, 16 GND Ground. Connect to ground. Ground. Connect to ground.
14 VS Analog Supply Voltage. Analog Supply Voltage.
17 VREG Regulator Output. Connect a 1 µF capacitor to this pin. Regulator Output. Connect a 1 µF capacitor to this pin.
18 VS Analog Supply Voltage. Analog Supply Voltage.
Rev. A | Page 5 of 19
ADXRS290 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
N > 240 for all typical performance characteristics plots, unless otherwise noted.
70
0
10
20
30
40
50
60
–500 –400 –300 –200 –100 0100 200 300 400 500
PERCENT OF POPULATION (%)
X-AXIS OFFSET (L SB)
12636-004
Figure 4. X-Axis Offset at 25°C
400
–400
–300
–200
–100
0
100
200
300
–50 –25 025 50 75 100
OFFSET (LSB)
TEMPERATURE (°C)
12636-005
Figure 5. X-Axis Offset vs. Temperature (N = 16)
22
20
18
16
14
12
10
8
6
4
2
0
PERCENT OF POPULATION (%)
X-AXIS SENSITIVIT Y (L SB/°/s)
180
182
184
186
188
190
192
194
196
198
200
202
204
206
208
210
212
214
216
218
220
12636-006
Figure 6. X-Axis Sensitivity at 25°C
40
35
0
5
10
15
20
25
30
–500 –400 –300 –200 –100 0100 200 300 400 500
PERCENT OF POPULATION (%)
Y-AXIS OFFSET (L SB)
12636-007
Figure 7. Y-Axis Offset at 25°C
1500
1000
–1500
–1000
–500
0
500
–50 –25 025 50 75 100
OFFSET (LSB)
TEMPERATURE (°C)
12636-008
Figure 8. Y-Axis Offset vs. Temperature (N = 16)
20
18
16
14
12
10
8
6
4
2
0
PERCENT OF POPULATION (%)
Y-AXIS SENSITIVIT Y (L SB/°/s)
180
182
184
186
188
190
192
194
196
198
200
202
204
206
208
210
212
214
216
218
220
12636-009
Figure 9. Y-Axis Sensitivity at 25°C
Rev. A | Page 6 of 19
Data Sheet ADXRS290
220
180
185
190
195
200
205
210
215
–50 –25 025 50 75 100
SENSITIVITY (LSB/°/s)
TEMPERATURE (°C)
12636-010
Figure 10. X-Axis Sensitivity vs. Temperature (N = 16)
250
–250
–200
–150
–100
–50
0
50
100
150
200
08070605040302010
ANGUL AR RATE ( °/ s)
TIME (ms)
REFERENCE
ADXRS290
12636-011
Figure 11. Rate Output Saturation Behavior
2.0
–2.0
–1.5
–1.0
–0.5
0
0.5
1.0
1.5
60
–20
–10
0
10
20
30
40
50
00.200.150.100.05
RATE O UTPUT (°/ s)
INPUT ACCELERATI ON (g)
TIME (Seconds)
X-AXIS
Y-AXIS
INPUT REFERE NCE
12636-012
Figure 12. Response to 50 g, 10 ms Half-Sine Shock Along the Z-Axis
(Out-of-Plane), HPF = Off and LPF = 480 Hz
220
180
185
190
195
200
205
210
215
–50 –25 025 50 75 100
SENSITIVITY (LSB/°/s)
TEMPERATURE (°C)
12636-013
Figure 13. Y-Axis Sensitivity vs. Temperature (N = 16)
0.20
0.15
–0.20
–0.10
–0.05
–0.15
0
0.10
0.05
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
110
AVERAG E V ALUE OF RATE O UTPUT (°/s)
RMS VALUE OF RATE O UTPUT (°/s)
FREQUENCY ( kHz )
X OUTPUT (AVERAGE)
Y OUTPUT (AVERAGE)
X OUTPUT (RMS)
Y OUTPUT (RMS)
12636-014
Figure 14. Response to 10 g Sine Vibration Along the Z-Axis (Out-of-Plane),
HPF = Off and LPF = 480 Hz
0.1
0.00001
0.0001
0.001
0.01
0.1 100
10110k1k
NOISE SPECTRAL DENSITY (°/s/√Hz)
FREQUENCY ( Hz )
X-AXIS
Y-AXIS
12636-015
Figure 15. Typical Noise Spectral Density
Rev. A | Page 7 of 19
ADXRS290 Data Sheet
200
–200
–150
–100
–50
0
50
100
150
01008060
4020 907050
3010
RATE O UTPUT (°/ s)
TIME (ms)
12636-017
X-AXIS
Y-AXIS
Figure 16. Start-Up Time (Standby to Measurement Mode)
1200
1000
800
600
400
200
0
–200
–400
–600
–50 100
7550250
–25
TEMPERATURE SENSOR OUTPUT (LSB)
AMBI E NT TE M P E RATURE ( °C)
12636-023
Figure 17. Temperature Sensor Output vs. Ambient Temperature (N = 16)
3.0
0
0.5
1.0
1.5
2.0
2.5
050403020
10
GRO UP DE LAY ( ms)
INPUT F RE QUENCY ( Hz )
LPF = 80Hz
LPF = 160Hz
LPF = 320Hz
12636-021
Figure 18. Low-Pass Filter Group Delay
0
–35
–30
–25
–20
–15
–10
–5
0504030
20
10
PHASE DE LAY ( Degrees)
INPUT F RE QUENCY ( Hz )
LPF = 80Hz
LPF = 160Hz
LPF = 320Hz
12636-020
Figure 19. Low-Pass Filter Phase Delay
0.5
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
–125 1257525–25–75
NONLINEARITY (% OF FULL-SCALE)
ANGULAR RATE ( °/ s)
12636-022
Figure 20. Rate Output Nonlinearity (N = 15)
50
0
10
20
30
40
45
5
15
25
35
10 15 20 25 30 35 40 45 50 55 60
PERCENT OF POPULATION (%)
STANDBY M ODE CURRE NT (µ A)
12636-019
Figure 21. Standby Mode Current Consumption
Rev. A | Page 8 of 19
Data Sheet ADXRS290
50
0
10
20
30
40
45
5
15
25
35
PERCENT OF POPULATION (%)
MEASURE M E NT MODE CURRE NT (mA)
12636-024
6.5 6.6 6.7 6.8 6.9 7.0 7.1 7.2 7.3 7.4 7.5
Figure 22. Measurement Mode Current Consumption
Rev. A | Page 9 of 19
ADXRS290 Data Sheet
THEORY OF OPERATION
The ADXRS290 is designed to sense x-axis and y-axis (roll and
pitch) angular rate. The ADXRS290 operates on the principle of
a vibratory rate gyroscope. Figure 23 presents a simplified
illustration of one of four, coupled polysilicon sensing structures.
Each sensing structure contains a resonating disk that is
electrostatically driven to resonance, which produces the
necessary rotating velocity element needed to generate a
Coriolis torque when experiencing angular rate.
ΩY
ΩX
Y-AXIS
X-AXIS
12636-025
Figure 23. Simplified Gyroscope Sensing Structure
When the sensing structure is exposed to an angular rate, the
resulting Coriolis torque drives each of the disks into a tilting
motion, which is sensed by plates under the disk. The disk and
plate form a capacitive pickoff structure that senses angular rate.
The resulting signal is fed to a series of gain and demodulation
stages that produce the electrical rate signal output. The sensor
design rejects linear and angular acceleration because external
g-forces appear as common-mode signals that are removed by
the fully differential architecture of the ADXRS290.
The resonator requires 31 V (typical) for operation. Because
only 5 V is typically available in most applications, a switching
regulator is included on-chip. An external 1 µF capacitor rated
for 50 V is required for proper operation of the charge pump
circuit.
After demodulation and analog-to-digital conversion, the rate
signal is filtered using a single-pole band-pass filter. The high-
pass and low-pass poles of this filter are programmable via the
digital interface.
Rev. A | Page 10 of 19
Data Sheet ADXRS290
APPLICATIONS INFORMATION
APPLICATION CIRCUIT
The ADXRS290 application circuit is shown in Figure 24. The
primary communications port is the 4-wire SPI interface. For
this device, external pull-up/pull-down resistors are not required
for the SPI interface, and these pins can be connected directly to
the system microcontroller. Four capacitors are required for
proper operation of the device. For optimum device performance,
separate the capacitors placed on the VS, VDD I/O, VREG, and CP pins.
SCLK
SYNC/ASEL
CP
GND
V
S
PDMY
CS
MISO
MOSI
PDMX
SENS
AST
V
DD I/O
V
REG
V
S
V
REG
GND
GND
1
2
3
4
5
14
13
12
11
10
9
6
7
8
15
16
17
18
TOP VIEW
(TE RM INAL S IDE DO WN)
Not to Scale
ADXRS290
2.7V TO
5.25V
2.7V TO
5.25V
C
REG
1µF C
CP
1µF
50V
C
S
1µF
C
I/O
1µF
SPI BUS
12636-026
Figure 24. Recommended Application Circuit
POWER SUPPLY DECOUPLING
In many applications, bypass capacitors at VS, VREG, and VDD I/O
(as shown in Figure 24) placed close to the ADXRS290 supply
pins adequately decouple the gyroscope from noise on the power
supply. However, in applications where noise is present at the
internal clock frequency, or any harmonic thereof, additional
care in power supply bypassing is required because this noise
may cause errors in angular rate measurement. If additional
decoupling is necessary, a 10 Ω resistor or ferrite bead in series
with VS and an additional larger bypass capacitor (2.2 µF or
greater) at VS may be helpful.
Ensure that the connection from the ADXRS290 ground to
the power supply ground be low impedance because noise
transmitted through ground has an effect similar to noise
transmitted through VS.
POWER SEQUENCING
The interface voltage level is set with the interface supply voltage
VDD I/O, which must be present to ensure that the ADXRS290
does not create a conflict on the communications bus. For single-
supply operation, VDD I/O can be the same as the main supply (VS).
Conversely, in a dual-supply application, VDD I/O can differ from
VS to accommodate the desired interface voltage. When VS is
applied, the device enters standby state, where power consumption
is minimized, and the device waits for VDD I/O to be applied and
for a command to enter measurement mode. Measurement mode
is activated by setting Bit B1 in Register 0x10 (POWER_CTL).
Clear this bit to return the device to a standby state.
In standby mode, the current consumption is reduced to 80 µA
(typical). In standby mode, only single-address SPI transactions
are performed, which includes reading from or writing to a single
register, but does not include writing to or reading from several
registers in one command. In standby mode, the gyroscope does
not respond to rate outputs. Transition time to measurement mode
where offsets settle to within ±1°/s of the final value is <100 ms.
SETTING BANDWIDTH
The ADXRS290 includes an internal configurable band-pass filter.
Both the high-pass and low-pass poles of the filter are adjustable, as
shown in Table 5 and Table 6. The filter frequency response is
shown in Figure 25 and Figure 26. The group delay of the
wideband filter option is less than 0.5 ms (see Figure 18 for filter
delay). At power-up, the default condition for the filters is dc for
the high-pass filter and 480 Hz for the low-pass filter.
Table 5. Low-Pass Filter Pole Locations
Bit 2 Filter Bit 1 Filter Bit 0 Filter Frequency (Hz)
0 0 0 480 (Default)
0 0 1 320
0 1 0 160
0 1 1 80
1
0
0
56.6
1 0 1 40
1 1 0 28.3
1 1 1 20
Table 6. High-Pass Filter Pole Locations
Bit 7
Filter
Bit 6
Filter
Bit 5
Filter
Bit 4
Filter
Frequency
(Hz)
0
0
0
0
All pass
(default)
0
0
0
1
0.011
0
0
1
0
0.022
0 0 1 1 0.044
0
1
0
0
0.087
0
1
0
1
0.175
0 1 1 0 0.350
0
1
1
1
0.700
1
0
0
0
1.400
1 0 0 1 2.800
1
0
1
0
11.30
Rev. A | Page 11 of 19
ADXRS290 Data Sheet
1.2
1.0
0.8
0.6
0.4
0.2
0
0.0001 1k1001010.10.010.001
NORM ALIZED M AGNI TUDE
FREQUENCY ( Hz )
12636-027
0.011Hz
0.022Hz
0.044Hz
0.087Hz
0.175Hz
0.35Hz
0.7Hz
1.4Hz
2.8Hz
11.3Hz
Figure 25. High-Pass Filter Frequency Response
1.2
1.0
0.8
0.6
0.4
0.2
0110k1k
10010
NORM ALIZED M AGNI TUDE
FREQUENCY ( Hz )
12636-028
20Hz
28.3Hz
40Hz
56.6Hz
80Hz
160Hz
320Hz
480Hz
Figure 26. Low-Pass Filter Frequency Response
Offset Preservation in the High-Pass Filter
One of the functions of the high-pass filter is to remove offset.
The high-pass filter effectively estimates the offset and subtracts
it from the output. When the high-pass filter settings are
changed, the output remains unchanged; the filter preserves its
estimate of offset. The high-pass filter can be set to the fast
settling option, allowed to converge to zero offset, and then set
to any other high-pass filter option while maintaining near zero
offset. Exiting measurement mode clears the preserved offset.
ANALOG EVALUATION MODE
An analog output evaluation mode has been incorporated in
the ADXRS290. In this mode, the output of the ADXRS290
is formatted as a pulse density modulated data stream at a
frequency of 144 kHz via the PDMX and PDMY pins. The
PDMX and PDMY pins high and low voltage levels are ratiometric
to VDD I/O. This signal can be decoded into an analog baseband
using a low-pass filter. Higher order filters allow for greater
attenuation of the 144 kHz switching noise while maintaining
the integrity of the baseband signal. A recommended application
circuit with a third-order Sallen-Key filter is shown in Figure 27.
Figure 28 shows the recommended low-pass filter for
demodulating the PDM output in analog mode operation.
SCLK
SYNC/ASEL
CP
GND
V
S
PDMY
CS
MISO
MOSI
PDMX
SENS
AST
V
DD I/O
V
REG
V
S
V
REG
GND
GND
1
2
3
4
5
14
13
12
11
10
9
6
7
8
15
16
17
18
TOP VIEW
(TE RM INAL S IDE DO WN)
Not to Scale
ADXRS290
2.7V TO
5.25V
2.7V TO
5.25V
C
REG
1µF C
CP
1µF
50V
C
S
1µF
C
I/O
1µF
LOW-PASS FILTER
12636-029
Figure 27. Recommended Application Circuit for Analog Mode Operation
+5V
–5V
0.1µF
0.1µF
47kΩ
30.1kΩ
ANALOG
BASEBAND
SIGNAL
5100pF
30.1kΩ
0.01µF
24kΩ
0.01µF
PDMX
OR
PDMY
12636-030
Figure 28. Recommended Low-Pass Filter for Demodulating the PDM Output
in Analog Mode Operation
In analog mode, the band-pass filter is disabled and the device
cannot be placed in standby mode. SPI communication to the
ADXRS290 is available but not required. Sensitivity in this
mode is 5 mV/°/s.
Rev. A | Page 12 of 19
Data Sheet ADXRS290
MECHANICAL CONSIDERATIONS FOR MOUNTING
Mount the ADXRS290 on the printed circuit board (PCB) in a
location close to a hard mounting point of the PCB to the case.
Mounting the ADXRS290 at an unsupported PCB location, as
shown in Figure 29, may result in large, apparent measurement
errors due to undamped PCB vibration. Locating the ADXRS290
near a hard mounting point ensures that any PCB vibration at
the device is above the resonant frequencies of the MEMS elements
and, therefore, effectively invisible to the device. In applications
where the gyroscope may be subjected to large shock events or
excessive vibration, consider the use of damping materials (such
as Polyurethane) at the mounting locations to dampen the
vibration. A thicker PCB can also help to reduce the effect of
system resonance on the performance of the ADXRS290.
MOUNTING POINTS
GOOD
PLACEMENT
BAD PL ACEMENT
12636-031
Figure 29. Two Examples of Incorrectly Mounted Gyroscopes
Rev. A | Page 13 of 19
ADXRS290 Data Sheet
SERIAL COMMUNICATIONS
In digital mode, the ADXRS290 communicates via 4-wire SPI
and operates as a slave. Ignore data transmitted from the
ADXRS290 to the master device during writes to the ADXRS290.
Wire the ADXRS290 for SPI communication as shown in the
connection diagram in Figure 30. The maximum SPI clock
speed is 5 MHz, with 12 pF maximum loading. The timing
scheme follows clock phase (CPHA) = clock polarity (CPOL) = 1.
SS
CS MOSI
SDI MISO
SDO SCLK
SCLK
ADXRS290 PROCESSOR
12636-032
Figure 30. 4-Wire SPI Connection
CS is the serial port enable line and is controlled by the SPI
master. It must go low at the start of transmissions and high at
the end as shown in Figure 31. SCLK is the serial port clock and
is supplied by the SPI master. It is stopped high when CS is high,
during periods of no transmission. At the rising edge of SCLK,
data can be sampled. Unless the ADXRS290 is in standby
mode, multiple bytes can be written to or read from in a single
transmission. In standby mode, only single register transactions
are supported. Deasserting the CS pin is necessary between
commands for transmissions with multiple commands. For SPI
operation greater than 1 MHz, it is necessary to deassert the CS
pin to ensure a total delay of 10 µs between the register addressing
portion of the transmission. The delay is required to allow
settling of the internal voltage controlled oscillator. For SPI
operation of 1 MHz or lower, the communication rate is low
enough to ensure a sufficient delay between register writes.
SPI read and write operations are completed in 16 or more
clock cycles, as shown in Figure 31. Setting the R/W bit to 1
indicates a read operation and setting it to 0 indicates a write
operation. For R/W = 0 (write), [D7:D0] data is written to the
device in the register map based on the [A6:A0] addresses. For
R/W = 1 (read), [D7:D0] is the data read by the external master
device based on the [A6:A0] addresses. Examples of SPI write
and read are shown in Figure 32 and Figure 33.
R/W A6 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D4 D0
D7 D6 D5 D4 D3 D2 D1 D0
CS
SCLK
SDI
SDO
tDELAY tSCLK tM
tSDO
tSETUP
tHOLD
tStQUIET
A5
12636-033
Figure 31. SPI Timing Diagram
Table 7. SPI Timing Specifications (TA = 25°C, VS = VDD I/O = 2.7 V)
Parameter
Limit
Unit
Description
fSCLK 5 MHz max SPI clock frequency
tSCLK 200 ns min 1/(SPI clock frequency), mark/space ratio for the SCLK input is 40/60 to 60/40
tDELAY 200 ns min CS falling edge to SCLK falling edge
tQUIET 200 ns min SCLK rising edge to CS rising edge
tS 0.4 × tSCLK ns min SCLK low pulse width (space)
tM 0.4 × tSCLK ns min SCLK high pulse width (mark)
tSDO 20 ns max SCLK falling edge to SDO transition
tSETUP 10 ns min SDI valid before SCLK rising edge
tHOLD 10 ns min SDI valid after SCLK rising edge
Rev. A | Page 14 of 19
Data Sheet ADXRS290
12636-034
CH1 5.00V CH2 5.00V
CH3 5.00V CH4 5.00V M4.00µs A CH1 1. 8V
2
4
1
3
T 7.400µ s
T
MOSI
MISO
SCLK
CS
Figure 32. SPI Write Example: Writing to Register 0x10 (Write 0x02 to Enter
Measurement Mode)
12636-035
CH1 5.00V CH2 5.00V
CH3 5.00V CH4 5.00V M4.00µs A CH1 1. 8V
2
4
1
3
T 7.400µ s
T
MOSI
MISO
SCLK
CS
Figure 33. SPI Read Example: Reading Register 0x01 (Output = 0x1D)
Rev. A | Page 15 of 19
ADXRS290 Data Sheet
REGISTER MAP
Table 8.
Register No. (Hex) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset R/W
0x00 ADI_ID ADI_ID[7:0] 10101101 R
0x01 MEMS_ID MEMS_ID[7:0] 00011101 R
0x02 DEV_ID DEV_ID[7:0] 10010010 R
0x03 REV_ID REV_ID[7:0] 00001001 R
0x04 SN0 SN[7:0] SN[7:0] R
0x05 SN1 SN[15:8] SN[15:8] R
0x06 SN2 SN[23:16] SN[23:16] R
0x07 SN3 SN[31:24] SN[31:24] R
0x08 DATAX0 X0[7:0] 00000000 R
0x09 DATAX1 X1[15:8] 00000000 R
0x0A DATAY0 Y0[7:0] 00000000 R
0x0B DATAY1 Y1[15:8] 00000000 R
0x0C TEMP0 TEMP[7:0] 00000000 R
0x0D TEMP1 0 0 0 0 TEMP[11:8] 00000000 R
0x0E Reserved Reserved[7:0] 00000000 R
0x0F Reserved Reserved[7:0] 00000011 R
0x10 POWER_CTL 0 0 0 0 0 0 Measurement TSM 00000000 R/W
0x11 Filter HPF[3:0] 0 LPF[2:0] 00000000 R/W
0x012
DATA_READY
0
0
0
0
0
0
Sync[1:0]
00000000
R/W
Rev. A | Page 16 of 19
Data Sheet ADXRS290
REGISTER DESCRIPTIONS
This section describes the functions of the ADXRS290 registers.
The ADXRS290 powers up with default register values as shown
in the reset column of Table 8.
ANALOG DEVICES IDENTIFIER
Table 9. Register 0x00, ADI_ID (Read Only)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
1 0 1 0 1 1 0 1
The ADI_ID register holds a fixed code 0xAD.
MEMS IDENTIFIER
Table 10. Register 0x01, MEMS_ID (Read Only)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 0 0 1 1 1 0 1
The MEMS_ID register holds a fixed code of 0x1D.
DEVICE IDENTIFIER
Table 11. Register 0x02, DEV_ID (Read Only)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
1 0 0 1 0 0 1 0
The DEV_ID register holds a fixed code of 0x92.
SILICON REVISION NUMBER
Table 12. Register 0x03, REV_ID (Read Only)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 0 0 0 1 0 0 1
The REV_ID register holds a revision ID code that increments
with each subsequent silicon revision.
SERIAL NUMBER (SNx)
These four bytes (Register 0x04 to Register 0x07) store the
unique electronic serial number for the part.
RATE OUTPUT DATA
Register 0x08 to Register 0x0B: DATAX0, DATAX1,
DATAY0, and DATAY1 (Read Only)
These four bytes (Register 0x08 to Register 0x0B) hold the rate
output data for each axis. Register 0x08 and Register 0x09 hold
the output data for the x-axis, and Register 0x0A and Register 0x0B
hold the output data for the y-axis. The output data is written in
twos complement. In each two byte set, DATAx0 is the least
significant byte, and DATAx1 is the most significant byte, where
x represents the x-axis or the y-axis. To prevent a change in data
between reads of the sequential registers, perform a multiple
byte read of all rate output data registers.
TEMPERATURE DATA
Register 0x0C to Register 0x0D: TEMP0 and TEMP1
(Read Only)
These two bytes hold temperature output data written in twos
complement. Register 0x0C contains Bits[7:0] and Register
0x0D contains Bits[11:8] of the 12-bit temperature reading.
When concurrent temperature and output data points are
desired, perform a multiple byte read of the TEMP1:TEMP0,
DATAX1:DATAX0, and DATAY1:DATAY0 registers. The scale
factor of the temperature reading is 10 LSB/°C, and 0 codes is
equivalent to 0°C.
POWER CONTROL
Table 13. Register 0x10, POWER_CTL (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0 0 0 0 0 0 Measurement TSM
TSM Bit
The TSM bit controls the temperature sensor. The default value
of this bit is 0 (temperature sensor off) and setting this bit to 1
enables the temperature sensor.
Measurement Bit
To set the ADXRS290 to standby mode, set the measurement bit
to 0. To set the ADXRS290 to measurement mode, set this bit to 1.
The ADXRS290 powers up in standby mode with a current
consumption of 80 µA (typical).
BAND-PASS FILTER
Table 14. Register 0x11, Filter (Read/Write)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
HPF[3:0] 0 LPF[2:0]
LPF Bits
The three LPF bits define the low-pass filter pole (see Table 5).
HPF Bits
The four HPF bits define the high-pass filter pole (see Table 6).
DATA READY
Table 15. Register 0x12, DATA_READY (Read/Write)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 0 0 0 0 0 Sync[1:0]
Sync Bits
Set the sync bits to 01 to generate a data ready interrupt at the
SYNC/ASEL pin when new data becomes available.
Table 16. SYNC Pin Functions
Bit 1 Bit 0 Description
X 0 Read for analog enable
0
1
Data ready out, high until read
Rev. A | Page 17 of 19
ADXRS290 Data Sheet
RECOMMENDED SOLDERING PROFILE
Figure 34 and Table 17 provide details about the recommended soldering profile.
tP
tL
t
25°C TO P E AK
tS
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
12636-036
Figure 34. Recommended Soldering Profile
Table 17. Recommended Soldering Profile1, 2
Condition
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate from Liquid Temperature (TL) to Peak Temperature (TP) 3°C/sec maximum 3°C/sec maximum
Preheat
Minimum Temperature (T
SMIN
)
100°C
150°C
Maximum Temperature (TSMAX) 150°C 200°C
Time from TSMIN to TSMAX (tS) 60 seconds to 120 seconds 60 seconds to 180 seconds
TSMAX to TL Ramp-Up Rate 3°C/second maximum 3°C/second maximum
Liquid Temperature (TL) 183°C 217°C
Time Maintained Above TL (tL) 60 seconds to 150 seconds 60 seconds to 150 seconds
Peak Temperature (T
P
)
240 + 0/−5°C
260 + 0/−5°C
Time of Actual TP − 5°C (tP) 10 seconds to 30 seconds 20 seconds to 40 seconds
Ramp-Down Rate 6°C/sec maximum 6°C/sec maximum
Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum
1 Based on JEDEC Standard J-STD-020D.1.
2 For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
PCB FOOTPRINT PATTERN
12636-037
4.00mm 5.66mm
2.70mm
4.35mm
0.25mm
TYP
0.40mm
TYP
0.60mm TYP
Figure 35. PCB Footprint Pattern and Dimensions
Rev. A | Page 18 of 19
Data Sheet ADXRS290
OUTLINE DIMENSIONS
04-26-2012-A
4.60
4.50
4.40
5.90
5.80
5.70
BOTTOM VIEW
TOP VI EW
SIDE VIEW
0.65 BS C
0.70
BSC
0.35 RE F
1.60 RE F
1.30
1.20
1.10
0.24 RE F
4.06
REF
5.36 RE F
0.30 × 0.45
(PINS 1-5, 10-14)
0.45 × 0.30
(PINS 6-9, 15-18)
1 5 6
9
1014
15
18
1.03
BSC
0.65
BSC 1.28
REF
0.095 RE F
0.35
REF
R 0.68
REF
R 0.15
REF
PI N 1 LAND
CORNER PIN 1 LAND
INDICATOR
VENT HOLE
Figure 36. 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
5.80 mm × 4.50 mm Body
(CE-18-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
ADXRS290BCEZ −25°C to +85°C 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] CE-18-2
ADXRS290BCEZ-RL −25°C to +85°C 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] CE-18-2
ADXRS290BCEZ-RL7
−25°C to +85°C
18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
CE-18-2
EVAL-ADXRS290Z Breakout Evaluation Board
EVAL-ADXRS290Z-M Analog Devices Inertial Sensor Evaluation System, which includes a
socket version of the satellite (ADXRS290-S) board
EVAL-ADXRS290Z-S ADXRS290 Satellite, Standalone Socket Version
EVAL-ADXRS290Z-M2 Analog Devices Inertial Sensor Evaluation System, which includes a
soldered version of the satellite (ADXRS290-S2) board
EVAL-ADXRS290Z-S2 ADXRS290 Satellite, Standalone Soldered Version
1 Z = RoHS Compliant Part.
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12636-0-12/14(A)
Rev. A | Page 19 of 19
