Ultralow Noise, Dual-Axis MEMS Gyroscope ADXRS290 Data Sheet FEATURES GENERAL DESCRIPTION MEMS pitch and roll rate gyroscope Ultralow noise: 0.004/s/Hz High vibration rejection over a wide frequency range Power saving standby mode 80 A current consumption in standby mode Fast startup time from standby mode: <100 ms Low delay of <0.5 ms for a 30 Hz input at the widest bandwidth setting Serial peripheral interface (SPI) digital output Programmable high-pass and low-pass filters 2000 g powered acceleration survivability 2.7 V to 5.0 V operation -25C to +85C operation 4.5 mm x 5.8 mm x 1.2 mm cavity laminate package The ADXRS290 is a high performance MEMS pitch and roll (dual-axis in-plane) angular rate sensor (gyroscope) designed for use in stabilization applications. The ADXRS290 provides an output full-scale range of 100/s with a sensitivity of 200 LSB//s. Its resonating disk sensor structure enables angular rate measurement about the axes normal to the sides of the package around an in-plane axis. Angular rate data is formatted as 16-bit twos complement and is accessible through a SPI digital interface. The ADXRS290 exhibits a low noise floor of 0.004/s/Hz and features programmable high-pass and lowpass filters. The ADXRS290 is available in a 4.5 mm x 5.8 mm x 1.2 mm, 18-terminal cavity laminate package. APPLICATIONS Optical image stabilization Platform stabilization Wearable products FUNCTIONAL BLOCK DIAGRAM SYNC/ASEL PDMY PDMX AST VDD I/O CP VREG VS POWER MANAGEMENT DEMOD PITCH GND ADC FILTERS DEMOD ROLL CONTROL LOGIC ADC MOSI SERIAL INPUT/OUTPUT DIGITAL MISO SCLK CS ADXRS290 MECHANICAL SENSOR PITCH ROLL PLL DRIVE 12636-001 VELOCITY Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. 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Technical Support www.analog.com ADXRS290 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Mechanical Considerations for Mounting .............................. 13 Applications ....................................................................................... 1 Serial Communications ................................................................. 14 General Description ......................................................................... 1 Register Map ................................................................................... 16 Functional Block Diagram .............................................................. 1 Register Descriptions ..................................................................... 17 Revision History ............................................................................... 2 Analog Devices Identifier.......................................................... 17 Specifications..................................................................................... 3 MEMS Identifier......................................................................... 17 Absolute Maximum Ratings............................................................ 4 Device Identifier ......................................................................... 17 Rate Sensitive Axes ....................................................................... 4 Silicon Revision Number .......................................................... 17 Package Information .................................................................... 4 Serial Number (SNx) ................................................................. 17 ESD Caution .................................................................................. 4 Rate Output Data ....................................................................... 17 Pin Configuration and Function Descriptions ............................. 5 Temperature Data ....................................................................... 17 Typical Performance Characteristics ............................................. 6 Power Control ............................................................................. 17 Theory of Operation ...................................................................... 10 Band-Pass Filter .......................................................................... 17 Applications Information .............................................................. 11 Data Ready .................................................................................. 17 Application Circuit ..................................................................... 11 Recommended Soldering Profile ................................................. 18 Power Supply Decoupling ......................................................... 11 PCB Footprint Pattern ............................................................... 18 Power Sequencing ...................................................................... 11 Outline Dimensions ....................................................................... 19 Setting Bandwidth ...................................................................... 11 Ordering Guide .......................................................................... 19 Analog Evaluation Mode ........................................................... 12 REVISION HISTORY 12/14--Rev.0 to Rev. A Changes to Title ................................................................................ 1 Changes to Features Section and General Description Section....... 1 10/14--Revision 0: Initial Version Rev. A | Page 2 of 19 Data Sheet ADXRS290 SPECIFICATIONS Specified conditions at TA = 25C. VS = VDD I/O = 3 V, angular rate = 0/sec, bandwidth = dc to 480 Hz, CS = CREG = CI/O = CCP = 1 F, digital mode, temperature sensor = off, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not tested or guaranteed. Table 1. Parameter MEASUREMENT RANGE Output Full-Scale Range Resolution Gyroscope Data Update Rate LINEARITY Nonlinearity Cross Axis Sensitivity SENSITIVITY Sensitivity Initial Sensitivity Tolerance1 Change Due to Temperature OFFSET Offset Error NOISE PERFORMANCE Rate Noise Density FREQUENCY RESPONSE -3 dB Frequency2 Low-Pass Filter High-Pass Filter Delay POWER SUPPLY Operating Voltage Range (VS, VDD I/O) Supply Current Start-Up Time (Standby) Start-Up Time (Measurement Mode) TEMPERATURE SENSOR Resolution Sensitivity OPERATING TEMPERATURE RANGE Operating Temperature Range 1 2 Test Conditions/Comments Each axis TA = 25C TA = -20C to +60C Min -12 Typ Max Unit 100 16 4250 /s Bits Hz 0.5 2.0 % FS % 200 3 1 +12 LSB//s % % TA = -20C to +60C 9 /s TA = 25C at 10 Hz Programmable (see the Setting Bandwidth section) 0.004 /s/Hz DC output setting available 30 Hz input, low-pass filter (LPF) = 480 Hz 20 0.011 480 11.3 Hz Hz ms 5.0 7.8 80 <5 <100 V mA A ms ms 12 0.1 Bits C/LSB <0.5 2.7 Measurement mode Standby mode Power off to standby mode Standby to measurement mode (to within 1/s of final value) -25 Initial sensitivity tolerance minimum and maximum specifications are guaranteed by characterization and are not tested in production. Guaranteed by design and are not tested in production. Rev. A | Page 3 of 19 +85 C ADXRS290 Data Sheet ABSOLUTE MAXIMUM RATINGS PACKAGE INFORMATION Table 2. Parameter Acceleration (Any Axis, Unpowered, 0.5 ms) Acceleration (Any Axis, Powered, 0.5 ms) VS, VDD I/O All Other Pins Output Short-Circuit Duration (Any Pin to Common) Operating Temperature Range Storage Temperature Range Rating 2000 g 2000 g 2.7 V to 5.25 V 2.7 V to 5.25 V Indefinite -40C to +105C -40C to +105C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. The information in Figure 2 and Table 3 provide details about the package branding for the ADXRS290. For a complete listing of product availability, see the Ordering Guide section. Table 3. Package Branding Information Branding Key XR290 #yyyy XXXXXX ESD CAUTION RATE SENSITIVE AXES The ADXRS290 is an x-axis and y-axis rate sensing device that is also called a roll and pitch rate sensing device. It produces a positive output voltage for clockwise rotation about the x-axis and y-axis, as shown in Figure 2. X 12636-002 Y Figure 2. Axes of Sensitivity Rev. A | Page 4 of 19 Field Description Part identifier for ADXRS290 Date code Pin 1 and factory lot code identifiers Data Sheet ADXRS290 8 MOSI 9 SENS AST VDD I/O VREG 2 1 ADXRS290 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale SCLK 10 11 12 13 14 18 VS 17 VREG 16 GND 15 GND 12636-003 MISO 3 VS 7 4 GND CS 5 CP 6 SYNC/ASEL PDMY PDMX PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration (Top View) Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 Mnemonic VREG VDD I/O AST SENS PDMX PDMY CS MISO (SDO) MOSI (SDI) SCLK SYNC/ASEL 12 CP 13, 15, 16 14 17 18 GND VS VREG VS Description Digital Mode Analog Evaluation Mode Regulator Output. Connect a 1 F capacitor to this pin. Regulator Output. Connect a 1 F capacitor to this pin. Digital Interface Supply Voltage. Digital Interface Supply Voltage. This pin is internally pulled to ground. Self Test. This pin is internally pulled to ground. Sensitivity Select. This pin is internally pulled to ground. Pulse-Density Modulation (PDM) XOUT. This pin is internally pulled to ground. PDM YOUT. Chip Select. Active low. Chip Select. Active low. Serial Data Out. Serial Data Out. Serial Data In. Serial Data In. Serial Communications Clock. Serial Communications Clock. Analog Enable (ASEL). Data Ready Out (SYNC). Connect this pin to ground if it is not used. Charge Pump Output. Connect a 1 F capacitor (rated Charge Pump Output. Connect a 1 F capacitor (rated for 50 V) to this pin. for 50 V) to this pin. Ground. Connect to ground. Ground. Connect to ground. Analog Supply Voltage. Analog Supply Voltage. Regulator Output. Connect a 1 F capacitor to this pin. Regulator Output. Connect a 1 F capacitor to this pin. Analog Supply Voltage. Analog Supply Voltage. Rev. A | Page 5 of 19 ADXRS290 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 70 40 60 35 PERCENT OF POPULATION (%) 50 40 30 20 10 30 25 20 15 10 5 -500 -400 -300 -200 -100 0 100 200 300 400 500 X-AXIS OFFSET (LSB) 0 12636-004 0 -500 -400 -300 -200 -100 0 100 200 300 400 500 Y-AXIS OFFSET (LSB) Figure 4. X-Axis Offset at 25C 12636-007 PERCENT OF POPULATION (%) N > 240 for all typical performance characteristics plots, unless otherwise noted. Figure 7. Y-Axis Offset at 25C 400 1500 300 1000 500 OFFSET (LSB) OFFSET (LSB) 200 100 0 -100 0 -500 -200 -1000 75 100 TEMPERATURE (C) -1500 -50 20 20 18 Figure 9. Y-Axis Sensitivity at 25C Rev. A | Page 6 of 19 220 218 216 214 12636-009 Y-AXIS SENSITIVITY (LSB//s) Figure 6. X-Axis Sensitivity at 25C 212 210 206 208 220 12636-006 218 216 214 212 210 208 206 204 202 200 198 196 0 194 0 192 2 190 2 204 4 202 4 6 198 6 8 200 8 10 194 10 188 100 12 196 12 186 75 14 192 14 184 50 16 190 16 180 PERCENT OF POPULATION (%) 18 182 25 Figure 8. Y-Axis Offset vs. Temperature (N = 16) 22 180 PERCENT OF POPULATION (%) 0 TEMPERATURE (C) Figure 5. X-Axis Offset vs. Temperature (N = 16) X-AXIS SENSITIVITY (LSB//s) -25 188 50 186 25 184 0 182 -25 12636-005 -400 -50 12636-008 -300 ADXRS290 220 220 215 215 210 210 205 200 195 205 200 195 190 190 185 185 50 75 100 180 -50 TEMPERATURE (C) Figure 13. Y-Axis Sensitivity vs. Temperature (N = 16) 250 AVERAGE VALUE OF RATE OUTPUT (/s) 0.20 200 ANGULAR RATE (/s) 150 100 50 0 -50 -100 -150 -200 ADXRS290 REFERENCE 10 20 30 40 50 60 70 80 TIME (ms) 0.10 0.07 0.05 0.03 -0.10 30 0 20 -0.5 10 -1.0 0 -1.5 -10 0.15 (AVERAGE) (AVERAGE) (RMS) (RMS) 0.01 0 10 X-AXIS Y-AXIS NOISE SPECTRAL DENSITY (/s/Hz) 0.5 0.10 X OUTPUT Y OUTPUT X OUTPUT Y OUTPUT -0.15 0.02 0.1 INPUT ACCELERATION (g) 40 0.05 0.04 -0.05 Figure 14. Response to 10 g Sine Vibration Along the Z-Axis (Out-of-Plane), HPF = Off and LPF = 480 Hz 1.0 0 0.05 FREQUENCY (kHz) 50 -2.0 0.06 0 -20 0.20 TIME (Seconds) 12636-012 RATE OUTPUT (/s) 0.08 60 X-AXIS Y-AXIS INPUT REFERENCE 0.09 0.15 1 Figure 11. Rate Output Saturation Behavior 2.0 0.10 -0.20 12636-011 -250 0 100 75 TEMPERATURE (C) Figure 10. X-Axis Sensitivity vs. Temperature (N = 16) 1.5 50 25 0 -25 RMS VALUE OF RATE OUTPUT (/s) 25 12636-014 0 Figure 12. Response to 50 g, 10 ms Half-Sine Shock Along the Z-Axis (Out-of-Plane), HPF = Off and LPF = 480 Hz 0.01 0.001 0.0001 0.00001 0.1 1 10 100 1k FREQUENCY (Hz) Figure 15. Typical Noise Spectral Density Rev. A | Page 7 of 19 10k 12636-015 -25 12636-010 180 -50 12636-013 SENSITIVITY (LSB//s) SENSITIVITY (LSB//s) Data Sheet ADXRS290 Data Sheet 0 200 X-AXIS Y-AXIS -5 PHASE DELAY (Degrees) 50 0 -50 -100 -10 -15 -20 -25 LPF = 80Hz LPF = 160Hz LPF = 320Hz -30 -150 0 10 20 40 30 50 60 70 80 90 100 TIME (ms) -35 12636-017 -200 0 50 Figure 19. Low-Pass Filter Phase Delay 0.5 1000 0.4 NONLINEARITY (% OF FULL-SCALE) 1200 800 600 400 200 0 -200 -400 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 0 -25 25 50 75 100 AMBIENT TEMPERATURE (C) -0.5 -125 -75 -25 25 75 12636-022 -0.4 -600 -50 12636-023 TEMPERATURE SENSOR OUTPUT (LSB) 40 INPUT FREQUENCY (Hz) Figure 16. Start-Up Time (Standby to Measurement Mode) 125 ANGULAR RATE (/s) Figure 17. Temperature Sensor Output vs. Ambient Temperature (N = 16) Figure 20. Rate Output Nonlinearity (N = 15) 3.0 50 LPF = 80Hz LPF = 160Hz LPF = 320Hz 45 PERCENT OF POPULATION (%) 2.5 2.0 1.5 1.0 0.5 40 35 30 25 20 15 10 5 0 0 10 20 30 40 INPUT FREQUENCY (Hz) 50 12636-021 GROUP DELAY (ms) 30 20 10 Figure 18. Low-Pass Filter Group Delay 0 10 15 20 25 30 35 40 45 50 55 STANDBY MODE CURRENT (A) Figure 21. Standby Mode Current Consumption Rev. A | Page 8 of 19 60 12636-019 RATE OUTPUT (/s) 100 12636-020 150 Data Sheet ADXRS290 50 40 35 30 25 20 15 10 5 0 6.5 6.6 6.7 6.8 6.9 7.0 7.1 7.2 7.3 7.4 MEASUREMENT MODE CURRENT (mA) 7.5 12636-024 PERCENT OF POPULATION (%) 45 Figure 22. Measurement Mode Current Consumption Rev. A | Page 9 of 19 ADXRS290 Data Sheet THEORY OF OPERATION The ADXRS290 is designed to sense x-axis and y-axis (roll and pitch) angular rate. The ADXRS290 operates on the principle of a vibratory rate gyroscope. Figure 23 presents a simplified illustration of one of four, coupled polysilicon sensing structures. Each sensing structure contains a resonating disk that is electrostatically driven to resonance, which produces the necessary rotating velocity element needed to generate a Coriolis torque when experiencing angular rate. The resonator requires 31 V (typical) for operation. Because only 5 V is typically available in most applications, a switching regulator is included on-chip. An external 1 F capacitor rated for 50 V is required for proper operation of the charge pump circuit. X-AXIS Y-AXIS Figure 23. Simplified Gyroscope Sensing Structure 12636-025 X Y When the sensing structure is exposed to an angular rate, the resulting Coriolis torque drives each of the disks into a tilting motion, which is sensed by plates under the disk. The disk and plate form a capacitive pickoff structure that senses angular rate. The resulting signal is fed to a series of gain and demodulation stages that produce the electrical rate signal output. The sensor design rejects linear and angular acceleration because external g-forces appear as common-mode signals that are removed by the fully differential architecture of the ADXRS290. After demodulation and analog-to-digital conversion, the rate signal is filtered using a single-pole band-pass filter. The highpass and low-pass poles of this filter are programmable via the digital interface. Rev. A | Page 10 of 19 Data Sheet ADXRS290 APPLICATIONS INFORMATION APPLICATION CIRCUIT POWER SEQUENCING The ADXRS290 application circuit is shown in Figure 24. The primary communications port is the 4-wire SPI interface. For this device, external pull-up/pull-down resistors are not required for the SPI interface, and these pins can be connected directly to the system microcontroller. Four capacitors are required for proper operation of the device. For optimum device performance, separate the capacitors placed on the VS, VDD I/O, VREG, and CP pins. The interface voltage level is set with the interface supply voltage VDD I/O, which must be present to ensure that the ADXRS290 does not create a conflict on the communications bus. For singlesupply operation, VDD I/O can be the same as the main supply (VS). Conversely, in a dual-supply application, VDD I/O can differ from VS to accommodate the desired interface voltage. When VS is applied, the device enters standby state, where power consumption is minimized, and the device waits for VDD I/O to be applied and for a command to enter measurement mode. Measurement mode is activated by setting Bit B1 in Register 0x10 (POWER_CTL). Clear this bit to return the device to a standby state. 2.7V TO 5.25V VREG VDD I/O CI/O 1F CREG 1F CS 1F In standby mode, the current consumption is reduced to 80 A (typical). In standby mode, only single-address SPI transactions are performed, which includes reading from or writing to a single register, but does not include writing to or reading from several registers in one command. In standby mode, the gyroscope does not respond to rate outputs. Transition time to measurement mode where offsets settle to within 1/s of the final value is <100 ms. 15 GND GND 16 17 18 VS VREG 2.7V TO 5.25V 1 14 VS GND 2 ADXRS290 13 AST 3 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale 12 SENS 4 11 PDMX 5 10 CP CCP 1F 50V SYNC/ASEL SETTING BANDWIDTH 9 SPI BUS 12636-026 MOSI 8 MISO CS PDMY 6 7 SCLK Figure 24. Recommended Application Circuit POWER SUPPLY DECOUPLING In many applications, bypass capacitors at VS, VREG, and VDD I/O (as shown in Figure 24) placed close to the ADXRS290 supply pins adequately decouple the gyroscope from noise on the power supply. However, in applications where noise is present at the internal clock frequency, or any harmonic thereof, additional care in power supply bypassing is required because this noise may cause errors in angular rate measurement. If additional decoupling is necessary, a 10 resistor or ferrite bead in series with VS and an additional larger bypass capacitor (2.2 F or greater) at VS may be helpful. Ensure that the connection from the ADXRS290 ground to the power supply ground be low impedance because noise transmitted through ground has an effect similar to noise transmitted through VS. The ADXRS290 includes an internal configurable band-pass filter. Both the high-pass and low-pass poles of the filter are adjustable, as shown in Table 5 and Table 6. The filter frequency response is shown in Figure 25 and Figure 26. The group delay of the wideband filter option is less than 0.5 ms (see Figure 18 for filter delay). At power-up, the default condition for the filters is dc for the high-pass filter and 480 Hz for the low-pass filter. Table 5. Low-Pass Filter Pole Locations Bit 2 Filter 0 0 0 0 1 1 1 1 Bit 1 Filter 0 0 1 1 0 0 1 1 Bit 0 Filter 0 1 0 1 0 1 0 1 Frequency (Hz) 480 (Default) 320 160 80 56.6 40 28.3 20 Table 6. High-Pass Filter Pole Locations Bit 7 Filter 0 Bit 6 Filter 0 Bit 5 Filter 0 Bit 4 Filter 0 0 0 0 0 0 0 0 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 Rev. A | Page 11 of 19 Frequency (Hz) All pass (default) 0.011 0.022 0.044 0.087 0.175 0.350 0.700 1.400 2.800 11.30 ADXRS290 Data Sheet ANALOG EVALUATION MODE 1.2 0.8 0.6 0.011Hz 0.022Hz 0.044Hz 0.087Hz 0.175Hz 0.35Hz 0.7Hz 1.4Hz 2.8Hz 11.3Hz 0.4 0.2 0 0.0001 0.001 0.01 0.1 1 10 100 1k FREQUENCY (Hz) 12636-027 NORMALIZED MAGNITUDE 1.0 An analog output evaluation mode has been incorporated in the ADXRS290. In this mode, the output of the ADXRS290 is formatted as a pulse density modulated data stream at a frequency of 144 kHz via the PDMX and PDMY pins. The PDMX and PDMY pins high and low voltage levels are ratiometric to VDD I/O. This signal can be decoded into an analog baseband using a low-pass filter. Higher order filters allow for greater attenuation of the 144 kHz switching noise while maintaining the integrity of the baseband signal. A recommended application circuit with a third-order Sallen-Key filter is shown in Figure 27. Figure 28 shows the recommended low-pass filter for demodulating the PDM output in analog mode operation. 2.7V TO 5.25V 0.8 VREG 2.7V TO 5.25V 0.6 VDD I/O CI/O 1F 0.4 CREG 1F SENS GND 15 GND CS 1F 1 14 VS GND 2 ADXRS290 13 3 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale 12 AST 0.2 16 18 NORMALIZED MAGNITUDE 1.0 VS 20Hz 28.3Hz 40Hz 56.6Hz 80Hz 160Hz 320Hz 480Hz 17 1.2 VREG Figure 25. High-Pass Filter Frequency Response CP 4 11 5 10 CCP 1F 50V SYNC/ASEL Offset Preservation in the High-Pass Filter 9 8 LOW-PASS FILTER Figure 27. Recommended Application Circuit for Analog Mode Operation +5V 47k 0.1F PDMX OR PDMY 24k 0.01F 30.1k 0.01F ANALOG BASEBAND SIGNAL 30.1k 5100pF 0.1F -5V 12636-030 One of the functions of the high-pass filter is to remove offset. The high-pass filter effectively estimates the offset and subtracts it from the output. When the high-pass filter settings are changed, the output remains unchanged; the filter preserves its estimate of offset. The high-pass filter can be set to the fast settling option, allowed to converge to zero offset, and then set to any other high-pass filter option while maintaining near zero offset. Exiting measurement mode clears the preserved offset. 12636-029 Figure 26. Low-Pass Filter Frequency Response SCLK MOSI FREQUENCY (Hz) 10k MISO 1k 7 100 CS 10 6 1 PDMY 0 12636-028 PDMX Figure 28. Recommended Low-Pass Filter for Demodulating the PDM Output in Analog Mode Operation In analog mode, the band-pass filter is disabled and the device cannot be placed in standby mode. SPI communication to the ADXRS290 is available but not required. Sensitivity in this mode is 5 mV//s. Rev. A | Page 12 of 19 Data Sheet ADXRS290 Mount the ADXRS290 on the printed circuit board (PCB) in a location close to a hard mounting point of the PCB to the case. Mounting the ADXRS290 at an unsupported PCB location, as shown in Figure 29, may result in large, apparent measurement errors due to undamped PCB vibration. Locating the ADXRS290 near a hard mounting point ensures that any PCB vibration at the device is above the resonant frequencies of the MEMS elements and, therefore, effectively invisible to the device. In applications where the gyroscope may be subjected to large shock events or excessive vibration, consider the use of damping materials (such as Polyurethane) at the mounting locations to dampen the vibration. A thicker PCB can also help to reduce the effect of system resonance on the performance of the ADXRS290. Rev. A | Page 13 of 19 BAD PLACEMENT GOOD PLACEMENT MOUNTING POINTS 12636-031 MECHANICAL CONSIDERATIONS FOR MOUNTING Figure 29. Two Examples of Incorrectly Mounted Gyroscopes ADXRS290 Data Sheet SERIAL COMMUNICATIONS data can be sampled. Unless the ADXRS290 is in standby mode, multiple bytes can be written to or read from in a single transmission. In standby mode, only single register transactions are supported. Deasserting the CS pin is necessary between commands for transmissions with multiple commands. For SPI operation greater than 1 MHz, it is necessary to deassert the CS pin to ensure a total delay of 10 s between the register addressing portion of the transmission. The delay is required to allow settling of the internal voltage controlled oscillator. For SPI operation of 1 MHz or lower, the communication rate is low enough to ensure a sufficient delay between register writes. In digital mode, the ADXRS290 communicates via 4-wire SPI and operates as a slave. Ignore data transmitted from the ADXRS290 to the master device during writes to the ADXRS290. Wire the ADXRS290 for SPI communication as shown in the connection diagram in Figure 30. The maximum SPI clock speed is 5 MHz, with 12 pF maximum loading. The timing scheme follows clock phase (CPHA) = clock polarity (CPOL) = 1. ADXRS290 SS SDI MOSI SDO MISO SCLK SCLK 12636-032 PROCESSOR CS SPI read and write operations are completed in 16 or more clock cycles, as shown in Figure 31. Setting the R/W bit to 1 indicates a read operation and setting it to 0 indicates a write operation. For R/W = 0 (write), [D7:D0] data is written to the device in the register map based on the [A6:A0] addresses. For R/W = 1 (read), [D7:D0] is the data read by the external master device based on the [A6:A0] addresses. Examples of SPI write and read are shown in Figure 32 and Figure 33. Figure 30. 4-Wire SPI Connection CS is the serial port enable line and is controlled by the SPI master. It must go low at the start of transmissions and high at the end as shown in Figure 31. SCLK is the serial port clock and is supplied by the SPI master. It is stopped high when CS is high, during periods of no transmission. At the rising edge of SCLK, tSCLK tDELAY tS tM tQUIET CS SDI R/W SDO A6 A5 tSETUP tHOLD A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D4 D0 D7 D6 D5 D4 D3 D2 D1 D0 tSDO Figure 31. SPI Timing Diagram Table 7. SPI Timing Specifications (TA = 25C, VS = VDD I/O = 2.7 V) Parameter fSCLK tSCLK tDELAY tQUIET tS tM tSDO tSETUP tHOLD Limit 5 200 200 200 0.4 x tSCLK 0.4 x tSCLK 20 10 10 Unit MHz max ns min ns min ns min ns min ns min ns max ns min ns min Description SPI clock frequency 1/(SPI clock frequency), mark/space ratio for the SCLK input is 40/60 to 60/40 CS falling edge to SCLK falling edge SCLK rising edge to CS rising edge SCLK low pulse width (space) SCLK high pulse width (mark) SCLK falling edge to SDO transition SDI valid before SCLK rising edge SDI valid after SCLK rising edge Rev. A | Page 14 of 19 12636-033 SCLK Data Sheet ADXRS290 T CS 1 CS MOSI MOSI 2 2 MISO MISO 3 3 SCLK SCLK 4 CH1 5.00V CH3 5.00V CH2 5.00V CH4 5.00V M4.00s T 7.400s A CH1 1.8V 12636-034 4 Figure 32. SPI Write Example: Writing to Register 0x10 (Write 0x02 to Enter Measurement Mode) CH1 5.00V CH3 5.00V CH2 5.00V CH4 5.00V M4.00s T 7.400s A CH1 1.8V 12636-035 1 T Figure 33. SPI Read Example: Reading Register 0x01 (Output = 0x1D) Rev. A | Page 15 of 19 ADXRS290 Data Sheet REGISTER MAP Table 8. Register No. (Hex) 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x012 Name ADI_ID MEMS_ID DEV_ID REV_ID SN0 SN1 SN2 SN3 DATAX0 DATAX1 DATAY0 DATAY1 TEMP0 TEMP1 Reserved Reserved POWER_CTL Filter DATA_READY Bit 7 Bit 6 Bit 5 Bit 4 0 0 0 0 0 0 0 0 HPF[3:0] 0 0 0 0 Bit 3 Bit 2 Bit 1 Bit 0 ADI_ID[7:0] MEMS_ID[7:0] DEV_ID[7:0] REV_ID[7:0] SN[7:0] SN[15:8] SN[23:16] SN[31:24] X0[7:0] X1[15:8] Y0[7:0] Y1[15:8] TEMP[7:0] TEMP[11:8] Reserved[7:0] Reserved[7:0] 0 0 Measurement TSM 0 LPF[2:0] 0 0 Sync[1:0] Rev. A | Page 16 of 19 Reset 10101101 00011101 10010010 00001001 SN[7:0] SN[15:8] SN[23:16] SN[31:24] 00000000 00000000 00000000 00000000 00000000 00000000 00000000 00000011 00000000 00000000 00000000 R/W R R R R R R R R R R R R R R R R R/W R/W R/W Data Sheet ADXRS290 REGISTER DESCRIPTIONS This section describes the functions of the ADXRS290 registers. The ADXRS290 powers up with default register values as shown in the reset column of Table 8. TEMPERATURE DATA ANALOG DEVICES IDENTIFIER These two bytes hold temperature output data written in twos complement. Register 0x0C contains Bits[7:0] and Register 0x0D contains Bits[11:8] of the 12-bit temperature reading. When concurrent temperature and output data points are desired, perform a multiple byte read of the TEMP1:TEMP0, DATAX1:DATAX0, and DATAY1:DATAY0 registers. The scale factor of the temperature reading is 10 LSB/C, and 0 codes is equivalent to 0C. Table 9. Register 0x00, ADI_ID (Read Only) Bit 7 1 Bit 6 0 Bit 5 1 Bit 4 0 Bit 3 1 Bit 2 1 Bit 1 0 Bit 0 1 Bit 1 0 Bit 0 1 The ADI_ID register holds a fixed code 0xAD. MEMS IDENTIFIER Table 10. Register 0x01, MEMS_ID (Read Only) Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 1 Bit 3 1 Bit 2 1 DEVICE IDENTIFIER Bit 5 0 Table 13. Register 0x10, POWER_CTL (Read/Write) Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 Measurement Bit 0 TSM TSM Bit Table 11. Register 0x02, DEV_ID (Read Only) Bit 6 0 POWER CONTROL Bit 7 0 The MEMS_ID register holds a fixed code of 0x1D. Bit 7 1 Register 0x0C to Register 0x0D: TEMP0 and TEMP1 (Read Only) Bit 4 1 Bit 3 0 Bit 2 0 Bit 1 1 Bit 0 0 The TSM bit controls the temperature sensor. The default value of this bit is 0 (temperature sensor off) and setting this bit to 1 enables the temperature sensor. The DEV_ID register holds a fixed code of 0x92. Measurement Bit SILICON REVISION NUMBER To set the ADXRS290 to standby mode, set the measurement bit to 0. To set the ADXRS290 to measurement mode, set this bit to 1. Table 12. Register 0x03, REV_ID (Read Only) Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 1 Bit 2 0 Bit 1 0 Bit 0 1 The REV_ID register holds a revision ID code that increments with each subsequent silicon revision. The ADXRS290 powers up in standby mode with a current consumption of 80 A (typical). BAND-PASS FILTER Table 14. Register 0x11, Filter (Read/Write) SERIAL NUMBER (SNx) Bit 7 Bit 6 Bit 5 HPF[3:0] Bit 4 Bit 3 0 Bit 2 Bit 1 Bit 0 LPF[2:0] These four bytes (Register 0x04 to Register 0x07) store the unique electronic serial number for the part. LPF Bits RATE OUTPUT DATA The three LPF bits define the low-pass filter pole (see Table 5). Register 0x08 to Register 0x0B: DATAX0, DATAX1, DATAY0, and DATAY1 (Read Only) HPF Bits These four bytes (Register 0x08 to Register 0x0B) hold the rate output data for each axis. Register 0x08 and Register 0x09 hold the output data for the x-axis, and Register 0x0A and Register 0x0B hold the output data for the y-axis. The output data is written in twos complement. In each two byte set, DATAx0 is the least significant byte, and DATAx1 is the most significant byte, where x represents the x-axis or the y-axis. To prevent a change in data between reads of the sequential registers, perform a multiple byte read of all rate output data registers. DATA READY The four HPF bits define the high-pass filter pole (see Table 6). Table 15. Register 0x12, DATA_READY (Read/Write) Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 Bit 0 Sync[1:0] Sync Bits Set the sync bits to 01 to generate a data ready interrupt at the SYNC/ASEL pin when new data becomes available. Table 16. SYNC Pin Functions Bit 1 X 0 Rev. A | Page 17 of 19 Bit 0 0 1 Description Read for analog enable Data ready out, high until read ADXRS290 Data Sheet RECOMMENDED SOLDERING PROFILE Figure 34 and Table 17 provide details about the recommended soldering profile. CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 12636-036 TEMPERATURE RAMP-UP TL t25C TO PEAK TIME Figure 34. Recommended Soldering Profile Table 17. Recommended Soldering Profile1, 2 Profile Feature Average Ramp Rate from Liquid Temperature (TL) to Peak Temperature (TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time from TSMIN to TSMAX (tS) TSMAX to TL Ramp-Up Rate Liquid Temperature (TL) Time Maintained Above TL (tL) Peak Temperature (TP) Time of Actual TP - 5C (tP) Ramp-Down Rate Time 25C to Peak Temperature 1 2 Sn63/Pb37 3C/sec maximum Condition Pb-Free 3C/sec maximum 100C 150C 60 seconds to 120 seconds 3C/second maximum 183C 60 seconds to 150 seconds 240 + 0/-5C 10 seconds to 30 seconds 6C/sec maximum 6 minutes maximum 150C 200C 60 seconds to 180 seconds 3C/second maximum 217C 60 seconds to 150 seconds 260 + 0/-5C 20 seconds to 40 seconds 6C/sec maximum 8 minutes maximum Based on JEDEC Standard J-STD-020D.1. For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used. PCB FOOTPRINT PATTERN 2.70mm 0.25mm TYP 4.00mm 5.66mm 0.40mm TYP 4.35mm 12636-037 0.60mm TYP Figure 35. PCB Footprint Pattern and Dimensions Rev. A | Page 18 of 19 Data Sheet ADXRS290 OUTLINE DIMENSIONS 5.90 5.80 5.70 R 0.15 REF 5.36 REF 0.35 REF PIN 1 LAND CORNER 4.60 4.50 4.40 4.06 REF PIN 1 LAND INDICATOR 1.03 BSC 0.45 x 0.30 (PINS 6-9, 15-18) VENT HOLE 0.095 REF 1 5 18 6 0.35 REF 0.65 BSC 9 15 14 BOTTOM VIEW TOP VIEW 0.30 x 0.45 (PINS 1-5, 10-14) 1.30 1.20 1.10 SIDE VIEW 10 1.28 REF 1.60 REF 0.65 BSC 04-26-2012-A R 0.68 REF 0.70 BSC 0.24 REF Figure 36. 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 5.80 mm x 4.50 mm Body (CE-18-2) Dimensions shown in millimeters ORDERING GUIDE Model1 ADXRS290BCEZ ADXRS290BCEZ-RL ADXRS290BCEZ-RL7 EVAL-ADXRS290Z EVAL-ADXRS290Z-M EVAL-ADXRS290Z-S EVAL-ADXRS290Z-M2 EVAL-ADXRS290Z-S2 1 Temperature Range -25C to +85C -25C to +85C -25C to +85C Package Description 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] Breakout Evaluation Board Analog Devices Inertial Sensor Evaluation System, which includes a socket version of the satellite (ADXRS290-S) board ADXRS290 Satellite, Standalone Socket Version Analog Devices Inertial Sensor Evaluation System, which includes a soldered version of the satellite (ADXRS290-S2) board ADXRS290 Satellite, Standalone Soldered Version Z = RoHS Compliant Part. (c)2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12636-0-12/14(A) Rev. A | Page 19 of 19 Package Option CE-18-2 CE-18-2 CE-18-2 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Analog Devices Inc.: ADXRS290BCEZ EVAL-ADXRS290Z-S EVAL-ADXRS290Z-M ADXRS290BCEZ-RL7 ADXRS290BCEZ-RL EVALADXRS290Z-S2 EVAL-ADXRS290Z-M2