P6 VNQ860 / VNQ860SP (R) QUAD CHANNEL HIGH SIDE DRIVER TYPE VNQ860 RDS(on) (*) IOUT VCC 270m 0.25A 36V VNQ860SP (*) Per each channel CMOS COMPATIBLE I/Os UNDERVOLTAGE & OVERVOLTAGE nSHUT- DOWN SHORTED LOAD PROTECTION THERMAL SHUTDOWN VERY LOW STAND-BY CURRENT PROTECTION AGAINST LOSS OF GROUND 10 DESCRIPTION The VNQ860, VNQ860SP are monolithic devices made using| STMicroelectronics VIPower M0-3 Technology, intended for driving any kind load with one side connected to ground. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. This device is ) s ( ct BLOCK DIAGRAM V CC o r P e CLAMP GND du t e l o I/O 1 s b O 1 SO-20 ORDER CODES PACKAGE SO-20 PowerSO-10 ) s t( PowerSO-10TM TUBE od VNQ860 r P e t le uc T&R VNQ86013TR VNQ860SP VNQ860SP13TR especially suitable for industrial applications in norms conformity with IEC1131 (Programmable Controllers International Standard). o s b O - VCC OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION Power CLAMP OVERTEMP I/O 2 CURRENT LIMITER OUTPUT1 Power CLAMP OVERTEMP I/O 3 CURRENT LIMITER OUTPUT2 LOGIC Power CLAMP I/O 4 OVERTEMP CURRENT LIMITER OUTPUT3 STATUS Power CLAMP OVERTEMP CURRENT LIMITER OUTPUT4 Rev. 1 July 2004 1/13 1 VNQ860 / VNQ860SP ABSOLUTE MAXIMUM RATING Symbol Value PowerSO-10 41 - 0.3 - 200 Internally Limited -2 +/- 10 -3/+VCC + VCC 2000 16 90 Internally Limited - 40 to 150 - 55 to 150 Parameter VCC - VCC - IGND IOUT - IOUT IIN VIN VSTAT VESD Ptot Tj Tc Tstg Unit SO-20 DC supply voltage Reverse DC supply voltage DC reverse ground pin current DC output current Reverse DC output current DC Input current Input voltage range DC Status voltage Electrostatic discharge (R=1.5 K; C=100 pF) Power dissipation TC=25 C Junction operating temperature Case operating temperature Storage temperature V V mA A A mA V V V W C C C ) s t( CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C. PINS 1 I/O 4 20 GROUND OUTPUT 4 I/O 3 OUTPUT 3 N.C. OUTPUT 3 I/O 3 VCC VCC GND VCC VCC I/O 4 OUTPUT 4 6 7 e t le 8 9 so VCC VCC OUTPUT 1 N.C. I/O 1 OUTPUT 2 STATUS (s) I/O 2 11 10 b O - Floating OUTPUT 2 I/O 2 STATUS 2 I/O 1 1 OUTPUT 1 TAB Status N.C. Output X X X To Ground d o r P e 5 4 3 VCC Connection / Pin t c u o r P 10 VCC VCC c u d X Input X Through 10K resistor CURRENT AND VOLTAGE CONVENTIONS t e l o bs O IS VCC IOUT1 I/O1 VI/O1 OUTPUT 1 II/O2 OUTPUT 2 II/O3 I/O 3 VI/O3 OUTPUT 3 I/O 4 IOUT4 ISTAT VSTAT OUTPUT 4 STATUS GND (*) VFn = VCCn - VOUTn during reverse battery condition 2/13 1 VOUT2 IOUT3 II/O4 VI/O4 VOUT1 IOUT2 I/O2 VI/O2 VCC VF1 (*) II/O1 IGND VOUT4 VOUT3 VNQ860 / VNQ860SP THERMAL DATA Symbol Rthj-amb Rthj-case Rthj-pin (1) (2) Parameter Thermal resistance junction-pins (MAX) (MAX) Thermal resistance junction-ambient Thermal resistance junction-case Value PowerSO-10 52 (1) 37 (2) 1.4 SO-20 8 58 (MAX) - Unit o C/W oC/W oC/W oC/W When mounted on FR4 printed circuit board with 0.5cm2 of copper area (at least 35 thick) connected to all VCC pins. When mounted on FR4 printed circuit board with 6cm2 of copper area (at least 35 thick) connected to all VCC pins. ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40oC<Tj<150oC; unless otherwise specified) POWER Symbol VCC VUSD VOV RON Parameter Operating supply voltage Undervoltage shut-down Overvoltage shut-down On state resistance ILGND Output current IL(off) Off state output current Off state output leakage so ) s ( ct u d o tD(off) Turn-off delay time r P e (dVOUT /dt)on Turn-on voltage slope (dVOUT /dt)off Turn-off voltage slope b O - VIN=VGND=0V; VCC=24V; VOUT =10V; Tamb=25oC Parameter Turn-on delay time 0 VIN=VGND=0V; VCC=VOUT=24V; Tamb=25oC SWITCHING (V CC=24V) (Per channel) tD(on) 5 Typ Max 36 5.5 48 270 Unit V V V m 540 120 m A 10 mA 1 mA 10 A 240 A 100 A Max Unit uc d o r P e let VOUT =0V VIN=VOUT=0V current t e l o 4 42 70 On state (all channels on) VCC-VSTAT=VIN=VGND=24V current Off state output leakage Symbol Typ IOUT =0.25A Off state; VCC=24V; Tc=25oC Supply current IOUTleak Min 5.5 3 36 IOUT =0.25A; Tj=25oC (per channel) IS IOUTleak Test Conditions ) s t( Test Conditions RL=96 from VIN rising edge to VOUT =2.4V RL=96 from VIN falling edge to VOUT=21.6V RL=96 from VOUT =2.4V to 19.2V RL=96 from VOUT =21.6V to 2.4V Min Test Conditions Min 0.35 7 Typ 0.7 15 Max 1.1 Unit A o C 150 175 200 oC 10 s 40 s 0.75 0.25 V/s V/s PROTECTIONS (Per channel) O bs Symbol Ilim T(hyst) TTSD TR Vdemag Parameter Current limitation Thermal hysteresis Thermal shut-down temperature Reset temperature Turn-off output clamp voltage IOUT=0.25A 135 VCC-47 VCC-52 VCC-59 o C V 3/13 1 VNQ860 / VNQ860SP ELECTRICAL CHARACTERISTICS (continued) LOGIC INPUT (Per channel) Symbol VIL IIL VIH IIH VI(hyst) IIN VOL Parameter Low level input voltage Low level input current High level input voltage High level input current Input hysteresis Voltage Input current I/O Output voltage Test Conditions Min VIN=1.25V Typ Max 1.25 200 1 Unit V A V A V A V Max 1 10 100 Unit V A pF 1 3.25 VIN=3.25V 10 0.5 VIN=VCC=36V IIN=5mA (Fault condition) STATUS PIN Symbol VSTAT ILSTAT CSTAT Parameter Status low output voltage Status leakage current Status pin input capacitance Test conditions ISTAT =5mA (Fault condition) Normal operation; VSTAT =VCC=36V Normal operation; VSTAT=5V Min Test Conditions -IOUT=0.3A; Tj=150C Min Typ VCC - OUTPUT DIODE Symbol VF Parameter Forward on Voltage TRUTH TABLE CONDITIONS Normal operation Current limitation Overtemperature ) s ( ct u d o H r P e t e l o 2 L H L H L H L Overvoltage 4/13 I/On L H L H L H L Undervoltage s b O MCOUTn e t le c u d Typ o r P ) s t( Max 0.6 OUTPUTn STATUS L H L X L H H H H L Driven low L L L L X H L L L X H H L H o s b O - Unit V VNQ860 / VNQ860SP SWITCHING CHARACTERISTICS VOUT 90% 80% (dVOUT/dt)off (dVOUT/dt)on tr tf 10% t td(on) td(off) VIN c u d t e t le Typical application schematic (s) MCOUTn d o r P e MCU o r P o s b O I/On OUTPUTn t c u MCINn t e l o ) s t( VNQ860 s b O 5/13 1 VNQ860 / VNQ860SP Figure 1: Waveforms NORMAL OPERATION VI/On VOUTn VSTAT UNDERVOLTAGE VUSDhyst VCC VUSD VI/On c u d VOUTn VSTAT undefined e t le OVERVOLTAGE VOV VCC VI/On ) s ( ct VOUTn VSTAT bs O VMCOUT VI/On IOUTn VSTAT 6/13 1 u d o r P e t e l o Tj TTSD TR o s b O - VOVhyst VCC>VUSD OVERTEMPERATURE o r P ) s t( VNQ860 / VNQ860SP PowerSO-10TM THERMAL DATA PowerSO-10TM PC Board c u d ) s t( Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2). e t le Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) ) s ( ct 55 o s b O - Tj-Tamb=50C u d o 50 o r P r P e 45 s b O t e l o40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 7/13 VNQ860 / VNQ860SP SO-20 MECHANICAL DATA mm. DIM. MIN. TYP A inch MAX. MIN. TYP. MAX. 2.65 a1 0.104 0.10 0.20 b 0.35 0.49 0.013 b1 0.23 0.32 0.009 a2 0.004 0.007 2.45 C 0.096 0.019 0.012 0.50 0.020 c1 45 (typ.) D 12.60 E 10.00 e 13.00 0.496 10.65 0.393 0.512 0.419 1.27 F 7.40 L 0.50 M 0.050 7.60 0.291 1.27 0.19 S uc d o r 0.75 8 (max.) ) s t( 0.299 0.050 0.029 P e let ) s ( ct o s b O - u d o r P e t e l o s b O 8/13 VNQ860 / VNQ860SP PowerSO-10TM MECHANICAL DATA mm. DIM. MIN. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*) inch TYP 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 MAX. MIN. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 1.80 1.10 8 8 0.047 0.031 0 2 TYP. c u d 1.27 0.050 1.25 1.20 13.80 13.85 e t le 0.50 1.20 0.80 0 2 (*) Muar only POA P013P (s) t c u 10 d o r P e H E t e l o o s b O B 0.10 A B E2 E4 1 e s b O SEATING PLANE B DETAIL "A" h A C 0.25 D = D1 = = = SEATING PLANE A F A1 A1 L DETAIL "A" 9/13 P095A o r P MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 ) s t( 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8 VNQ860 / VNQ860SP PowerSO-10TM SUGGESTED PAD LAYOUT TUBE SHIPMENT (no suffix) 14.6 - 14.9 CASABLANCA B 10.8 - 11 MUAR C 6.30 C A A 0.67 - 0.73 1 9.5 10 9 8 7 2 3 4 5 B 0.54 - 0.6 All dimensions are in mm. 1.27 Base Q.ty Bulk Q.ty Tube length ( 0.5) 6 Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 10.4 16.4 4.9 17.2 0.8 0.8 TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) e t le TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) r P e u d o s b O t e l o ) s ( ct o s b O - 600 600 330 1.5 13 20.2 24.4 60 30.4 c u d o r P ) s t( All dimensions are in mm. 24 4 24 1.5 1.5 11.5 6.5 2 All dimensions are in mm. End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed 10/13 1 VNQ860 / VNQ860SP SO-20 TUBE SHIPMENT (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) C B 40 800 532 3.5 13.8 0.6 All dimensions are in mm. A TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) e t le TAPE DIMENSIONS ) s ( ct According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) r P e u d o t e l o s b O All dimensions are in mm. 1000 1000 330 1.5 13 20.2 24.4 60 30.4 c u d ) s t( o r P o s b O - 24 4 12 1.5 1.5 11.5 6.5 2 End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed 11/13 1 VNQ860 / VNQ860SP REVISION HISTORY Date Revision Description of Changes - Minor changes. - Order Codes table insertion (page 1). - Current and voltage convention update (page 2). Jul 2004 1 - "Configuration diagram (top view) & suggested connections for unused and n.c. pins" insertion (page 2). - 6cm2 Cu condition insertion in Thermal Data table (page 3). - VCC - OUTPUT DIODE section insertion (page 4). - SO-20 Shipment Data insertion (page 11) - Revision History table insertion (page12). - Disclaimers update (page 13). c u d e t le ) s ( ct u d o r P e t e l o s b O 12/13 1 o s b O - o r P ) s t( VNQ860 / VNQ860SP c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. s b O The ST logo is a trademark of STMicroelectronics. All other names are the property of their respective owners 2004 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com 13/13