Data Sheet
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© 2011 ROHM Co., Ltd. All rights reserved.
Schottky Barrier Diode
RB521SM-40
lApplications lDimensions (Unit : mm) lLand size figure (Unit : mm)
Small current rectification
lFeatures
1)Ultra small mold type. (EMD2)
2)Low VF
3)High reliability
lConstruction
Silicon epitaxial
lStructure
lTaping specifications (Unit : mm)
lAbsolute maximum ratings (Ta=25°C)
Symbol Unit
VRM V
VRV
Io mA
IFSM A
Tj °C
Tstg °C
lElectrical characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Conditions
0.16 0.26 0.30
0.31 0.395 0.45
0.41 0.495 0.54
- 3.50 20.00
- 13.00 90.00
IF=10mA
IF=100mA
IF=200mA
Reverse current
IR
μA
VR=10V
VR=40V
Storage temperature
-55 to +150
Parameter
Forward voltage
VF
V
Average rectified forward current
200
Forward current surge peak (60Hz・1cyc)
4
Junction temperature
150
Parameter
Limits
Reverse voltage (repetitive)
45
Reverse voltage (DC)
40
ROHM : EMD2
JEITA : SC-79
JEDEC :SOD-523
dot (year week factory)
0.12±0.05
0.6±0.1
0.3±0.05
0.8±0.05
1.2±0.05
1.6±0.1
EMD2
0.8
1.7
0.6
1/3
2011.06 - Rev.A
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Data Sheet
RB521SM-40
10
100
1000
0.001 0.1 10 1000
Rth(j-a)
Rth(j-c)
Mounted on epoxy board
20
21
22
23
24
25
26
27
28
29
30
AVE:27.2pF
0
0.05
0.1
0.15
0.2
0.25
0.3
0 0.1 0.2 0.3 0.4
0
0.1
0.2
0.3
0.4
0.5
010 20 30 40
Sin(θ＝180)
D=1/2
DC
0
5
10
110 100
t
Ifsm
0
5
10
110 100
8.3ms
Ifsm
1cyc
8.3ms
0
5
10
15
20
AVE:5.60A
0
10
20
30
40
50
60
70
80
90
100
Ta=25℃
VR=40V
n=30pcs
AVE:6.86uA
470
480
490
500
510
520
Ta=25℃
IF=200mA
n=30pcs
AVE:495.2mV
1
10
100
010 20 30
0.1
1
10
100
1000
0100 200 300 400 500 600
Ta=125℃
Ta=75℃
Ta=25℃
Ta=-25℃
FORWARD VOLTAGE : VF(mV)
VF-IF CHARACTERISTICS
FORWARD CURRENT:IF(mA)
REVERSE CURRENT:IR(uA)
REVERSE VOLTAGE : VR(V)
VR-IR CHARACTERISTICS
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
REVERSE VOLTAGE : VR(V)
VR-Ct CHARACTERISTICS
VF DISPERSION MAP
FORWARD VOLTAGE:VF(mV)
REVERSE CURRENT:VR(uA)
IR DISPERSION MAP
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
Ct DISPERSION MAP
IFSM DISPERSION MAP
PEAK SURGE
FORWARD CURRENT:IFSM(A)
PEAK SURGE
FORWARD CURRENT:I
FSM
(A)
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
PEAK SURGE
FORWARD CURRENT:I
FSM
(A)
TIME:t(ms)
IFSM-t CHARACTERISTICS
TIME:(s)
Rth-t CHARACTERISTICS
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
FORWARD POWER
DISSIPATION:Pf(W)
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
Io-Pｆ CHARACTERISTICS
REVERSE POWER
DISSIPATION : P
R
(w)
REVERSE VOLTAGE
：
VR(V)
VR-PR CHARACTERISTICS
Ta=25℃
f=1MHz
VR=0V
n=10pcs
f=1MHz
8.3ms
Ifsm 1cyc
DC
D=1/2
Sin(θ＝180)
0.01
0.1
1
10
100
1000
10000
010 20 30 40
Ta=125℃
Ta=75℃
Ta=25℃
Ta=-25℃
2/3 2011.06 - Rev.A
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Data Sheet
RB521SM-40
0
0.1
0.2
0.3
0.4
0.5
025 50 75 100 125 150
0
0.1
0.2
0.3
0.4
0.5
025 50 75 100 125 150
Sin(θ＝180)
D=1/2
DC
AMBIENT TEMPERATURE
：
Ta(
℃
)
DERATING CURVE (Io-Ta)
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
CASE TEMPARATURE：Tc(℃)
DERATING CURVE (Io-Tc)
Sin(θ＝180)
D=1/2
DC
T
Tj=150℃
D=t/T
t
VR
Io
VR=20V
0A
0V
T
Tj=150℃
D=t/T
t
VR
Io
VR=20V
0A
0V
3/3 2011.06 - Rev.A
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
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[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
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[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation (P d) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specificati on.
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this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the pl aces where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
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