LM809
RESET RESET
INPUT
GND GND
VCC VCC
VCC
µP
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM809
,
LM810
SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016
LM809/LM810 3-Pin Microprocessor Reset Circuits
1
1 Features
1• Precision Monitoring of Supply Voltages
– Available Threshold Options:
2.63 V, 2.93 V, 3.08 V, 4.38 V, 4.63 V
• Superior Upgrade to MAX809 and MAX810
• Fully Specified Over Temperature
• 140-ms Minimum Power-On Reset Pulse Width,
240-ms Typical
– Active-Low RESET Output (LM809)
– Active-High RESET Output (LM810)
• Ensured RESET Output Valid for VCC ≥1 V
• Low Supply Current, 15-µA Typical
• Power Supply Transient Immunity
2 Applications
• Factory Automation
• Building Automation
• Programmable Logic Control
• Renewable Energy
• Microprocessor Systems
• Computers
• Controllers
• Intelligent Instruments
• Portable/Battery-Powered Equipment
• Automotive
3 Description
The LM809 and LM810 microprocessors supervisory
circuits can be used to monitor the power supplies in
microprocessor and digital systems. They provide a
reset to the microprocessor during power-up, power-
down and brown-out conditions.
The function of the LM809 and LM810 are to monitor
the VCC supply voltage, and assert a reset signal
whenever this voltage declines below the factory-
programmed reset threshold. The reset signal
remains asserted for 240 ms after VCC rises above
the threshold. The LM809 has an active-low RESET
output, while the LM810 has an active-high RESET
output.
Seven standard reset voltage options are available,
suitable for monitoring 5-V, 3.3-V, and 3-V supply
voltages.
With a low supply current of only 15 µA, the LM809
and LM810 are ideal for use in portable equipment.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM809, LM810 SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application for Microprocessor Reset Circuit
2
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,
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 7
7.1 Overview................................................................... 7
7.2 Functional Block Diagram......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 9
8 Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application.................................................. 10
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support................. 12
11.1 Related Links ........................................................ 12
11.2 Community Resources.......................................... 12
11.3 Trademarks........................................................... 12
11.4 Electrostatic Discharge Caution............................ 12
11.5 Glossary................................................................ 12
12 Mechanical, Packaging, and Orderable
Information........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (May 2013) to Revision E Page
• Removed the SON package................................................................................................................................................... 1
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
1GND
2RESET
3 VCC
1GND
2RESET
3 VCC!
3
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5 Pin Configuration and Functions
LM809
DBZ Package
3-Pin SOT-23
Top View
LM810
DBZ Package
3-Pin SOT-23
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
LM809 LM810
RESET 2 — O Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms
after VCC rises above the reset threshold.
RESET — 2 O Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms
after VCC rises above the reset threshold.
VCC 3 3 I Supply voltage
GND 1 1 — Ground reference
4
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,
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
see (1)(2)
MIN MAX UNIT
Input supply voltage VCC –0.3 6 V
Output voltage RESET, RESET –0.3 VCC + 0.3 V
Input current VCC 20 mA
Output current RESET, RESET 20 mA
Rate of rise VCC 100 V/µs
Continuous power dissipation 320 mW
Lead temperature (soldering, 10 s) 300 °C
Ambient temperature range, TA–40 105 °C
Maximum junction temperature, TJ(MAX) 125 °C
Storage temperature, Tstg –65 160 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
VCC Input voltage range TA= 0°C to 70°C 1.0 5.5 V
TA= –40°C to 105°C 1.2 5.5
ICC Supply Current
VCC < 5.5 V,
LM8xx: 4.63, 4.38, 4.00 TA= –40°C to 85°C 18 60
µA
TA= 85°C to 105°C 100
VCC < 3.6 V,
LM8xx: 3.08, 2.93, 2.63, 2.45 TA= –40°C to 85°C 15 50
TA= 85°C to 105°C 100
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM809, LM810
UNITDBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 252.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 113.3 °C/W
RθJB Junction-to-board thermal resistance 53.5 °C/W
ψJT Junction-to-top characterization parameter 9.9 °C/W
ψJB Junction-to-board characterization parameter 52.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
5
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(1) Production testing done at TA= 25°C, over temperature limits specified by design only.
(2) RESET Output for LM809, RESET output for LM810.
6.5 Electrical Characteristics
VCC = full range, TA= –40°C to 105°C, unless otherwise noted. Typical values are at TA= 25°C, VCC = 5 V for 4.63, 4.38, and
4.00 versions, VCC = 3.3 V for 3.08 and 2.93 versions, and VCC = 3 V for 2.63 and 2.45 version(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VTH Reset Threshold(2)
LM8xx: 4.63 V TA= 25°C 4.56 4.63 4.70
V
TA= –40°C to 85°C 4.50 4.75
TA= 85°C to 105°C 4.40 4.86
LM8xx: 4.38 V TA= 25°C 4.31 4.38 4.45
TA= –40°C to 85°C 4.25 4.50
TA= 85°C to 105°C 4.16 4.56
LM8xx: 4.00 V TA= 25°C 3.93 4.00 4.06
TA= –40°C to 85°C 3.89 4.10
TA= 85°C to 105°C 3.80 4.20
LM8xx: 3.08 V TA= 25°C 3.04 3.08 3.11
TA= –40°C to 85°C 3.00 3.15
TA= 85°C to 105°C 2.92 3.23
LM8xx: 2.93 V TA= 25°C 2.89 2.93 2.96
TA= –40°C to 85°C 2.85 3.00
TA= 85°C to 105°C 2.78 3.08
LM8xx: 2.63 V TA= 25°C 2.59 2.63 2.66
TA= –40°C to 85°C 2.55 2.70
TA= 85°C to 105°C 2.50 2.76
LM8xx: 2.45 V TA= 25°C 2.41 2.45 2.49
TA= –40°C to 85°C 2.38 2.52
TA= 85°C to 105°C 2.33 2.57
Reset Threshold
Temperature Coefficient 30 ppm/°C
VCC to Reset Delay(2) VCC = VTH to (VTH – 100 mV) 20 µs
Reset Active Timeout
Period TA= –40°C to 85°C 140 240 560 ms
TA= 85°C to 105°C 100 840
VOL
RESET Output Voltage
Low (LM809)
VCC = VTH(min), ISINK = 1.2 mA, LM809: 2.45, 2.63, 2.93, 3.08 0.3
V
VCC = VTH(min), ISINK = 3.2 mA, LM809: 4.63, 4.38, 4.00 0.4
VCC > 1 V, ISINK = 50 µA 0.3
RESET Output Voltage
Low (LM810) VCC = VTH(max), ISINK = 1.2 mA, LM810: 2.63, 2.93, 3.08 0.3
VCC = VTH(max), ISINK = 3.2 mA, LM810: 4.63, 4.38, 4.00 0.4
VOH
RESET Output Voltage
High (LM809) VCC > VTH(max), ISOURCE = 500 µA, LM809: 2.45, 2.63, 2.93, 3.08 0.8 × VCC
V
VCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00 VCC – 1.5
RESET Output Voltage
High (LM810) 1.8 V < VCC < VTH(min), ISOURCE = 150 μA 0.8 × VCC
–40 –20 0 20 40 60 80
220
215
210
205
200
Temperature (°C)
Power-Up Reset Timeout (ms)
225
230
235
245
250
240
–40 –20 0 20 40 60 80
1.002
1.001
1.000
0.999
0.997
Temperature (°C)
Normalized Threshold
1.003
0.998
–40 –20 0 20 40 60 80
80
60
40
20
0
Temperature (°C)
Power-Down Reset Delay (µs)
100
–40 –20 0 20 40 60 80
80
60
40
20
0
Temperature (°C)
Power-Down Reset Delay (µs)
100
120
140
160
180
–40 –20 0 20 40 60 80
20
15
10
5
0
Temperature (°C)
Supply Current (µA)
–40 –20 0 20 40 60 80
20
15
10
5
0
Temperature (°C)
Supply Current (µA)
6
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,
LM810
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6.6 Typical Characteristics
Figure 1. Supply Current vs Temperature
(No Load, LM8xx: 2.63, 2.93, 3.08) Figure 2. Supply Current vs Temperature
(No Load, LM8xx: 4.63, 4.38)
Figure 3. Power-Down Reset Delay vs Temp
(LM8xx: 2.63, 2.93, 3.08) Figure 4. Power-Down Reset Delay vs Temperature
(LM8xx: 4.63, 4.38)
Figure 5. Power-Up Reset Timeout vs Temperature Figure 6. Normalized Reset Threshold vs Temperature
RESET
INPUT
RD
GND
VREF
-
+
7
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,
LM810
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7 Detailed Description
7.1 Overview
The LM809 and LM810 microprocessor supervisory circuits provide a simple solution to monitor the power
supplies in microprocessor and digital systems and provide a reset during power-up, power-down, and brown-out
conditions. The reset signal is controlled by the factory-programmed reset threshold on the VCC supply voltage
pin. When the voltage declines below the reset threshold, the reset signal is asserted and remains asserted for
240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has
an active-high RESET output. The available threshold options are 2.63 V, 2.93 V, 3.08 V, 4.38 V, and 4.63 V to
provide precision monitoring of supply voltages.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63-V and 3.08-V
options of the LM809 and LM810 use highly accurate circuitry to ensure that the reset threshold occurs only
within this range (for 5-V and 3.3-V supplies). The other voltage options have the same tight tolerance to ensure
a reset signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds
apply to 3-V, 3.3-V, and 5-V nominal supply voltages.
Table 1. Reset Thresholds Related to Common Supply Voltages
Reset Threshold 3 V 3.3 V 5 V
4.63 ± 3% 90 – 95%
4.38 ± 3% 85 – 90%
4.00 ± 3% 78 – 82%
3.08 ± 3% 90 – 95%
2.93 ± 3% 86 – 90%
2.63 ± 3% 85 – 90% 77 – 81%
2.45 ± 3% 79 – 84% 72 – 76%
1 10 100 1000
240
160
80
0
Reset Comparator Overdrive (ms)
Maximum Transient Duration (µs)
320
400
560
480
VCC
RESET
GND
LM809
R1
100 kΩ
8
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,
LM810
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7.3.1.1 Ensuring a Valid Reset Output Down to VCC =0V
When VCC falls below 1 V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100-kΩ
resistor should be connected from the RESET output to ground, as shown in Figure 7.
A 100-kΩpullup resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC
< 1 V.
Figure 7. RESET Valid to VCC = Ground Circuit
7.3.1.2 Negative-Going VCC Transients
The LM809 and LM810 are relatively immune to short negative-going transients or glitches on VCC.Figure 8
shows the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In
general, as the magnitude of the transient increases, going further below the threshold, the maximum allowable
pulse width decreases. Typically, for the 4.63-V and 4.38-V version of the LM809 or LM810, a VCC transient that
goes 100 mV below the reset threshold and lasts 20 µs or less will not cause a reset pulse. A 0.1-µF bypass
capacitor mounted as close as possible to the VCC pin will provide additional transient rejection.
Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive
VCC
RESET
GND
LM809
VCC
RESET
GND
BUFFER
4.7 kΩ
Buffered
to other system
components
RESET
µP
9
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7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the
LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in
the opposite state, connect a 4.7-kΩresistor between the LM809 RESET output and the µP reset pin, as shown
in Figure 9. Buffer the LM809 RESET output to other system components.
Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O
7.4 Device Functional Modes
7.4.1 VCC Supply Voltage Low
When VCC supply voltage declines below the reset threshold, the RESET output is asserted. For LM809, the
active-low RESET output is low. For LM810, the active-high RESET output is high.
7.4.2 VCC Supply Voltage High
When the VCC supply voltage rises above the reset threshold, the RESET output resets after 240 ms. For LM809,
the active-low RESET output rises high. For LM810, the active-high RESET output drops low.
LM809
RESET RESET
INPUT
GND GND
VCC VCC
VCC
µP
10
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,
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM809 and LM810 are a supervisor circuit for microprocessor and digital systems. With a low supply current
of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment.
8.2 Typical Application
Figure 10. Microprocessor RESET Circuit
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input supply voltage range 1 V to 5.5 V
Reset output voltage (high) Input supply
Reset output voltage (low) 0 V
8.2.2 Detailed Design Procedure
For the typical application circuit, all that is required is the LM809 or LM810 IC, but TI recommends an input
capacitor to help with input voltage transients. A typical input capacitor value is 0.1 uF and must be rated for the
highest expected input voltage.
C1 U1
V Input
CC
GND
Reset
240 ms
RESET (LM809)
RESET (LM810)
VCC
V threshold (5 V, 3.3 V, or 3 V)
CC
11
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8.2.3 Application Curve
Figure 11. Reset Active Timeout
9 Power Supply Recommendations
The input of the LM809 is designed to handle up to the supply voltage absolute maximum rating of 6.5 V. If the
input supply is susceptible to any large transients above the maximum rating, then extra precautions should be
taken. An input capacitor is recommended to avoid false reset output triggers due to noise.
10 Layout
10.1 Layout Guidelines
Place the input capacitor as close as possible to the IC.
10.2 Layout Example
Figure 12. Layout Example
12
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,
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11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM809 Click here Click here Click here Click here Click here
LM810 Click here Click here Click here Click here Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM809M3-2.63/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S3B
LM809M3-2.93 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 105 S4B
LM809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S4B
LM809M3-3.08 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 105 S5B
LM809M3-3.08/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S5B
LM809M3-4.38/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S7B
LM809M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S8B
LM809M3X-2.63/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S3B
LM809M3X-2.93/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S4B
LM809M3X-3.08/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S5B
LM809M3X-4.38/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM S7B
LM809M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 S8B
LM810M3-4.63 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 105 SEB
LM810M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 SEB
LM810M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 SEB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-2.93 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-3.08 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM810M3-4.63 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-2.93 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-3.08 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM810M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
4203227/C
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
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