1
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Rev. V5
MADP-017025-1314
MADP-030025-1314
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Case Style ODS 1314
Absolute Maximum Ratings1 @ TA = +25°C
(unless otherwise specified)
1) Exceeding these limits may cause permanent damage
Chip Dimensions
DIM INCHES MM
Min Max Min Max
A 0.060 0.062 1.525 1.575
B 0.031 0.032 0.775 0.825
C 0.004 0.008 0.102 0.203
D 0.019 0.021 0.475 0.525
E 0.019 0.021 0.475 0.525
F 0.019 0.021 0.475 0.525
G 0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
Features
♦ 0603 Outline
♦ Surface Mount
♦ 25µm I-Region Length Devices
♦ No Wirebonds Required
♦ Silicon Nitride Passivation
♦ Polymer Scratch Protection
♦ Low Parasitic Capacitance and Inductance
♦ High Average and Peak Power Handling
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMICTM process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤50dBm/C.W. or where the peak
power is ≤75dBm, pulse width is 1µS, and duty cycle is
0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Parameter Absolute Maximum
Forward Current 500 mA
Reverse Voltage - 135 V
Operating Temperature -55°C to +125°C
Storage Temperature -55 °C to +150°C
Junction Temperature +175°C
C.W. Incident Power +44dBm MADP-017025
+47dBM MADP-030025
Mounting Temperature +280°C for 30 seconds
Peak Incident Power (dBm) +50 dBm, 10µS, 1% duty
2
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Rev. V5
MADP-017025-1314
MADP-030025-1314
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Electrical Specifications @ TA = 25°C (unless otherwise noted)
Notes:
1) Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2) Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3) Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20,
Au/Sn solder.
MADP-0XX025 Series Typical Spice Parameters @ +25°C
Parameter Symbol Conditions Units Min Typ Max Min Typ Max
MADP-017025 MADP-030025
Capacitance 1 C
T - 40V, 1MHz 1 pF 0.23 0.29
0.50 0.56
Capacitance 1 C
T - 40V, 1GHz 1,3 pF 0.23 0.50
Capacitance 1, 85°C CT - 40V, 1GHz 1,3 pF 0.22 -
Resistance 2 R
S +10mA, 1GHz
2,3 Ω 1.01 0.65
Resistance 2 R
S +70mA, 1GHz
2,3 Ω 0.64 0.45
Resistance 2, 85°C RS +10mA, 1GHz
2,3 Ω 1.48 -
Resistance 2, 85°C RS +70mA, 1GHz
2,3 Ω 1.03 -
Forward Voltage VF +10mA V 0.74 0.90
0.73 0.90
Reverse Leakage
Current IR | -135V | µA - 10 - 10
Third Order
Intercept Point IP3
F1 = 1800MHz
F2 = 1810MHz
Input Power = +39dBm CW
I bias = +70mA
dBm 76 77
C.W.
Thermal Resistance RqJL
IH = 0.5A, IL= 10mA
°C/W 30 13
Lifetime TL
+10mA / -6mA
( 50 % - 90 % V )
uS 2.3 2.8
Spice Parameter N RS IS IK BV IBV Ct CJO VJ M FC Cpar_Cj
Units - Ω A (mA) (Volts) (µA) (pF) (pF) (Volts) - - (F)
MADP-017025-1314 1.1 1.4 5.1E-15 12.6 175 10 0.38 0.10 0.17 0.50 0.12 2.7E-13
MADP-030025-1314 1.1 1.3 7.8E-15 12.7 175 10 0.80 0.27 0.12 0.50 0.07 5.3E-13
3
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Rev. V5
MADP-017025-1314
MADP-030025-1314
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MADP-0XXX15 Series Typical Performance Curves @ +25°C
Ct vs. V Rs vs. I
Ct vs. Freq. Ls vs. Freq.
Rs vs. Freq. Ls vs. I
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
0 10203040
Voltage (V)
Ct @ 1GHz (pF)
MADP-017025
MADP-030025
0.10
1.00
10.00
0.001 0.01 0.1
Current (A)
Rs @ 1GHz (ohm)
MADP-017025
MADP-030025
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Frequency (GHz)
Ct (pF)
MADP-17025
MADP-30025
0V
10V
40V
0V
10V
40V
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Frequency (GHz)
Ls @ 5, 10, 20mA (nH)
MADP-17025
MADP-30025
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Frequency (GHz)
Rs (ohm)
MADP-017025
5m
1
0
mA
20mA
MADP-030025
5m
10mA
2
0
mA
A
A
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0 0.02 0.04 0.06 0.08 0.1
Current (A)
Ls @ 1G H z (nH)
MADP-017025
MADP-030025
4
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Rev. V5
MADP-017025-1314
MADP-030025-1314
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use
of 60/40, Pb/Sn, 80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series
resistance and optimum heat sink.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same
time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and
potentially create thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical soldering process profile and handling instructions are provided in
Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the
MA-COM website at www.macomtech.com.
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
Ordering Information
Part Number Package
MADP-017025-13140G 100 piece gel pack
MADP-017025-13140P 3000 piece reel
MADP-030025-13140P 3000 piece reel
MADP-030025-13140G 100 piece gel pack
