  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
  !" # $%&" !#  '%()$!" *!"&
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#"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*&
"&#"/  !)) '!!&"&#
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BCA
JM38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
JM38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
JM38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
JM38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
JM38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
JM38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
JM38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
JM38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
M38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BCA
M38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BCA
M38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
M38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
M38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
M38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
M38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
M38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
M38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
M38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
M38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
M38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
M38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
M38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
SN54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS74AJ
SN54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS74AJ
SN54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S74J
SN54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S74J
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74AN ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74AN ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74ANE4 ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74ANE4 ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S74
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S74
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74S74N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S74N
SN74S74N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S74N
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74S74
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74S74
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
74AFK
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
74AFK
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AJ
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AJ
SNJ54LS74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AW
SNJ54LS74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AW
SNJ54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74J
SNJ54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74J
SNJ54S74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74W
SNJ54S74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 5
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS74A, SN54LS74A-SP, SN54S74, SN74LS74A, SN74S74 :
Catalog: SN74LS74A, SN54LS74A, SN74S74
Military: SN54LS74A, SN54S74
Space: SN54LS74A-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS74ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS74ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74S74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS74ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LS74ADR SOIC D 14 2500 367.0 367.0 38.0
SN74S74NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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