www.fairchildsemi.com LM108A/LH2108A Precision Operational Amplifiers Features Description * * * * * * * * * The LM108A operational amplifiers features low input bias current combined with the advantages of bipolar transistor construction; input offset voltages and currents are kept low over a wide range of temperature and supply voltage. Fairchild Semiconductor's superbeta bipolar manufacturing process includes extra treatment at epitaxial growth to ensure low input voltage noise. Low input bias current -- 2 nA Low input offset current -- 200 pA Low input offset voltage -- 500mV Low input offset drift -- 5 mV/C Wide supply range -- 3V to 20V Low supply current -- 0.6 mA High PSRR -- 96 dB High CMRR -- 96 dB MIL-STD-883B available The LH2108 consists of two LM108 ICs in one 16-lead DIP. The "A" versions meet tighter electrical specifications than the plain versions. All types are available with 883B military screening. Rev 1.0.0 LM108A/LH2108A PRODUCT SPECIFICATION Pin Assignments 8-Lead Metal Can (Top View) 8-Lead DIP (Top View) Comp 8 Comp -Input +Input +VS 7 1 6 2 Comp 1 8 Comp -Input 2 7 +VS +Input 3 6 Output -VS 4 5 NS Output 5 3 NC 4 -VS 65-108A-01 16-Lead DIP (Top View) +VS (A) 1 16 Output (A) 15 NC Comp (A) 2 Comp/VOS Trim (A) 3 14 VOS Trim -Input (A) 4 13 +Input (B) +Input (A) 5 12 -Input (B) -VS 6 11 Comp/VOS Trim (B) NC 7 10 Comp (B) Output (B) 8 9 +VS (B) 65-108A-02 Absolute Maximum Ratings Parameter Min. Supply Voltage Differential Input Input Current1 Voltage2 Output Short-Circuit Duration2 Max. Units 20 V 10 mA 15 V Continuous Operating Temperature Range -55 +125 C Storage Temperature Range -65 +150 C +300 C Lead Soldering Temperature (60 seconds) Notes: 1. The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, if a differential input voltage in excess of 1V is applied between the inputs, excessive current will flow, unless some limiting resistance is provided. 2. For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage. 2 PRODUCT SPECIFICATION LM108A/LH2108A Thermal Characteristics 8-Lead Metal Can 8-Lead Ceramic DIP 16-Lead Ceramic DIP Maximum Junction Temperature +175C +175C +175C Max. PDTA < 50C 658 mW 833 mW 1042 mW Thermal Resistance, qJC 50C/W 45C/W 60C/W Thermal Resistance, qJA 190C/W 150C/W 120C/W For TA > 50C Derate at 5.26 mW/C 8.33 mW/C 8.38 mW/C Parameter Electrical Characteristics 5V, VS 20V and TA +25C unless otherwise noted LM108A/LH2108A Parameters Test Conditlons Min. Typ. Max. Input Offset Voltage 0.3 Input Offset Current Input Bias Current Input Resistance1 Large Signal Voltage Gain VS = 15V, VOUT 10V, RL 10KW Supply Current Each Amplifier LM108/LH2108 Min. Typ. Max. Units 0.5 0.7 2.0 mV 0.05 0.2 0.05 0.2 nA 0.8 2.0 0.8 2.0 nA 30 70 30 70 MW 80 300 50 300 V/mV 0.3 0.6 0.3 0.6 mA 5V, VS 20V; -55C TA +25C unless otherwise noted Input Offset Voltage 0.4 1.0 1.0 3.0 mV Avg. Input Offset Voltage Drift2 1.0 5.0 3.0 15 mV/C Input Offset Current 0.1 0.4 0.1 0.4 nA Avg. lnput Offset Current Drift2 0.5 2.5 0.5 2.5 pA/C Input Bias Current 1.0 3.0 1.0 3.0 nA Large Signal Voltage Gain VS = 15V, VOUT = 10V, RL 10 KW 40 200 25 200 V/mV Output Voltage Swing RL 10 KW, VS = 20V 16 18 16 18 V Input Voltage Range VS = 15V Common Mode Rejection Ratio VCM = 13.5V, VS = 15V 96 110 85 100 dB Power Supply Rejection Ratio VS = 15V 96 110 80 96 dB Supply Current Each Amplifier 13.5 13.5 0.6 V 0.6 mA Notes: 1. Guaranteed by input bias current specification. 2. Sample tested. 3 LM108A/LH2108A PRODUCT SPECIFICATION Typical Applications cleaning procedure is required to achieve the LM108A's rated performance. It is suggested that board leakage be minimized by encircling the input pins with a guard ring maintained at a potential close to that of the inputs. The guard ring should be driven by a low impedance source such as an amplifier's output or ground. The LM108 series has very low input offset and bias currents; the user is cautioned that printed circuit board leakages can produce significant errors especially at high board temperatures. Careful attention to board layout and R5 +VS R3 50K R1 -VIN R1 200K R4 2 R2 100 3 R2 2 LM108 6 VOUT R3 +VIN -VS Range = VS 3 ( R2 ( Gain = 1 + VOUT 8 1 C * F R1 +VIN 6 LM108 ( ( R4R5 + R2 CF > *Bandwidth and slew rate are proportional to 1/CF 65-2653 Figure 1. Offset Adjustment for Non-Inverting Amplifiers Figure 2. Standard Compensation Circuit R2 -VIN 2 R1 3 -VIN +VIN R5 20K R2 VOUT +VS R3 R1 2 6 LM108 +VIN R3 -VS 6 LM108 3 VOUT 8** CS 100 pF R6 25K R4 10 L CL = Load Capacitance 65-2652 R1 ( R1R1+CR2 ( R2 = R3 + R4 R5 Range = VS Gain = R2 ( R4 (( R1 R1 + R3 ( *Improves rejection of power supply noise by a factor of 10. **Bandwidth and slew rate are proportional to 1/CS. R1 65-2655 65-2654 Figure 3. Offset Adjustment for Differential Amplifiers Figure 4. Alternate Frequency Compensation C2 5 pF R3 R2 R4 VIN +VS R5 50K R1 200K 3 LM108 6 VOUT 2 Range = VS ( R2 ( R1 Figure 5. Offset Adjustment for Inverting Amplifiers C1 500 pF 6 LM108 8 1 65-2650 4 VIN 10K 3 R2 100 -VS R1 10K 2 VOUT R3 3K C3 10 pF 65-2651 Figure 6. Feedforward Compensation PRODUCT SPECIFICATION LM108A/LH2108A Mechanical Dimensions 8-Lead TO-99 Metal Can oD Symbol Min. oD1 F L1 Q A ob ob1 oD oD1 oD2 e e1 A L2 L Inches ob BASE and SEATING PLANE ob1 REFERENCE PLANE F k k1 L L1 L2 Q a Max. .165 .185 .016 .019 .016 .021 .335 .375 .305 .335 .110 .160 .200 BSC .100 BSC -- .040 .027 .034 .027 .045 .500 .750 -- .050 .250 -- .010 .045 45 BSC Millimeters Min. Notes Max. 4.19 4.70 .41 .48 .41 .53 8.51 9.52 7.75 8.51 2.79 4.06 5.08 BSC 2.54 BSC -- 1.02 .69 .86 .69 1.14 12.70 19.05 -- 1.27 6.35 -- .25 1.14 45 BSC 1, 5 1, 5 2 1 1 1 e Notes: e1 oD2 1. (All leads) ob applies between L1 & L2. ob1 applies between L2 & .500 (12.70mm) from the reference plane. Diameter is uncontrolled in L1 & beyond .500 (12.70mm) from the reference plane. 2. Measured from the maximum diameter of the product. 3. Leads having a maximum diameter .019 (.48mm) measured in gauging plane, .054 (1.37mm) +.001 (.03mm) -.000 (.00mm) below the reference plane of the product shall be within .007 (.18mm) of their true position relative to a maximum width tab. 4. The product may be measured by direct methods or by gauge. a 5. All leads - increase maximum limit by .003 (.08mm) when lead finish is applied. k k1 5 LM108A/LH2108A PRODUCT SPECIFICATION Mechanical Dimensions (continued) 8-Lead Ceramic DIP Inches Symbol Min. A b1 b2 c1 D E e eA L Q s1 a Millimeters Max. Min. -- .200 .014 .023 .045 .065 .008 .015 -- .405 .220 .310 .100 BSC .300 BSC .125 .200 .015 .060 .005 -- 90 105 Notes: Notes Max. -- 5.08 .36 .58 1.14 1.65 .20 .38 -- 10.29 5.59 7.87 2.54 BSC 7.62 BSC 3.18 5.08 .38 1.52 .13 -- 90 105 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one. The manufacturer's identification shall not be used as pin one identification mark. 8 2, 8 2. The minimum limit for dimension "b2" may be .023 (.58mm) for leads number 1, 4, 5 and 8 only. 8 4 4 5, 9 7 3. Dimension "Q" shall be measured from the seating plane to the base plane. 3 6 4. This dimension allows for off-center lid, meniscus and glass overrun. 5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline shall be located within .010 (.25mm) of its exact longitudinal position relative to pins 1 and 8. 6. Applies to all four corners (leads number 1, 4, 5, and 8). 7. "eA" shall be measured at the center of the lead bends or at the centerline of the leads when "a" is 90. 8. All leads - Increase maximum limit by .003 (.08mm) measured at the center of the flat, when lead finish applied. 9. Six spaces. D 4 1 Note 1 E 5 8 s1 eA e A Q a L b2 b1 6 c1 PRODUCT SPECIFICATION LM108A/LH2108A Mechanical Dimensions (continued) 16-Lead Ceramic DIP Inches Symbol Min. A b1 b2 c1 D E e eA L Q s1 a Notes: Millimeters Max. Min. -- .200 .014 .023 .050 .065 .008 .015 .745 .840 .220 .310 .100 BSC .300 BSC .115 .160 .015 .060 .005 -- 90 105 Notes Max. -- 5.08 .36 .58 1.27 1.65 .20 .38 18.92 21.33 5.59 7.87 2.54 BSC 7.62 BSC 2.92 4.06 .38 1.52 .13 -- 90 105 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one. The manufacturer's identification shall not be used as pin one identification mark. 8 2 2. The minimum limit for dimension "b2" may be .023 (.58mm) for leads number 1, 8, 9 and 16 only. 8 4 3. Dimension "Q" shall be measured from the seating plane to the base plane. 4 5, 9 7 4. This dimension allows for off-center lid, meniscus and glass overrun. 3 6 5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline shall be located within .010 (.25mm) of its exact longitudinal position relative to pins 1 and 16. 6. Applies to all four corners (leads number 1, 8, 9, and 16). 7. "eA" shall be measured at the center of the lead bends or at the centerline of the leads when "a" is 90. 8. All leads - Increase maximum limit by .003 (.08mm) measured at the center of the flat, when lead finish applied. 9. Fourteen spaces. D 8 1 9 16 NOTE 1 E s1 eA e A Q L a c1 b1 7 PRODUCT SPECIFICATION LM108A/LH2108A Ordering Information Part Number Package Operation Temperature Range LM108D 8-Lead Ceramic DIP -55C to +125C LM108D/883B 8-Lead Ceramic DIP -55C to +125C LM108AD 8-Lead Ceramic DIP -55C to +125C LM108AD/883B 8-Lead Ceramic DIP -55C to +125C 8-Lead Metal Can TO-99 -55C to +125C LM108T LM108T/883B 8-Lead Metal Can TO-99 -55C to +125C LM108AT 8-Lead Metal Can TO-99 -55C to +125C LM108AT/883B 8-Lead Metal Can TO-99 -55C to +125C LH2108D 16-Lead Ceramic DIP -55C to +125C LH2108D/883B 16-Lead Ceramic DIP -55C to +125C LH2108AD 16-Lead Ceramic DIP -55C to +125C LH2108AD/883B 16-Lead Ceramic DIP -55C to +125C Note: 1. /883B suffix denotes Mil-Std-883, Level B processing LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 5/20/98 0.0m 001 Stock#DS3000108A O 1998 Fairchild Semiconductor Corporation