AMD EMBEDDED SOLUTIONS: Product Selection Guide AMD Embedded: The Next Generation of Embedded Computing AMD helps deliver the right balance of CPU, GPU and chipset capabilities, to give designers the solutions they need to create the next generation of embedded applications. Along with a broad range of varied solutions, AMD supports the x86 embedded marketplace with design tools and technology partnerships that offer simplicity and flexibility to help create high-performance, feature-rich, and customer-driven products. AMD has long been a leader in innovation with its continued focus on improving both x86 processor and graphics processor designs. AMD's embedded products offer designers a balanced foundation for overall system performance with the quick time-to-market typically offered by commercial off-the-shelf components. AMD embedded solutions give designers ample flexibility to design scalable, x86-based, cost-efficient and feature-rich products, and help drive energy conservation into their systems without compromising application performance or compatibility, graphics performance or features. AMD technologybased products are leading edge from enterprise-class servers and consumer systems to traditional embedded markets. This brochure presents the full array of AMD's embedded solutions that help deliver maximum performance with low overall system power consumption and are supported by longer than standard availability1, a full library of x86 software development applications, and hardware tools. It's time to design and produce the nextgeneration embedded systems your customers demand -- quickly, easily, and efficiently. AMD's unique processor designs help deliver high performance and balanced system design. AMD's range of embedded solutions provides flexible features and a balanced performance approach for the overall system. FEATURES INCLUDE > Integrated low power processor and GPU2 > Industry-leading performance-per-watt > Native eight-core processor design provides highly scalable performance gains within a consistent thermal envelope > Lead-free, four-layer processes with maximum on-board space > Efficient heat dissipation reduces or eliminates the need for heat sinks and reduces ambient cooling requirements > Range of available packaging and pin counts meets variety of design requirements Along with these and other technical features, embedded designers can enjoy long-term component availability, comprehensive design support, and AMD's commitment to continue offering new, customeroriented products. Tools and support for developers AMD offers: > A full range of RDK (Reference Design Kit) products designed to enable designers to go from concept to finished product quickly > A broad array of development boards for creating efficient x86 system designs > Industry collaborations with leading software and hardware specialists, fostering maximum choice for your unique design Get to market faster with superior products Ready to create high-performance, low-power embedded designs that give your innovative new products an edge in the marketplace? Experience the AMD advantage. Note 1: Most models support a planned 5 year availability from Product Release. See AES Product Roadmap: Backup - Product Longevity & Features document for last time buy schedules on specific products. Note 2: On some models The AMD Fusion Family of Accelerated Processing Units (APU) AMD Fusion is a new approach to processor design and software development, delivering powerful CPU and GPU capabilities for HD, 3D and data-intensive workloads in a single-die processor called an APU. APUs combine high-performance serial and parallel processing cores with other special-purpose hardware accelerators, enabling breakthroughs in visual computing, security, performance-per-watt and device form factor. The first introduction of this technology for embedded applications is the new AMD Embedded G-Series Family of APUs, targeted at delivering the ideal combination of price, power and performance for applications such as integrated digital signage, x86 set-top-box (xSTB), IP-TV, Thin Client, Point-of-Sale, Infotainment, and Casino Gaming markets. The AMD64 embedded family: leading-edge technology for high-end embedded systems AMD64 embedded solutions are each uniquely matched to a defined set of product applications. These solutions include high-performance dual-, quad-, six- and eight-core AMD OpteronTM processors and dual-core AMD TurionTM II Neo processors with Direct Connect Architecture for enterprise-class telecom, networking and storage equipment. The ASB1 (BGA) family of processors are designed with unique computing features and a thin, compact form factor to help enable new and uncompromising designs. The ASB2 processors are the second generation BGA platform, featuring the AMD TurionTM II Neo dual-core processors coupled with the AMD 785E chipset, are designed to deliver exceptional performance while maintaining low average solution power draw with greater levels of performance and power efficiency over the previous generation ASB1 (BGA) processor family. The AMD64 solutions are each uniquely equipped to provide the processing needs for a large number of target markets. These solutions enable unique high-performance, smaller form factor products, with maximum versatility, and minimum design challenge. AMD GeodeTM LX processors: optimized for low-power, high-performance applications AMD GeodeTM LX processors are configured to deliver developers a versatile and flexible suite of x86 solutions that enable fast design cycles and short time-to-market roadmaps. Ideal for applications ranging from thin-client and set-top boxes to point-of-sale devices and kiosks. AMD has also introduced technology that allows the AMD Geode LX family to use DDR2 memory modules in an existing design. With a minor change in the memory voltage and an updated BIOS, a current AMD Geode LX processor based design can use a DDR2 memory module from AStint which helps ensure memory longevity and results in system level power efficiency. In addition to processors, the family includes a broad range of design tools including Development Boards (DBs) and Reference Design Kits (RDKs) to empower designers to make maximum use of the established world of x86 software applications. The AMD RadeonTM embedded graphics family: game-changing graphics for embedded systems. AMD RadeonTM graphics for embedded applications are designed to deliver exciting, desktop-level visual experiences to embedded systems. Built with advanced 3D graphics engines supporting Microsoft(R) DirectX(R) and OpenGL graphics APIs, AMD graphics solutions enable market-leading, rich, immersive images. Outstanding multimedia capabilities are supported by an integrated multi-standard video decoder delivering enhanced video quality from MPEG-2, H.264 or VC-1 video streams. The ultimate in display flexibility is provided by dual display controllers driving high-resolution displays through VGA, DVI, DisplayPort or HDMI interfaces. AMD graphics solutions are designed to perform, engineered to lead and built to win. With a product portfolio including AMD chipsets, discrete graphics processors, MXM modules and PC add-in boards, AMD provides system designers with exciting and innovative graphics solutions for their embedded systems. AMD Embedded Solutions Eight-Core AMD OpteronTM 6100 Series Processor - Socket G34 Note 1. Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransportTM Interface Product Release 61KS OE61KSWKT8EGO up to 4 2.0GHz L2 512KB x6; L3 12MB 115W1 DDR3-1333 4-ch Registered ECC & Chipkill Four 16-lane @ up to 3.2GHz Full Duplex Q1-10 61QS OE61KSWKT8EGO up to 4 2.3GHz L2 512KB x6; L3 12MB 115W1 DDR3-1333 4-ch Registered ECC & Chipkill Four 16-lane @ up to 3.2GHz Full Duplex Q1-10 Temperature is server part. Six-Core and Four-Core AMD OpteronTM 4100 Series Processors - Socket C32 Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransportTM Interface Product Release 41KX HE OE41KXOHU6DGOE 6 cores up to 2 sockets 2.2GHz L2 512K x6; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz Full Duplex Q3-10 41QS HE OE41QSOHU4DGOE 4 cores up to 2 sockets 2.5GHz L2 512K x4; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz Full Duplex Q3-10 41LE HE OE41LEOHU4DGOE 4 cores up to 2 sockets 2.3GHz L2 512K x4; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz Full Duplex Q3-10 41GL EE OE41GLHKU6DGOE 6 cores up to 2 sockets 1.8GHz L2 512K x6; L3 6MB 40W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz Full Duplex Q3-10 Six-Core AMD OpteronTM Processors - Socket F (1207)A Note 1. Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransportTM Interface Product Release 84QS OE84QSWJS6DGNE up to 8 2.4GHz L2 512KB x6; L3 6MB 115W1 DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q1-10 84KS OE84QSWJS6DGNE up to 8 2.0GHz L2 512KB x6; L3 6MB 79W1 DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q1-10 24QS OE24QSWJS6DGNE up to 2 2.4GHz L2 512KB x6; L3 6MB 115W1 DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q1-10 24KS OE24QSWJS6DGNE up to 2 2.0GHz L2 512KB x6; L3 6MB 79W1 DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q1-10 Temperature is server part. Quad-Core AMD OpteronTM Processors - Socket F (1207)A Model OPN Multi-CPU Scalability Core Frequency Cache Peak Power (worst case) TDP Memory Interface HyperTransportTM Technology Product Release 83VS OE83VSWHP4DGIE Up to 8 2.8GHz L2: 512KB x4 115W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q3-09 71W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.0GHz Full Duplex Q3-09 L3: 6MB 83QS HE OE83QSMAP4DGIE Up to 8 2.4GHz 23VS OE23VSWHP4DGIE Up to 2 2.8GHz 115W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.2GHz Full Duplex Q3-09 23QS HE OE23QSMAP4DGIE Up to 2 2.4GHz 71W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.0GHz Full Duplex Q3-09 23KS EE OE23KSFLP4DGIE Up to 2 2.0GHz 50W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@1.8GHz Full Duplex Q3-09 13QS HE OE13QSMAP4DGIE Up to 1 2.4GHz 71W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@2.0GHz Full Duplex Q3-09 13KS EE OE13KSFLP4DGIE Up to 1 2.0GHz 50W DDR2-800 2-ch Registered ECC & Chipkill Three 16-lane@1.8GHz Full Duplex Q3-09 Dual-Core AMD OpteronTM Processors - Socket F (1207)A Model OPN Multi-CPU Scalability Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransportTM Technology Tcase Product Release 8214 HE OSP8214GAU6CYE up to 8 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 83C Q4-06 8210 EE OSH8210GAS6CYE up to 8 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 80C Q4-06 2214 HE OSP2214GAU6CXE up to 2 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 83C Q4-06 2210 EE OSH2210GAS6CXE up to 2 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 80C Q4-06 2208 HE OSP2208GAA5CXE up to 2 1.8GHz 512KB x2 68W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 76C Q4-06 1214 HE OSP1214GAU6DGE 1 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 83C Q4-06 1210 EE OSH1210GAS6DGE 1 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered ECC & Chipkill Three 16-lane@1GHz Full Duplex 80C Q4-06 Note A: AMD Opteron processors in Socket F (1207) type is packaged in Lidded 1207 pad LGA package. All AMD Opteron processors in socket F (1207) generation support DDMP, AMD CoolCoreTM technology, enhanced PowerNow!TM technology, AMD wide floating point accelerator, AMD memory optimizer technology, AMD balanced smart cache, AND-V with Rapid Virtualization Indexing, EVP and OPMA support. AMD Embedded Solutions, cont. AMD G-Series Accelerated Processing Units Model OPN Package CPU Cores L2 Cache /Core Memory Interface CPU Core Frequency Discrete Class Graphics GPU Core Frequency Graphics Hardware Video Acceleration12 Display Outputs13 T56N GET56NGBB22GTE 2 512KB DDR3-1066, Unbuffered 1.6GHz AMD RadeonTM HD 6310 500MHz UVD 3 for H.264, VC-1 and MPEG2 with Blu-ray support T48N GET48NGBB22GTE 2 512KB DDR3-1066, Unbuffered 1.4GHz AMD RadeonTM HD 6310 500MHz UVD 3 for H.264, VC-1 and MPEG2 with Blu-ray support Dual independent display controllers DDR3-1066, Unbuffered15 1.0GHz AMD RadeonTM HD 6250 280MHz UVD 3 for H.264, VC-1 and MPEG2 1x VGA DirectX(R) 11 T40N GET40NFPB22GTE 19mm FCBGA 2 512KB Shader Model 5 Open CLTM 1.1 T52R GET52RGBB12GTE 1 512KB DDR3-1066, Unbuffered 1.5GHz AMD RadeonTM HD 6310 500MHz T44R GET44RFPB12GTE 1 512KB DDR3-1066, Unbuffered15 1.2GHz AMD RadeonTM HD 6250 280MHz OpenGL 3.2, 2.1 2 active outputs from: 1x single-link LVDS UVD 3 for H.264, VC-1 and MPEG2 with Blu-ray support VGA: 2560x1600 (HD 6310) or 1920x1200 (HD 6250) 30 bpp Single-link DVI: 1920x1200 24 bpp 2x single-link DVI 2x DisplayPort v1.1a 1x HDMI 1x DVO UVD 3 for H.264, VC-1 and MPEG2 Thermal Design Power Display Resolutions HDMITM: 1920x1080p 36 bpp Single-link LVDS14: 1400x1050 18 bpp DisplayPort v1.1a: 2560x1600 (HD 6310) or 1920x1200 (HD 6250) @ 30 bpp Tcase Product Release 18W 90C Q1-11 18W 90C Q1-11 9W 90C Q1-11 18W 90C Q1-11 9W 90C Q1-11 AMD G-Series Platform Controller Hubs Model OPN CPU Interface Package PCI Express PCI SATA FISBased Switching Ethernet MAC EEE USB HD Audio LPC SPI SMBus Max GPIOs APU Fan Control APU Clock Gen Power16 A50M 100-CG2198 1X4 Gen 1 23mm FCBGA 4x1 Gen 2 No 6x 6Gb/s No No No 14 v2.0 2 v1.1 Up to 4-channels Yes 102 Yes Yes 2.7W5.9W A55E 100-CG2188 1X4 Gen 2 23mm FCBGA 4x1 Gen 2 33MHz 4 Slots 6x 6Gb/s with RAID 0,1,5,10 Yes Yes Yes 14 v2.0 2 v1.1 Up to 4-channels Yes 102 Yes Yes 2.7W5.9W 12: Refer to the Brazos Platform Minimum System Recommendations for HD Video Playback, order# 48826 to view the minimum system configurations required to enable HD playback and the maximum resolution supported for each advanced video quality feature. 13: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth. 14: eDP translator option supporting 2048x1536 (HD 6310) or 1920x1200 (HD 6250) at 18 or 24 bpp. 15: Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder. 16: Configuration dependant. See product databook for configurations. AMD Embedded Solutions, cont. Socket AM3/AM21 Model OPN Number of Cores Core Frequency Cache Thermal Design Power3 Memory Interface HyperTransportTM Interface Package Product Release AMD Phenom II XLT Q54L HEQ54LOEK4DGME 4 2.2/0.8GHz2 L2 512K x4; L3 6MB 65/36.5W2 DDR3-1333, 2-ch Unbuffered ECC One 16-lane@1.8GHz Full Duplex AM3 Q2-10 AMD AthlonTM II XL - V66C AEV66CHDK23GME 2 2.8GHz 1MB x2 45W DDR3-1333, 2-ch Unbuffered ECC One 16-lane@2GHz Full Duplex AM3 Q2-10 AMD AthlonTM II XLT - V64L AEV64LHFK23GME 2 2.7GHz 1MB x2 45W DDR3-1066, 2-ch Unbuffered ECC One 16-lane@2Ghz Full Duplex AM3 Q2-10 AMD AthlonTM II XLT - V50L AEV50LSCK23GME 2 2.2/0.8GHz2 1MB x2 25/13.8W2 DDR3-1066, 2-ch Unbuffered ECC One 16-lane@2Ghz Full Duplex AM3 Q2-10 AMD AthlonTM X2 4200+ ADD4200IAA5DOE 2 2.2GHz 512KB x2 35W DDR2-800, 2-ch nbuffered ECC One 16-lane@1000MHz Full Duplex AM2 Q2-08 AMD AthlonTM X2 3600+ ADD3600IAA5DOE 2 1.9GHz 512KB x2 35W DDR2-800, 2-ch Unbuffered ECC One 16-lane@1000MHz Full Duplex AM2 Q2-08 AMD AthlonTM X2 3400e ADJ3400IAA5DOE 2 1.8/1.0GHz 512KB x2 22/10.8W DDR2-800, 2-ch Unbuffered ECC One 16-lane@1000MHz Full Duplex AM2 Q2-08 AMD Athlon 3100+ ADS3100IAR4DRE 1 2.0GHz 512KB 25W DDR2-667, 2-ch Unbuffered ECC One 16-lane@1000MHz Full Duplex AM2 Q4-07 AMD Athlon 2600+ ADG2600IAV4DRE 1 1.6GHz 512KB 15W DDR2-667, 2-ch Unbuffered ECC One 16-lane@800MHz Full Duplex AM2 Q4-07 AMD AthlonTM 2000+ ADF2000IAV4DRE 1 1.0GHz 512KB 8W DDR2-667, 2-ch Unbuffered ECC One 16-lane@1000MHz Full Duplex AM2 Q4-07 TM TM Note 1. Note 2. Note 3. 2 2 Socket AM3 processors can operate in Socket AM2 board designs with DDR2 memory. Socket AM2 processors cannot operate in Socket AM3 board designs with DDR3 memory. While operating at the max/min P-States which can be dynamic or fixed through BIOS. TDP specified in dual-plane platform. Socket S1 Model OPN Number of Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransportTM Technology Tcase Product Release AMD TurionTM 64 X2 TL-62 TMDTL62HAX5DME 2 2.1GHz 512KB x2 35W DDR2-800, 2-ch Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-07 AMD TurionTM 64 X2 TL-56 TMDTL56HAX5DME 2 1.8/0.8GHz1 512KB x2 31/9.4W1 DDR2-800, 2-ch Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-07 AMD Sempron 3700+ SMS3700HAX4DQE 1 2.0GHz 512KB 25W DDR2-800, 2-ch Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-07 AMD Sempron 2100+ SMF2100HAX3DQE 1 1.0GHz 256KB 8W DDR2-800, 2-ch Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-07 Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS. ASB2 BGA Model OPN Number of Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransportTM Technology Tcase Product Release AMD TurionTM II Neo - N54L TEN54LSDV23GME 2 2.2GHz 1MB x2 25W DDR3-800, 2-ch Unbuffered ECC One 16-lane@1.6GHz Full Duplex 95C Q2-10 AMD TurionTM II Neo - N40L TEN40LGAV23GME 2 1.5GHz 1MB x2 15W DDR3-800, 2-ch Unbuffered ECC One 16-lane@1.6GHz Full Duplex 95C Q2-10 AMD AthlonTM II Neo - N36L AEN36LLAV23GME 2 1.3/0.8GHz1 1MB x2 12/8W1 DDR3-800, 2-ch Unbuffered ECC One 16-lane@1GHz Full Duplex 95C Q2-10 AMD AthlonTM II Neo - R44L AER44LLAV13GME 1 1.7GHz 1MB 12W DDR3-800, 2-ch Unbuffered ECC One 16-lane@1GHz Full Duplex 95C Q2-10 AMD AthlonTM II Neo - R34L AER34LFCV13GME 1 1.0GHz 1MB 8W DDR3-800, 2-ch Unbuffered ECC One 16-lane@1GHz Full Duplex 95C Q2-10 Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS. ASB1 BGA Model OPN Number of Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransportTM Technology Tcase Product Release AMD TurionTM Neo X2 L625 TMZL625OAX5DYE 2 1.6/0.8GHz1 512KB x2 18/10.1W1 DDR2-667, 2-ch Unbuffered ECC One 16-lane@800MHz Full Duplex 95C Q3-09 AMD TurionTM Neo X2 L325 AMZL325OAX5DYE 2 1.5GHz1 512KB x2 18W1 DDR2-667, 2-ch Unbuffered ECC One 16-lane@800MHz Full Duplex 95C Q3-09 AMD SempronTM 210U SMG210UOAX3DVE 1 1.5GHz 256KB 15W DDR2-400, Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-08 AMD SempronTM 208U SML208UOAX3DVE 1 1.4GHz 256KB 12W DDR2-400, Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-08 AMD SempronTM 200U SMF200UOAX3DVE 1 1.0GHz 256KB 8W DDR2-400, Unbuffered One 16-lane@800MHz Full Duplex 95C Q4-08 Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS. AMD Embedded Solutions, cont. AMD Embedded Discrete Graphics Model Process ATI RadeonTM E2400 Discreet GPU Package GPU + memory TDP # Shaders Interface 13W2 Memory Engine/ Memory Clock (MHz) OS Compute MXM 2.1a Type II module 65 nm 64-bit wide 256 MB GDDR3 2 active outputs from: 2x VGA, 1x Comp/YC/YPbPr, 2x single-link DVI, 1x dual-link DVI, 1x single / dual-link LVDS, 1x HDMITM, 1x DVO 73 x 78 mm 40 PCIe(R) 1.1 (x1, x2, x4, x8, x16) AvivoTM Display System 600/700 Windows(R) XP/ XPe/ Vista(R)/7 Linux(R) Single Precision FP Performance: 48 GFLOPS (x86 32/64) ATI RadeonTM E2400 PCIe(R) Add-in Board PCIe(R) Addin Board 18W4 Shader Model 3.0 64-bit wide 128 MB GDDR3 16 x 11 cm Unified Video Decoder (UVD) for H.264, VC-1 DirectX(R) 10 Product Release Q1-08 Dual independent display controllers Open GL(R) 2.0 18W3 Display Resolutions AvivoTM Display System 3D Mark 05 4061 @ 13W ATI RadeonTM E2400 MXM-II Module Display Outputs Video DirectX(R) 10 Shader Model 3.0 64-bit wide 128 MB GDDR3 31 x 31 mm BGA Graphics MPEG 1/2/4 decode & encode acceleration Dual independent display controllers Available on MXM 2.1a connector 2 active outputs from: 2x VGA, 1x Comp/YC/YPbPr, 2x single-link DVI 1x dual-link DVI, 1x single / dual-link LVDS, 1x HDMITM 1x DVO on header AvivoTM Display System Open GL 2.0 (R) VGA: 400 MHz pixel clk Comp/YC: NTSC, PAL YPbPr: 480i/p, 576i/p, 720p, 1080i Single-link DVI: 1600x1200 60 Hz 24 bpp Q2-08 Dual-link DVI: 2048x1536 60 Hz 24 bpp Single-link LVDS: 1280x1024 60 Hz 24 bpp Dual-link LVDS: 2048x1536 60 Hz 24 bpp Dual independent display controllers HDMITM: 1920x1080i 60 Hz 24 bpp Available on dual DVI-I connectors DVO: 220 MHz pixel clk Q2-10 2 active outputs from: 2x VGA, 2x single-link DVI, 1x dual-link DVI, 1x HDMITM ATI RadeonTM E4690 Discreet GPU GPU + memory 25W6 DirectX(R) 10.1 Shader Model 4.0 35 x 35 mm BGA 55 nm ATI RadeonTM E4690 PCIe(R) Add-in Board MXM 3.0 Type A module 32W7 320 70 x 82 mm PCIe(R) Addin Board Dual independent display controllers Open GL 3.0 3D Mark 06 6686 @ 25W ATI RadeonTM E4690 MXM AvivoTM Display System PCIe(R) 2.0 (x1, x2, x4, x8, x16) 128-bit wide 512 MB GDDR3 Single Precision FP Performance: 384 GFLOPS 600/700 Windows(R) XP/ XPe/ Vista(R)/7 DirectX(R) 10.1 Shader Model 4.0 Open GL 3.0 2nd Generation Unified Video Decoder (UVD2) for H.264, VC-1, MPEG2 decode SD & HD HQVTM processing Blu-Ray Linux(R) 32W8 AvivoTM Display System Dual independent display controllers Available on MXM 3.0 connector 2 active outputs from: 2x VGA, 4x single-link DVI, 2x dual-link DVI, 1x single / dual-link LVDS, 4x DisplayPort v1.1a, 1x HDMITM AvivoTM Display System (x86 32/64 18 x 11 cm 2 active outputs from: 2x VGA, 1x Comp/YC/YPbPr, 5x single-link DVI 3x dual-link DVI, 1x single / dual-link LVDS, 5x DisplayPort v1.1a, 1x HDMITM, 1x DVO Dual independent display controllers Available on dual DVI-I connectors 2 active outputs from: 2x single / duallink DVI, 1x HDMITM, 2x VGA ATI RadeonTM HD 5770 Graphics Board 40 nm PC Add-in Board 23.5 x 11.2 cm 108W10 800 PCIe(R) 2.1 (x1, x2, x4, x8, x16) 128-bit wide 1 GB GDDR5 850/4.8Gbps ATI Stream Technology OpenCLTM 1.1 DirectCompute 11 Single Precision FP Performance: 1.36 TFLOPS DirectX(R) 11 Shader Model 5.0 Open GL(R) 3.2 OpenCLTM 1.0 3D Mark Vantage (P) 10141 @ 108W 2nd Generation Unified Video Decoder (UVD2) for H.264, VC-1, MPEG4, MPEG2 decode Dual HD 1080p decode VGA: 400 MHz pixel clk YPbPr: 480i/p, 576i/p, 720p, 1080i/p Single-link DVI: 1600x1200 60 Hz 24 bpp Dual-link DVI: 2048x1536 60 Hz 24 bpp Q1-10 Single-link LVDS: 1280x1024 60 Hz 24 bpp Dual-link LVDS: 2048x1536 60 Hz 24 bpp DisplayPort v1.1a: 2560x1600 60 Hz 24 bpp HDMITM: 1920x1080p 60 Hz 24 bpp Q1-10 DVO: 220 MHz pixel clk ATI Eyefinity VGA: 2048x1536 AvivoTM Display System Dual-link DVI: 2560x1600 Three independent display controllers DisplayPort v1.1a: 2560x1600 3 active outputs from: 2x dual-link DVI, 1x DisplayPort v1.1a, 1x HDMITM 1.3 Q2-09 Comp/YC: NTSC, PAL Q2-10 HDMITM 1.3: 1920x1200p HQV Benchmark 2.0 score 175 1: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth. 2: System configuration: 3DMark05, 1280x1024, ASUS MB - ASUS 790 M3A32 - MVP Deluxe, CPU - Quad-Core AMD PhenomTM processor, 4x 2.3GHz, Memory - 4x 512MB DDR2-800, Windows(R) XP (8.61). 3: System configuration: 3DMark03, 1600x1200, 32bpp, 60Hz. For additional information see ATI RadeonTM E2400 MXM-II Module Specification. 4: System configuration: Estimate same as MXM 2.1a Type II module. 5: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth. 6: System configuration: 3DMark06, 1280x1024, ASUS M4A79T DeLuxe Motherboard, CPU - Quad-Core AMD PhenomTM processor , 4x 2.3GHz, Memory - 2x 2GB Corsair DDR310200 , Windows(R) XP SP3. 7: System configuration: 3DMark01, 1600x1200, 32bpp, 60 Hz. For additional information see ATI RadeonTM E4690 MXM 3.0 Module Specification. 8: Estimate same as MXM 3.0 Type A module. 9: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth. 10: System configuration: 3DMark Vantage (P), CPU: AMD PhenomTM II 965 (3.4GHz), Motherboard: Asus M3A79-T(790)/ ASUS M3N-HT DLX (780a), Memory: 4GB DDR2-800 5-5-5-18, OS: Windows 7 RTM 64bit, GPU: 1G GDDR5, 850e/1200m, 8.732RC1-100504a-099648E-ATI. 11: See www.KITGURU.net AMD Embedded Solutions, cont. AMD Embedded Chipsets Model Devices CPU Interface Package AMD M69OT M690T/ SB600 1GHz HyperTransportTM 21mm FCBGA/ 23mm FCBGA AMD M69OE M690E/ SB600 1GHz HyperTransportTM AMD 780E 780E/ SB710 AMD 785E AMD SR5690, SR5670, SR5650 PCI (R) Express ATI Hybrid TM CrossFireX DVI/ HDMI Display Port DirectX 9.0 WMV9 (R) No 1@ 1080i2 DirectX 9.0 WMV9 (R) No (R) (R) LPC SPI SMBus Max GPIOs Display: Max 1 Resol. HD Audio, AC97 v2.3 Yes 73 2048 x 1536 10 v2.0 HD Audio, AC97 v2.3 Yes 73 2048 x 1536 No 12 v2.0, 2 v1.1 HD Audio, AC97 v2.3 Yes 73 2560 x 1600 6.4 13W Yes5 14 v2.0, 2 v1.1 HD Audio, AC97 v2.3 Yes 73 2560 x 1600 SR5690: 18W SR5670: 17W SR5650: 13W SP5100: 4W No 12 v2.0, 2 v1.1 HD Audio, AC97 v2.3 Yes 73 N/A LVDS TV DVO SATA II IDE Power Ethernet MAC No 24-bit DualChannel Yes DVI & LVDS Transmitter 3 Support 4, RAID 0, 1, 10 meets 1.0a spec ATA 133 8W 2@ 1080i4 No 24-bit DualChannel No DVI & LVDS Transmitter 3 Support 4, RAID 0, 1, 10 meets 1.0a spec ATA 133 Yes 2@ 1080P4 Yes 24-bit DualChannel No No 6, RAID 0, 1, 10 meets 2.5 spec DirectX 10.1 OpenGL 2.0, UVD 2.0 Yes 2@ 1080P4 Yes 24-bit DualChannel No No N/A N/A N/A N/A N/A N/A N/A PCI Graphics 1x8, 4x1 Gen 1 v2.3 21mm FCBGA/ 23mm FCBGA 1x8, 4x1 Gen 1 v2.3 2.6GHz HyperTransportTM 3.0 21mm FCBGA/ 23mm FCBGA 2x8 or 1x16, 6x1 Gen 2 v2.3 DirectX 10.0 OpenGL 2.0, UVD 2.0 785E/ SB8XX 2.6GHz HyperTransportTM 3.0 21mm FCBGA/ 23mm FCBGA 2x8 or 1x16, 6x1 Gen 2, 2x1 Gen 1 v2.3 SR56x0/ SP5100 HyperTransportTM 3.0 (5.2GT/s) Backward Compatible with HT 1.0 29x29mm FCBGA/ SP5100: 21x21mm FCBGA Gen 2 v1.0; SR5690: 42 lanes/ 11 engines SR5670: 30 lanes/ 9 engines SR5650: 22 lanes/ 8 engines v2.3 USB Audio No 10 v2.0 8W No ATA 133 13W 6, RAID 0, 1, 55, 105, 6GBPS No 6, RAID 0, 1, 10 meets 2.5 spec ATA 133 Note 1. Capable display resolutions are influenced by the operating system driver, processor and memory selection. Note 2. The PCI Express(R) x8 interface is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 with HDCP 1.1 support. Note 3. The sideport memory interface of the M690T and M690E can be configured as a DVO to attach to an additional DVI, LVDS, or CRT transmitter. Note 4. The LVDS interface of the M690E and 780E is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 (for the M690E) or HDMI 1.3b (for the 780E) with HDCP 1.1 support. This enables support for native dual DVI; however, only one HDMI interface may be enabled at a time. Note 5. Avalable on the SB850. AMD Development Boards 1 ATX * 1 RJ45 ATX 4, 3Gbps ports 1 1 ATX 4 * 1 1 1 ATX 6 * 1 CD-ROM/Std. Documentation 1x16, 1x4 1 DVI/HDMI Adapter Board 12 IrDA 7.1 Parallel Port * PS/2 Keyboard/Mouse 1x164 1x1 Serial Ports 9 IDE UDMA 7.1 1 1 Serial ATA * 1 Power 1 x1 1 Ethernet on Board 8 3 Super I/O on Board 2 * LPC Slots or Headers * Mini-PCI 4 PCI Slots 2 PCI Express Mini Card * PCI Express(R) Slots USB * Audio Out Channels * Linux Display Output Windows(R) CE 6.0 Form Factor Windows(R) CE 5.0 Chipset Typical Kit Contents I/O Connectors Windows(R) XP/XPe Processor (* Denotes Processor shipped in Kit) Windows(R) Embedded Standard 2009 Name Windows(R) 7 / Windows(R) Embedded Standard 7 OS1 AMD GEODETM SOLUTIONS BASED DEVELOPMENT BOARDS LX DB800 AMD GeodeTM LX 800@0.9W2 AMD CS5536 Mini-ITX/ETX CRT, TFT * A55E Mini-ITX VGA, single-link DVI-D support * 13 * AMD64 BASED DEVELOPMENT BOARDS AMD DB-FT1 Development Board G-Series T56N (DBFT1-00-E1-EVAL-KT) Or * * 1 4 * G-Series T40N (DBFT1-01-EVAL-KT S1 DBM690T/E Mobile AMD SempronTM 3500+* and 2100+, AMD TurionTM 64 X2 TL-52, AMD SempronTM 2100+ AMD M690T or M690E, SB600 ATX CRT, DVI/HDMI, LVDS * * AM2+ DB780E AMD PhenomTM 9350e, AMD AthlonTM X2 4200+ and 3400e, AMD AthlonTM 3100+ and 2000+, AMD AthlonTM II XLT, AMD PhenomTM II XLT AMD 780E, SB710 ATX CRT, DVI * * * * 3 1 * 1 Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required. Note 2. The Geode LX 800@0.9W processor operates at 500MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark. DDR2 versions available - please talk with your AMD representative Note 3.The Geode LX DB800 has one 32-bit, 66/33MHz, 3.3V (non-5V tolerant) PCI slot. Additionally, a bridge card that offers two 32-bit, 66/33MHz, 3.3V (5V tolerant) slots is shipped with the development board. The bridge card occupies the one slot on the main board. Note 4. The S1 DBM690T/E has one x16 PCI Express(R) slot that is supported by a 1x8 PCI Express interface. 1 1 * * AMD Embedded Solutions, cont. AMD GeodeTM Processors Processor Family Device Number Chipset Package/ Operating Case Temp. Core Freq. (Perform. Rating) Core Volt Thermal Design Power Power Mgmt./ Rating AMD GeodeTM LX Processors (Integrated North Bridge/ Graphics) LX900@ 1.5W AMD CS5536 BGU481 0C to 80C 600MHz (900) 1.4V 5.1W ACPI v2.0 LX800@ 0.9W BGU481 0C to 85C and -40C to 85C2 500MHz (800) 1.25V 3.6W LX700@ 0.8W BGU481 0C to 85C 433MHz (700) 1.2V 3.1W DDR-333 LX600@ 0.7W BGU481 0C to 85C 366MHz (600) 1.2V 2.8W DDR-266 FPU MMX , AMD 3DNow!TM Technology TM Memory Support PCI Ethernet IDE USB LPC Audio DDR-400 v2.2 No 1 Ch., UDMA100 4 Ports, v2.0 1 LDRQ AC97 v2.3 UART/ IR 2/1 Serial/ Parallel Interfaces ACCESS.bus w/2 Ports RTC Max. GPI0s 1 32 DDR-400 Display: Max Res. Security 28-Bit AES w/Optional In-package EEPROM CRT: 1920x1440 TFT: 1600x1200 VIP/VOP = 1.1, 2.0 28-Bit AES AMD GeodeTM Solutions Based Reference Design Kits 5.0 * LX Ultra Value Client AMD GeodeTM LX 800@0.9W2 AMD CS5536 5.5x5 CRT * * * 1 4 LX EPIC Single Board Computer AMD GeodeTM LX 800@0.9W or LX 700@0.8W2 AMD CS5536 4.5x6.5 CRT/TFT/LVDS * 5.0 * 2 4 LX Network Attached Storage Processor AMD GeodeTM LX 800@0.9W or LX 700@0.8W2 AMD CS5536 Mini-ITX CRT for debug only * 4 * 1 Mini PCI 1 SVDC thru ETX conn. 1 12VDC * * 1 Mini-ITX * 2 * * 3 1 ATX * 2 1 IrDA * Parallel Port CRT/TFT PS/2 Keyboard/Mouse 3.7x4.5 Serial Ports Linux(R) AMD CS5536 IDE UDMA Windows CE AMD GeodeTM LX 800@0.9W2 Serial ATA Windows(R) XP/XPe LX ETX Power Input Video Output Ethernet on Board Form Factor (Inches) Super I/O on Board Companion Device PCI Slots Processor USB Name LPC Slots or Headers I/O Connectors Audio Out Channels OS1 Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required. Note 2. The Geode LX 800@0.9W processor operates at 500MHz and the Geode LX 700@0.8W processor operates at 433MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark AMD64 Reference Design Kits Second-Generation AMD OpteronTM Processor-based AdvancedTCA(R) Blade AMD OpteronTM Model 2210 EE Processor Broadcom HT-2100, HT-1000 ATCA(R) Blade Dual Star Backplane or 5 slot Full Mesh AMD Socket S1 Processor COM Express AMD TurionTM 64 X2, Mobile AMD SempronTM Processors AMD M690T/E with ATI RadeonTM X1250 Graphics COM Express Type 2 N/A AMD Socket AM2 Processor Storage Bridge Bay AMD AthlonTM and AMD AthlonTM X2 Processors Broadcom HT-2100, HT-1000 SBB 2.0 N/A AMD SempronTM 210U/200U Processor Mini-DTX ABS1 BGA Processors AMD M690E with ATI RadeonTM X1250 Graphics Mini-DTX N/A 4 HDMI connectors, Supports CES-861B video modes, including 4800, 720p, 1980i and 1080p 1Gb None No 2 internal SATA II, 3Gbps ports 1 External eSATA 3 Gbps 2 channel HDaudio: 1 analog line in, 1 analog line out 2 2 * * * Dual 1G to Fabric, Dual 1G to Base AMC(R) x2 Half Height * * DVI, LVDS, Analog VGA, TV 1Gb 3x1 PCIe,(R) 1x8 PCIe, PCI 2Ch * Analog VGA GbE to back plate, GbE to mid-plane 1x8 PCIe * * DVI VGA 1Gb 2x1 PCIe * HD * Custom form factor N/A RoHS Compliant 2 1 Core Specification PICMG 3.0 NEBS Level-3 and ETSI Installations RoHS Compliant 8 1 HD www.amd.com/embedded One AMD Place P.O. Box 3453 Sunnyvale, CA 94088-3453, USA Tel: 408-749-4000 or 800-538-8450 TWX: 910-339-9280 TELEX: 34-6306 (c)2011 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Opteron, AMD Turion, AMD Sempron, AMD Phenom, AMD Digital Media Xpress, AMD Virtualization, AMD-V, AMD PowerNow!, 3DNow!, Geode, PowerPlay, Radeon, and Avivo and combinations thereof are trademarks of Advanced Micro Devices. AdvancedTCA, ATCA, and AMC are registered trademarks of PCI Industrial Computers Manufacturers Group. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. Linux is a registered trademark of Linus Torvalds. MMX is a trademark of Intel Corporation. PCIe and PCI Express are registered trademarks of PCI-SIG. Other names are for informational purposes only and may be trademarks of their respective owners. January 2011 - 43838I Compliance * NEBS * Standard Serial N/A USB 203mm x 122mm custom form factor Audio AMD 780E , AMD SB710, and ATI RadeonTM E4690 GPU SAS AMD AthlonTM II XL/XLT Processors AMD PhenomTM II XLT Processors IDE Topology High Performance Embedded Graphics RDK Aux Slots Form Factor Ethernet Chipset Display Processor Support Electrical/Mechanical Linux(R) Name I/O Connectors Windows XP/ XPe/ 7/ WES 7 OS 6 1 COM.0 RoHS Compliant SBB 2.0 RoHS Compliant Mini-DTX RoHS Compliant