AMD Embedded: The Next Generation of Embedded Computing
AMD helps deliver the right balance of CPU, GPU and chipset
capabilities, to give designers the solutions they need to create the
next generation of embedded applications. Along with a broad range
of varied solutions, AMD supports the x86 embedded marketplace
with design tools and technology partnerships that offer simplicity
and exibility to help create high-performance, feature-rich, and
customer-driven products. AMD has long been a leader in innovation
with its continued focus on improving both x86 processor and
graphics processor designs. AMD’s embedded products offer
designers a balanced foundation for overall system performance
with the quick time-to-market typically offered by commercial
off-the-shelf components. AMD embedded solutions give designers
ampleexibility to design scalable, x86-based, cost-efcient and
feature-rich products, and help drive energy conservation into their
systems without compromising application performance or
compatibility, graphics performance or features. AMD technology-
based products are leading edge from enterprise-class servers and
consumer systems to traditional embedded markets.
This brochure presents the full array of AMD’s embedded solutions
that help deliver maximum performance with low overall system
power consumption and are supported by longer than standard
availability1, a full library of x86 software development applications,
and hardware tools. It’s time to design and produce the next-
generation embedded systems your customers demand — quickly,
easily, and efciently.
AMD’s unique processor designs help deliver high performance
and balanced system design.
AMD’s range of embedded solutions provides exible features
and a balanced performance approach for the overall system.
FEATURES INCLUDE
> Integrated low power processor and GPU2
> Industry-leading performance-per-watt
> Native eight-core processor design provides highly scalable
performance gains within a consistent thermal envelope
> Lead-free, four-layer processes with maximum on-board space
> Efcient heat dissipation reduces or eliminates the need
for heat sinks and reduces ambient cooling requirements
> Range of available packaging and pin counts meets
variety of design requirements
Along with these and other technical features, embedded designers
can enjoy long-term component availability, comprehensive design
support, and AMD’s commitment to continue offering new, customer-
oriented products.
Tools and support for developers
AMD offers:
> A full range of RDK (Reference Design Kit) products designed to
enable designers to go from concept to nished product quickly
> A broad array of development boards for creating efcient x86
system designs
> Industry collaborations with leading software and hardware
specialists, fostering maximum choice for your unique design
Get to market faster with superior products
Ready to create high-performance, low-power embedded designs
that give your innovative new products an edge in the marketplace?
Experience the AMD advantage.
Note 1: Most models support a planned 5 year availability from Product Release. See AES Product Roadmap: Backup - Product Longevity & Features
document for last time buy schedules on specic products.
Note 2: On some models
AMD EMBEDDED SOLUTIONS:
Product Selection Guide
The AMD Fusion Family of Accelerated Processing Units (APU)
AMD Fusion is a new approach to processor design and software
development, delivering powerful CPU and GPU capabilities for HD,
3D and data-intensive workloads in a single-die processor called an
APU. APUs combine high-performance serial and parallel processing
cores with other special-purpose hardware accelerators, enabling
breakthroughs in visual computing, security, performance-per-watt
and device form factor. The rst introduction of this technology for
embedded applications is the new AMD Embedded G-Series Family
of APUs, targeted at delivering the ideal combination of price, power
and performance for applications such as integrated digital signage,
x86 set-top-box (xSTB), IP-TV, Thin Client, Point-of-Sale,
Infotainment, and Casino Gaming markets.
The AMD64 embedded family: leading-edge technology
for high-end embedded systems
AMD64 embedded solutions are each uniquely matched to a
dened set of product applications. These solutions include
high-performance dual-, quad-, six- and eight-core AMD Opteron™
processors and dual-core AMD Turion™ II Neo processors with
Direct Connect Architecture for enterprise-class telecom, networking
and storage equipment. The ASB1 (BGA) family of processors are
designed with unique computing features and a thin, compact form
factor to help enable new and uncompromising designs. The ASB2
processors are the second generation BGA platform, featuring the
AMD Turion™ II Neo dual-core processors coupled with the AMD
785E chipset, are designed to deliver exceptional performance while
maintaining low average solution power draw with greater levels of
performance and power efciency over the previous generation
ASB1 (BGA) processor family.
The AMD64 solutions are each uniquely equipped to provide the
processing needs for a large number of target markets. These
solutions enable unique high-performance, smaller form factor
products, with maximum versatility, and minimum design challenge.
AMD Geode™ LX processors: optimized for low-power,
high-performance applications
AMD Geode™ LX processors are congured to deliver developers a
versatile and exible suite of x86 solutions that enable fast design
cycles and short time-to-market roadmaps. Ideal for applications
ranging from thin-client and set-top boxes to point-of-sale devices
and kiosks. AMD has also introduced technology that allows the
AMD Geode LX family to use DDR2 memory modules in an existing
design. With a minor change in the memory voltage and an updated
BIOS, a current AMD Geode LX processor based design can use a
DDR2 memory module from AStint which helps ensure memory
longevity and results in system level power efciency. In addition to
processors, the family includes a broad range of design tools
including Development Boards (DBs) and Reference Design Kits
(RDKs) to empower designers to make maximum use of the
established world of x86 software applications.
The AMD Radeon™ embedded graphics family: game-changing
graphics for embedded systems.
AMD Radeon™ graphics for embedded applications are designed to
deliver exciting, desktop-level visual experiences to embedded
systems. Built with advanced 3D graphics engines supporting
Microsoft® DirectX® and OpenGL graphics APIs, AMD graphics
solutions enable market-leading, rich, immersive images.
Outstanding multimedia capabilities are supported by an integrated
multi-standard video decoder delivering enhanced video quality from
MPEG-2, H.264 or VC-1 video streams. The ultimate in display
exibility is provided by dual display controllers driving high-resolution
displays through VGA, DVI, DisplayPort or HDMI interfaces. AMD
graphics solutions are designed to perform, engineered to lead and
built to win. With a product portfolio including AMD chipsets, discrete
graphics processors, MXM modules and PC add-in boards, AMD
provides system designers with exciting and innovative graphics
solutions for their embedded systems.
Quad-Core AMD Opteron™ Processors - Socket F (1207)A
Model OPN Multi-CPU Scalability Core Frequency Cache
Peak Power
(worst case) TDP Memory Interface HyperTransport™ Technology Product Release
83VS OE83VSWHP4DGIE Up to 8 2.8GHz L2: 512KB x4
L3: 6MB
115W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q3-09
83QS HE OE83QSMAP4DGIE Up to 8 2.4GHz 71W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.0GHz
Full Duplex
Q3-09
23VS OE23VSWHP4DGIE Up to 2 2.8GHz 115W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q3-09
23QS HE OE23QSMAP4DGIE Up to 2 2.4GHz 71W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.0GHz
Full Duplex
Q3-09
23KS EE OE23KSFLP4DGIE Up to 2 2.0GHz 50W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@1.8GHz
Full Duplex
Q3-09
13QS HE OE13QSMAP4DGIE Up to 1 2.4GHz 71W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.0GHz
Full Duplex
Q3-09
13KS EE OE13KSFLP4DGIE Up to 1 2.0GHz 50W DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@1.8GHz
Full Duplex
Q3-09
Note A: AMD Opteron processors in Socket F (1207) type is packaged in Lidded 1207 pad LGA package.
All AMD Opteron processors in socket F (1207) generation support DDMP, AMD CoolCoreTM technology, enhanced PowerNow!TM technology, AMD wide oating point accelerator, AMD memory optimizer technology, AMD balanced smart cache, AND-V
with Rapid Virtualization Indexing, EVP and OPMA support.
Six-Core and Four-Core AMD Opteron™ 4100 Series Processors - Socket C32
Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransport™ Interface Product Release
41KX HE OE41KXOHU6DGOE 6 cores up to 2 sockets 2.2GHz L2 512K x6; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz
Full Duplex
Q3-10
41QS HE OE41QSOHU4DGOE 4 cores up to 2 sockets 2.5GHz L2 512K x4; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz
Full Duplex
Q3-10
41LE HE OE41LEOHU4DGOE 4 cores up to 2 sockets 2.3GHz L2 512K x4; L3 6MB 65W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz
Full Duplex
Q3-10
41GL EE OE41GLHKU6DGOE 6 cores up to 2 sockets 1.8GHz L2 512K x6; L3 6MB 40W DDR3-1333 2-ch Registered ECC & Chipkill Two 16-lanes@2.2GHz
Full Duplex
Q3-10
AMD Embedded Solutions
Eight-Core AMD Opteron™ 6100 Series Processor - Socket G34
Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransport™ Interface Product Release
61KS OE61KSWKT8EGO up to 4 2.0GHz L2 512KB x6; L3 12MB 115W1DDR3-1333 4-ch Registered
ECC & Chipkill
Four 16-lane @ up to 3.2GHz
Full Duplex
Q1-10
61QS OE61KSWKT8EGO up to 4 2.3GHz L2 512KB x6; L3 12MB 115W1DDR3-1333 4-ch Registered
ECC & Chipkill
Four 16-lane @ up to 3.2GHz
Full Duplex
Q1-10
Note 1. Temperature is server part.
Six-Core AMD Opteron™ Processors - Socket F (1207)A
Model OPN Multi-CPU Scalability Core Frequency Cache TDP Memory Interface HyperTransport™ Interface Product Release
84QS OE84QSWJS6DGNE up to 8 2.4GHz L2 512KB x6; L3 6MB 115W1DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q1-10
84KS OE84QSWJS6DGNE up to 8 2.0GHz L2 512KB x6; L3 6MB 79W1DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q1-10
24QS OE24QSWJS6DGNE up to 2 2.4GHz L2 512KB x6; L3 6MB 115W1DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q1-10
24KS OE24QSWJS6DGNE up to 2 2.0GHz L2 512KB x6; L3 6MB 79W1DDR2-800 2-ch Registered
ECC & Chipkill
Three 16-lane@2.2GHz
Full Duplex
Q1-10
Note 1. Temperature is server part.
Dual-Core AMD Opteron™ Processors - Socket F (1207)A
Model OPN
Multi-CPU
Scalability Core Frequency L2 Cache/Core Thermal Design Power Memory Interface
HyperTransport™
Technology Tcase Product Release
8214 HE OSP8214GAU6CYE up to 8 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
83ºC Q4-06
8210 EE OSH8210GAS6CYE up to 8 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
80ºC Q4-06
2214 HE OSP2214GAU6CXE up to 2 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
83ºC Q4-06
2210 EE OSH2210GAS6CXE up to 2 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
80ºC Q4-06
2208 HE OSP2208GAA5CXE up to 2 1.8GHz 512KB x2 68W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
76ºC Q4-06
1214 HE OSP1214GAU6DGE 1 2.2GHz 1MB x2 68W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
83ºC Q4-06
1210 EE OSH1210GAS6DGE 1 1.8GHz 1MB x2 45W DDR2-667, 2-ch Registered
ECC & Chipkill
Three 16-lane@1GHz
Full Duplex
80ºC Q4-06
AMD G-Series Platform Controller Hubs
Model OPN CPU
Interface Package PCI
Express PCI SATA
FIS-
Based
Switching
Ethernet
MAC EEE USB HD Audio
LPC
SPI
SMBus
Max
GPIOs
APU Fan
Control
APU
Clock
Gen
Power16
A50M
100-CG2198
1X4 Gen 1 23mm
FCBGA
4x1 Gen 2 No 6x 6Gb/s No No No 14 v2.0
2 v1.1
Up to 4-channels Yes 102 Yes Yes 2.7W-
5.9W
A55E
100-CG2188
1X4 Gen 2 23mm
FCBGA
4x1 Gen 2 33MHz
4 Slots
6x 6Gb/s
with RAID
0,1,5,10
Yes Yes Yes 14 v2.0
2 v1.1
Up to 4-channels Yes 102 Yes Yes 2.7W-
5.9W
AMD Embedded Solutions, cont.
AMD G-Series Accelerated Processing Units
Model OPN Package CPU
Cores
L2
Cache
/Core
Memory
Interface
CPU Core
Frequency
Discrete Class
Graphics
GPU Core
Frequency Graphics
Hardware
Video
Acceleration12
Display
Outputs13
Display
Resolutions
Thermal
Design
Power
Tcase Product
Release
T56N GET56NGBB22GTE
19mm
FCBGA
2 512KB DDR3-1066,
Unbuffered
1.6GHz AMD Radeon™
HD 6310
500MHz
DirectX® 11
Shader Model 5
Open CL™ 1.1
OpenGL 3.2, 2.1
UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
Dual independent
display controllers
2 active outputs
from:
1x VGA
2x single-link DVI
1x single-link LVDS
2x DisplayPort v1.1a
1x HDMI
1x DVO
VGA: 2560x1600 (HD
6310) or 1920x1200
(HD 6250) 30 bpp
Single-link DVI:
1920x1200 24 bpp
HDMI™: 1920x1080p
36 bpp Single-link
LVDS14: 1400x1050
18 bpp
DisplayPort v1.1a:
2560x1600 (HD 6310)
or 1920x1200 (HD
6250) @ 30 bpp
18W 90°C Q1-11
T48N GET48NGBB22GTE 2 512KB DDR3-1066,
Unbuffered
1.4GHz AMD Radeon™
HD 6310
500MHz UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
18W 90°C Q1-11
T40N GET40NFPB22GTE 2 512KB DDR3-1066,
Unbuffered15
1.0GHz AMD Radeon™
HD 6250
280MHz UVD 3 for H.264,
VC-1 and MPEG2
9W 90°C Q1-11
T52R GET52RGBB12GTE 1 512KB DDR3-1066,
Unbuffered
1.5GHz AMD Radeon™
HD 6310
500MHz UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
18W 90°C Q1-11
T44R GET44RFPB12GTE 1 512KB DDR3-1066,
Unbuffered15
1.2GHz AMD Radeon™
HD 6250
280MHz UVD 3 for H.264,
VC-1 and MPEG2
9W 90°C Q1-11
12: Refer to the Brazos Platform Minimum System Recommendations for HD Video Playback, order# 48826 to view the minimum system
congurations required to enable HD playback and the maximum resolution supported for each advanced video quality feature.
13: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
14: eDP translator option supporting 2048x1536 (HD 6310) or 1920x1200 (HD 6250) at 18 or 24 bpp.
15: Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder.
16: Conguration dependant. See product databook for congurations.
Socket S1
Model OPN
Number of
Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransport™ Technology Tcase Product Release
AMD TurionTM 64 X2 TL-62 TMDTL62HAX5DME 2 2.1GHz 512KB x2 35W DDR2-800, 2-ch
Unbuffered
One 16-lane@800MHz Full
Duplex
95ºC Q4-07
AMD TurionTM 64 X2 TL-56 TMDTL56HAX5DME 2 1.8/0.8GHz1512KB x2 31/9.4W1DDR2-800, 2-ch
Unbuffered
One 16-lane@800MHz Full
Duplex
95ºC Q4-07
AMD Sempron 3700+ SMS3700HAX4DQE 1 2.0GHz 512KB 25W DDR2-800, 2-ch
Unbuffered
One 16-lane@800MHz Full
Duplex
95ºC Q4-07
AMD Sempron 2100+ SMF2100HAX3DQE 1 1.0GHz 256KB 8W DDR2-800, 2-ch
Unbuffered
One 16-lane@800MHz Full
Duplex
95ºC Q4-07
Note 1. While operating at the max/min P-States which can be dynamic or xed through BIOS.
Socket AM3/AM21
Model OPN Number of Cores Core Frequency Cache Thermal Design Power3Memory Interface HyperTransport™ Interface Package Product Release
AMD Phenom II XLT Q54L HEQ54LOEK4DGME 4 2.2/0.8GHz2L2 512K x4; L3
6MB
65/36.5W2DDR3-1333, 2-ch
Unbuffered ECC
One 16-lane@1.8GHz
Full Duplex
AM3 Q2-10
AMD AthlonTM II XL - V66C AEV66CHDK23GME 2 2.8GHz 1MB x2 45W DDR3-1333, 2-ch
Unbuffered ECC
One 16-lane@2GHz
Full Duplex
AM3 Q2-10
AMD AthlonTM II XLT - V64L AEV64LHFK23GME 2 2.7GHz 1MB x2 45W DDR3-1066, 2-ch
Unbuffered ECC
One 16-lane@2Ghz
Full Duplex
AM3 Q2-10
AMD AthlonTM II XLT - V50L AEV50LSCK23GME 2 2.2/0.8GHz21MB x2 25/13.8W2DDR3-1066, 2-ch
Unbuffered ECC
One 16-lane@2Ghz
Full Duplex
AM3 Q2-10
AMD AthlonTM X2 4200+ ADD4200IAA5DOE 2 2.2GHz 512KB x2 35W DDR2-800, 2-ch
nbuffered ECC
One 16-lane@1000MHz Full
Duplex
AM2 Q2-08
AMD AthlonTM X2 3600+ ADD3600IAA5DOE 2 1.9GHz 512KB x2 35W DDR2-800, 2-ch
Unbuffered ECC
One 16-lane@1000MHz Full
Duplex
AM2 Q2-08
AMD AthlonTM X2 3400e ADJ3400IAA5DOE 2 1.8/1.0GHz2512KB x2 22/10.8W2DDR2-800, 2-ch
Unbuffered ECC
One 16-lane@1000MHz Full
Duplex
AM2 Q2-08
AMD AthlonTM 3100+ ADS3100IAR4DRE 1 2.0GHz 512KB 25W DDR2-667, 2-ch
Unbuffered ECC
One 16-lane@1000MHz Full
Duplex
AM2 Q4-07
AMD AthlonTM 2600+ ADG2600IAV4DRE 1 1.6GHz 512KB 15W DDR2-667, 2-ch
Unbuffered ECC
One 16-lane@800MHz Full
Duplex
AM2 Q4-07
AMD AthlonTM 2000+ ADF2000IAV4DRE 1 1.0GHz 512KB 8W DDR2-667, 2-ch
Unbuffered ECC
One 16-lane@1000MHz Full
Duplex
AM2 Q4-07
Note 1. Socket AM3 processors can operate in Socket AM2 board designs with DDR2 memory. Socket AM2 processors cannot operate in Socket AM3 board designs with DDR3 memory.
Note 2. While operating at the max/min P-States which can be dynamic or xed through BIOS.
Note 3. TDP specied in dual-plane platform.
ASB2 BGA
Model OPN
Number of
Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransport™ Technology Tcase Product Release
AMD TurionTM II Neo - N54L TEN54LSDV23GME 2 2.2GHz 1MB x2 25W DDR3-800, 2-ch
Unbuffered ECC
One 16-lane@1.6GHz
Full Duplex
95ºC Q2-10
AMD TurionTM II Neo - N40L TEN40LGAV23GME 2 1.5GHz 1MB x2 15W DDR3-800, 2-ch
Unbuffered ECC
One 16-lane@1.6GHz
Full Duplex
95ºC Q2-10
AMD AthlonTM II Neo - N36L AEN36LLAV23GME 2 1.3/0.8GHz11MB x2 12/8W1DDR3-800, 2-ch
Unbuffered ECC
One 16-lane@1GHz
Full Duplex
95ºC Q2-10
AMD AthlonTM II Neo - R44L AER44LLAV13GME 1 1.7GHz 1MB 12W DDR3-800, 2-ch
Unbuffered ECC
One 16-lane@1GHz
Full Duplex
95ºC Q2-10
AMD AthlonTM II Neo - R34L AER34LFCV13GME 1 1.0GHz 1MB 8W DDR3-800, 2-ch
Unbuffered ECC
One 16-lane@1GHz
Full Duplex
95ºCQ2-10
Note 1. While operating at the max/min P-States which can be dynamic or xed through BIOS.
ASB1 BGA
Model OPN
Number of
Cores Core Frequency L2 Cache/Core Thermal Design Power Memory Interface HyperTransport™ Technology Tcase Product Release
AMD TurionTM Neo X2 L625 TMZL625OAX5DYE 2 1.6/0.8GHz1512KB x2 18/10.1W1 DDR2-667, 2-ch
Unbuffered ECC
One 16-lane@800MHz
Full Duplex
95ºC Q3-09
AMD TurionTM Neo X2 L325 AMZL325OAX5DYE 2 1.5GHz1512KB x2 18W1 DDR2-667, 2-ch
Unbuffered ECC
One 16-lane@800MHz
Full Duplex
95ºC Q3-09
AMD SempronTM 210U SMG210UOAX3DVE 1 1.5GHz 256KB 15W DDR2-400, Unbuffered One 16-lane@800MHz
Full Duplex
95ºC Q4-08
AMD SempronTM 208U SML208UOAX3DVE 1 1.4GHz 256KB 12W DDR2-400, Unbuffered One 16-lane@800MHz
Full Duplex
95ºC Q4-08
AMD SempronTM 200U SMF200UOAX3DVE 1 1.0GHz 256KB 8W DDR2-400, Unbuffered One 16-lane@800MHz
Full Duplex
95ºC Q4-08
Note 1. While operating at the max/min P-States which can be dynamic or xed through BIOS.
AMD Embedded Solutions, cont.
AMD Embedded Discrete Graphics
Model Process Package TDP # Shaders Interface Memory
Engine/
Memory
Clock (MHz)
OS Compute Graphics Video Display
Outputs
Display
Resolutions
Product
Release
ATI RadeonTM
E2400 Discreet
GPU
65 nm
GPU +
memory
31 x 31 mm
BGA
13W2
40
PCIe® 1.1
(x1, x2, x4,
x8, x16)
64-bit wide
128 MB
GDDR3
600/700
Windows®
XP/ XPe/
Vista®/7
Linux®
(x86 32/64)
Single Precision
FP Performance:
48 GFLOPS
DirectX® 10
Shader Model
3.0
Open GL® 2.0
3D Mark 05
4061 @ 13W
Unied Video
Decoder (UVD) for
H.264, VC-1
MPEG 1/2/4
decode & encode
acceleration
Avivo™ Display System
Dual independent display controllers
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 2x single-link DVI,
1x dual-link DVI, 1x single / dual-link
LVDS, 1x HDMI™, 1x DVO
VGA: 400 MHz pixel clk
Comp/YC: NTSC, PAL
YPbPr: 480i/p, 576i/p,
720p, 1080i
Single-link DVI:
1600x1200 60 Hz 24 bpp
Dual-link DVI:
2048x1536 60 Hz 24 bpp
Single-link LVDS:
1280x1024 60 Hz 24 bpp
Dual-link LVDS:
2048x1536 60 Hz 24 bpp
HDMI™: 1920x1080i
60 Hz 24 bpp
DVO: 220 MHz pixel clk
Q1-08
ATI RadeonTM
E2400 MXM-II
Module
MXM 2.1a
Type II
module
73 x 78 mm
18W364-bit wide
256 MB
GDDR3
DirectX® 10
Shader Model
3.0
Open GL® 2.0
Avivo™ Display System
Dual independent display controllers
Available on MXM 2.1a connector
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 2x single-link DVI
1x dual-link DVI, 1x single / dual-link
LVDS, 1x HDMI™
1x DVO on header
Q2-08
ATI RadeonTM
E2400 PCIe®
Add-in Board
PCIe® Add-
in Board
16 x 11 cm
18W464-bit wide
128 MB
GDDR3
Avivo™ Display System
Dual independent display controllers
Available on dual DVI-I connectors
2 active outputs from: 2x VGA,
2x single-link DVI, 1x dual-link DVI,
1x HDMI™
Q2-10
ATI RadeonTM
E4690 Discreet
GPU
55 nm
GPU +
memory
35 x 35 mm
BGA
25W6
320
PCIe® 2.0
(x1, x2, x4,
x8, x16)
128-bit
wide
512 MB
GDDR3
600/700
Windows®
XP/
XPe/
Vista®/7
Linux®
(x86 32/64
Single Precision
FP Performance:
384 GFLOPS
DirectX® 10.1
Shader Model
4.0
Open GL 3.0
3D Mark 06
6686 @ 25W 2nd Generation
Unied Video
Decoder (UVD2)
for H.264, VC-1,
MPEG2 decode
SD & HD HQV™
processing
Blu-Ray
Avivo™ Display System
Dual independent display controllers
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 5x single-link DVI
3x dual-link DVI, 1x single / dual-link
LVDS, 5x DisplayPort v1.1a, 1x
HDMI™, 1x DVO
VGA: 400 MHz pixel clk
Comp/YC: NTSC, PAL
YPbPr: 480i/p, 576i/p, 720p,
1080i/p
Single-link DVI: 1600x1200
60 Hz 24 bpp
Dual-link DVI: 2048x1536
60 Hz 24 bpp
Single-link LVDS: 1280x1024
60 Hz 24 bpp
Dual-link LVDS: 2048x1536
60 Hz 24 bpp
DisplayPort v1.1a:
2560x1600
60 Hz 24 bpp
HDMI™: 1920x1080p
60 Hz 24 bpp
DVO: 220 MHz pixel clk
Q2-09
ATI RadeonTM
E4690 MXM
MXM 3.0
Type A
module
70 x 82 mm
32W7
DirectX® 10.1
Shader Model
4.0
Open GL 3.0
Avivo™ Display System
Dual independent display controllers
Available on MXM
3.0 connector
2 active outputs from: 2x VGA,
4x single-link DVI, 2x dual-link DVI,
1x single / dual-link LVDS, 4x
DisplayPort v1.1a, 1x HDMI™
Q1-10
ATI RadeonTM
E4690 PCIe®
Add-in Board
PCIe® Add-
in Board
18 x 11 cm
32W8 Avivo™ Display System
Dual independent display controllers
Available on dual DVI-I connectors
2 active outputs from: 2x single / dual-
link DVI, 1x HDMI™, 2x VGA
Q1-10
ATI RadeonTM
HD 5770
Graphics Board
40 nm PC Add-in
Board
23.5 x 11.2
cm
108W10 800 PCIe® 2.1
(x1, x2, x4,
x8, x16)
128-bit
wide
1 GB
GDDR5
850/4.8Gbps ATI Stream
Technology
OpenCL™ 1.1
DirectCompute 11
Single Precision
FP Performance:
1.36 TFLOPS
DirectX® 11
Shader Model
5.0
Open GL® 3.2
OpenCL™ 1.0
3D Mark
Vantage (P)
10141 @ 108W
2nd Generation
Unied Video
Decoder (UVD2)
for H.264, VC-1,
MPEG4, MPEG2
decode
Dual HD 1080p
decode
HQV Benchmark 2.0
score 175
ATI Eyenity
Avivo™ Display System
Three independent display controllers
3 active outputs from: 2x dual-link DVI,
1x DisplayPort v1.1a, 1x HDMI™ 1.3
VGA: 2048x1536
Dual-link DVI: 2560x1600
DisplayPort v1.1a:
2560x1600
HDMI™ 1.3: 1920x1200p
Q2-10
1: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
2: System conguration: 3DMark05, 1280x1024, ASUS MB - ASUS 790 M3A32 – MVP Deluxe, CPU – Quad-Core AMD Phenom™ processor, 4x 2.3GHz, Memory – 4x 512MB DDR2-800, Windows® XP (8.61).
3: System conguration: 3DMark03, 1600x1200, 32bpp, 60Hz. For additional information see ATI Radeon™ E2400 MXM-II Module Specication.
4: System conguration: Estimate same as MXM 2.1a Type II module.
5: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
6: System conguration: 3DMark06, 1280x1024, ASUS M4A79T DeLuxe Motherboard, CPU - Quad-Core AMD Phenom™ processor , 4x 2.3GHz, Memory – 2x 2GB Corsair DDR310200 , Windows® XP SP3.
7: System conguration: 3DMark01, 1600x1200, 32bpp, 60 Hz. For additional information see ATI Radeon™ E4690 MXM 3.0 Module Specication.
8: Estimate same as MXM 3.0 Type A module.
9: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
10: System conguration: 3DMark Vantage (P), CPU: AMD Phenom™ II 965 (3.4GHz), Motherboard: Asus M3A79-T(790)/ ASUS M3N-HT DLX (780a), Memory: 4GB DDR2-800 5-5-5-18, OS: Windows 7 RTM 64bit, GPU: 1G GDDR5, 850e/1200m,
8.732RC1-100504a-099648E-ATI.
11: See www.KITGURU.net
AMD Embedded Solutions, cont.
AMD Development Boards
Name
Processor
(* Denotes Processor
shipped in Kit) Chipset
Form
Factor
Display
Output
OS1I/O Connectors
Typical Kit
Contents
Windows® 7 / Windows® Embedded
Standard 7
Windows® Embedded Standard 2009
Windows® XP/XPe
Windows® CE 5.0
Windows® CE 6.0
Linux
Audio Out Channels
USB
PCI Express® Slots
PCI Express Mini Card
PCI Slots
Mini-PCI
LPC Slots or Headers
Super I/O on Board
Ethernet on Board
Power
Serial ATA
IDE UDMA
Serial Ports
PS/2 Keyboard/Mouse
Parallel Port
IrDA
DVI/HDMI Adapter Board
CD-ROM/Std. Documentation
AMD GEODE™ SOLUTIONS BASED DEVELOPMENT BOARDS
LX DB800 AMD GeodeTM LX 800@0.9W2AMD
CS5536
Mini-ITX/ETX CRT, TFT • • • • 2 4 131 1 1 ATX • 3 1 1 1 •
AMD64 BASED DEVELOPMENT BOARDS
AMD DB-FT1
Development
Board
G-Series T56N
(DBFT1-00-E1-EVAL-KT)
Or
G-Series T40N
(DBFT1-01-EVAL-KT
A55E Mini-ITX VGA,
single-link
DVI-D
support
• • • • 2 8 1 x1 1 • 1
RJ45
ATX 4,
3Gbps
ports
4 •
S1 DBM690T/E Mobile AMD SempronTM 3500+*
and 2100+, AMD TurionTM 64
X2 TL-52,
AMD SempronTM 2100+
AMD M690T
or M690E,
SB600
ATX CRT,
DVI/HDMI,
LVDS
• • • • 7.1 9 1x164
1x1
• 3 • 1 1 1 ATX 4 • 1 1 1 •
AM2+ DB780E AMD PhenomTM 9350e,
AMD AthlonTM X2 4200+ and 3400e,
AMD AthlonTM 3100+ and 2000+,
AMD AthlonTM II XLT,
AMD PhenomTM II XLT
AMD 780E,
SB710
ATX CRT, DVI • • • 7.1 12 1x16,
1x4
1 1 1 ATX 6 • 1 •
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX 800@0.9W processor operates at 500MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark. DDR2 versions available - please talk with your AMD representative
Note 3. The Geode LX DB800 has one 32-bit, 66/33MHz, 3.3V (non-5V tolerant) PCI slot. Additionally, a bridge card that offers two 32-bit, 66/33MHz, 3.3V (5V tolerant) slots is shipped with the development board. The bridge card occupies the one slot on the main board.
Note 4. The S1 DBM690T/E has one x16 PCI Express® slot that is supported by a 1x8 PCI Express interface.
AMD Embedded Chipsets
Model Devices CPU Interface Package
PCI
Express®PCI Graphics
ATI Hybrid
CrossFireX™
DVI/
HDMI
Display
Port LVDS TV DVO SATA II IDE Power
Ethernet
MAC USB Audio
LPC
SPI
SMBus
Max
GPIOs
Display:
Max
Resol.1
AMD
M69OT
M690T/
SB600
1GHz
HyperTransportTM
21mm
FCBGA/
23mm
FCBGA
1x8, 4x1
Gen 1
v2.3 DirectX®
9.0
WMV9
No 1 @
1080i2
No 24-bit
Dual-
Channel
Yes DVI &
LVDS
Transmitter
Support3
4, RAID 0,
1, 10 meets
1.0a spec
ATA
133
8W No 10
v2.0
HD
Audio,
AC97
v2.3
Yes 73 2048 x 1536
AMD
M69OE
M690E/
SB600
1GHz
HyperTransportTM
21mm
FCBGA/
23mm
FCBGA
1x8, 4x1
Gen 1
v2.3 DirectX®
9.0
WMV9
No 2 @
1080i4
No 24-bit
Dual-
Channel
No DVI &
LVDS
Transmitter
Support3
4, RAID 0,
1, 10 meets
1.0a spec
ATA
133
8W No 10
v2.0
HD
Audio,
AC97
v2.3
Yes 73 2048 x 1536
AMD
780E
780E/
SB710
2.6GHz
HyperTransport
TM
3.0
21mm
FCBGA/
23mm
FCBGA
2x8 or
1x16, 6x1
Gen 2
v2.3 DirectX®
10.0
OpenGL
2.0, UVD
2.0
Yes 2@
1080P4
Yes 24-bit
Dual-
Channel
No No 6, RAID 0,
1, 10 meets
2.5 spec
ATA
133
13W No 12
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes 73 2560 x 1600
AMD
785E
785E/
SB8XX
2.6GHz
HyperTransport
TM
3.0
21mm
FCBGA/
23mm
FCBGA
2x8 or
1x16,
6x1 Gen
2, 2x1
Gen 1
v2.3 DirectX®
10.1
OpenGL
2.0, UVD
2.0
Yes 2@
1080P4
Yes 24-bit
Dual-
Channel
No No 6, RAID 0,
1, 55, 105,
6GBPS
No 6.4 -
13W
Yes514
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes 73 2560 x 1600
AMD
SR5690,
SR5670,
SR5650
SR56x0/
SP5100
HyperTransport
TM
3.0
(5.2GT/s)
Backward
Compatible with
HT 1.0
29x29mm
FCBGA/
SP5100:
21x21mm
FCBGA
Gen 2
v1.0;
SR5690:
42 lanes/
11 engines
SR5670:
30 lanes/
9 engines
SR5650:
22 lanes/
8 engines
v2.3 N/A N/A N/A N/A N/A N/A N/A 6, RAID 0,
1, 10 meets
2.5 spec
ATA
133
SR5690:
18W
SR5670:
17W
SR5650:
13W
SP5100:
4W
No 12
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes 73 N/A
Note 1. Capable display resolutions are inuenced by the operating system driver, processor and memory selection.
Note 2. The PCI Express® x8 interface is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 with HDCP 1.1 support.
Note 3. The sideport memory interface of the M690T and M690E can be congured as a DVO to attach to an additional DVI, LVDS, or CRT transmitter.
Note 4. The LVDS interface of the M690E and 780E is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 (for the M690E) or HDMI 1.3b (for the 780E) with HDCP 1.1 support. This enables support for native dual DVI; however, only one HDMI interface may be enabled at a time.
Note 5. Avalable on the SB850.
AMD Embedded Solutions, cont.
AMD Geode™ Processors
Processor
Family
Device
Number Chipset
Package/
Operating
Case Temp.
Core Freq.
(Perform.
Rating)
Core
Volt
Thermal
Design
Power
Power
Mgmt./
Rating FPU
Memory
Support PCI Ethernet IDE USB LPC Audio
UART/
IR
Serial/
Parallel
Interfaces RTC
Max.
GPI0s Security
Display:
Max Res.
AMD
Geode™ LX
Processors
(Integrated
North Bridge/
Graphics)
LX900@
1.5W
AMD
CS5536
BGU481
0˚C to 80˚C
600MHz
(900)
1.4V 5.1W ACPI v2.0 MMX™,
AMD
3DNow!™
Technology
DDR-400 v2.2 No 1 Ch.,
UDMA-
100
4
Ports,
v2.0
1
LDRQ
AC97
v2.3
2/1 ACCESS.bus
w/2 Ports
1 32 28-Bit AES
w/Optional
In-package
EEPROM
CRT:
1920x1440
TFT:
1600x1200
VIP/VOP =
1.1, 2.0
LX800@
0.9W
BGU481
0˚C to 85˚C
and -40˚C
to 85˚C2
500MHz
(800)
1.25V 3.6W DDR-400
LX700@
0.8W
BGU481
0˚C to 85˚C
433MHz
(700)
1.2V 3.1W DDR-333
28-Bit AES
LX600@
0.7W
BGU481
0˚C to 85˚C
366MHz
(600)
1.2V 2.8W DDR-266
AMD Geode™ Solutions Based Reference Design Kits
Name Processor
Companion
Device
Form
Factor
(Inches)
Video
Output
OS1I/O Connectors
Windows® XP/XPe
Windows CE
Linux®
Audio Out Channels
USB
PCI Slots
LPC Slots or Headers
Super I/O on Board
Ethernet on Board
Power Input
Serial ATA
IDE UDMA
Serial Ports
PS/2 Keyboard/Mouse
Parallel Port
IrDA
LX ETX AMD GeodeTM LX 800@0.9W2AMD CS5536 3.7x4.5 CRT/TFT • 5.0 • 4 1 SVDC thru
ETX conn.
LX Ultra Value Client AMD GeodeTM LX 800@0.9W2AMD CS5536 5.5x5 CRT • • • 1 4 1 1 12VDC •
LX EPIC Single Board
Computer
AMD GeodeTM LX 800@0.9W or
LX 700@0.8W2
AMD CS5536 4.5x6.5 CRT/TFT/LVDS • 5.0 • 2 4 Mini
PCI
• 1 Mini-ITX • 2 • •
LX Network Attached Storage
Processor
AMD GeodeTM LX 800@0.9W or
LX 700@0.8W2
AMD CS5536 Mini-ITX CRT for debug
only
• • 3 1 ATX 1 • 2
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX 800@0.9W processor operates at 500MHz and the Geode LX 700@0.8W processor operates at 433MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark
AMD64 Reference Design Kits
Name
Processor
Support Chipset
Form
Factor Topology
OS I/O Connectors Electrical/Mechanical
Windows XP/
XPe/ 7/ WES 7
Linux
®
Display
Ethernet
Aux Slots
IDE
SAS
Audio
USB
Serial
Standard
NEBS
Compliance
High Performance Embedded
Graphics RDK
AMD AthlonTM
II XL/XLT
Processors
AMD PhenomTM
II XLT
Processors
AMD 780E ,
AMD SB710,
and
ATI RadeonTM
E4690 GPU
203mm x
122mm
custom
form
factor
N/A • • 4 HDMI connectors,
Supports CES-861B
video modes, includ-
ing 4800, 720p,
1980i and 1080p
1Gb None No 2 internal
SATA II,
3Gbps ports
1 External
eSATA 3
Gbps
2 channel
HDaudio:
1 analog
line in,
1 analog
line out
2 2 Custom form
factor
N/A RoHS
Compliant
Second-Generation AMD OpteronTM
Processor-based
AdvancedTCA® Blade
AMD OpteronTM
Model 2210 EE
Processor
Broadcom
HT-2100,
HT-1000
ATCA®
Blade
Dual Star
Backplane
or 5 slot
Full Mesh
• Dual 1G to
Fabric,
Dual 1G
to Base
AMC® x2
Half
Height
• 2 1 Core
Specication
PICMG 3.0
NEBS
Level-3
and ETSI
Installations
RoHS
Compliant
AMD Socket S1 Processor
COM Express
AMD TurionTM
64 X2, Mobile
AMD SempronTM
Processors
AMD M690T/E
with
ATI RadeonTM
X1250
Graphics
COM
Express
Type 2
N/A • • DVI, LVDS, Analog
VGA, TV
1Gb 3x1
PCIe,®
1x8 PCIe,
PCI
2Ch HD 8 COM.0 RoHS
Compliant
AMD Socket AM2 Processor
Storage Bridge Bay
AMD AthlonTM
and
AMD AthlonTM
X2 Processors
Broadcom
HT-2100,
HT-1000
SBB 2.0 N/A • Analog VGA GbE to
back plate,
GbE to
mid-plane
1x8 PCIe • • 1 1 SBB 2.0 RoHS
Compliant
AMD SempronTM 210U/200U
Processor Mini-DTX
ABS1 BGA
Processors
AMD M690E
with
ATI RadeonTM
X1250
Graphics
Mini-DTX N/A • • DVI VGA 1Gb 2x1 PCIe • HD 6 Mini-DTX RoHS
Compliant
AMD Embedded Solutions, cont.
©2011 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Opteron, AMD Turion, AMD Sempron, AMD Phenom, AMD Digital Media
Xpress, AMD Virtualization, AMD-V, AMD PowerNow!, 3DNow!, Geode, PowerPlay, Radeon, and Avivo and combinations thereof are trademarks of Advanced Micro Devices. AdvancedTCA,
ATCA, and AMC are registered trademarks of PCI Industrial Computers Manufacturers Group. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft,
Windows and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. Linux is a registered trademark of Linus Torvalds. MMX is a trademark of Intel
Corporation. PCIe and PCI Express are registered trademarks of PCI-SIG. Other names are for informational purposes only and may be trademarks of their respective owners.
January 2011 - 43838I
www.amd.com/embedded
One AMD Place
P.O. Box 3453
Sunnyvale, CA 94088-3453, USA
Tel: 408-749-4000 or 800-538-8450
TWX: 910-339-9280
TELEX: 34-6306