1. Product profile
1.1 General description
NPN/NPN resistor-equipped transistors.
1.2 Features
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place costs
1.3 Applications
Low current peripheral driver
Control of IC inputs
Replaces general-purpose transistors in digit al applications
1.4 Quick reference data
PEMH20; PUMH20
NPN/NPN resistor-equipped transistors;
R1 = 2.2 kΩ, R2 = 2.2 kΩ
Rev. 04 — 15 November 2009 Product data sheet
Table 1. Product overview
Type number Package NPN/PNP
complement PNP/PNP
complement
NXP JEITA
PEMH20 SOT666 - PEMD20 PEMB20
PUMH20 SOT363 SC-88 PUMD20 PUMB20
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 50 V
IOoutput current (DC) - - 100 mA
R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩ
R2/R1 bias resistor ratio 0.8 1 1.2
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 2 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 3. Pinning
Pin Description Simplified outline Symbol
1 GND (emitter) TR1
2 input (base) TR1
3 output (collector) TR2
4 GND (emitter) TR2
5 input (base) TR2
6 output (collector) TR1 001aab55
5
6 45
1 32
65 4
123
R2
TR1
TR2
R1
R2 R1
sym063
Table 4. Orderin g i nformation
Type number Package
Name Description Version
PEMH20 - plastic surface mounted package; 6 leads SOT666
PUMH20 SC-88 plastic surface mounted package; 6 leads SOT363
Table 5. Marking codes
Type number Marking code[1]
PEMH20 6K
PUMH20 H7*
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 3 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
5. Limiting values
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transis tor
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 10 V
VIinput voltage
positive - +12 V
negative - 10 V
IOoutput current (DC) - 100 mA
ICM peak collector current - 100 mA
Ptot total power dissipation Tamb 25 °C
SOT363 [1] -200mW
SOT666 [1][2] -200mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Per device
Ptot total power dissipation Tamb 25 °C
SOT363 [1] -300mW
SOT666 [1][2] -300mW
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 4 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
6. Thermal characteristics
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Per transis tor
Rth(j-a) thermal resistance from
junction to ambient in free air
SOT363 [1] --625K/W
SOT666 [1][2] --625K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air
SOT363 [1] --416K/W
SOT666 [1][2] --416K/W
Table 8. Characteristics
Tamb = 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off
current VCB = 50 V; IE = 0 A - - 100 nA
ICEO collector-emitter
cut-off current VCE = 30 V; IB = 0 A --1μA
VCE = 30 V; IB = 0 A;
Tj= 150 °C--50μA
IEBO emitter-base cut-off
current VEB = 5 V; IC = 0 A --2mA
hFE DC current gain VCE = 5 V; IC = 20 mA 30 - -
VCEsat collector-emitter
saturation voltage IC = 10 mA; IB = 0.5 mA - - 150 mV
VI(off) off-state input voltage VCE = 5 V; IC = 1 mA - 1.2 0.5 V
VI(on) on-state input voltage VCE = 0.3 V; IC = 20 mA 2 1.6 - V
R1 bias resistor1 (input) 1.54 2.2 2.86 kΩ
R2/R1 bias resistor ratio 0.8 1 1.2
Cccollector capacit ance VCB = 10 V; IE = ie = 0 A;
f=1MHz --2.5pF
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 5 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
VCE = 5 V
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = 40 °C
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = 40 °C
Fig 1. DC current gain as a function of collector
current; typical values Fig 2. Collector-emitter saturation vo ltage as a
function of collector current; typical values
VCE = 0.3 V
(1) Tamb = 40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
VCE = 5 V
(1) Tamb = 40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 3. On-state input voltage as a function of
collector current; typical values Fig 4. Off-sta te input voltage as a function of
collector current; typical values
IC (mA)
101102
101
006aaa015
102
10
103
hFE
1
(3)
(2)
(1)
IC (mA)
110
2
10
006aaa014
102
103
VCEsat
(mV)
10
(1)
(3)
(2)
IC (mA)
101102
101
006aaa016
10
1
102
VI(on)
(V)
101
(1)
(3)
(2)
006aaa017
IC (mA)
102101101
1
10
VI(off)
(V)
101
(1)
(2)
(3)
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 6 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 12.
[2] T1: normal taping
[3] T2: reverse taping
Fig 5. Pac kage outline SOT363 (SC-88) Fig 6. Pa ckage outline SOT666
06-03-16Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0
1.35
1.15
2.2
1.8
1.1
0.8
0.45
0.15
132
465
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
PEMH20 SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
PUMH20 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 7 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
10. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PEMH20_PUMH20_4 20091115 Product data sheet - PEMH20_PUMH20_3
Modifications: This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
Figure 5 “Package outline SOT363 (SC-88): updated
PEMH20_PUMH20_3 20050214 Product data sheet - PUMH20_2
PUMH20_2 20040414 Product specification - PUMH20_1
PUMH20_1 20031016 Product specification - -
PEMH20_PUMH20_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 15 November 2009 8 of 9
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
11.3 Disclaimers
General — In formation in this document is beli eved to be accurate and
reliable. However, NXP Semiconductors d oes not give any represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PEMH20; PUMH20
NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 2.2 kΩ
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of rele ase: 15 Novemb er 2009
Document identifier: PEMH20_PUMH20_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Packing information . . . . . . . . . . . . . . . . . . . . . 6
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9