3
Equivalent Circuit Model
HSMS-2850, HSMS-2860;
Singles
SPICE Parameters
Parameter Units HSMS-285X HSMS-286X
BVV 3.8 7.0
CJ0 pF 0.18 0.18
EGeV 0.69 0.69
IBV A 3 x 10E-4 10E-5
ISA 3 x 10E-6 5.0 x 10E-8
N 1.06 1.08
RSΩ25 5.0
PB (VJ) V 0.35 0.65
PT (XTI) 2 2
M 0.5 0.5
0.18 pF
R
j
R
S
0.08 pF
2 nH
R
j
= 8.33 X 10
-5
nT
I
b
+ I
s
where
I
b
= externally applied bias current in amps
I
s
= saturation current (see table of SPICE parameters)
T
= temperature, °K
n = identity factor (see table of SPICE parameters)
R
S
= series resistance (see Table of SPICE parameters)
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Absolute Maximum Ratings, Ta = +25°C, Single Diode
Symbol Parameter Absolute Maximum[1]
HSMS-285x HSMS-286x
PTTotal Device Dissipation[2] 75 mW 250 mW
PIV Peak Inverse Voltage 2.0 V 4.0 V
TJJunction Temperature 150°C 150°C
TSTG Storage Temperature -65°C to 150°C-65°C to 150°C
TOP Operating Temperature -65°C to 150°C-65°C to 150°C
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. CW Power Dissipation at TLEAD = +25°C. Derate linearly to zero at
maximum rated temperature.
4
Typical Parameters, Single Diode
1
10
100
1
10
FORWARD CURRENT
(µA)
FORWARD VOLTAGE DIFFERENCE
(mV)
VOLTAGE OUT (mV)
POWER IN (dBm)
0.05 0.15 0.200.10 0.25
FORWARD VOLTAGE (V)
Figure 3. Typical Forward Voltage
Match, HSMS-2860 Pairs.
.01
.1
1
10
100
0.1 0.2 0.3 0.4 0.70.6 0.8 0.90.5 1.0
FORWARD CURRENT (mA)
FORWARD VOLTAGE (V)
Figure 2. Typical Forward Current vs.
Forward Voltage at Temperature,
HSMS-2860 Series.
Figure 1. Typical Forward Current vs.
Forward Voltage, HSMS-2850 Series.
1
10
100
1000
10,000
–40 –30 –10 0–20 10
Figure 6. Dynamic Transfer
Characteristic as a Function of DC Bias,
HSMS-2860.
Figure 4. +25°C Output Voltage vs.
Input Power, HSMS-2850 at Zero Bias,
HSMS-2860 at 3 µA Bias.
Figure 5. +25°C Expanded Output
Voltage vs. Input Power. See Figure 4.
5
35
30
40
10
15
20
25
.1 1 10 100
OUTPUT VOLTAGE (mV)
BIAS CURRENT (µA)
Figure 7. Voltage Sensitivity as a
Function of DC Bias Current,
HSMS-2860.
Figure 8. Output Voltage vs.
Temperature, HSMS-2850 Series.
T
A
= +85°C
T
A
= +25°C
T
A
= –55°C
I
F
(left scale)
∆V
F
(right scale)
Frequency = 2.45 GHz
Fixed-tuned FR4 circuit
R
L
= 100 KΩ
20 µA
5 µA
10 µA
Input Power =
–30 dBm @ 2.45 GHz
Data taken in fixed-tuned
FR4 circuit
R
L
= 100 KΩ
I
F
– FORWARD CURRENT (mA)
0
0.01
V
F
– FORWARD VOLTAGE (V)
0.8 1.0
100
1
0.1
0.2 1.8
10
1.4
0.4 0.6 1.2 1.6
VOLTAGE OUT (mV)
-50
0.1
POWER IN (dBm)
-30 -20
10000
10
1
-40 0
100
-10
1000
R
L
= 100 KΩ
5.8 GHz
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
915 MHz
2.45 GHz
VOLTAGE OUT (mV)
-50
0.3
POWER IN (dBm)
-30
10
1
-40
30 R
L
= 100 KΩ
2.45 GHz
915 MHz
5.8 GHz
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
OUTPUT VOLTAGE (mV)
0
0.9
TEMPERATURE (°C)
40 50
3.1
2.1
1.5
10 100
2.5
80
20 30 70 9060
1.1
1.3
1.7
1.9
2.3
2.7
2.9
MEASUREMENTS MADE USING A
FR4 MICROSTRIP CIRCUIT.
FREQUENCY = 2.45 GHz
P
IN
= -40 dBm
R
L
= 100 KΩ
Applications Information
See the HSMS-285A data sheet.
5
Profile Option
Descriptions
#L30 = Bulk
#L31 = 3K pc. Tape and Reel,
Device Orientation
Figures 9, 10
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
Outline 143 (SOT-143)
Package Dimensions
Outline 23 (SOT-23)
Ordering Information
Specify part number followed by option. For example:
H SMS - 285X #X XX
Bulk or Tape and Reel Option
Profile: Low = L
Part Number
Surface Mount Schottky
Hewlett-Packard
3
12
X X
PACKAGE
MARKING
CODE
SIDE VIEW
TOP VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
1.02 (0.040)
0.89 (0.035)
0.50 (0.024)
0.45 (0.018)
1.40 (0.055)
1.20 (0.047) 2.65 (0.104)
2.10 (0.083)
3.06 (0.120)
2.80 (0.110)
2.04 (0.080)
1.78 (0.070)
1.02 (0.041)
0.85 (0.033)
0.152 (0.006)
0.066 (0.003)
0.10 (0.004)
0.013 (0.0005) 0.69 (0.027)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.10 (0.004)
0.013 (0.0005)
0.92 (0.036)
0.78 (0.031)
E
E
B
C
XX
PACKAGE
MARKING
CODE 1.40 (0.055)
1.20 (0.047) 2.65 (0.104)
2.10 (0.083)
0.54 (0.021)
0.37 (0.015)
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110) 0.15 (0.006)
0.09 (0.003)
1.02 (0.041)
0.85 (0.033)
0.69 (0.027)
0.45 (0.018)
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-0928E, 5966-2939E
Printed in U.S.A. 5966-4283E (3/98)
Package Characteristics
Lead Material Alloy 42
Lead Finish Tin-Lead 85/15%
Max. Soldering Temp. 260°C for 5 sec.
Min. Lead Strength 2 pounds pull
Typical Package Inductance 2 nH (opposite leads)
Typical Package Capacitance 0.08 pF (opposite leads)
Device Orientation
Figure 10. Option L31 for SOT-143 Packages.
Figure 9. Option L31 for SOT-23 Packages.
USER
FEED
DIRECTION COVER TAPE
CARRIER
TAPE
REEL
END VIEW
8 mm
4 mm
TOP VIEW
8 mm
4
mm
