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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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SSA36 — Surface Mount Schottky Barrier Rectifier
www.fairchildsemi.com© 2015 Fairchild Semiconductor Corporation
SSA36 Rev. 2
July 2018
SSA36
Surface Mount Schottky Barrier Rectifier
Features
UL Flammability 94V-0 Classification
MSL 1
RoHS Compliant / Green Mold Compound
Ordering Information
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the re co mmen ded operating conditions and s tres si ng the parts to these level s i s n ot re co mme nde d. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Part Number Top Mark Package Packing Method
SSA36 SSA36 DO-214AC (SMA) Tape and Reel
Symbol Parameter Value Unit
VRRM Recurrent Peak Reverse Voltage 60 V
VRMS RMS Voltage 42 V
VDC DC Blocking Voltage 60 V
IF(AV) Average Forward Current at TL = 75°C 3 A
IFSM Peak Forward Surge Current: 8.3 ms Single Half Sine-Wave
Superimposed on Rated Load 80 A
TJOperating Junction Temperature Range -55 to +150 °C
TSTG Storage Temperature Range -55 to +150 °C
12
Cathode Anode
SMA/DO-214AC
COLOR BAND DENOTES CATHODE
1
2
SSA36 — Surface Mount Schottky Barrier Rectifier
www.fairchildsemi.com© 2015 Fairchild Semiconductor Corporation
SSA36 Rev. 22
Thermal Characteristics(1)
Values are at TA = 25°C unless otherwise noted.
Note:
1. Per JESD51-3 recommended thermal test board . Device mounted on FR-4 PCB, board size = 76.2 mm x 114.3 mm.
2. Thermocouple soldered at cathode lead.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Note:
3. Pulse test with Pulse width = 300 μs, 1% duty cycle.
Symbol Parameter Value Unit
ψJL Typical Thermal Characteristics, Junction-to-Lead(2) 30 °C/W
RθJA Ty pical Thermal Resistance, Junction-to-Ambient 180 °C/W
Symbol Parameter Conditions Min. Typ. Max. Unit
VFForward Voltage(3) IF = 3.0 A 0.75 V
IRDC Reverse Current VR = 60 V 0.1 mA
VR = 60 V, TA = 100°C 20
Trr Reverse Recovery Time IF = 0.5 A, IR = 1 A, Irr = 0.25 A 10.74 ns
SSA36 — Surface Mount Schottky Barrier Rectifier
www.fairchildsemi.com© 2015 Fairchild Semiconductor Corporation
SSA36 Rev. 23
Typical Performance Characteristics
Figure 1. Forward Current Derating Curve Figure 2. Maximum Non-Repetitive Surge Current
Figure 3. Typical Reverse Characteristic Figure 4. Typical Instantaneous Forward
Characteristics
Figure 5. Typical Junction Capacitance Figure 6. Typical Forward Characteristics
0.01
0.1
1
10
0.0 0.1 0.2 0.3 0.4 0.5 0.6
TA= 150oC
TA= 125oC
TA= 100oC
TA= 25oC
TA= 75oC
Forward Vo ltage, V F [V]
Forward Current, IF [A]
SSA36 — Surface Mount Schottky Barrier Rectifier
www.fairchildsemi.com© 2015 Fairchild Semiconductor Corporation
SSA36 Rev. 24
Physical Dimensions
Figure 7. 2-LEAD, SMA, JEDEC DO-214, VARIATION AC
1.75
2.65
4.30
2.70 MAX
2.20
1.90
0.30
0.05
2.05
1.95
B0.203
0.050
A
0.13 MC B A
C
2.95
2.50 B1.65
1.20
B5.60
4.80
B4.75
4.00
0.13 MC B A
B
A
0.41
0.15
1.52
0.75
R0.15 4X
0.45
0 -
DETAIL A
SCALE 20 : 1
LAND PATTERN RECOMMENDATION
GAUGE
PLANE
NOTES:
A. EXCEPT WHERE NOTED CONFORMS TO
JEDEC DO214 VARIATION AC.
BDOES NOT COMPLY JEDEC STD. VALUE.
C. ALL DIMENSIONS ARE IN MILLIMETERS.
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
F. LAND PATTERN STD. DIOM5025X231M.
G. DRAWING FILE NAME: DO214ACREV1
© Fairchild Semiconductor Corporation www.fairchildsemi.com
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Rev. I76
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